KR20090060713A - Led display module and manufacturing method thereof - Google Patents

Led display module and manufacturing method thereof Download PDF

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Publication number
KR20090060713A
KR20090060713A KR1020070127634A KR20070127634A KR20090060713A KR 20090060713 A KR20090060713 A KR 20090060713A KR 1020070127634 A KR1020070127634 A KR 1020070127634A KR 20070127634 A KR20070127634 A KR 20070127634A KR 20090060713 A KR20090060713 A KR 20090060713A
Authority
KR
South Korea
Prior art keywords
circuit board
printed circuit
led
display module
reflector
Prior art date
Application number
KR1020070127634A
Other languages
Korean (ko)
Inventor
정춘목
Original Assignee
주식회사 미광전자
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 미광전자 filed Critical 주식회사 미광전자
Priority to KR1020070127634A priority Critical patent/KR20090060713A/en
Publication of KR20090060713A publication Critical patent/KR20090060713A/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133605—Direct backlight including specially adapted reflectors
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1343—Electrodes

Abstract

The present invention relates to an LED display module, the patterned printed circuit board; An LED bonded to an upper surface of the printed circuit board and having a chip formed of a compound semiconductor to emit light when power is applied; A reflector positioned above the printed circuit board and reflecting light emitted from the LED; And at least one electrode terminal surface-mounted on the printed circuit board.

Description

LED Display Module and Manufacturing Method Thereof

The present invention relates to an LED display module suitable for shortening the process number and slimming down the thickness, and a manufacturing method thereof.

In general, the display module is installed in a restaurant, a shopping mall, a building roof, or the like to express a character, a symbol, or an image required for this purpose. Installed in Therefore, by emitting the light of the required color in each pixel, it is possible to represent the required character, letter or color image.

According to the LED display module according to the related art, as shown in FIG. 1, an LED chip 2 and an LED chip 2 bonded to an upper surface of the printed circuit board 1 having a predetermined pattern are formed. Reflector 4 for reflecting the light emitted from the (), and an electrode pin (5) inserted into the bottom of the printed circuit board (1).

As shown in FIG. 2, the LED display module bonds the LED chip 2 to the printed circuit board 1, and connects the LED chip 2 to the pattern 1a through a wire 3, and emits light from the LED chip 2. The reflector 4 is formed to connect the reflector 4 to reflect the light. When the LED chip 2 is positioned on the reflector 4, epoxy is injected in the process of reflecting and diffusing light emitted from the LED chip 2. Are manufactured.

Such an LED display module often shows a seven-segment shape in the case of a numeric display. According to the related art, the reflector 4, which is an injection molded product into which the printed circuit board 1 is inserted, is minimized even if the size thereof is minimized. The minimum size of the actual product is 7.5mm in width, 13mm in length and 6.5mm in thickness on the basis of 1 digit.

In other words, precision mold manufacturing and injection technology is also a problem, but further miniaturization is impossible because of miniaturization due to problems such as tolerance management of parts involved in the manufacturing process and defective rate.

Accordingly, it becomes an obstacle to miniaturization and lightening of electronic products to which the LED display module is applied, and an epoxy filling process is required to evenly and smoothly diffuse light as the product thickness is thick, and this epoxy filling, degassing and curing process Because of the nature of the gel-like liquid mixture, a certain time is required for each process, which is a factor that hinders the entire production time of the LED display module.

In addition, since the operation of inserting the electrode pin 5 into the printed circuit board 1 and fixing the soldering 5a is necessary, there is a problem in that the number of steps and the process time are further required.

The present invention is to solve such a problem, to make it possible to slim in manufacturing the LED display module, and to simplify the process.

In order to solve the above problems, a printed circuit board having a pattern; An LED bonded to an upper surface of the printed circuit board and having a chip formed of a compound semiconductor to emit light when power is applied; A reflector positioned above the printed circuit board and reflecting light emitted from the LED; And at least one electrode terminal surface-mounted on the printed circuit board.

According to the LED display module of the present invention, it is possible to simplify the process and minimize the thickness by mounting the electrode terminal on the printed circuit board by the surface mount method.

Hereinafter, an embodiment of the LED display module according to the present invention will be described with reference to the accompanying drawings.

3 and 4 illustrate an LED display module according to an embodiment of the present invention, respectively.

As shown, the LED display module of the present embodiment is a printed circuit board 10 having a pattern is formed, the LED 20 bonded to the printed circuit board 10 and the wire bonded to the pattern 11, the printed circuit board 10 The reflector 40 fixed to the upper side, and the electrode terminal 50 is surface-mounted on the bottom of the printed circuit board 10.

The printed circuit board 10 has a pattern 11 formed to be connected to the LED 20. That is, the pattern 11 is soldered to the printed circuit board 10 so as to control the LED 20. When the current is connected to the LED 20 to flow a current, the LED 20 emits light.

The LED 20 is connected to the pattern 11 of the printed circuit board 10 so as to emit light when a power source is applied because a chip made of a compound semiconductor is embedded. Is designed to be.

In general, when the LED 20 is connected to the p-type semiconductor, negatively connected to the n-type semiconductor, and a forward current flows, the p-type hole and the n-type electron move to the pn junction and recombine. Since the energy state at the time of recombination becomes smaller than when they are separated from each other, it is to emit that much energy.

The reflector 40 is configured to control the light emitted from the LED 20, and is connected to the surface of the printed circuit board 10 by a surface mount technology process. The reflector 40 is made of, for example, a liquid crystal polymer (LCP) material so as to withstand high temperatures during the surface mounting process.

The diffuser plate 60 is positioned above the reflector 40 and configured to diffuse the light emitted from the LED 20, and should be able to ensure uniformity of luminance over the entire surface of each segment. The diffusion plate 60 black-processes the remaining part of the segment so that the light source from the LED 20 shines in an appropriate shape by each segment.

The manufacturing method of the LED display module of the present embodiment configured as described above will be described with reference to FIG. 5.

First, the LED 20 chip is bonded to the upper surface of the printed circuit board 10, the wire 30 is bonded so that the pattern of the LED 20 chip and the printed circuit board 10 are connected, and then the first test is performed. Rough

In addition, the reflector 40 is surface-mounted on the upper side of the printed circuit board 10 and the electrode terminal 50 is surface-mounted on the lower side, and then manufactured through a second test. As such, the reflector 40 and the electrode terminal 50 may be mounted on the printed circuit board 10 by the surface mounting method, thereby simplifying the process and minimizing the thickness.

In this case, the surface mounting method is to solder the printed circuit board 10, the reflector 40 and the electrode terminal 50 by flowing directly, so as to withstand the temperature conditions over the entire surface. Since the soldering temperature is about 260 ~ 270 degrees Celsius, the printed circuit board 10 and the reflector 40 should use a material that can withstand the above temperature.

On the other hand, the diffusion plate 60 is adhesively fixed to the upper side of the reflector using silicon or the like. At this time, the rest of the segment is subjected to a black screen so that the light source from the LED 20 emits light in an appropriate shape by each segment. Omit.

1 is a cross-sectional view showing an LED display module according to the prior art.

2 is a process chart for manufacturing the LED display module of FIG.

Figure 3 is a perspective view of the LED display module according to an embodiment of the present invention.

4 is a cross-sectional view of the LED display module according to FIG.

5 is a process chart for manufacturing the LED display module according to FIG.

<Description of Symbols for Main Parts of Drawings>

10; Printed circuit board 11; pattern

20; LED (chip) 30; wire

40; Reflector 50; Electrode terminal

60; Diffuser

Claims (4)

A printed circuit board having a pattern formed thereon; An LED bonded to an upper surface of the printed circuit board and having a chip formed of a compound semiconductor to emit light when power is applied; A reflector positioned above the printed circuit board and reflecting light emitted from the LED; And LED display module comprising at least one electrode terminal surface-mounted on the printed circuit board. The method according to claim 1, LED display module, characterized in that the upper side of the reflector further comprises a diffusion plate for diffusing the light emitted from the LED. LED fixing step of bonding the LED to the printed circuit board pattern is formed; A wire bonding step of bonding the wires so that the patterns and the LEDs of the printed circuit board are connected to each other; A reflector mounting step for surface-mounting the reflector on an upper side of the printed circuit board; The method of manufacturing an LED display module comprising an electrode terminal mounting step of surface-mounting the electrode terminal on the lower side of the printed circuit board. The method according to claim 3, And a diffuser plate fixing step of fixing a diffuser plate for diffusing light emitted from the LED on the upper side of the reflector.
KR1020070127634A 2007-12-10 2007-12-10 Led display module and manufacturing method thereof KR20090060713A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020070127634A KR20090060713A (en) 2007-12-10 2007-12-10 Led display module and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070127634A KR20090060713A (en) 2007-12-10 2007-12-10 Led display module and manufacturing method thereof

Publications (1)

Publication Number Publication Date
KR20090060713A true KR20090060713A (en) 2009-06-15

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070127634A KR20090060713A (en) 2007-12-10 2007-12-10 Led display module and manufacturing method thereof

Country Status (1)

Country Link
KR (1) KR20090060713A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013094833A1 (en) * 2011-12-20 2013-06-27 Han Yoon-Hee Optical led module and method of manufacturing optical led module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013094833A1 (en) * 2011-12-20 2013-06-27 Han Yoon-Hee Optical led module and method of manufacturing optical led module

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