WO2013094833A1 - Optical led module and method of manufacturing optical led module - Google Patents

Optical led module and method of manufacturing optical led module Download PDF

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Publication number
WO2013094833A1
WO2013094833A1 PCT/KR2012/005066 KR2012005066W WO2013094833A1 WO 2013094833 A1 WO2013094833 A1 WO 2013094833A1 KR 2012005066 W KR2012005066 W KR 2012005066W WO 2013094833 A1 WO2013094833 A1 WO 2013094833A1
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WO
WIPO (PCT)
Prior art keywords
printed circuit
circuit board
wire
led
circuit boards
Prior art date
Application number
PCT/KR2012/005066
Other languages
French (fr)
Korean (ko)
Inventor
한윤희
Original Assignee
Han Yoon-Hee
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Han Yoon-Hee filed Critical Han Yoon-Hee
Publication of WO2013094833A1 publication Critical patent/WO2013094833A1/en

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00—Illuminated signs; Luminous advertising
    • G09F13/20—Illuminated signs; Luminous advertising with luminescent surfaces or parts
    • G09F13/22—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/04—Provision of filling media
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/10—Lighting devices or systems using a string or strip of light sources with light sources attached to loose electric cables, e.g. Christmas tree lights
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/01—Housings, e.g. material or assembling of housing parts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
    • F21V21/002—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips making direct electrical contact, e.g. by piercing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00—Illuminated signs; Luminous advertising
    • G09F13/20—Illuminated signs; Luminous advertising with luminescent surfaces or parts
    • G09F13/22—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent
    • G09F2013/222—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent with LEDs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10356—Cables

Definitions

  • the present invention relates to a method for manufacturing an advertising LED module and an advertising LED module manufactured therefrom. Specifically, a case is formed around the printed circuit board on which the LED is surface-mounted by an insert injection method, thereby providing a complicated method.
  • the present invention relates to a method for manufacturing an advertising LED module for enabling the manufacture of a completed advertising LED module without undergoing a process and an advertising LED module manufactured therefrom.
  • the LED is used for advertising indoors or outdoors.
  • the LED is applied with low power consumption and easy installation.
  • the advertisement text formed on the back board and LED is installed and applied to the background plate, and recently, there is a tendency to switch to the character signboard which emits only the text area in the state where the background plate is excluded.
  • LED is applied like advertising panel or sign board
  • low voltage of 5 ⁇ 9V it can reduce electricity consumption by 60% compared to neon sign, and it has long life and is not damaged easily. It has the advantage of easy handling.
  • Korean Patent Laid-Open Publication No. 2004-49697 discloses an LED billboard having an electronic signboard structure in which LEDs are arranged in a lattice shape to emit various advertisement texts.
  • LEDs are arranged in a lattice shape to emit various advertisement texts.
  • the character itself is schematic, the aesthetics are inferior, there is a problem that it is difficult to express various designs.
  • Korean Patent No. 540592 discloses an LED signboard in which a plurality of LEDs are arranged along the design form in a channel of an advertising design, but is not applicable to an advertising signboard without a case or channel.
  • Korean Utility Model Registration No. 347653 discloses an LED module. The LED module is arranged along with the advertisement text to provide a structure for making the advertisement text.
  • the LED modules are arranged along the front direction of the LED module in a horizontal case formed by combining the lower frame and the upper frame, the LED module cannot be bent along the ad text, for example, to form an L-shape.
  • making the signboard is very cumbersome.
  • wires typically pass through the bottom of the case, and a small screw or the like is mounted on the upper side of the case by mounting a printed circuit board on which an LED lamp is mounted. After passing through the printed circuit board so that the covering of the wire is forcibly peeled off by the screw, a series of processes of molding with epoxy on the surface of the printed circuit board is performed.
  • Korean Patent Application No. 10-2011-0091821 (filed on Sep. 9, 2011) filed by the present applicant provides a "coupling structure between an LED lamp for printed circuit board and a printed circuit board".
  • connection pin which is press-through through the hole after solder masking is made into a hole drilled to be connected to a circuit pattern of the printed circuit board
  • the upper and lower openings are respectively formed in the lower end of the case having a partition plate partitioning the center in the longitudinal direction therein is formed a hole for the wire to be introduced along the longitudinal direction, the connection pin is partitioned
  • a case having a cover covering the lower end and having a through hole drilled in the partition plate for insertion through the plate;
  • the surface of the printed circuit board is subjected to epoxy molding to an area excluding the LED top surface, and then connected.
  • a process is disclosed in which a wire is stripped of a sheath in a region coinciding with a pin, and then the case is joined, and the bottom surface of the bonded case is epoxy molded to be covered with a cover and finished.
  • a separate case must be divided by injection molding. That is, the LED is divided into a case constituting a main body for mounting a printed circuit board on which the surface mount is processed, and a cover case configured to cover the bottom side of the main body case, and to be injection molded.
  • Korean Patent Application No. 10-2011-0091821 and Korean Patent Registration No. 10-1084979 filed by the present applicant are divided into two cases so as to be divided into a main body case and a cover case.
  • an epoxy molding process is performed to the space between the cover case to arrange the wires so that the contact pins formed on the bottom surface of the printed circuit board and the coated wires are contacted.
  • the case is divided into two injection molding after the injection process, etc., there may be a problem that the shortening degree in the process is insufficient.
  • the present invention has been made to solve the above-mentioned problems at a glance, and is completed by insert epoxy molding in the form of a case over the entire printed circuit board and wires including the surface-mounted LED in advance.
  • the purpose of the present invention is to complete the LED module in the finished state, thereby completely eliminating the conventional complicated process itself, and to allow the case itself to be epoxy-molded, thereby ensuring excellent watertightness and airtightness.
  • connection pin fixing step (S20) are arranged so that the printed circuit boards in the state in which the connection pins are fixed, each spaced apart, and arrange the wires so as to be connected to the connection pins protruding to the bottom surface of each printed circuit board, A wire covering step (S30) for removing the covering of the wire region region corresponding to the position in contact with each connection pin;
  • the present invention discloses a method for manufacturing an LED module for advertising, comprising an epoxy molding step (S40) for epoxy molding to surround a set of printed circuit boards.
  • the LED when manufacturing the LED module for advertising as before, the surface of the printed circuit board, the LED is mounted on the upper surface of the printed circuit board, and then the connection pins and the individual printed circuit board prepared by epoxy molding the printed circuit board, After injection molding the case and the cover for accommodating the printed circuit board with a resin or the like, the coated wire is disposed along a predetermined interval, and the connecting pins of the printed circuit board are positioned to be connected to the coated area of the wire, followed by printing. Stripped from a series of processes of epoxy molding on the bottom side of the circuit board, and the LED is printed as a whole while being temporarily connected to the wires coated at regular intervals to the connection pins fixed to the bottom side of the printed circuit board on which the surface is mounted.
  • Epoxy molding of the circuit board provides a simple, watertight and airtight LED module Joe so allows, it can be expected an effect to be able to ensure good reliability of the products and simplifies the manufacturing process of the advertising LED modules.
  • FIGS. 2 and 3 illustrate a printed circuit board that can be employed in the present invention.
  • FIG. 4 is a view showing an example of a connecting pin for protruding to the bottom side of the printed circuit board and to be connected to the covering area of the electric wire;
  • FIG. 5 is a view showing another example of a connecting pin for protruding to the bottom side of a printed circuit board and for connecting with a covering area of an electric wire;
  • FIG. 6 is a cross-sectional view showing an example to be connected to the covering area of the wire by applying the connecting pin shown in FIG.
  • FIG. 7 is a cross-sectional view showing an example to be connected to the covering area of the wire by applying the connecting pin shown in FIG.
  • FIG. 8 is an exemplary view of a printed circuit board to which the connection pins according to FIGS. 4 and 5 are applied.
  • FIG. 9 is a view illustrating a state in which a printed circuit board is disposed along a covering area of an electric wire, and a connection pin of the printed circuit board is temporarily connected to the covering area.
  • FIG. 10 is an enlarged view of a portion “A” of FIG. 9.
  • FIG. 11 is a cross-sectional view illustrating an example in which an epoxy molding part is formed by epoxy molding the entire printed circuit board prepared by FIG. 9.
  • FIG. 11 is a cross-sectional view illustrating an example in which an epoxy molding part is formed by epoxy molding the entire printed circuit board prepared by FIG. 9.
  • FIG. 13 is a view according to another embodiment of the present invention.
  • Figure 15 is a perspective view according to another embodiment of the case and the lower case in the present invention.
  • 16 is a cross-sectional view showing a completed LED module by epoxy molding using a case according to another embodiment of the present invention.
  • 17 is a cross-sectional view showing a completed LED module by epoxy molding using a lower case according to another embodiment of the present invention.
  • the present invention is a surface-mounted LED surface mounting step (S10) for solder masking the LED on the surface of a set of printed circuit board, and the printed circuit board through the LED surface mounting step (S10), through the connection pin, but the printed circuit A printed circuit board in which the connecting pin is fixed by the connecting pin fixing step (S20) and the connecting pin fixing step (S20) for protruding downwardly through the substrate and soldering the connection pins to the printed circuit board.
  • Wires are arranged so as to be spaced apart from each other at a predetermined interval, and the wires are arranged to be connected to the connection pins protruding to the bottom of each printed circuit board, and the wire covering step of removing the coating of the wire part area corresponding to the position contacting the respective connection pins. (S30) and temporarily fixed between the coated wire portion and the connecting pin in a state in which the area covered by the wire and the connecting pin are in contact with each other by the wire covering step (S30), and then the wire is fixed.
  • the plurality of printed circuit boards arranged at equal intervals is composed of an epoxy molding step (S40) for epoxy molding to sequentially surround the entire set of printed circuit board.
  • the present invention relates to a method for manufacturing an advertising LED module and an advertising LED module manufactured therefrom. After the LED is connected to the printed circuit board on which the surface is mounted, the connecting pin is configured downward, and the wire coated with the connecting pin is Providing an advertising LED module that proceeds through the epoxy molding as a whole in the disposed state.
  • LED surface mounting step (S10), connecting pin fixing step (S20), the wire covering step (S30), and epoxy molding step (S40).
  • This step refers to the step of surface-mounting the LED 20 to the printed circuit board 10, the circuit is patterned on the surface can be followed according to the conventional method, the process according to a detailed embodiment thereof is omitted Let's do it.
  • This step is to fix the connection pin (11) to enable the conductive part exposed to the cover area 31 of the wire 30 to be described later to the printed circuit board 10 through the LED surface mounting step (S10). Means to do.
  • the connecting pin 11 has a wire gripping groove 110 having an end portion having a “ ⁇ ” shape, and the pin 111 extending from the wire gripping groove 110 is a printed circuit.
  • the substrate 10 to be soldered on the upper surface of the printed circuit board 10 (see Figure 5).
  • the wire gripping groove 110 should be understood as a portion to which the covering region 31 of the wire 30 is fitted, and in the present invention, the pin 111 extends from the wire gripping groove 110 to print the printed circuit board 10.
  • the wire gripping groove 110 and the pin 111 will be referred to as a connection pin (11).
  • connection pin 11 can be implemented differently as shown in FIG.
  • the connecting pin 11 is formed in a “ ⁇ ” shape so as to penetrate downward from the upper surface of the printed circuit board 10, and then the wire 30 into the wire holding groove 110 formed by the “ ⁇ ” shape. ) Can be gripped (see Fig. 7).
  • the step of mounting the surface of the LED (S10), and the connecting pin fixing step (S20) for fixing the connecting pin 11 to the printed circuit board 10 The printed circuit board 10 to be passed is prepared as shown in FIG. 8, and a large amount of the printed circuit board 10 is prepared.
  • This step refers to the step of covering the wire 30, to form a coating area 31 to be coated at a predetermined interval along the wire 30, the separation distance of the covering area 31 is It will be equal to the separation distance that the printed circuit board 10 is disposed.
  • the separation distance at which the printed circuit board 10 is disposed along the wire 30 may vary depending on the shape, shape, or structure of an advertisement panel or advertisement text consisting only of letters.
  • the printed circuit board 10 may be configured to form a separation distance along the wire 30 to selectively apply the arrangement of the printed circuit board 10 as necessary in the field.
  • the coating area 31 of the wire 30 to be coated as described above is fitted into the wire gripping groove 110 of the connection pin 11 described above, while the printed circuit board 10 is along the wire 30 as shown in FIG. 9. ) Is placed.
  • the epoxy molding step S40 may include mounting the LEDs 20 on the printed circuit board 10, and then connecting the pins 11 so that the wire holding grooves 110 protrude toward the bottom surface of the printed circuit board 10. ), The wire 30 having the covering areas 31 spaced at regular intervals at fixed intervals is arranged such that the covering area 31 is fitted into the wire holding groove 110 of the connecting pin 11. As shown in FIG. 9, an epoxy molding process is performed on the entire printed circuit board 10 arranged along a wire 30 having a predetermined length.
  • the entire printed circuit board 10 is molded through an injection molding molding method, and the epoxy is entirely molded.
  • the shape after molding is preferably the same as that of a conventional case.
  • the epoxy molded case is referred to as an epoxy molding part 40 in the present invention
  • a finished product made through such an epoxy molding process will be referred to as an LED module 1 in the present invention.
  • the printed circuit board 10 is enclosed using a case and the like, and then epoxy molding is performed on the upper surface of the printed circuit board 10 and the bottom surface is covered using a cover or the like. Next, without the process of molding the bottom of the printed circuit board 10 by the epoxy molding, the printed circuit board 10 is put into the insert injection mold as a whole it is possible to obtain a simple LED module (1) by the epoxy molding process.
  • Such an LED module 1 is in a state of being transparent as shown in FIG. 12, as well as being able to completely control the penetration of moisture in an advertising panel installed outside, the wire 30 and the LED module 1.
  • the arrangement of the can be made freely so that the expression of the advertising content to have a variety of characters, patterns and shapes.
  • the object of the present invention can be achieved by the following implementation.
  • the case 50 to accommodate the printed circuit board 10 ) And then injection molding (S310) accommodating the printed circuit board 10 into the case 50, and then completing the resin injection step (S410) into the case 50 to complete the LED module 1. Can be obtained.
  • the rimimure guide 51 for guiding the end of the connecting pin 11 to be inserted into the printed circuit board 10 to the bottom surface side of the case 50 in which the printed circuit board 10 is accommodated
  • the lower end of the connecting pin 11 protruding toward the bottom surface and holding the covering area 31 of the electric wire 30 is recessed. It is preferable to forcibly wrap the covering area 31 positioned at 110.
  • the connecting pin 11 surrounding the covering area 31 of the electric wire 30 has a phenomenon that the lower end of the connecting pin 11 is opened when the resin is inserted at a high pressure during the epoxy molding process. It is to exclude.
  • the lower end of the connection pin 11 is recessed and the wires of the connection pin 11 are closed.
  • the resin is injected through the upper surface side of the case 50.
  • the lower case 50 'in the present embodiment is injection molded only in which the printed circuit board 10 is seated.
  • the resin injection molding step 420 described later the lower case 50 '
  • the resin is injection molded.
  • the resin is injected into the case 50 to be molded, whereas in the present embodiment, the printed circuit board 10, in which the wire is connected to the lower case 50 ′, is injected into the injection mold.
  • a transparent resin is injected into the injection mold so that the lower case 50 'may be injected in the form of enclosing all of the lower case 50'.
  • the rimim guide 51 for preventing the cover area 31 of the separation is formed to the bottom of the lower case 50 '.
  • the case 50 and the lower case 50 ' can be implemented differently.
  • the wire receiving groove 52 capable of accommodating the wire 30 and the coating area accommodating groove 53 capable of accommodating the covering area 31 are formed on the bottom surface side of the case 50 and the lower case 50 '.
  • the wire 30 and the cover area 31 can be more stably seated in the case 50 and the lower case 50 '.
  • the position of the wire 30 and the coating area 31 does not change in the injection molding of the resin by forming the wire receiving groove 52 and the coating area receiving groove 53 so as to be connected to the coating area 31.
  • the reliability of the connection between the pins 11 can be improved.
  • the present invention is simple and excellent in watertightness and airtightness by epoxy molding the printed circuit board as a whole while the LED is temporarily connected to the wire coated at a predetermined interval to the connection pin fixed to the bottom of the printed circuit board on which the surface is mounted. Since the LED module can be manufactured, there is industrial applicability by providing a method of manufacturing an LED module for advertising and an LED module for advertising, which can simplify the manufacturing process of the advertising LED module and ensure excellent reliability of the product.

Abstract

The present invention relates to a method of manufacturing an optical LED module, comprising: an LED surface mounting step (S10) of surface mounting through solder masking an LED on a top surface of a group of printed circuit boards; a connection pin fixing step (S20) of passing connection pins through the printed circuit boards that have undergone the LED surface mounting step (S10) such that the connection pins pass through to project downward from the printed circuit boards, and soldering the connection pins and the printed circuit boards; a wire coating step (S30) of disposing each of the printed circuit boards at uniform intervals with the connection pins fixed by means of the connection pin fixing step (S20), disposing wires to be connected to the connection pins projecting from the undersurface of each printed circuit board, and stripping the regions of the wires corresponding to the positions at which they connect to each of the connection pins; and an epoxy molding step (S40) of pre-fixing the coated wire portions with the connection pins in a state where the coated regions of the wires and the connection pins are connected by means of the wire coating step (S30), and then performing epoxy molding sequentially on the plurality of printed circuit boards disposed at uniform intervals along the wires such that one group of printed circuit boards is completely enclosed. A thus-manufactured LED module is provided, and individual printed circuit boards are prepared in the same manner as when manufacturing existing LED modules for advertisements by surface mounting LEDs on the top surfaces of the printed circuit boards, then configuring connection pins, and epoxy mold processing the top surfaces of the printed circuit boards. After injection molding a case and a cover for receiving the printed circuit boards by using resin or the like, the wires that are coated are arranged at uniform intervals, the connection pins of the printed circuit boards are positioned to connect to the coated regions of the wires, and then the wires are stripped in the serial process of epoxy mold processing the undersurface sides of the printed circuit boards. With the coated wires pre-connected at uniform intervals to the connection pins fixed on the undersurface sides of the printed circuit boards that have the LEDs surface mounted thereon, the printed circuit boards are epoxy molded overall to enable the convenient manufacturing of an LED module having good water tightness and air tightness. Thus, a method of manufacturing an LED module for advertisements and an LED module for advertisements which is manufactured through same can be expected to have the effects of simplifying the manufacturing process of an LED module for advertisements and securing good product reliability.

Description

광고용 엘이디 모듈 및 광고용 엘이디 모듈 제조방법Advertising LED Module and Advertising LED Module Manufacturing Method
본 발명은 광고용 엘이디 모듈 제조방법과, 이로부터 제조되는 광고용 엘이디 모듈에 관한 것으로, 상세하게는 LED가 표면 실장 되는 인쇄회로기판의 주위를 인서트 사출 방식에 의해 케이스를 구성하여, 종전과 같은 번잡한 공정을 거치지 않는 상태에서 완성된 광고용 엘이디 모듈의 제조가 가능하도록 하기 위한 광고용 엘이디 모듈 제조방법 및 이로부터 제조되는 광고용 엘이디 모듈에 관한 것이다.The present invention relates to a method for manufacturing an advertising LED module and an advertising LED module manufactured therefrom. Specifically, a case is formed around the printed circuit board on which the LED is surface-mounted by an insert injection method, thereby providing a complicated method. The present invention relates to a method for manufacturing an advertising LED module for enabling the manufacture of a completed advertising LED module without undergoing a process and an advertising LED module manufactured therefrom.
실내 또는 실외에서 광고용으로 사용되는 것으로 전력소비가 적고 설치가 용이한 엘이디(LED)가 적용되고 있는 실정인데, 이러한 엘이디(LED)가 적용되는 광고패널 또는 광고사인몰에는 백보드에 형성되는 광고문안 및 배경판에 엘이디가 설치 적용되고 있으며, 최근들어서는 배경판이 배제된 상태에서 문자영역만 발광되도록 하는 문자간판으로 전환되는 추세에 있다. It is used for advertising indoors or outdoors. The LED is applied with low power consumption and easy installation. In the advertising panel or advertising signboard to which the LED is applied, the advertisement text formed on the back board and LED is installed and applied to the background plate, and recently, there is a tendency to switch to the character signboard which emits only the text area in the state where the background plate is excluded.
이와 같은 광고패널 또는 문자간판과 같이 LED 를 적용하게 되는 광고방식의 경우, 5~9V의 저전압을 사용함으로써 안전하면서도 네온간판에 비해 전기소모량을 60% 정도 줄일 수 있으며, 수명이 길고, 잘 파손되지 않아 취급이 용이한 장점을 가지고 있다.In the case of advertising method that LED is applied like advertising panel or sign board, by using low voltage of 5 ~ 9V, it can reduce electricity consumption by 60% compared to neon sign, and it has long life and is not damaged easily. It has the advantage of easy handling.
엘이디 광고간판 등은 여러가지 종류가 있는데, 예컨대 한국 공개특허 제2004-49697호에는 엘이디들을 격자형으로 배치하여, 각종 광고문안을 발광시키는 전광판 구조의 엘이디 광고간판이 개시되어 있다. 그런데, 이러한 엘이디 광고간판의 경우에는, 문자광고에는 적절하지만, 그 문자 자체가 도식적이어서 미감이 떨어지고, 다양한 도안을 표현하기 힘든 문제점이 있다.There are various kinds of LED billboards. For example, Korean Patent Laid-Open Publication No. 2004-49697 discloses an LED billboard having an electronic signboard structure in which LEDs are arranged in a lattice shape to emit various advertisement texts. By the way, in the case of such an LED sign, it is suitable for text advertising, but the character itself is schematic, the aesthetics are inferior, there is a problem that it is difficult to express various designs.
또한, 한국 등록특허 제540592호에는, 광고도안 형태의 채널 내부에 그 도안 형태를 따라 다수 개의 엘이디들을 배열한 엘이디 광고간판이 개시되어 있으나, 케이스나 채널이 없는 형태의 광고간판 에는 적용할 수 없는 문제점이 있으며, 한국 등록실용신안 제347653호에는 엘이디 모듈이 개시되어 있는데, 광고문안을 따라 엘이디 모듈을 배치하여 광고문안을 만들게 되는 구조를 제공하고 있다. In addition, Korean Patent No. 540592 discloses an LED signboard in which a plurality of LEDs are arranged along the design form in a channel of an advertising design, but is not applicable to an advertising signboard without a case or channel. There is a problem, and the Korean Utility Model Registration No. 347653 discloses an LED module. The LED module is arranged along with the advertisement text to provide a structure for making the advertisement text.
그러나, 상기한 엘이디 모듈은 하부프레임과 상부프레임을 결합하여 이루어지는 수평케이스에서 그 앞쪽의 길이방향을 따라 엘이디들이 배열되어 있으므로, 엘이디 모듈을 광고문안을 따라 굴곡할 수 없는바, 예컨대 L자형을 만들려면 수평부분과 수직부분에 대응하여 2개로 절단한 엘이디 모듈을 배치하여 전선들을 접속하여야 하므로, 광고간판을 만드는 작업이 대단히 번거롭다. However, since the LED modules are arranged along the front direction of the LED module in a horizontal case formed by combining the lower frame and the upper frame, the LED module cannot be bent along the ad text, for example, to form an L-shape. In order to connect the wires by arranging the LED module cut in two corresponding to the horizontal part and the vertical part, making the signboard is very cumbersome.
특히, 전술한 바와 같이 꺽인 부위나 곡선 부위가 많은 광고문안을 가진 광고간판을 만들기는 매우 어려운 문제점이 있다. In particular, as described above, there is a problem that it is very difficult to make a billboard with a large number of advertising texts or a curved portion.
최근에 이르러서는 상기한 엘이디들이 다수개 형성되는 블럭화된 유니트들을 이용하여 전원케이블로 접속하여서 되는 것으로 한국 등록특허 제550400호나 공개특허 제2010-18843호와 같은 유사한 구성을 갖는 기술내용이 개시되고 있다. Recently, the technical contents having a similar configuration, such as Korean Patent No. 550400 or Korean Patent No. 2010-18843, have been disclosed to be connected by a power cable using a block unit in which a plurality of LEDs are formed. .
이와 같이 블럭화된 유니트들을 전원케이블로 상호 연결하는 경우, 통상적으로 케이스의 하단으로 전선이 지나가도록 하고, 케이스의 상측에서 LED 램프가 표면실장된 인쇄회로기판을 안착시킨 후, 작은 나사 등을 이용하여 인쇄회로기판을 관통하여 상기 전선의 피복이 나사에 의해 강제로 벗겨지도록 한 후, 인쇄회로기판 표면상에 에폭시로 몰딩처리하는 일련의 과정을 거쳐 이루어진다. In the case of interconnecting the blocked units with a power cable, wires typically pass through the bottom of the case, and a small screw or the like is mounted on the upper side of the case by mounting a printed circuit board on which an LED lamp is mounted. After passing through the printed circuit board so that the covering of the wire is forcibly peeled off by the screw, a series of processes of molding with epoxy on the surface of the printed circuit board is performed.
그러나, 상기한 바와 같이 작은 나사 등을 이용하여 인쇄회로기판을 관통하며 전선의 피복이 벗겨지도록 하여 통전되도록 하는 경우, 작업자의 숙련도에 따라 피복이 탈피된 전선과 나사간 완전한 접촉이 이루어지지 않아 전원 공급이 단락되어 불『량률을 증가시키는 요인으로 작용하여 왔다. However, as described above, when a small screw or the like penetrates the printed circuit board and the electric wire is peeled off so that the electric wire is energized, the electric wire is not completely contacted with the electric stripped wire and the screw according to the skill of the operator. Short circuits have been a factor in increasing yield rates.
따라서, 이러한 문제점을 개선하기 위해 본원인에 의해 기출원된 대한민국 특허출원 제 10-2011-0091821 호 (2011-09-09자 출원)에 의해 "간판용 엘이디 램프와 인쇄회로기판간 결합구조"를 개시하였는바, Therefore, in order to improve such a problem, Korean Patent Application No. 10-2011-0091821 (filed on Sep. 9, 2011) filed by the present applicant provides a "coupling structure between an LED lamp for printed circuit board and a printed circuit board". As we started,
즉 『 LED 램프가 다수 표면실장되는 인쇄회로기판과, `` Printed circuit boards with a large number of LED lamps surface-mounted,
상기 인쇄회로기판의 회로패턴과 연결되도록 천공되는 구멍으로 솔더마스크 처리한 후 상기 구멍을 통해 압입 관통되어지는 접속핀과, A connection pin which is press-through through the hole after solder masking is made into a hole drilled to be connected to a circuit pattern of the printed circuit board;
상기 인쇄회로기판이 안착되는 것으로, 상하부가 각각 개구되며 내부에 길이방향으로 중앙을 구획하는 구획판을 갖는 케이스의 하단으로 길이방향을 따라 전선이 인입되기 위한 인입공이 형성되고, 상기 접속핀이 구획판으로 삽입 관통되기 위해 상기 구획판에 천공되는 통공을 갖으며 하단부를 커버링하는 커버를 갖는 케이스와, Wherein the printed circuit board is seated, the upper and lower openings are respectively formed in the lower end of the case having a partition plate partitioning the center in the longitudinal direction therein is formed a hole for the wire to be introduced along the longitudinal direction, the connection pin is partitioned A case having a cover covering the lower end and having a through hole drilled in the partition plate for insertion through the plate;
상기 케이스의 구획판 상면에 안착 되는 인쇄회로기판의 접속핀이 위치하는 지점의 전선 위치의 피복을 탈피하여 상기 접속핀과 전선간 통전이 가능하도록 하고, 상기 인쇄회로기판 상면과 케이스 하단측으로 에폭시몰딩부를 형성하게 되는 간판용 엘이디 램프와 인쇄회로기판간 결합구조. 』로 하여 출원된바 있다. Peel off the covering of the wire position at the point where the connection pin of the printed circuit board seated on the upper surface of the partition plate of the case to enable the connection between the connection pin and the wire, and epoxy molding to the upper surface of the printed circuit board and the bottom of the case Joining structure between the LED lamp for signboard and the printed circuit board forming a part. Has been filed.
이와 같이 본원인에 의해 개시되는 선행 기술의 경우에 있어서도, 인쇄회로기판상에 LED를 표면실장 처리한 다음 솔더마스크 처리 후 인쇄회로기판 표면에 LED 상면을 제외한 영역으로 에폭시 몰딩 처리하도록 한 다음, 접속핀과 일치되는 영역으로 피복이 탈피된 전선이 위치되도록 한 후 케이스를 결합하고, 그 결합된 케이스 저면으로 에폭시 몰딩처리하여 커버로 덮어 마무리하게 되는 과정이 개시되어 있다. In the case of the prior art disclosed by the present inventors as well, after surface-mounting the LEDs on the printed circuit board and then performing solder soldering, the surface of the printed circuit board is subjected to epoxy molding to an area excluding the LED top surface, and then connected. A process is disclosed in which a wire is stripped of a sheath in a region coinciding with a pin, and then the case is joined, and the bottom surface of the bonded case is epoxy molded to be covered with a cover and finished.
따라서, 본원인에 의한 선행 기술을 실시하기 위해서는 별도의 케이스를 상하로 나누어 사출 성형하여야 한다. 즉 LED가 표면실장처리되는 인쇄회로기판이 안착되기 위한 본체를 구성하는 케이스와, 상기 본체 케이스의 저면측을 덮도록 구성되는 커버케이스로 나누어져, 사출 성형되어야 한다. Therefore, in order to carry out the prior art by the present inventors, a separate case must be divided by injection molding. That is, the LED is divided into a case constituting a main body for mounting a printed circuit board on which the surface mount is processed, and a cover case configured to cover the bottom side of the main body case, and to be injection molded.
이와 같은 공정과 유사한 선행기술이 대한민국 특허등록 제 10-1084979 호에도 개시되어 있다. Prior art similar to this process is disclosed in Korean Patent Registration No. 10-1084979.
상기한 바와 같이 본원인에 의해 출원된 한국 특허등록출원 제 10-2011-0091821 호와, 대한민국 특허등록 제 10-1084979 호는 케이스를 두개로 나누어 본체 케이스와 덮개 케이스로 구분되도록 하여, 인쇄회로기판이 안착된 후 인쇄회로기판의 저면으로 형성되는 접속핀과, 피복된 전선간의 접촉이 이루어지도록 전선의 배치가 이루어지도록 덮개 케이스간의 공간으로 에폭시 몰딩 처리하게 되는바, 이러한 기술에 의할 경우 전술한 문제점과 같이 케이스를 두개로 나누어 사출 성형한 후 결합하는 과정 등을 거쳐야 하므로, 공정상에서의 단축 정도가 미비한 문제가 존재할 수 있다. As described above, Korean Patent Application No. 10-2011-0091821 and Korean Patent Registration No. 10-1084979 filed by the present applicant are divided into two cases so as to be divided into a main body case and a cover case. After the seat is mounted, an epoxy molding process is performed to the space between the cover case to arrange the wires so that the contact pins formed on the bottom surface of the printed circuit board and the coated wires are contacted. Like the problem, since the case is divided into two injection molding after the injection process, etc., there may be a problem that the shortening degree in the process is insufficient.
따라서 본 발명은 전술한 문제점 들을 일거에 해소하기 위해 안출한 것으로서, 표면실장 처리되는 LED를 포함하는 인쇄회로기판과 전선간을 미리 가접지 시킨 상태에서 전체에 걸쳐서 케이스 형태로 인서트 에폭시 몰딩 처리하여 완성된 상태의 엘이디 모듈을 완성할 수 있도록 하여, 기존과 같은 번잡한 공정 자체를 완전히 해소하고 아울러 케이스 자체를 에폭시 몰딩 성형 되도록 하므로서, 수밀성 및 기밀성의 우수한 확보가 가능하도록 하는 데 그 목적을 둔다.Accordingly, the present invention has been made to solve the above-mentioned problems at a glance, and is completed by insert epoxy molding in the form of a case over the entire printed circuit board and wires including the surface-mounted LED in advance. The purpose of the present invention is to complete the LED module in the finished state, thereby completely eliminating the conventional complicated process itself, and to allow the case itself to be epoxy-molded, thereby ensuring excellent watertightness and airtightness.
상기한 목적을 달성하기 위한 본 발명은, The present invention for achieving the above object,
한조의 인쇄회로기판 상면에 LED를 솔더마스킹하며 표면실장 처리하는 LED 표면실장단계(S10)와, LED surface mounting step (S10) for solder-masking the LED on the surface of a set of printed circuit boards, and surface mount processing,
상기 LED 표면실장단계(S10)를 거친 인쇄회로기판에, 접속핀을 관통하되 인쇄회로기판 하방측으로 돌출 관통되도록 하고, 상기 접속핀과 인쇄회로기판간을 납땜 처리하는 접속핀 고정단계(S20)와, A connection pin fixing step (S20) for penetrating the connection pin to the printed circuit board which has undergone the LED surface mounting step (S10), protruding downwardly from the printed circuit board, and soldering the connection pin to the printed circuit board; ,
상기 접속핀 고정단계(S20)에 의해 상기 접속핀이 고정된 상태의 인쇄회로기판을 각각 일정 간격 이격되도록 배치하고, 각각의 인쇄회로기판 저면으로 돌출된 접속핀과 접속되도록 전선을 배치하되, 상기 각각의 접속핀과 접하는 위치에 해당되는 전선 부위 영역의 피복을 탈피하는 전선 피복 단계(S30)와, By the connection pin fixing step (S20) are arranged so that the printed circuit boards in the state in which the connection pins are fixed, each spaced apart, and arrange the wires so as to be connected to the connection pins protruding to the bottom surface of each printed circuit board, A wire covering step (S30) for removing the covering of the wire region region corresponding to the position in contact with each connection pin;
상기 전선 피복 단계(S30)에 의해 상기 전선에서 피복된 영역과 접속핀이 접하는 상태에서 상기 피복된 전선 부위와 접속핀간을 가고정 시킨 후, 전선을 따라 등간격 배치되는 다수의 인쇄회로기판을 순차적으로 한조의 인쇄회로기판 전체를 에워싸도록 에폭시 몰딩처리하는 에폭시 몰딩단계(S40)로 이루어지는 것을 특징으로 하는 광고용 엘이디 모듈 제조방법을 개시한다.After temporarily fixing between the coated wire part and the connecting pin in a state where the wire covered area and the contact pin are in contact with each other by the wire covering step (S30), a plurality of printed circuit boards arranged at equal intervals along the wire are sequentially The present invention discloses a method for manufacturing an LED module for advertising, comprising an epoxy molding step (S40) for epoxy molding to surround a set of printed circuit boards.
본 발명에 의하면, 종전과 같이 광고용 엘이디 모듈을 제조할 때 인쇄회로기판 상면에 LED 를 표면실장처리한 다음 접속핀을 구성하고 인쇄회로기판 상면을 에폭시 몰딩 처리하여서 되는 개별적인 인쇄회로기판을 준비하고, 상기 인쇄회로기판을 수용하기 위한 케이스와 커버 등을 수지 등으로 사출 성형한 다음 일정간격을 따라 피복 처리된 전선을 배치하고 인쇄회로기판의 접속핀을 전선의 피복영역에 접속되도록 위치 시킨 후, 인쇄회로기판의 저면측을 에폭시 몰딩 처리하는 일련의 과정에서 탈피하여, LED가 표면실장 처리되는 인쇄회로기판의 저부측으로 고정되어 있는 접속핀에 일정간격으로 피복처리되는 전선에 가접속시킨 상태에서 전체적으로 인쇄회로기판을 에폭시 몰딩 처리하여 간편하면서도 수밀성 및 기밀성이 우수한 엘이디 모듈의 제조가 가능하게 되므로, 광고용 엘이디 모듈의 제조 공정의 단순화 및 제품의 우수한 신뢰성을 확보할 수 있게 되는 효과를 기대할 수 있다.According to the present invention, when manufacturing the LED module for advertising as before, the surface of the printed circuit board, the LED is mounted on the upper surface of the printed circuit board, and then the connection pins and the individual printed circuit board prepared by epoxy molding the printed circuit board, After injection molding the case and the cover for accommodating the printed circuit board with a resin or the like, the coated wire is disposed along a predetermined interval, and the connecting pins of the printed circuit board are positioned to be connected to the coated area of the wire, followed by printing. Stripped from a series of processes of epoxy molding on the bottom side of the circuit board, and the LED is printed as a whole while being temporarily connected to the wires coated at regular intervals to the connection pins fixed to the bottom side of the printed circuit board on which the surface is mounted. Epoxy molding of the circuit board provides a simple, watertight and airtight LED module Joe so allows, it can be expected an effect to be able to ensure good reliability of the products and simplifies the manufacturing process of the advertising LED modules.
도 1은 본 발명의 공정을 나타낸 공정도1 is a process diagram showing the process of the present invention
도 2 및 도 3은 본 발명에 채택될 수 있는 인쇄회로기판을 나타낸 도면2 and 3 illustrate a printed circuit board that can be employed in the present invention.
도 4는 인쇄회로기판의 저부측으로 돌출되며 전선의 피복영역과 접속되도록 하기 위한 접속핀의 일예를 나타낸 도면4 is a view showing an example of a connecting pin for protruding to the bottom side of the printed circuit board and to be connected to the covering area of the electric wire;
도 5는 인쇄회로기판의 저부측으로 돌출되며 전선의 피복영역과 접속되도록 하기 위한 접속핀의 다른 예를 나타낸 도면5 is a view showing another example of a connecting pin for protruding to the bottom side of a printed circuit board and for connecting with a covering area of an electric wire;
도 6은 도 4에 의한 접속핀을 적용하여 전선의 피복영역과 접속되도록 하는 예를 도시한 단면도6 is a cross-sectional view showing an example to be connected to the covering area of the wire by applying the connecting pin shown in FIG.
도 7은 도 5에 의한 접속핀을 적용하여 전선의 피복영역과 접속되도록 하는 예를 도시한 단면도7 is a cross-sectional view showing an example to be connected to the covering area of the wire by applying the connecting pin shown in FIG.
도 8의 각 도면은 도 4, 도 5에 의한 접속핀이 적용된 인쇄회로기판의 예시도8 is an exemplary view of a printed circuit board to which the connection pins according to FIGS. 4 and 5 are applied.
도 9는 전선의 피복영역을 따라 인쇄회로기판이 배치되며, 상기 인쇄회로기판의 접속핀이 상기 피복영역에 가접속된 상태를 나타낸 도면9 is a view illustrating a state in which a printed circuit board is disposed along a covering area of an electric wire, and a connection pin of the printed circuit board is temporarily connected to the covering area.
도 10은 도 9의 "A" 부분을 확대 도시한 도면FIG. 10 is an enlarged view of a portion “A” of FIG. 9.
도 11은 도 9에 의해 준비된 인쇄회로기판 전체를 에폭시 몰딩 처리하여 에폭시 몰딩부가 형성된 예를 도시한 단면도FIG. 11 is a cross-sectional view illustrating an example in which an epoxy molding part is formed by epoxy molding the entire printed circuit board prepared by FIG. 9. FIG.
도 12는 에폭시 몰딩에 의한 완성된 LED 모듈을 도시한 사시도12 is a perspective view of a completed LED module by epoxy molding
도 13은 본 발명의 다른 실시예에 의한 도면13 is a view according to another embodiment of the present invention.
도 14는 본 발명의 또 다른 실시예에 의한 도면14 is a view according to another embodiment of the present invention
도 15는 본 발명에서 케이스 및 하단케이스의 다른 실시예에 의한 분시 사사도Figure 15 is a perspective view according to another embodiment of the case and the lower case in the present invention
도 16은 본 발명에서 다른 실시예에 의한 케이스를 이용해 에폭시 몰딩에 의한 완성된 LED 모듈을 도시한 단면도16 is a cross-sectional view showing a completed LED module by epoxy molding using a case according to another embodiment of the present invention.
도 17은 본 발명에서 다른 실시예에 의한 하단케이스를 이용해 에폭시 몰딩에 의한 완성된 LED 모듈을 도시한 단면도17 is a cross-sectional view showing a completed LED module by epoxy molding using a lower case according to another embodiment of the present invention.
본 발명은 한조의 인쇄회로기판 상면에 LED를 솔더마스킹하며 표면실장 처리하는 LED 표면실장단계(S10)와, 상기 LED 표면실장단계(S10)를 거친 인쇄회로기판에, 접속핀을 관통하되 인쇄회로기판 하방측으로 돌출 관통되도록 하고, 상기 접속핀과 인쇄회로기판간을 납땜 처리하는 접속핀 고정단계(S20)와, 상기 접속핀 고정단계(S20)에 의해 상기 접속핀이 고정된 상태의 인쇄회로기판을 각각 일정 간격 이격되도록 배치하고, 각각의 인쇄회로기판 저면으로 돌출된 접속핀과 접속되도록 전선을 배치하되, 상기 각각의 접속핀과 접하는 위치에 해당되는 전선 부위 영역의 피복을 탈피하는 전선 피복 단계(S30)와, 상기 전선 피복 단계(S30)에 의해 상기 전선에서 피복된 영역과 접속핀이 접하는 상태에서 상기 피복된 전선 부위와 접속핀간을 가고정 시킨 후, 전선을 따라 등간격 배치되는 다수의 인쇄회로기판을 순차적으로 한조의 인쇄회로기판 전체를 에워싸도록 에폭시 몰딩처리하는 에폭시 몰딩단계(S40)로 구성된다.The present invention is a surface-mounted LED surface mounting step (S10) for solder masking the LED on the surface of a set of printed circuit board, and the printed circuit board through the LED surface mounting step (S10), through the connection pin, but the printed circuit A printed circuit board in which the connecting pin is fixed by the connecting pin fixing step (S20) and the connecting pin fixing step (S20) for protruding downwardly through the substrate and soldering the connection pins to the printed circuit board. Wires are arranged so as to be spaced apart from each other at a predetermined interval, and the wires are arranged to be connected to the connection pins protruding to the bottom of each printed circuit board, and the wire covering step of removing the coating of the wire part area corresponding to the position contacting the respective connection pins. (S30) and temporarily fixed between the coated wire portion and the connecting pin in a state in which the area covered by the wire and the connecting pin are in contact with each other by the wire covering step (S30), and then the wire is fixed. According to the plurality of printed circuit boards arranged at equal intervals is composed of an epoxy molding step (S40) for epoxy molding to sequentially surround the entire set of printed circuit board.
이하 본 발명의 바람직한 실시예들을 첨부하는 도면을 참조하여 설명한다. Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.
본 발명은 광고용 엘이디 모듈 제조방법과 이로부터 제조되는 광고용 엘이디 모듈에 대한 것으로, 엘이디가 표면 실장 처리되는 인쇄회로기판으로 접속핀이 하방향 구성되도록 한 후, 상기 접속핀을 통해 피복 처리된 전선이 배치된 상태에서 에폭시 몰딩을 전체적으로 진행하여 케이스화 하는 광고용 엘이디 모듈을 제공한다. The present invention relates to a method for manufacturing an advertising LED module and an advertising LED module manufactured therefrom. After the LED is connected to the printed circuit board on which the surface is mounted, the connecting pin is configured downward, and the wire coated with the connecting pin is Providing an advertising LED module that proceeds through the epoxy molding as a whole in the disposed state.
- 제 1 실시예 -First Embodiment
상기와 같은 광고용 엘이디 모듈을 제조하기 위한 일예에 의한 방법으로, In the method according to an example for manufacturing the LED module for advertising as described above,
엘이디(LED) 표면실장단계(S10)와, 접속핀 고정단계(S20)와, 전선 피복 단계(S30)와, 에폭시 몰딩 단계(S40)로 이루어진다. LED (LED) surface mounting step (S10), connecting pin fixing step (S20), the wire covering step (S30), and epoxy molding step (S40).
LED 표면실장단계 - S10LED Surface Mount Stage-S10
본 단계는 표면에 회로가 패턴 처리되는 인쇄회로기판(10)으로 LED(20)를 표면실장처리하는 단계를 의미하는 것으로 통상의 방법에 따를 수 있는바, 이에 대한 상세한 실시예에 의한 공정은 생략하기로 한다. This step refers to the step of surface-mounting the LED 20 to the printed circuit board 10, the circuit is patterned on the surface can be followed according to the conventional method, the process according to a detailed embodiment thereof is omitted Let's do it.
접속핀 고정단계 - S20Connection pin fixing step-S20
본 단계는 상기한 LED 표면실장단계(S10)를 거친 인쇄회로기판(10)으로 후술하게 되는 전선(30)의 피복영역(31)으로 노출된 부분과 통전 가능하도록 하는 접속핀(11)을 고정하는 단계를 의미한다. This step is to fix the connection pin (11) to enable the conductive part exposed to the cover area 31 of the wire 30 to be described later to the printed circuit board 10 through the LED surface mounting step (S10). Means to do.
여기서 상기 접속핀(11)은 도 4 에서 보는 바와 같이, 단부측이 "∩"자 형태를 이루는 전선파지홈(110)을 갖도록 하고 전선파지홈(110)으로부터 연장되는 핀(111)은 인쇄회로기판(10)을 관통하여 인쇄회로기판(10) 상면에서 납땜 처리되도록 한다.(도 5 참조) Here, as shown in FIG. 4, the connecting pin 11 has a wire gripping groove 110 having an end portion having a “∩” shape, and the pin 111 extending from the wire gripping groove 110 is a printed circuit. Through the substrate 10 to be soldered on the upper surface of the printed circuit board 10 (see Figure 5).
상기 전선파지홈(110)은 전선(30)의 피복영역(31)이 끼워지는 부분으로 이해되어야 하며, 본 발명에서 핀(111)은 전선파지홈(110)으로부터 연장되어 인쇄회로기판(10)으로 돌출되는 부분을 의미하는 것으로, 전선파지홈(110)과 핀(111)을 접속핀(11)이라 명명하기로 한다. The wire gripping groove 110 should be understood as a portion to which the covering region 31 of the wire 30 is fitted, and in the present invention, the pin 111 extends from the wire gripping groove 110 to print the printed circuit board 10. By means of a protruding portion, the wire gripping groove 110 and the pin 111 will be referred to as a connection pin (11).
한편, 이와는 달리 접속핀(11)을 도 6 에서 보는 바와 같이 달리 실시할 수 있다. On the other hand, the connection pin 11 can be implemented differently as shown in FIG.
예컨데 접속핀(11)을 "∩"자 형태로 구성하여 인쇄회로기판(10) 상면에서 하방측으로 관통되도록 한 후, 상기 "∩"자 형태에 의해 형성되는 전선파지홈(110)으로 전선(30)의 피복영역(31)이 파지 될 수 있도록 할 수 있다.(도 7 참조)For example, the connecting pin 11 is formed in a “∩” shape so as to penetrate downward from the upper surface of the printed circuit board 10, and then the wire 30 into the wire holding groove 110 formed by the “∩” shape. ) Can be gripped (see Fig. 7).
이와 같이, 인쇄회로기판(10)으로 회로가 패턴 처리된 후 LED 표면실장처리하는 단계(S10)와, 접속핀(11)을 인쇄회로기판(10)에 고정하는 접속핀 고정단계(S20)를 거쳐서 되는 인쇄회로기판(10)을 도 8 에서와 같이 준비하고, 이러한 인쇄회로기판(10)을 다량 준비하게 된다. As such, after the circuit is patterned by the printed circuit board 10, the step of mounting the surface of the LED (S10), and the connecting pin fixing step (S20) for fixing the connecting pin 11 to the printed circuit board 10 The printed circuit board 10 to be passed is prepared as shown in FIG. 8, and a large amount of the printed circuit board 10 is prepared.
전선 피복 단계 - S30Wire Cover Steps-S30
본 단계는 전선(30)을 피복 처리하는 단계를 의미하는데, 전선(30)을 따라 일정 간격으로 피복 처리하여서 되는 피복영역(31)을 형성하도록 하는바, 상기한 피복영역(31)의 이격 거리는 인쇄회로기판(10)이 배치되는 이격거리와 동일하게 될 것이다. This step refers to the step of covering the wire 30, to form a coating area 31 to be coated at a predetermined interval along the wire 30, the separation distance of the covering area 31 is It will be equal to the separation distance that the printed circuit board 10 is disposed.
인쇄회로기판(10)이 전선(30)을 따라 배치되는 이격 거리는 광고패널이나 문자만으로 이루어지는 광고문안 등의 형상 및 모양이나 구조 등에 따라 달라질 수 있을 것이다. The separation distance at which the printed circuit board 10 is disposed along the wire 30 may vary depending on the shape, shape, or structure of an advertisement panel or advertisement text consisting only of letters.
또는 인쇄회로기판(10)이 전선(30)을 따라 배치되는 이격 거리를 정형화하여 현장에서 필요에 따라 인쇄회로기판(10)의 배치를 선택적으로 적용할 수 있음은 물론이다. Alternatively, the printed circuit board 10 may be configured to form a separation distance along the wire 30 to selectively apply the arrangement of the printed circuit board 10 as necessary in the field.
이와 같이 피복처리되는 전선(30)의 피복영역(31)은 전술한 접속핀(11)의 전선파지홈(110)에 끼워지도록 하면서 도 9 에서와 같이 전선(30)을 따라 인쇄회로기판(10)이 배치되도록 한다. The coating area 31 of the wire 30 to be coated as described above is fitted into the wire gripping groove 110 of the connection pin 11 described above, while the printed circuit board 10 is along the wire 30 as shown in FIG. 9. ) Is placed.
에폭시 몰딩 단계 - S40Epoxy Molding Steps-S40
상기 에폭시 몰딩 단계(S40)는 전술한 바와 같이 인쇄회로기판(10)에 LED(20)를 표면실장한 후, 인쇄회로기판(10) 저면측으로 전선파지홈(110)이 돌출되도록 접속핀(11)을 고정 시킨 상태에서, 일정 간격으로 등간격 이격 되는 피복영역(31)을 갖는 전선(30)을 상기 접속핀(11)의 전선파지홈(110)에 상기 피복영역(31)이 끼워지도록 배치하여, 도 9 에서와 같이 일정 길이의 전선(30)을 따라 배열되는 인쇄회로기판(10) 전체를 에폭시 몰딩 처리하는 과정을 의미한다. As described above, the epoxy molding step S40 may include mounting the LEDs 20 on the printed circuit board 10, and then connecting the pins 11 so that the wire holding grooves 110 protrude toward the bottom surface of the printed circuit board 10. ), The wire 30 having the covering areas 31 spaced at regular intervals at fixed intervals is arranged such that the covering area 31 is fitted into the wire holding groove 110 of the connecting pin 11. As shown in FIG. 9, an epoxy molding process is performed on the entire printed circuit board 10 arranged along a wire 30 having a predetermined length.
즉 도 11 에서 보는 바와 같이 인쇄회로기판(10) 전체를 인서트 사출에 의한 몰딩 처리 방법을 통해 에폭시를 전체적으로 몰딩하게 되는데, 몰딩 후의 형태는 기존의 케이스와 같은 형태를 갖도록 하는 것이 바람직하다. That is, as shown in FIG. 11, the entire printed circuit board 10 is molded through an injection molding molding method, and the epoxy is entirely molded. The shape after molding is preferably the same as that of a conventional case.
이와 같이 에폭시 몰딩되어 케이스화 된 것을 본 발명에서는 에폭시 몰딩부(40)라 칭하며, 이와 같은 에폭시 몰딩과정을 통해 이루어지는 완성된 제품을 본 발명에서는 LED 모듈(1)이라 칭하기로 한다. As such, the epoxy molded case is referred to as an epoxy molding part 40 in the present invention, and a finished product made through such an epoxy molding process will be referred to as an LED module 1 in the present invention.
상기 LED 모듈(1)을 얻게 되면 기존과 같이, 케이스 등을 이용하여 인쇄회로기판(10)을 에워싼 후 인쇄회로기판(10)의 상면을 에폭시 몰딩하고, 커버 등을 이용하여 저면부를 커버링한 다음 에폭시 몰딩으로 인쇄회로기판(10)의 저부를 몰딩처리하는 과정 없이, 전체적으로 인쇄회로기판(10)을 인서트 사출 금형에 투입하여 에폭시 몰딩 처리에 의해 간편한 LED 모듈(1)을 얻을 수 있게 된다. When the LED module 1 is obtained, the printed circuit board 10 is enclosed using a case and the like, and then epoxy molding is performed on the upper surface of the printed circuit board 10 and the bottom surface is covered using a cover or the like. Next, without the process of molding the bottom of the printed circuit board 10 by the epoxy molding, the printed circuit board 10 is put into the insert injection mold as a whole it is possible to obtain a simple LED module (1) by the epoxy molding process.
이러한 LED 모듈(1)은 도 12 에서 보는 바와 같이 전체적으로 투명한 상태에 있게 됨은 물론, 외부에 설치되는 광고패널에서 수분의 침투를 완벽하게 제어할 수 있게 되며, 전선(30) 및 LED 모듈(1)의 배치가 자유롭게 이루어질 수 있어 다양한 문자, 무늬 및 형상을 갖도록 광고 내용의 발현이 가능하게 된다. Such an LED module 1 is in a state of being transparent as shown in FIG. 12, as well as being able to completely control the penetration of moisture in an advertising panel installed outside, the wire 30 and the LED module 1. The arrangement of the can be made freely so that the expression of the advertising content to have a variety of characters, patterns and shapes.
- 제 2 실시예 -Second Embodiment
상기한 제1실시예에 의한 것과는 달리, 하기의 실시에 의해서도 본 발명의 목적을 달성할 수 있다. Unlike the first embodiment described above, the object of the present invention can be achieved by the following implementation.
예컨데, 제1실시예에서의 LED 표면실장단계(S10)와, 접속핀 고정단계(S20) 및 전선 피복단계(S30)의 동일한 과정을 거친 후, 인쇄회로기판(10)을 수용할 케이스(50)를 성형 사출 한 다음 케이스(50) 내부로 인쇄회로기판(10)을 수용하는 단계(S310)를 거친 다음, 상기 케이스(50)로 수지 주입 단계(S410)를 거쳐 완성된 LED 모듈(1)을 얻을 수 있다. For example, after the same process of the LED surface mounting step (S10), the connection pin fixing step (S20) and the wire coating step (S30) of the first embodiment, the case 50 to accommodate the printed circuit board 10 ) And then injection molding (S310) accommodating the printed circuit board 10 into the case 50, and then completing the resin injection step (S410) into the case 50 to complete the LED module 1. Can be obtained.
여기서, 상기한 인쇄회로기판(10)이 수용되는 케이스(50)의 저면측으로 인쇄회로기판(10)으로 끼워지는 접속핀(11)의 단부를 오므리게 하도록 가이드하는 오무림가이드(51)를 구성하여, 인쇄회로기판(10)이 케이스(50)에 끼워질 때 저부면으로 돌출되며 전선(30)의 피복영역(31)을 파지하고 있는 접속핀(11)의 하단부를 오무리도록 하여 전선파지홈(110)으로 위치되어 있는 피복영역(31)을 강제로 감싸도록 하는 것이 바람직하다. Here, the rimimure guide 51 for guiding the end of the connecting pin 11 to be inserted into the printed circuit board 10 to the bottom surface side of the case 50 in which the printed circuit board 10 is accommodated When the printed circuit board 10 is inserted into the case 50, the lower end of the connecting pin 11 protruding toward the bottom surface and holding the covering area 31 of the electric wire 30 is recessed. It is preferable to forcibly wrap the covering area 31 positioned at 110.
이와 같이 하는 이유는, 전선(30)의 피복영역(31)을 감싸는 접속핀(11)이 에폭시 몰딩 처리시에 강한 압력으로 수지가 인서팅 되어질 때 접속핀(11)의 하단이 벌려지는 현상을 배제하기 위한 것이다. The reason for doing this is that the connecting pin 11 surrounding the covering area 31 of the electric wire 30 has a phenomenon that the lower end of the connecting pin 11 is opened when the resin is inserted at a high pressure during the epoxy molding process. It is to exclude.
상기와 같이 케이스(50)의 저면측으로 오무림가이드(51)에 의해 인쇄회로기판(10)이 케이스(50)에 끼워질 때 접속핀(11) 하단이 오무려지며 접속핀(11)의 전선파지홈(110)으로 파지되어 있는 전선(30)의 피복영역(31)이 이탈되지 않도록 파지한 상태에서, 케이스(50)의 상면측을 통해 수지를 주입하는 과정을 거치게 된다.(S410) As described above, when the printed circuit board 10 is inserted into the case 50 by the rimim guide 51 toward the bottom of the case 50, the lower end of the connection pin 11 is recessed and the wires of the connection pin 11 are closed. In a state in which the covering area 31 of the electric wire 30 held by the gripping groove 110 is not separated, the resin is injected through the upper surface side of the case 50.
- 제 3 실시예 - Third embodiment
한편, 본 발명은 상기한 제1,2실시예와는 다른 실시가 가능하게 되는데 이를 설명하면 다음과 같다.Meanwhile, the present invention may be implemented differently from the first and second embodiments described above.
먼저 본 발명에서의 제3실시예에서도, 제1실시예에서의 LED 표면실장단계(S10)와, 접속핀 고정단계(S20) 및 전선 피복단계(S30)의 동일한 과정을 거친 후, 인쇄회로기판(10)이 안착 되어질 케이스를 사출 성형하되 제2실시예에서와는 달리 하단케이스(50')를 사출 성형하는 과정을 거친 후(S320), 그 하단케이스(50')에 인쇄회로기판(10)을 안착한 후, 수지를 이용하여 사출 처리하므로서, 완성된 LED 모듈(1)을 얻도록 하였다(S420). First, in the third embodiment of the present invention, after the same process of the LED surface mounting step (S10), the connection pin fixing step (S20) and the wire coating step (S30) in the first embodiment, the printed circuit board Injection molding the case to be seated (10), but unlike in the second embodiment after the process of injection molding the lower case 50 '(S320), the printed circuit board 10 in the lower case 50' After seating, by injection molding using a resin, to obtain a completed LED module 1 (S420).
한편 본 실시예에서의 하단케이스(50')는 제2실시예에서와는 달리 인쇄회로기판(10)이 안착되는 부분만을 사출성형하는 것으로, 후술하는 수지사출성형단계(420)에서는 상기 하단케이스(50')를 모두 포함하며 수지가 주입 사출성형된다. Meanwhile, unlike the second embodiment, the lower case 50 'in the present embodiment is injection molded only in which the printed circuit board 10 is seated. In the resin injection molding step 420 described later, the lower case 50 ') And the resin is injection molded.
즉, 제2실시예에서는 수지를 케이스(50)에 주입하여 몰딩되도록 하는 것임에 반하여, 본 실시예에서는 하단케이스(50')에 전선이 연결되는 인쇄회로기판(10)을 사출금형에 투입하여 안착시킨 상태에서, 사출금형내에 투명의 수지를 주입하여 하단케이스(50')를 모두 에워싸는 형태로 사출되도록 하는 것이다. That is, in the second embodiment, the resin is injected into the case 50 to be molded, whereas in the present embodiment, the printed circuit board 10, in which the wire is connected to the lower case 50 ′, is injected into the injection mold. In the seated state, a transparent resin is injected into the injection mold so that the lower case 50 'may be injected in the form of enclosing all of the lower case 50'.
상기 하단케이스(50')로 인쇄회로기판(10)을 안착할 때에도, 제2실시예에서와 마찬가지로 인쇄회로기판(10)으로 구비되는 접속핀(11)의 하단부가 오무려지며 전선(30)의 피복영역(31)이 이탈되지 않도록 하기 위한 오무림가이드(51)가 상기 하단케이스(50')의 저면으로 형성되도록 하는 것이 바람직하다. Even when the printed circuit board 10 is seated with the lower case 50 ', the lower end of the connecting pin 11 provided as the printed circuit board 10 is recessed as in the second embodiment, and the electric wire 30 It is preferable that the rimim guide 51 for preventing the cover area 31 of the separation is formed to the bottom of the lower case 50 '.
한편, 상기한 제2,3실시예에서 케이스(50) 및 하단케이스(50')의 다른 실시가 가능하게 되는데 이를 설명하면 다음과 같다.On the other hand, in the second and third embodiments described above, the case 50 and the lower case 50 'can be implemented differently.
상기 케이스(50) 및 하단케이스(50')의 저면측으로 전선(30)을 수용할 수 있는 전선수용홈(52)과 피복영역(31)을 수용할 수 있는 피복영역수용홈(53)을 구성하여, 전선(30) 및 피복영역(31)이 보다 안정적으로 케이스(50) 및 하단케이스(50')에 안착될 수 있도록 하였다.The wire receiving groove 52 capable of accommodating the wire 30 and the coating area accommodating groove 53 capable of accommodating the covering area 31 are formed on the bottom surface side of the case 50 and the lower case 50 '. Thus, the wire 30 and the cover area 31 can be more stably seated in the case 50 and the lower case 50 '.
상기와 같이 전선수용홈(52)과 피복영역수용홈(53)을 구성하여 수지를 주입 사출성형하는 데 있어 전선(30) 및 피복영역(31)의 위치가 변하지 않아 피복영역(31)과 접속핀(11)간의 접속의 신뢰성을 향상시킬 수 있는 것이다.As described above, the position of the wire 30 and the coating area 31 does not change in the injection molding of the resin by forming the wire receiving groove 52 and the coating area receiving groove 53 so as to be connected to the coating area 31. The reliability of the connection between the pins 11 can be improved.
본 발명은 LED가 표면실장 처리되는 인쇄회로기판의 저부측으로 고정되어 있는 접속핀에 일정간격으로 피복처리되는 전선에 가접속시킨 상태에서 전체적으로 인쇄회로기판을 에폭시 몰딩 처리하여 간편하면서도 수밀성 및 기밀성이 우수한 엘이디 모듈의 제조가 가능하게 되므로, 광고용 엘이디 모듈의 제조 공정의 단순화 및 제품의 우수한 신뢰성을 확보할 수 있는 광고용 엘이디 모듈 및 광고용 엘이디 모듈 제조방법을 제공에 의한 산업상 이용가능성이 있다.The present invention is simple and excellent in watertightness and airtightness by epoxy molding the printed circuit board as a whole while the LED is temporarily connected to the wire coated at a predetermined interval to the connection pin fixed to the bottom of the printed circuit board on which the surface is mounted. Since the LED module can be manufactured, there is industrial applicability by providing a method of manufacturing an LED module for advertising and an LED module for advertising, which can simplify the manufacturing process of the advertising LED module and ensure excellent reliability of the product.

Claims (7)

  1. 한조의 인쇄회로기판 상면에 LED를 솔더마스킹하며 표면실장 처리하는 LED 표면실장단계(S10)와, LED surface mounting step (S10) for solder-masking the LED on the surface of a set of printed circuit boards, and surface mount processing,
    상기 LED 표면실장단계(S10)를 거친 인쇄회로기판에, 접속핀을 관통하되 인쇄회로기판 하방측으로 돌출 관통되도록 하고, 상기 접속핀과 인쇄회로기판간을 납땜 처리하는 접속핀 고정단계(S20)와, A connection pin fixing step (S20) for penetrating the connection pin to the printed circuit board which has undergone the LED surface mounting step (S10), protruding downwardly from the printed circuit board, and soldering the connection pin to the printed circuit board; ,
    상기 접속핀 고정단계(S20)에 의해 상기 접속핀이 고정된 상태의 인쇄회로기판을 각각 일정 간격 이격되도록 배치하고, 각각의 인쇄회로기판 저면으로 돌출된 접속핀과 접속되도록 전선을 배치하되, 상기 각각의 접속핀과 접하는 위치에 해당되는 전선 부위 영역의 피복을 탈피하는 전선 피복 단계(S30)와, By the connection pin fixing step (S20) are arranged so that the printed circuit boards in the state in which the connection pins are fixed, each spaced apart, and arrange the wires so as to be connected to the connection pins protruding to the bottom surface of each printed circuit board, A wire covering step (S30) for removing the covering of the wire region region corresponding to the position in contact with each connection pin;
    상기 전선 피복 단계(S30)에 의해 상기 전선에서 피복된 영역과 접속핀이 접하는 상태에서 상기 피복된 전선 부위와 접속핀간을 가고정 시킨 후, 전선을 따라 등간격 배치되는 다수의 인쇄회로기판을 순차적으로 한조의 인쇄회로기판 전체를 에워싸도록 에폭시 몰딩처리하는 에폭시 몰딩단계(S40)로 이루어지는 것을 특징으로 하는 광고용 엘이디 모듈 제조방법.After temporarily fixing between the coated wire part and the connecting pin in a state where the wire covered area and the contact pin are in contact with each other by the wire covering step (S30), a plurality of printed circuit boards arranged at equal intervals along the wire are sequentially The advertising LED module manufacturing method, characterized in that consisting of an epoxy molding step (S40) for the epoxy molding process to surround the entire set of printed circuit board.
  2. 한조의 인쇄회로기판 상면에 LED를 솔더마스킹하며 표면실장 처리하는 LED 표면실장단계(S10)와, LED surface mounting step (S10) for solder-masking the LED on the surface of a set of printed circuit boards, and surface mount processing,
    상기 LED 표면실장단계(S10)를 거친 인쇄회로기판에, 접속핀을 관통하되 인쇄회로기판 하방측으로 돌출 관통되도록 하고, 상기 접속핀과 인쇄회로기판간을 납땜 처리하는 접속핀 고정단계(S20)와, A connection pin fixing step (S20) for penetrating the connection pin to the printed circuit board which has undergone the LED surface mounting step (S10), protruding downwardly from the printed circuit board, and soldering the connection pin to the printed circuit board; ,
    상기 접속핀 고정단계(S20)에 의해 상기 접속핀이 고정된 상태의 인쇄회로기판을 각각 일정 간격 이격되도록 배치하고, 각각의 인쇄회로기판 저면으로 돌출된 접속핀과 접속되도록 전선을 배치하되, 상기 각각의 접속핀과 접하는 위치에 해당되는 전선 부위 영역의 피복을 탈피하는 전선 피복 단계(S30)와, By the connection pin fixing step (S20) are arranged so that the printed circuit boards in the state in which the connection pins are fixed, each spaced apart, and arrange the wires so as to be connected to the connection pins protruding to the bottom surface of each printed circuit board, A wire covering step (S30) for removing the covering of the wire region region corresponding to the position in contact with each connection pin;
    상기 전선 피복 단계(S30)를 거친 전선과 상기 인쇄회로기판의 저면으로 관통되는 접속핀간을 가접속한 상태에 있는 인쇄회로기판을 수용할 케이스를 성형 사출하되, 상기 케이스 저면으로 접속핀의 단부를 오무리도록 가이드하는 오무림가이드가 구비되도록 성형 사출한 다음, 상기 케이스 내부에 인쇄회로기판을 수용하는 단계(S310)와, Molding and injection of a case to accommodate the printed circuit board in a state in which the connection between the wire passed through the wire covering step (S30) and the connecting pin penetrated to the bottom surface of the printed circuit board is molded, the end of the connection pin to the bottom of the case Molding injection molding so that the guiding guide is provided so as to be squeezed, and accommodating a printed circuit board in the case (S310);
    상기 인쇄회로기판이 수용된 상태에 있는 케이스로 투명수지를 주입하여 몰딩하는 수지 주입단계(S410)로 이루어지는 것을 특징으로 하는 광고용 엘이디 모듈 제조방법.The advertising LED module manufacturing method comprising a resin injection step (S410) for molding by injecting a transparent resin into the case in which the printed circuit board is accommodated.
  3. 한조의 인쇄회로기판 상면에 LED를 솔더마스킹하며 표면 실장 처리하는 LED 표면실장단계(S10)와,LED surface mounting step (S10) for solder-masking the LED on the surface of a set of printed circuit board, and surface mount processing,
    상기 LED 표면실장단계(S10)를 거친 인쇄회로기판에, 접속핀을 관통하되 인쇄회로기판 하방측으로 돌출 관통되도록 하고, 상기 접속핀과 인쇄회로기판간을 납땜 처리하는 접속핀 고정단계(S20)와, A connection pin fixing step (S20) for penetrating the connection pin to the printed circuit board which has undergone the LED surface mounting step (S10), protruding downwardly from the printed circuit board, and soldering the connection pin to the printed circuit board; ,
    상기 접속핀 고정단계(S20)에 의해 상기 접속핀이 고정된 상태의 인쇄회로기판을 각각 일정 간격 이격되도록 배치하고, 각각의 인쇄회로기판 저면으로 돌출된 접속핀과 접속되도록 전선을 배치하되, 상기 각각의 접속핀과 접하는 위치에 해당되는 전선 부위 영역의 피복을 탈피하는 전선 피복 단계(S30)와, By the connection pin fixing step (S20) are arranged so that the printed circuit boards in the state in which the connection pins are fixed, each spaced apart, and arrange the wires so as to be connected to the connection pins protruding to the bottom surface of each printed circuit board, A wire covering step (S30) for removing the covering of the wire region region corresponding to the position in contact with each connection pin;
    상기 전선 피복 단계(S30)를 거친 전선과 상기 인쇄회로기판의 저면으로 관통되는 접속핀간을 가접속한 상태에 있는 인쇄회로기판이 안착되어질 하단케이스를 성형 사출하되, 상기 하단케이스 내측 저부면으로 접속핀의 단부를 오무리도록 가이드하는 오무림가이드가 구비되도록 하단케이스를 성형 사출하는 하단케이스 사출성형단계(S320)와, Injection molding the lower case to be seated on the printed circuit board in the state that the connection between the wire passing through the wire covering step (S30) and the connecting pin penetrated to the bottom surface of the printed circuit board is molded, connected to the inner bottom surface of the lower case A lower case injection molding step (S320) for molding and injecting a lower case so that a rimim guide is provided to guide the end of the pin;
    상기 하단케이스 사출성형단계(S320)에 의해 사출성형 된 하단케이스 상면으로 인쇄회로기판을 안착하되, 상기 인쇄회로기판을 관통하며 하방향으로 돌출되는 접속핀이 상기 전선에서 피복처리되는 영역과 접속한 상태를 이루며 상기 하단케이스 저부측에 위치되도록 한 후 상기 접속핀이 상기한 오무림가이드에 의해 오무려지며 전선의 피복 영역을 파지한 상태에서, 사출금형에 상기 인쇄회로기판이 상면에 안착된 하단케이스를 투입하여 수지를 이용하여 상기 하단케이스를 에워싸도록 몰딩 사출 처리하며 완성된 LED 모듈을 얻도록 하는 수지사출성형단계(S420)으로 이루어지는 것을 특징으로 하는 광고용 엘이디 모듈 제조방법.The printed circuit board is seated on the upper surface of the lower case injection-molded by the lower case injection molding step (S320), and the connecting pins penetrating the printed circuit board and protruding downwards are connected to the area covered by the wire. After forming the state to be located on the bottom side of the bottom case, the connecting pin is squeezed by the rimim guide and gripping the covering area of the wire, the lower end of the printed circuit board seated on the upper surface in the injection mold The injection molding method for advertising LED module, characterized in that made of a resin injection molding step (S420) to obtain a completed LED module by injection molding the case to enclose the bottom case by using a resin.
  4. LED가 표면실장 처리된 인쇄회로기판을 관통하는 접속핀의 단부측과 전선의 피복영역이 접속되어, 상기 LED가 점등되도록 하는 광고용 엘이디 모듈에 있어서, In the LED module for advertising that the LED is turned on by connecting the end side of the connecting pin through the printed circuit board surface-treated LED and the covering area of the electric wire,
    단부측에 "∩"자 형태의 전선파지홈을 형성하고, 상기 전선파지홈 상부로 일체 연장되는 핀이 인쇄회로기판을 관통하여 인쇄회로기판 상면에서 납땜 고정되는 접속핀과, A connection pin having an “∩” shaped wire gripping groove formed at an end side, and a pin integrally extending above the wire gripping groove penetrating the printed circuit board to be soldered and fixed on the upper surface of the printed circuit board;
    상기 전선의 피복영역이 접속핀의 상기 전선파지홈에 끼워지는 한 조의 인쇄회로기판과, A set of printed circuit boards in which the covering area of the wire is fitted into the wire gripping groove of the connecting pin;
    상기 인쇄회로기판 전체를 수지에 의해 에워싸며 몰딩하는 에폭시몰딩부로 이루어지고, Epoxy molding unit for molding the entire printed circuit board surrounded by a resin,
    상기 에폭시몰딩부에 의해 에워싸진 한 조의 인쇄회로기판을 이루는 LED모듈이 상기 전선을 따라 다수개 이격 구성되는 것을 특징으로 하는 광고용 엘이디 모듈.LED module for constituting a set of printed circuit board surrounded by the epoxy molding unit is characterized in that a plurality of spaced apart along the wire.
  5. LED가 표면실장 처리된 인쇄회로기판을 관통하는 접속핀의 단부측과 전선의 피복영역이 접속되어, 상기 LED가 점등되도록 하는 광고용 엘이디 모듈에 있어서, In the LED module for advertising that the LED is turned on by connecting the end side of the connecting pin through the printed circuit board surface-treated LED and the covering area of the electric wire,
    단부측에 "∩" 형태의 전선파지홈을 형성하여, 인쇄회로기판 상방에서 하방측으로 관통되도록 하되 인쇄회로기판 상면으로 접하는 부위는 납땜 처리하여 고정되는 접속핀과, Connection pins are formed on the end side to form a wire gripping groove having a “∩” shape so as to penetrate from the upper side to the lower side of the printed circuit board, but contact the upper surface of the printed circuit board by soldering.
    상기 전선의 피복영역이 접속핀의 상기 전선파지홈에 끼워지는 한 조의 인쇄회로기판과, A set of printed circuit boards in which the covering area of the wire is fitted into the wire gripping groove of the connecting pin;
    상기 인쇄회로기판 전체를 수지에 의해 에워싸며 몰딩하는 에폭시몰딩부로 이루어지고, Epoxy molding unit for molding the entire printed circuit board surrounded by a resin,
    상기 에폭시몰딩부에 의해 에워싸진 한 조의 인쇄회로기판을 이루는 LED모듈이 상기 전선을 따라 다수개 이격 구성되는 것을 특징으로 하는 광고용 엘이디 모듈.LED module for constituting a set of printed circuit board surrounded by the epoxy molding unit is characterized in that a plurality of spaced apart along the wire.
  6. 한조의 인쇄회로기판 상면에 LED를 솔더마스킹하며 표면실장 처리하는 LED 표면실장단계(S10)와, LED surface mounting step (S10) for solder-masking the LED on the surface of a set of printed circuit boards, and surface mount processing,
    상기 LED 표면실장단계(S10)를 거친 인쇄회로기판에, 접속핀을 관통하되 인쇄회로기판 하방측으로 돌출 관통되도록 하고, 상기 접속핀과 인쇄회로기판간을 납땜 처리하는 접속핀 고정단계(S20)와, A connection pin fixing step (S20) for penetrating the connection pin to the printed circuit board which has undergone the LED surface mounting step (S10), protruding downwardly from the printed circuit board, and soldering the connection pin to the printed circuit board; ,
    상기 접속핀 고정단계(S20)에 의해 상기 접속핀이 고정된 상태의 인쇄회로기판을 각각 일정 간격 이격되도록 배치하고, 각각의 인쇄회로기판 저면으로 돌출된 접속핀과 접속되도록 전선을 배치하되, 상기 각각의 접속핀과 접하는 위치에 해당되는 전선 부위 영역의 피복을 탈피하는 전선 피복 단계(S30)와, By the connection pin fixing step (S20) are arranged so that the printed circuit boards in the state in which the connection pins are fixed, each spaced apart, and arrange the wires so as to be connected to the connection pins protruding to the bottom surface of each printed circuit board, A wire covering step (S30) for removing the covering of the wire region region corresponding to the position in contact with each connection pin;
    상기 전선 피복 단계(S30)를 거친 전선과 상기 인쇄회로기판의 저면으로 관통되는 접속핀간을 가접속한 상태에 있는 인쇄회로기판을 수용할 케이스를 성형 사출하되, 상기 케이스 저면으로 전선을 수용할 수 있는 전선수용홈과 피복영역을 수용할 수 있는 피복영역수용홈이 구비되도록 성형 사출한 다음, 상기 케이스 내부에 인쇄회로기판을 수용하는 단계(S310)와, Molded injection molded case for accommodating the printed circuit board in a state in which the connection between the wire passed through the wire covering step (S30) and the connecting pin penetrated to the bottom surface of the printed circuit board is molded, it can accommodate the wire to the bottom of the case Molding injection to provide a wire receiving groove and a covering area receiving groove for accommodating the covering area, and then accommodating a printed circuit board in the case (S310);
    상기 인쇄회로기판이 수용된 상태에 있는 케이스로 투명수지를 주입하여 몰딩하는 수지 주입단계(S410)로 이루어지는 것을 특징으로 하는 광고용 엘이디 모듈 제조방법.The advertising LED module manufacturing method comprising a resin injection step (S410) for molding by injecting a transparent resin into the case in which the printed circuit board is accommodated.
  7. 한조의 인쇄회로기판 상면에 LED를 솔더마스킹하며 표면 실장 처리하는 LED 표면실장단계(S10)와,LED surface mounting step (S10) for solder-masking the LED on the surface of a set of printed circuit board, and surface mount processing,
    상기 LED 표면실장단계(S10)를 거친 인쇄회로기판에, 접속핀을 관통하되 인쇄회로기판 하방측으로 돌출 관통되도록 하고, 상기 접속핀과 인쇄회로기판간을 납땜 처리하는 접속핀 고정단계(S20)와, A connection pin fixing step (S20) for penetrating the connection pin to the printed circuit board which has undergone the LED surface mounting step (S10), protruding downwardly from the printed circuit board, and soldering the connection pin to the printed circuit board; ,
    상기 접속핀 고정단계(S20)에 의해 상기 접속핀이 고정된 상태의 인쇄회로기판을 각각 일정 간격 이격되도록 배치하고, 각각의 인쇄회로기판 저면으로 돌출된 접속핀과 접속되도록 전선을 배치하되, 상기 각각의 접속핀과 접하는 위치에 해당되는 전선 부위 영역의 피복을 탈피하는 전선 피복 단계(S30)와, By the connection pin fixing step (S20) are arranged so that the printed circuit boards in the state in which the connection pins are fixed, each spaced apart, and arrange the wires so as to be connected to the connection pins protruding to the bottom surface of each printed circuit board, A wire covering step (S30) for removing the covering of the wire region region corresponding to the position in contact with each connection pin;
    상기 전선 피복 단계(S30)를 거친 전선과 상기 인쇄회로기판의 저면으로 관통되는 접속핀간을 가접속한 상태에 있는 인쇄회로기판이 안착되어질 하단케이스를 성형 사출하되, 상기 하단케이스 저면으로 전선을 수용할 수 있는 전선수용홈과 피복영역을 수용할 수 있는 피복영역수용홈이 구비되도록 성형 사출하는 하단케이스 사출성형단계(S320)와, Injection molding the lower case to be seated on the printed circuit board in the state that is connected between the wire passing through the wire covering step (S30) and the connecting pin penetrated to the bottom of the printed circuit board, the wire is received at the bottom of the lower case A lower case injection molding step (S320) for molding and injecting a wire receiving groove and a covering area receiving groove to accommodate the covering area;
    상기 하단케이스 사출성형단계(S320)에 의해 사출성형 된 하단케이스 상면으로 인쇄회로기판을 안착하되, 상기 인쇄회로기판을 관통하며 하방향으로 돌출되는 접속핀이 상기 전선에서 피복처리되는 영역과 접속한 상태를 이루도록 한 후 사출금형에 상기 인쇄회로기판이 상면에 안착된 하단케이스를 투입하여 수지를 이용하여 상기 하단케이스를 에워싸도록 몰딩 사출 처리하며 완성된 LED 모듈을 얻도록 하는 수지사출성형단계(S420)으로 이루어지는 것을 특징으로 하는 광고용 엘이디 모듈 제조방법.The printed circuit board is seated on the upper surface of the lower case injection-molded by the lower case injection molding step (S320), and the connecting pins penetrating the printed circuit board and protruding downwards are connected to the area covered by the wire. After achieving the state, the injection molding step of molding injection processing to enclose the bottom case using resin by inserting a lower case seated on the upper surface of the printed circuit board into an injection mold to obtain a completed LED module ( Advertising method of the LED module, characterized in that consisting of (S420).
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