WO2013111984A1 - Electronic circuit board for education and electronic circuit kit using same - Google Patents

Electronic circuit board for education and electronic circuit kit using same Download PDF

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Publication number
WO2013111984A1
WO2013111984A1 PCT/KR2013/000596 KR2013000596W WO2013111984A1 WO 2013111984 A1 WO2013111984 A1 WO 2013111984A1 KR 2013000596 W KR2013000596 W KR 2013000596W WO 2013111984 A1 WO2013111984 A1 WO 2013111984A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic circuit
base plate
land
lands
educational
Prior art date
Application number
PCT/KR2013/000596
Other languages
French (fr)
Korean (ko)
Inventor
김상일
김재원
조경
Original Assignee
Kim Sang Il
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kim Sang Il filed Critical Kim Sang Il
Priority to CN201380006578.1A priority Critical patent/CN104067330B/en
Publication of WO2013111984A1 publication Critical patent/WO2013111984A1/en

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0286Programmable, customizable or modifiable circuits
    • H05K1/0287Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09BEDUCATIONAL OR DEMONSTRATION APPLIANCES; APPLIANCES FOR TEACHING, OR COMMUNICATING WITH, THE BLIND, DEAF OR MUTE; MODELS; PLANETARIA; GLOBES; MAPS; DIAGRAMS
    • G09B23/00Models for scientific, medical, or mathematical purposes, e.g. full-sized devices for demonstration purposes
    • G09B23/06Models for scientific, medical, or mathematical purposes, e.g. full-sized devices for demonstration purposes for physics
    • G09B23/18Models for scientific, medical, or mathematical purposes, e.g. full-sized devices for demonstration purposes for physics for electricity or magnetism
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09BEDUCATIONAL OR DEMONSTRATION APPLIANCES; APPLIANCES FOR TEACHING, OR COMMUNICATING WITH, THE BLIND, DEAF OR MUTE; MODELS; PLANETARIA; GLOBES; MAPS; DIAGRAMS
    • G09B1/00Manually or mechanically operated educational appliances using elements forming, or bearing, symbols, signs, pictures, or the like which are arranged or adapted to be arranged in one or more particular ways
    • G09B1/02Manually or mechanically operated educational appliances using elements forming, or bearing, symbols, signs, pictures, or the like which are arranged or adapted to be arranged in one or more particular ways and having a support carrying or adapted to carry the elements
    • G09B1/04Manually or mechanically operated educational appliances using elements forming, or bearing, symbols, signs, pictures, or the like which are arranged or adapted to be arranged in one or more particular ways and having a support carrying or adapted to carry the elements the elements each bearing a single symbol or a single combination of symbols
    • G09B1/06Manually or mechanically operated educational appliances using elements forming, or bearing, symbols, signs, pictures, or the like which are arranged or adapted to be arranged in one or more particular ways and having a support carrying or adapted to carry the elements the elements each bearing a single symbol or a single combination of symbols and being attachable to, or mounted on, the support
    • G09B1/08Manually or mechanically operated educational appliances using elements forming, or bearing, symbols, signs, pictures, or the like which are arranged or adapted to be arranged in one or more particular ways and having a support carrying or adapted to carry the elements the elements each bearing a single symbol or a single combination of symbols and being attachable to, or mounted on, the support by means of magnets
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09BEDUCATIONAL OR DEMONSTRATION APPLIANCES; APPLIANCES FOR TEACHING, OR COMMUNICATING WITH, THE BLIND, DEAF OR MUTE; MODELS; PLANETARIA; GLOBES; MAPS; DIAGRAMS
    • G09B23/00Models for scientific, medical, or mathematical purposes, e.g. full-sized devices for demonstration purposes
    • G09B23/06Models for scientific, medical, or mathematical purposes, e.g. full-sized devices for demonstration purposes for physics
    • G09B23/18Models for scientific, medical, or mathematical purposes, e.g. full-sized devices for demonstration purposes for physics for electricity or magnetism
    • G09B23/182Models for scientific, medical, or mathematical purposes, e.g. full-sized devices for demonstration purposes for physics for electricity or magnetism for components
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09BEDUCATIONAL OR DEMONSTRATION APPLIANCES; APPLIANCES FOR TEACHING, OR COMMUNICATING WITH, THE BLIND, DEAF OR MUTE; MODELS; PLANETARIA; GLOBES; MAPS; DIAGRAMS
    • G09B23/00Models for scientific, medical, or mathematical purposes, e.g. full-sized devices for demonstration purposes
    • G09B23/06Models for scientific, medical, or mathematical purposes, e.g. full-sized devices for demonstration purposes for physics
    • G09B23/18Models for scientific, medical, or mathematical purposes, e.g. full-sized devices for demonstration purposes for physics for electricity or magnetism
    • G09B23/183Models for scientific, medical, or mathematical purposes, e.g. full-sized devices for demonstration purposes for physics for electricity or magnetism for circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08Magnetic details
    • H05K2201/083Magnetic materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10234Metallic balls
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10363Jumpers, i.e. non-printed cross-over connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17Post-manufacturing processes
    • H05K2203/173Adding connections between adjacent pads or conductors, e.g. for modifying or repairing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire

Definitions

  • the present invention relates to an educational electronic circuit board and an electronic circuit kit using the same, and more particularly, to install a land having magnetic force and electrical conductivity on an insulating base plate and to attach a connection line connected to the device by using magnetic force to the land. It relates to an educational electronic circuit board.
  • the braid board 1 which is an educational electronic circuit board used in electronic circuit education, has a resistance r, which is an electronic component element, in a socket made at regular intervals in the horizontal and vertical directions as shown in FIGS.
  • a light sensor (CdS), a light emitting diode (led), a variable resistor (vr), a microchip (ic), a connecting line (w), etc. by plugging in the electrical connection to configure and disassemble the circuit.
  • Reference numeral 2 in the drawings is a power supply.
  • the educational electronic circuit board 21 includes a power switch 24, a plurality of sockets 22 and 23, and protrusions 25 having a predetermined size.
  • the protrusion 25 blocks 26, 27, and 28 of various sizes as shown in FIG. 4 are press-fitted.
  • the blocks 26, 27, and 28 are sockets 26a, 27a, 27a ', 28a, 28b, and 28c into which the leads of an electronic circuit component are inserted, and a connector for stacking and fixing the blocks 26 up and down ( 26b and 26c are arranged at predetermined intervals.
  • another educational electronic circuit board 31 includes an element such as a resistor r as a base 36a, a cover 36b, an attachment plate 36c, and a metal terminal 36d.
  • a component block (36) consisting of 36d, and the component block (36) is a condenser terminal (33), a speaker terminal (32), a switch terminal (34), and a power connection terminal made of the electronic circuit board (31).
  • the metal terminals 36d and 36d ' can be attached to form a circuit.
  • the educational electronic circuit board 47 makes an electronic device board 41 on which various electronic devices are mounted, as shown in FIGS. 7 and 8.
  • the electronic device plate 41 is made of an insulating material (b) and the magnet case (p1, p2) for pressing the cylindrical magnet (Mc1, Mc2) at both ends, the two cylindrical magnets (Mc1, Mcc) are
  • the leads l1 and l2 of a device such as a light emitting diode are connected between the connecting lines w1 and w2 and between the connecting lines w1 and w2.
  • the electronic device plates 41, 42, 43, 44, 45, and 46 as described above constitute a circuit by connecting the cylindrical magnets Mc1 and Mc2 with each other, such as the power applying plate 46, to allow electrical communication.
  • reference numeral ps denotes a power supply and sw denotes a switch.
  • the educational electronic circuit board configured as described above has the following problems.
  • the braid board 1 which is an educational electronic circuit board as shown in FIG. 1, is connected to the socket by electrically inserting a lead of an electronic component, such as a resistor r and a light emitting diode, to be electrically connected. It was difficult to observe with the naked eye. In addition, it is difficult for educated children to understand the electrical flow of circuits because of the cluttered insertion of electronic components, and because it is so different from PCB, it is difficult to educate them to see and understand electronic circuit boards in electronic products. have.
  • the educational electronic circuit board 21 as shown in FIGS. 3 and 4 may be assembled by first fitting various electronic devices to the blocks 26, 27, 28 of various shapes, and then inserting them into the protrusions 25. Electrical connection, but the sockets 26a, 27a, 27a ', 28a, 28a' made with the braid board 1 are also present in the blocks 26, 27, 28. do.
  • the educational electronic circuit board 31 shown in FIGS. 5 and 6 can be assembled without soldering a predetermined circuit, the educational electronic circuit board 31 is made of a single unit that cannot be variously applied.
  • the electronic circuit board 47 for education as shown in FIGS. 7 and 8 is blocked by connecting a device such as a resistor r and a light emitting diode led and cylindrical magnets Mc1 and Mc2.
  • the circuit is electrically connected by making a 41 to connect or laminate the cylindrical magnets Mc1 and Mc2. This results in a bulky shape that is too different from the electronic circuitry.
  • An object of the present invention is to solve the conventional problems as described above, in the electronic circuit board for education and the electronic circuit kit using the same by using a connection line attached to the land by the elements and land, land and land by magnetic force To do the training for the circuit.
  • Another object of the present invention is to connect a land having magnetic force and electrical conductivity to each other by using a connection line and to directly connect the land and the element by the connection line so that the electronic circuit can be visually identified.
  • the present invention is installed in the plate-shaped base plate having a fastening hole made of an insulating material and formed in a row, and the fastening hole of the base plate And a land having magnetic force and electrical conductivity and connected by lead and magnetic force of the device to perform electrical connection.
  • the base plate is made of a transparent material.
  • the land includes a spherical body and a fastening boss extending from the body and a threaded portion that is fastened to a fastening tab formed on an inner surface of the fastening hole.
  • the land is arranged on at least one surface of both surfaces of the base plate.
  • the present invention provides a plate-shaped base plate having a fastening hole made of an insulating material and formed in a row, and a land installed in the fastening hole of the base plate and having magnetic force and electrical conductivity;
  • a connection line having elastic terminals and electrically connected to the lands at both ends of the electrically conductive member having electrical conductivity, and a lead extending from the body to be electrically connected to the lands. It includes an element to be provided.
  • the base plate is made of a transparent material.
  • the land includes a spherical body and a fastening boss extending from the body and a threaded portion that is fastened to a fastening tab formed on an inner surface of the fastening hole.
  • the land is arranged on at least one surface of both surfaces of the base plate.
  • the lands are located at both surfaces of the fastening hole of the base plate, and the lands are formed in a spherical body so that the surfaces of both surfaces are magnetically installed on the base plate.
  • a coil spring having electrical conductivity is used as the conductive member constituting the connecting line.
  • connection terminal is formed to protrude a coupling protrusion coupled to the electrically conductive member in a ring-shaped terminal body.
  • An insulating coating made of a flexible material surrounds the electrically conductive member.
  • connection line may be connected to the lead of the device, and the connection line has an electrical conductivity and a socket to which the lead is coupled to one end of the elastically deformable electrically conductive member, and is connected to the land at the other end of the electrically conductive member.
  • a ring-shaped connecting terminal is provided.
  • An insulating coating made of a flexible material surrounds the electrically conductive member.
  • the lead of the device is provided with a lead terminal attached to the land and made into a ring shape.
  • the land and land or connecting lines connecting the land and the elements can be directly seen by the naked eye so that the trainee can easily check the configuration of the circuit, thereby improving the educational effect on the configuration of the circuit.
  • the land can be installed only on one surface of the base plate, or the land can be installed on both sides, so that a very similar form to an actual single-sided printed circuit board or a double-sided printed circuit board can be realized, so that circuit education can be made more easily. It also works.
  • connection lines between the lands or the lands and the elements have a flexible property, so that various types of connections can be made, thereby simplifying the circuit configuration.
  • FIG. 1 is a perspective view showing the structure of a braid board which is an electronic circuit kit for education according to the prior art.
  • Figure 2 is a partial perspective view showing a detailed structure of a braid board which is an educational electronic circuit kit according to the prior art.
  • Figure 3 is a perspective view showing the structure of another educational electronic circuit board according to the prior art.
  • Figure 4 is a perspective view showing the structure of the various blocks assembled to the educational electronic circuit board shown in FIG.
  • Figure 5 is a plan view showing a structure of another educational electronic circuit kit according to the prior art.
  • Figure 6 is an exploded perspective view showing the structure of the component block assembled to the educational electronic circuit board shown in FIG.
  • Figure 7 is a perspective view showing the structure of an electronic device board assembled to another educational electronic circuit board according to the prior art.
  • FIG. 8 is a perspective view illustrating a structure of an electronic circuit board for education according to the related art in which the electronic device board illustrated in FIG. 7 is connected and assembled.
  • Figure 9 is a perspective view showing the configuration of a preferred embodiment of the educational electronic circuit board according to the present invention.
  • FIG. 10 is a partial cross-sectional perspective view showing a detailed configuration of the embodiment shown in FIG.
  • Figure 11 is a side view showing the configuration of a preferred embodiment of the educational electronic circuit kit using the electronic circuit board shown in FIG.
  • FIG. 12 is an exploded perspective view showing the configuration of the connecting line constituting an embodiment of the present invention.
  • FIG. 13 is a partial cutaway perspective view showing the configuration of the connecting line shown in FIG.
  • FIG. 14 is a perspective view showing the configuration of elements used in the embodiment shown in FIG.
  • Figure 15 is an exploded perspective view showing the configuration of the connecting line used in the embodiment shown in FIG.
  • FIG. 16 is a partially cutaway perspective view showing the configuration of a connecting line used in the embodiment shown in FIG.
  • Figure 17 is a perspective view showing another configuration of a connecting line connected to the lead of the device used in the present invention.
  • FIG. 18 is a perspective view showing that the embodiment shown in FIG. 11 is used.
  • 19 is a perspective view showing the configuration of another embodiment of an electronic circuit board for education according to the present invention.
  • FIG. 20 is a partial cross-sectional perspective view showing a detailed configuration of the embodiment shown in FIG.
  • 21 is a side view showing the configuration of another embodiment of an electronic circuit kit for education using the electronic circuit board shown in FIG.
  • the base plate 110 forms a skeleton.
  • the base plate 110 is a transparent synthetic resin material in the present embodiment, a rectangular plate shape.
  • the base plate 110 may be made of an insulating material and may be any plate shape.
  • the base plate 110 is transparent, it may be easy to check the configuration provided on the front and rear surfaces of the base plate 110 when using both the front and back surfaces.
  • the base plate 110 is formed with a fastening hole 112 in which the land 120 to be described below is installed.
  • the fastening hole 112 is formed through the base plate 110.
  • a fastening tab 114 is formed on an inner surface of the fastening hole 112.
  • the fastening hole 112 is good to have a predetermined interval between the adjacent ones.
  • Reference numeral 116 denotes a fixing hole.
  • Lands 120 are respectively installed in the fastening holes 112 formed in the base plate 110.
  • the land 120 is a conductor capable of transferring electricity and has magnetic force. That is, the land 120 is a magnet capable of electrical conduction.
  • a plurality of lands 120 are installed in a row.
  • the lands 120 are arranged in rows so as to have a constant distance in the horizontal and vertical directions.
  • the lands 120 do not necessarily have to be arranged in rows at regular intervals, but as shown in this embodiment, it is best to configure the circuits in rows at regular intervals.
  • the fastening boss 124 is inserted into the fastening hole 112 is fastened to the body 122 protruding to the outside of the base plate 110 ) Is integrally provided.
  • the body 122 has a spherical shape in the present embodiment, and protrudes from the surface of the base plate 110. However, the shape of the body 122 may be made in various ways, a portion of the base plate 110 may be entered.
  • the fastening boss 124 has a rod shape and is integrally formed on the body 122, and a tab is fastened to an outer surface of the fastening boss 124.
  • connection line 130 is used to connect the lands 120 to perform electrical connection.
  • the configuration of the connecting line 130 is shown well in FIGS. 12 and 13.
  • the connection line 130 is provided with an electrically conductive member 132 for electrical connection, and the electrically conductive member 132 has a short with the lead 144 of the adjacent connection line 130 or the elements 140 to be described below. It is surrounded by an insulating coating 134 to prevent. That is, the conductive member 132 passes through the insulating coating 134.
  • the conductive member 132 is made in the shape of a cylindrical coil spring, and the insulating coating 134 is also made of a flexible material. Therefore, the electrically conductive member 132 can be freely elastically deformed and bent while being covered with the insulating coating 134.
  • connection terminal 136 Both ends of the connection line 130 is provided with a connection terminal 136 to be coupled to the electrically conductive member 132.
  • the connection terminal 136 is a portion that is attached to the land 120 and electrically connected. That is, the electrically conductive member 132 and the land 120 are electrically connected to each other by attaching the connection terminal 136 to the land 120.
  • the connection terminal 136 is provided with a ring-shaped terminal body 136 ′, the coupling protrusion 138 protrudes on one side of the terminal body 136 ′.
  • the coupling protrusion 138 is inserted into the conductive member 132 to electrically connect the conductive member 132 to the terminal body 9336 '.
  • the terminal body 136 ′ has a ring shape, and thus, the terminal body 136 ′ may be stably coupled to the body 122 of the land 120 formed in a spherical shape.
  • a plurality of elements 140 may be used to construct a circuit. Examples of the device 140 are shown in FIGS. 11 and 14. In general, the device 140 is provided with a lead 144 for electrical connection to the outside of the device body 142. Examples of the device 140 include a light emitting diode (LED), an electrolytic capacitor (C1), a tantalum capacitor (C2), a transistor (TR), a resistor (R), a microchip (IC).
  • LED light emitting diode
  • C1 electrolytic capacitor
  • C2 tantalum capacitor
  • TR transistor
  • R resistor
  • IC microchip
  • the lead 144 protruding from the device body 142 is capable of a certain degree of elastic deformation and plastic deformation, and when the lead terminal 146 is integrally connected to the end thereof, the lead 144 is stably coupled to the land 120. Can be.
  • an electrical connection with the land 120 may be easily performed by installing a ring-shaped lead terminal 146 at the tip of the lead 144 extending from the device body 142. At this time, the lead 144 may vary the land 120 to be connected while being made to some extent elastic or plastic deformation.
  • the length of the lead 144 of the device 140 may be shortened, and a separate connection line 130 ′ may be connected to the lead 144 to make an electrical connection with the land 120. This is because plastic deformation may occur or be cut when the lead 144 is repeatedly deformed, so that the connection line 130 ′ is connected to the lead 144 so that the land 120 may be more easily connected. will be.
  • connection line 130 ′ used here is illustrated in FIGS. 15 and 16.
  • the configuration is similar to that of the connection line 130, and the socket 139 is used instead of the connection terminal 136 on one side. Is to use.
  • the socket 139 is a portion coupled to the lead 144.
  • the socket 139 is formed of a cylindrical body 139 'having a substantially cylindrical shape and integrally provided with a coupling protrusion 139 "coupled to the conductive member 132.
  • the cylinder 139' includes the lead. 144 is inserted.
  • the connecting line 130 ′′ may be configured such that the conductive member 132 is directly coupled with the lead 144 without using the insulating coating 134 and the socket 139. ”) Is shown in FIG.
  • the conductive member 132 is made of a cylindrical coil spring so that the elastic deformation is possible, but the lead 144 may be press-fitted into the cylindrical inner space.
  • Such a configuration may be used in an environment where the connection line 130 ′′ is used where no electrical short with the surroundings occurs.
  • FIG. 18 shows a circuit structure of the electronic circuit board 100 using the electronic circuit kit of this embodiment. That is, the land 120 provided in the base plate 110 is electrically connected using the connection line 130, and the lead 144 of the device 140 is electrically connected to the land 120. To construct the circuit.
  • connection line 130 is connected to the land terminal 120 by the magnetic force of the connecting terminal 136 at both ends of the land 122 of the land 120, respectively.
  • the connection line 130 serves as a circuit pattern of a printed circuit board.
  • the connection line 130 may be configured in various lengths to electrically connect the adjacent lands 120, or electrically connect the lands 120 having a plurality of lands 120 therebetween.
  • each of the elements 140 has a lead terminal 146 at the tip of the lead 144 directly applied to the land 120. Attached to make an electrical connection.
  • connection line 130 ′ illustrated in FIGS. 15 and 16 may be used. That is, the length of the lead 144 is shortened and the lead 144 is press-fitted into the socket 139 of the connection line 130 'to connect the connection line 130' and the lead 144 to electrically connect the land 120 to the land 120. To do the connection.
  • the elements 140 may be magnetically attached to the lands 120 in the base plate 110, and electrically connected to each other by using the connection line 130. This state is well illustrated in FIG. 18.
  • One of the lands 120 may be connected to an external power source, and a connection line 130 may be connected to the lands 120 to supply power to the circuit. Can be.
  • connection line 130 and the element 140 are separated from the lands 120 to form a new circuit. Separating the connecting line 130 and the element 140 from the land 120 can easily separate the connecting line 130 and the element 140 because the magnetic force of the land 120 is overcome. After separating the connection line 130 and the device 140, the connection line 130 and the device 140 may be connected to the lands 120 again according to a newly designed circuit.
  • connection terminal 136 and the lead terminal 146 are used for electrical connection with the land 120, all of which are ring-shaped.
  • This is related to the body 122 of the land 120 is spherical. That is, when the land 120 is attached to the outer surface of the body 122, a portion of the body 122 enters into the connection terminal 136 and the lead terminal 146, the connection terminal 136 ) And the lead terminal 146 draws a circle in contact with the body 122 of the land 120. That is, the body 122 and the connection terminal 136 and the lead terminal 146 of the land 120 is a circular contact. By doing so, the electrical connection between the connecting terminal 136 and the lead terminal 146 and the land 120 can be more secure.
  • FIGS. 19 to 21 For convenience of description, the present embodiment will be given the reference numeral of 200 units in the configuration corresponding to the above-described embodiment and only the main parts will be described.
  • the lands 220 are provided on both sides of the base plate 210 of the electronic circuit board 200.
  • the electronic circuit board 200 of the present embodiment corresponds to a double-sided board of the printed circuit board.
  • the base plate 210 is formed of a transparent material as an insulating synthetic resin. In particular, when the base plate 210 is made of a transparent material, it is possible to easily check both the element 240 and the insulating line 230 provided on both sides of the base plate 210.
  • Fastening holes 212 are formed through the base plate 210.
  • a fastening tab 214 is formed on an inner surface of the fastening hole 212.
  • Reference numeral 216 denotes a fixing hole.
  • Lands 220 are provided on both surfaces of the base plate 210, and the lands 220 have magnetic properties and electrical conductivity.
  • the land 220 has a configuration in which the fastening boss 224 protrudes from the body 222 as in the above embodiment, and is formed on the outer surface of the fastening boss 224 with the fastening tab 214. Is formed.
  • the lands 220 are respectively provided on both surfaces of the base plate 210, one fastening hole 212 is installed one by one on both surfaces.
  • Each of the lands 220 is inserted into and fastened to the fastening hole 212 at one surface and the other surface of the base plate 210, respectively.
  • the lands 220 on both surfaces of the lands 220 are not placed on the fastening boss 224 and the fastening tab 214. It can also be coupled by the magnetic force of.
  • connection line 230 an electrical connection is made between the lands 220 in the base plate 210 by a connection line 230. Both ends of the connection line 230 is provided with a connection terminal 236, the other configuration of the connection line 230 is the same as the embodiment described above.
  • the leads 244 extend from the body 242. Two or more leads 244 may be provided in the body 242.
  • the lead 240 may be shortened and a separate connection line 230 ′ may be provided in the device 240.
  • FIG. 21 illustrates a side view of the present embodiment, in which elements 240 are installed on lands 220 respectively provided on both sides of the base plate 210 to form a circuit. That is, the land 220 provided in the base plate 210 is electrically connected to each other using the connection line 230, and the lead 244 of the device 240 is electrically connected to the land 220. To configure the circuit.
  • connection line 230 is connected to each of the connecting terminal 236 of the land 220, the body 222 of the land 220 by magnetic force to electrically connect between the land 220.
  • the connection line 230 serves as a circuit pattern of a printed circuit board.
  • the connection line 230 may be configured in various lengths to electrically connect between immediately adjacent lands 220 or between lands 220 having a plurality of lands 220 therebetween.
  • each element 240 has a lead terminal 246 at the tip of the lead 244 directly applied to the land 220. Attached to make an electrical connection.
  • the elements 240 may be magnetically attached to the lands 220 in the base plate 210, and electrically connected to each other by using the connection line 230. This state is well illustrated in FIG.
  • FIG. 21 a configuration for electrically connecting a circuit formed on one surface of the base plate 210 and a circuit formed on the other surface to each other is not illustrated, which means that the fastening bosses 224 of the land 220 are electrically connected to each other.
  • the lands 220 on both surfaces of the base plate 210 may be electrically connected by using a separate connection line 230.
  • one of the lands 220 may be connected to an external power source, and the lands 220 may be connected to a connection line 230 to supply power to a circuit. Can be.
  • Educational electronic circuit board of the present invention and the electronic circuit kit using the same can be taught to design a printed circuit board. That is, by connecting the various elements described above with a connection line to implement them as a circuit on the base plate to be seen with the naked eye. By doing so, it is possible for the user of the present invention to develop the ability to construct the circuit, and it can be used in the field of teaching the circuit.

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Abstract

The present invention relates to an electronic circuit board for education and to an electronic circuit kit using same. The present invention may realize an electronic circuit in which lands (120) having a magnetic property and electric conductivity are arranged in columns and rows on a base plate (110) made of an insulation material, and an element (140) having a lead (144) is employed, the lead (144) being electrically connected to a connection line (130) for an electrical connection between the lands (120) and being electrically connected to a connection line (130') that is electrically connected to the lands (120) or arranged for an electrical connection to the lands (120). According to the above-described present invention, it can be easier to learn how to design and actually manufacture a circuit.

Description

교육용 전자회로보드 및 이를 사용한 전자회로키트Educational electronic circuit board and electronic circuit kit using same
본 발명은 교육용 전자회로보드 및 이를 사용한 전자회로키트에 관한 것으로, 더욱 상세하게는 절연재질의 베이스판에 자력과 전기전도성을 가진 랜드를 설치하고 소자에 연결된 연결선을 랜드에 자력을 사용하여 부착하도록 된 교육용 전자회로보드에 관한 것이다.The present invention relates to an educational electronic circuit board and an electronic circuit kit using the same, and more particularly, to install a land having magnetic force and electrical conductivity on an insulating base plate and to attach a connection line connected to the device by using magnetic force to the land. It relates to an educational electronic circuit board.
일반적으로, 전자회로 교육시에 사용하는 교육용 전자회로보드인 브레이드보드(1)는 도 1과 도 2에 도시된 바와 같이 가로.세로방향 일정 간격으로 만들어진 소켓에 전자부품 소자인 저항(r), 빛감지센서(CdS), 발광다이오드(led), 가변저항기(vr), 마이크로칩(ic), 연결선(w) 등을 꽂아서 전기적으로 연결하여 회로를 구성하고 분해할 수 있도록 되어 있다.In general, the braid board 1, which is an educational electronic circuit board used in electronic circuit education, has a resistance r, which is an electronic component element, in a socket made at regular intervals in the horizontal and vertical directions as shown in FIGS. A light sensor (CdS), a light emitting diode (led), a variable resistor (vr), a microchip (ic), a connecting line (w), etc. by plugging in the electrical connection to configure and disassemble the circuit.
도면상의 미설명 부호 2는 전원공급장치이다.Reference numeral 2 in the drawings is a power supply.
또, 다른 교육용 전자회로보드(21)는 도 3과 도 4에 도시된 바와 같이 전원스위치(24)와 다수의 소켓(22,23) 그리고 일정 크기를 갖는 돌기(25)가 일정간격으로 배열되어 있고, 상기 돌기(25)에는 상기 도 4에 도시된 바와 같은 다양한 크기의 블럭(26,27,28)이 압입고정되는 것이다.In addition, as shown in FIGS. 3 and 4, the educational electronic circuit board 21 includes a power switch 24, a plurality of sockets 22 and 23, and protrusions 25 having a predetermined size. In the protrusion 25, blocks 26, 27, and 28 of various sizes as shown in FIG. 4 are press-fitted.
상기 블럭(26,27,28)은 전자회로부품의 리드가 삽입되는 소켓(26a,27a,27a',28a,28b,28c)과 그 블럭(26)을 상하로 적층하여 고정할 수 있는 연결구(26b,26c)가 소정의 간격으로 배열되어 있다.The blocks 26, 27, and 28 are sockets 26a, 27a, 27a ', 28a, 28b, and 28c into which the leads of an electronic circuit component are inserted, and a connector for stacking and fixing the blocks 26 up and down ( 26b and 26c are arranged at predetermined intervals.
그리고, 또 다른 교육용 전자회로보드(31)는 도 5와 도 6에 도시된 바와 같이 저항(r)과 같은 소자를 베이스(36a), 커버(36b), 부착판(36c), 금속단자(36d,36d,)로 구성된 부품블럭(36)으로 만들고 그 부품블럭(36)은 상기 전자회로보드(31)에 만들어진 콘덴서단자(33), 스피커단자(32), 스위치단자(34), 파워연결단자(35)에 맞추어 상기 금속단자(36d,36d')를 부착하여 회로를 구성할 수 있도록 되어 있다.In addition, as shown in FIGS. 5 and 6, another educational electronic circuit board 31 includes an element such as a resistor r as a base 36a, a cover 36b, an attachment plate 36c, and a metal terminal 36d. And a component block (36) consisting of 36d, and the component block (36) is a condenser terminal (33), a speaker terminal (32), a switch terminal (34), and a power connection terminal made of the electronic circuit board (31). In accordance with 35, the metal terminals 36d and 36d 'can be attached to form a circuit.
그리고 또, 교육용 전자회로보드(47)는 도 7과 도 8에 도시된 바와 같이 다양한 전자소자를 장착한 전자소자판(41)을 만든다. 상기 전자소자판(41)은 절연소재로 몸체(b)를 만들고 양단에는 원통형자석(Mc1,Mc2)을 압입하는 자석케이스(p1,p2)가 있으며, 상기 두 개의 원통형자석(Mc1,Mc2)은 연결선(w1,w2)으로 연결하고 그 연결선(w1,w2) 사이에는 발광다이오드(led)와 같은 소자의 리드(l1,l2)가 연결되어 있다.In addition, the educational electronic circuit board 47 makes an electronic device board 41 on which various electronic devices are mounted, as shown in FIGS. 7 and 8. The electronic device plate 41 is made of an insulating material (b) and the magnet case (p1, p2) for pressing the cylindrical magnet (Mc1, Mc2) at both ends, the two cylindrical magnets (Mc1, Mcc) are The leads l1 and l2 of a device such as a light emitting diode are connected between the connecting lines w1 and w2 and between the connecting lines w1 and w2.
상기와 같은 전자소자판(41,42,43,44,45,46)은 전원인가판(46) 등과 함께 원통형자석(Mc1,Mc2)을 서로 연결하여 전기적으로 통할 수 있도록 하여 회로를 구성하는 것이다. 도면상의 미설명 부호 ps는 전원공급장치, sw는 스위치이다.The electronic device plates 41, 42, 43, 44, 45, and 46 as described above constitute a circuit by connecting the cylindrical magnets Mc1 and Mc2 with each other, such as the power applying plate 46, to allow electrical communication. . In the drawings, reference numeral ps denotes a power supply and sw denotes a switch.
그러나, 상기와 같이 구성된 교육용 전자회로보드는 다음과 같은 문제점을 갖고 있다.However, the educational electronic circuit board configured as described above has the following problems.
상기 도 1과 도 2에 도시된 바와 같은 교육용 전자회로보드인 브레이드보드(1)는 소켓에 저항(r)과 발광다이오드(led) 등과 같은 전자부품의 리드를 삽입하여 전기적으로 연결하기 때문에 연결상태를 육안으로 관찰하기가 어려웠다. 그리고, 난잡하게 삽입된 전자부품으로 인하여 교육받는 아이들이 회로의 전기적 흐름을 이해하기 어려웠으며, 또 피시비(PCB)와 너무도 상이하기 때문에 전자제품에 있는 전자회로기판을 보고 이해할 수 있도록 교육하기에는 어려움이 있다.1 and 2, the braid board 1, which is an educational electronic circuit board as shown in FIG. 1, is connected to the socket by electrically inserting a lead of an electronic component, such as a resistor r and a light emitting diode, to be electrically connected. It was difficult to observe with the naked eye. In addition, it is difficult for educated children to understand the electrical flow of circuits because of the cluttered insertion of electronic components, and because it is so different from PCB, it is difficult to educate them to see and understand electronic circuit boards in electronic products. have.
그리고, 상기 도 3과 4에 도시된 바와 같은 교육용 전자회로보드(21)는 다양한 전자소자를 다양한 형태의 블럭(26,27,28)에 맞추어 먼저 조립한 후 상기 돌기(25)에 끼워 배열한 하여 전기적으로 연결하게 되어 있으나, 상기 브레이드보드(1)와 같이 만들어진 소켓(26a,27a,27a',28a,28a')이 상기 블럭(26,27,28)에도 있어 결국 같은 방법으로 전기적 연결이 된다.In addition, the educational electronic circuit board 21 as shown in FIGS. 3 and 4 may be assembled by first fitting various electronic devices to the blocks 26, 27, 28 of various shapes, and then inserting them into the protrusions 25. Electrical connection, but the sockets 26a, 27a, 27a ', 28a, 28a' made with the braid board 1 are also present in the blocks 26, 27, 28. do.
따라서, 상기 브레이드보드(1)와 같은 문제와 함께 부피가 큰 블럭(26,27,28)으로 인하여 교육받는 아이들이 전기회로를 이해하는데 더욱더 어려웠다. 또한, 복잡하고 부품이 많이 필요한 전자회로를 만들기 위해서는 여러 개의 상기 전자회로보드(21)가 있어야 하기 때문에 비용이 많이 드는 문제와 함께 상기 브레이드보드(1)와 같이 피시비(PCB)와는 너무도 상이하기 때문에 전자제품에 있는 전자회로기판을 이해할 수 있도록 교육하기에는 어려움이 있다.Therefore, it is more difficult for the educated children to understand the electric circuit due to the bulky blocks 26, 27, 28 with the same problem as the braid board 1 above. In addition, since the electronic circuit board 21 must be several in order to make an electronic circuit that is complicated and requires a lot of parts, it is too different from the PCB as in the braid board 1 with the costly problem. It is difficult to educate students to understand electronic circuit boards in electronic products.
그리고 또, 상기 도 5와 도 6에 도시된 바와 같은 교육용 전자회로보드(31)는 정해진 회로를 납땝하지 않고 조립할 수 있게 되어 있기 때문에 다양하게 응용할 수 없는 단품으로 만들어지게 된다.In addition, since the educational electronic circuit board 31 shown in FIGS. 5 and 6 can be assembled without soldering a predetermined circuit, the educational electronic circuit board 31 is made of a single unit that cannot be variously applied.
또, 부품이 블럭(36)화 되어 있어 실제 전자제품에 있는 전자회로기판과 너무도 상이하고 이로 인하여 전자회로를 이해할 수 있도록 교육하기 어려운 문제점이 있다. 또한, 상기 전자소자를 블럭화 해야 하기 때문에 제조원가가 높아져 제품의 가격이 높아지는 문제점이 있다.In addition, since the parts are made into blocks 36, there is a problem that it is too different from the electronic circuit board in the actual electronic product, which makes it difficult to educate the electronic circuit. In addition, since the electronic device must be blocked, there is a problem in that the manufacturing cost increases and the price of the product increases.
또, 상기 도 7과 도 8에 도시된 바와 같은 교육용 전자회로보드(47)는 저항(r), 발광다이오드(led)와 같은 소자와 원통형자석(Mc1,Mc2)과 연결하여 블럭화 한 전자소자판(41)을 만들어 상기 원통형자석(Mc1,Mc2)을 서로 연결부착하거나 적층함으로써 회로가 전기적으로 연결된다. 이로 인하여 부피가 커짐과 함께 전자회로와 너무도 상이한 모양을 이루게 된다.In addition, the electronic circuit board 47 for education as shown in FIGS. 7 and 8 is blocked by connecting a device such as a resistor r and a light emitting diode led and cylindrical magnets Mc1 and Mc2. The circuit is electrically connected by making a 41 to connect or laminate the cylindrical magnets Mc1 and Mc2. This results in a bulky shape that is too different from the electronic circuitry.
이로 인하여, 상기 설명한 교육용 전자회로보드(1,21,31)와 같은 문제점 즉, 전자제품에 있는 실제 전자회로기판과 너무 상이하여 전자회로를 이해하도록 하는 것이 어려운 문제가 있다. 또한, 복잡하게 연결되고 적층된 전자소자판(41)으로 인하여 회로의 전기적 연결 상태를 파악하는데 어려운 문제가 있다.For this reason, there are problems such as the above-described educational electronic circuit boards 1, 21, and 31, that is, it is so different from the actual electronic circuit board in the electronic product that it is difficult to understand the electronic circuit. In addition, there is a problem that it is difficult to determine the electrical connection state of the circuit due to the complicated connected and stacked electronic device plate (41).
본 발명의 목적은 상기한 바와 같은 종래의 문제점을 해결하기 위한 것으로, 교육용 전자회로보드 및 이를 사용한 전자회로키트에서 소자와 랜드, 랜드와 랜드를 자력으로 상기 랜드에 부착되는 연결선을 사용하여 전기적으로 연결하도록 하여 회로에 대한 교육을 수행하도록 하는 것이다.An object of the present invention is to solve the conventional problems as described above, in the electronic circuit board for education and the electronic circuit kit using the same by using a connection line attached to the land by the elements and land, land and land by magnetic force To do the training for the circuit.
본 발명의 다른 목적은 자력과 전기전도성을 가진 랜드를 연결선을 사용하여 서로 연결하고 연결선으로 랜드와 소자를 직접 연결하도록 하여 시각적으로 전자회로를 확인할 수 있도록 하는 것이다. Another object of the present invention is to connect a land having magnetic force and electrical conductivity to each other by using a connection line and to directly connect the land and the element by the connection line so that the electronic circuit can be visually identified.
상기한 바와 같은 목적을 달성하기 위한 본 발명의 특징에 따르면, 본 발명은 절연재질로 만들어지고 열을 지어 형성되는 체결공을 구비하는 판형상의 베이스판과, 상기 베이스판의 상기 체결공에 설치되고 자력과 전기전도성을 가져 연결선 및 소자의 리드와 자력에 의해 연결되어 전기적 연결을 수행하는 랜드를 포함한다.According to a feature of the present invention for achieving the above object, the present invention is installed in the plate-shaped base plate having a fastening hole made of an insulating material and formed in a row, and the fastening hole of the base plate And a land having magnetic force and electrical conductivity and connected by lead and magnetic force of the device to perform electrical connection.
상기 베이스판은 투명재질로 만들어진다.The base plate is made of a transparent material.
상기 랜드는 구형상의 몸체와 상기 몸체에서 연장되고 상기 체결공의 내면에 형성된 체결탭과 체결되는 나사부가 외면에 형성된 체결보스를 포함한다.The land includes a spherical body and a fastening boss extending from the body and a threaded portion that is fastened to a fastening tab formed on an inner surface of the fastening hole.
상기 랜드는 상기 베이스판의 양측 표면중 적어도 일측 표면에 배열된다.The land is arranged on at least one surface of both surfaces of the base plate.
본 발명의 다른 특징에 따르면, 본 발명은 절연재질로 만들어지고 열을 지어 형성되는 체결공을 구비하는 판형상의 베이스판과, 상기 베이스판의 상기 체결공에 설치되고 자력과 전기전도성을 가지는 랜드와, 상기 랜드 사이를 전기적으로 연결하는 것으로 탄성변형이 되고 전기전도성을 가지는 전기전도부재의 양단부에 상기 랜드에 부착되는 연결단자가 구비되는 연결선과, 몸체에서 연장되어 상기 랜드에 전기적으로 연결되는 리드를 구비하는 소자를 포함한다.According to another feature of the present invention, the present invention provides a plate-shaped base plate having a fastening hole made of an insulating material and formed in a row, and a land installed in the fastening hole of the base plate and having magnetic force and electrical conductivity; A connection line having elastic terminals and electrically connected to the lands at both ends of the electrically conductive member having electrical conductivity, and a lead extending from the body to be electrically connected to the lands. It includes an element to be provided.
상기 베이스판은 투명한 재질로 만들어진다.The base plate is made of a transparent material.
상기 랜드는 구형상의 몸체와 상기 몸체에서 연장되고 상기 체결공의 내면에 형성된 체결탭과 체결되는 나사부가 외면에 형성된 체결보스를 포함한다.The land includes a spherical body and a fastening boss extending from the body and a threaded portion that is fastened to a fastening tab formed on an inner surface of the fastening hole.
상기 랜드는 상기 베이스판의 양측 표면중 적어도 일측 표면에 배열된다.The land is arranged on at least one surface of both surfaces of the base plate.
상기 랜드는 상기 베이스판의 상기 체결공에 양측 표면에서 위치되는데 상기 랜드는 구형상의 몸체로 구성되어 양측 표면의 것이 서로 자력에 의해 베이스판에 설치된다.The lands are located at both surfaces of the fastening hole of the base plate, and the lands are formed in a spherical body so that the surfaces of both surfaces are magnetically installed on the base plate.
상기 연결선을 구성하는 전기전도부재는 전기전도성을 가지는 코일스프링이 사용된다.As the conductive member constituting the connecting line, a coil spring having electrical conductivity is used.
상기 연결단자는 링형상의 단자몸체에서 상기 전기전도부재에 결합되는 결합돌기가 돌출되어 형성된다.The connection terminal is formed to protrude a coupling protrusion coupled to the electrically conductive member in a ring-shaped terminal body.
상기 전기전도부재를 유연한 재질로 만들어진 절연피복이 둘러싼다.An insulating coating made of a flexible material surrounds the electrically conductive member.
상기 소자의 리드에는 별도의 연결선이 연결될 수 있는데, 상기 연결선은 전기전도성을 가지고 탄성변형가능한 전기전도부재의 일단부에 상기 리드가 결합되는 소켓이 구비되고 상기 전기전도부재의 타단부에 상기 랜드에 부착되는 링형상의 연결단자가 구비된다.A separate connection line may be connected to the lead of the device, and the connection line has an electrical conductivity and a socket to which the lead is coupled to one end of the elastically deformable electrically conductive member, and is connected to the land at the other end of the electrically conductive member. A ring-shaped connecting terminal is provided.
상기 전기전도부재를 유연한 재질로 만들어진 절연피복이 둘러싼다.An insulating coating made of a flexible material surrounds the electrically conductive member.
상기 소자의 리드에는 상기 랜드에 부착되고 링형상으로 만들어진 리드단자가 구비된다.The lead of the device is provided with a lead terminal attached to the land and made into a ring shape.
본 발명에 의한 교육용 전자회로보드 및 이를 사용한 전자회로키트에서는 다음과 같은 효과를 얻을 수 있다.Educational electronic circuit board and electronic circuit kit using the same according to the present invention can obtain the following effects.
먼저, 본 발명에서는 베이스판에 열을 지어 설치되고 자력과 전기전도성을 가지는 랜드에 연결선을 간단하게 자력으로 부착하여 랜드끼리 서로 연결하거나 랜드와 소자를 연결하도록 하였으므로 회로의 구성에 대해서 쉽게 교육할 수 있는 효과가 있다.First, in the present invention, it is easy to educate about the circuit configuration because it is installed in a row on the base plate and simply attaches a connection line to a land having magnetic force and electrical conductivity to connect the lands to each other or to connect the land and the elements. It has an effect.
그리고, 본 발명에서는 랜드와 랜드 또는 랜드와 소자를 연결하는 연결선을 직접 육안으로 볼 수 있으므로 피교육자가 회로의 구성을 쉽게 확인할 수 있어 회로의 구성에 대한 교육효과를 높일 수 있다.In addition, in the present invention, the land and land or connecting lines connecting the land and the elements can be directly seen by the naked eye so that the trainee can easily check the configuration of the circuit, thereby improving the educational effect on the configuration of the circuit.
또한, 본 발명에서는 베이스판의 일면에만 랜드를 설치하거나, 양면 모두에 랜드를 설치할 수 있으므로 실제의 단면 인쇄회로기판 또는 양면 인쇄회로기판과 매우 유사한 형태를 구현할 수 있어 회로 교육이 보다 쉽게 이루어질 수 있는 효과도 있다.In addition, in the present invention, the land can be installed only on one surface of the base plate, or the land can be installed on both sides, so that a very similar form to an actual single-sided printed circuit board or a double-sided printed circuit board can be realized, so that circuit education can be made more easily. It also works.
그리고, 본 발명에서는 랜드 사이나 랜드와 소자를 연결하는 연결선이 유연한 성질을 가져서 다양한 형태로의 연결이 가능하여 회로 구성을 간단하게 할 수 있게 되는 효과도 있다.In addition, in the present invention, the connection lines between the lands or the lands and the elements have a flexible property, so that various types of connections can be made, thereby simplifying the circuit configuration.
도 1은 종래 기술에 의한 교육용 전자회로키트인 브레이드보드의 구조를 보인 사시도.1 is a perspective view showing the structure of a braid board which is an electronic circuit kit for education according to the prior art.
도 2는 종래 기술에 의한 교육용 전자회로키트인 브레이드보드의 상세 구조를 보인 부분 사시도.Figure 2 is a partial perspective view showing a detailed structure of a braid board which is an educational electronic circuit kit according to the prior art.
도 3은 종래 기술에 의한 다른 교육용 전자회로보드의 구조를 보인 사시도.Figure 3 is a perspective view showing the structure of another educational electronic circuit board according to the prior art.
도 4는 상기 도 3에 도시된 교육용 전자회로보드에 조립되는 다양한 블럭의 구조를 보인 사시도.Figure 4 is a perspective view showing the structure of the various blocks assembled to the educational electronic circuit board shown in FIG.
도 5는 종래 기술에 의한 또 다른 교육용 전자회로키트의 구조를 보인 평면도.Figure 5 is a plan view showing a structure of another educational electronic circuit kit according to the prior art.
도 6은 상기 도 5에 도시된 교육용 전자회로보드에 조립되는 부품블럭의 구조를 보인 분해사시도.Figure 6 is an exploded perspective view showing the structure of the component block assembled to the educational electronic circuit board shown in FIG.
도 7은 종래 기술에 의한 또 다른 교육용 전자회로보드에 조립되는 전자소자판의 구조를 보인 사시도.Figure 7 is a perspective view showing the structure of an electronic device board assembled to another educational electronic circuit board according to the prior art.
도 8은 도 7에 도시된 전자소자판이 연결조립된 상태를 보인 종래 기술에 의한 교육용 전자회로보드의 구조를 보인 사시도.FIG. 8 is a perspective view illustrating a structure of an electronic circuit board for education according to the related art in which the electronic device board illustrated in FIG. 7 is connected and assembled.
도 9는 본 발명에 의한 교육용 전자회로보드의 바람직한 실시예의 구성을 보인 사시도.Figure 9 is a perspective view showing the configuration of a preferred embodiment of the educational electronic circuit board according to the present invention.
도 10은 도 9에 도시된 실시예의 상세 구성을 보인 부분단면 사시도.10 is a partial cross-sectional perspective view showing a detailed configuration of the embodiment shown in FIG.
도 11은 도 9에 도시된 전자회로보드를 사용한 교육용 전자회로키트의 바람직한 실시예의 구성을 보인 측면도.Figure 11 is a side view showing the configuration of a preferred embodiment of the educational electronic circuit kit using the electronic circuit board shown in FIG.
도 12는 본 발명 실시예를 구성하는 연결선의 구성을 보인 분해사시도.12 is an exploded perspective view showing the configuration of the connecting line constituting an embodiment of the present invention.
도 13은 도 12에 도시된 연결선의 구성을 보인 부분절결사시도.13 is a partial cutaway perspective view showing the configuration of the connecting line shown in FIG.
도 14는 도 11에 도시된 실시예에서 사용되는 소자들의 구성을 보인 사시도.14 is a perspective view showing the configuration of elements used in the embodiment shown in FIG.
도 15는 도 11에 도시된 실시예에서 사용되는 연결선의 구성을 보인 분해사시도.Figure 15 is an exploded perspective view showing the configuration of the connecting line used in the embodiment shown in FIG.
도 16은 도 11에 도시된 실시예에서 사용되는 연결선의 구성을 보인 부분절결사시도.16 is a partially cutaway perspective view showing the configuration of a connecting line used in the embodiment shown in FIG.
도 17은 본 발명에서 사용되는 소자의 리드에 연결되는 연결선의 다른 구성을 보인 사시도.Figure 17 is a perspective view showing another configuration of a connecting line connected to the lead of the device used in the present invention.
도 18은 도 11에 도시된 실시예가 사용되는 것을 보인 사시도.FIG. 18 is a perspective view showing that the embodiment shown in FIG. 11 is used;
도 19는 본 발명에 의한 교육용 전자회로보드의 다른 실시예의 구성을 보인 사시도.19 is a perspective view showing the configuration of another embodiment of an electronic circuit board for education according to the present invention.
도 20은 도 19에 도시된 실시예의 상세구성을 보인 부분단면 사시도.20 is a partial cross-sectional perspective view showing a detailed configuration of the embodiment shown in FIG.
도 21은 도 19에 도시된 전자회로보드를 사용한 교육용 전자회로키트의 다른 실시예의 구성을 보인 측면도.21 is a side view showing the configuration of another embodiment of an electronic circuit kit for education using the electronic circuit board shown in FIG.
이하 본 발명에 의한 교육용 전자회로보드 및 이를 사용한 전자회로키트의 바람직한 실시예를 첨부된 도면을 참고하여 상세하게 설명한다.Hereinafter, exemplary embodiments of an electronic circuit board for education and an electronic circuit kit using the same will be described in detail with reference to the accompanying drawings.
도 9에 도시된 바에 따르면, 본 실시예의 전자회로보드(100)는 베이스판(110)이 골격을 형성한다. 상기 베이스판(110)은 본 실시예에서는 투명한 합성수지재질이고, 사각형의 판형상이다. 하지만, 상기 베이스판(110)은 절연성 재질로 만들어지고 판형상이라면 어떠하여도 상관없다. 물론, 상기 베이스판(110)이 투명하면 그 표면과 이면 모두를 사용하는 경우에 베이스판(110)의 표면과 이면에 설치된 구성을 쉽게 확인할 수 있으므로 좋다. As shown in FIG. 9, in the electronic circuit board 100 of the present embodiment, the base plate 110 forms a skeleton. The base plate 110 is a transparent synthetic resin material in the present embodiment, a rectangular plate shape. However, the base plate 110 may be made of an insulating material and may be any plate shape. Of course, if the base plate 110 is transparent, it may be easy to check the configuration provided on the front and rear surfaces of the base plate 110 when using both the front and back surfaces.
상기 베이스판(110)에는 아래에서 설명될 랜드(120)가 설치되는 체결공(112)이 형성되어 있다. 상기 체결공(112)은 상기 베이스판(110)을 관통하여 형성된다. 상기 체결공(112)의 내면에는 체결탭(114)이 형성되어 있다. 상기 체결공(112)은 인접한 것끼리 일정한 간격을 가지도록 하는 것이 좋다. 도면부호 116은 고정홀이다.The base plate 110 is formed with a fastening hole 112 in which the land 120 to be described below is installed. The fastening hole 112 is formed through the base plate 110. A fastening tab 114 is formed on an inner surface of the fastening hole 112. The fastening hole 112 is good to have a predetermined interval between the adjacent ones. Reference numeral 116 denotes a fixing hole.
상기 베이스판(110)에 형성된 체결공(112)에는 각각 랜드(120)가 설치된다. 상기 랜드(120)는 전기를 전달할 수 있는 전도체이고 자력을 가진다. 즉, 상기 랜드(120)는 전기전도가 가능한 자석이다. 상기 랜드(120)는 다수개가 열을 지어 설치된다. 본 실시예에서는 상기 랜드(120)가 가로와 세로방향으로 일정한 간격을 가지도록 열을 지어 설치된다. 물론, 상기 랜드(120)가 반드시 일정한 간격을 가지고 열을 지어 설치되어야 하는 것은 아니나, 본 실시예에서 도시된 바와 같이 일정한 간격으로 열을 지어 배치되는 것이 회로의 구성에 가장 좋다. Lands 120 are respectively installed in the fastening holes 112 formed in the base plate 110. The land 120 is a conductor capable of transferring electricity and has magnetic force. That is, the land 120 is a magnet capable of electrical conduction. A plurality of lands 120 are installed in a row. In the present embodiment, the lands 120 are arranged in rows so as to have a constant distance in the horizontal and vertical directions. Of course, the lands 120 do not necessarily have to be arranged in rows at regular intervals, but as shown in this embodiment, it is best to configure the circuits in rows at regular intervals.
상기 랜드(120)의 구성을 살펴보면, 도 10에 잘 도시된 바와 같이 상기 베이스판(110)의 외부로 돌출되어 있는 몸체(122)에 상기 체결공(112)에 삽입되어 체결되는 체결보스(124)가 일체로 구비된다. 상기 몸체(122)는 본 실시예에서 구형상으로 되어 있고, 상기 베이스판(110)의 표면에 돌출되어 있다. 하지만, 상기 몸체(122)의 형상은 다양하게 만들어질 수 있고, 상기 베이스판(110)의 내부에 일부가 들어가 있도록 될 수 있다. 상기 체결보스(124)는 봉형상으로 되어 상기 몸체(122)에 일체로 형성되고, 외면에 상기 체결탭(114)과 체결되는 탭이 형성되어 있다.Looking at the configuration of the land 120, as shown in Figure 10, the fastening boss 124 is inserted into the fastening hole 112 is fastened to the body 122 protruding to the outside of the base plate 110 ) Is integrally provided. The body 122 has a spherical shape in the present embodiment, and protrudes from the surface of the base plate 110. However, the shape of the body 122 may be made in various ways, a portion of the base plate 110 may be entered. The fastening boss 124 has a rod shape and is integrally formed on the body 122, and a tab is fastened to an outer surface of the fastening boss 124.
상기 랜드(120) 사이를 연결하여 전기적 연결을 수행하기 위해서 연결선(130)이 사용된다. 상기 연결선(130)의 구성은 도 12 및 도 13에 잘 도시되어 있다. 상기 연결선(130)에는 전기적 연결을 위한 전기전도부재(132)가 구비되고 상기 전기전도부재(132)는 인접하는 연결선(130)이나 아래에서 설명될 소자(140)들의 리드(144)와의 쇼트를 방지하기 위해 절연피복(134)으로 둘러싸여진다. 즉, 상기 절연피복(134)을 관통하여 상기 전기전도부재(132)가 통과한다.The connection line 130 is used to connect the lands 120 to perform electrical connection. The configuration of the connecting line 130 is shown well in FIGS. 12 and 13. The connection line 130 is provided with an electrically conductive member 132 for electrical connection, and the electrically conductive member 132 has a short with the lead 144 of the adjacent connection line 130 or the elements 140 to be described below. It is surrounded by an insulating coating 134 to prevent. That is, the conductive member 132 passes through the insulating coating 134.
본 실시예에서 상기 전기전도부재(132)는 원통코일스프링의 형상으로 만들어지고, 상기 절연피복(134) 역시 유연한 재질로 만들어진다. 따라서, 상기 전기전도부재(132)는 상기 절연피복(134)으로 씌워진 상태에서 자유롭게 탄성변형되어 구부러 질 수 있게 된다.In the present embodiment, the conductive member 132 is made in the shape of a cylindrical coil spring, and the insulating coating 134 is also made of a flexible material. Therefore, the electrically conductive member 132 can be freely elastically deformed and bent while being covered with the insulating coating 134.
상기 연결선(130)의 양단에는 상기 전기전도부재(132)와 결합되게 연결단자(136)가 구비된다. 상기 연결단자(136)는 상기 랜드(120)에 부착되어 전기적으로 연결되는 부분이다. 즉, 상기 연결단자(136)가 상기 랜드(120)에 부착됨에 의해 상기 전기전도부재(132)와 랜드(120)가 전기적으로 연결된다. 상기 연결단자(136)는 링형상의 단자몸체(136')가 구비되고, 상기 단자몸체(136')의 일측에 결합돌기(138)가 돌출되어 있다. 상기 결합돌기(138)는 상기 전기전도부재(132)의 내부에 삽입되어 전기전도부재(132)와 단자몸체9136')를 전기적으로 연결한다.Both ends of the connection line 130 is provided with a connection terminal 136 to be coupled to the electrically conductive member 132. The connection terminal 136 is a portion that is attached to the land 120 and electrically connected. That is, the electrically conductive member 132 and the land 120 are electrically connected to each other by attaching the connection terminal 136 to the land 120. The connection terminal 136 is provided with a ring-shaped terminal body 136 ′, the coupling protrusion 138 protrudes on one side of the terminal body 136 ′. The coupling protrusion 138 is inserted into the conductive member 132 to electrically connect the conductive member 132 to the terminal body 9336 '.
여기서, 상기 단자몸체(136')는 링형상으로 되어 있는데, 이와 같이 됨에 의해 구형상으로 만들어진 랜드(120)의 몸체(122)에 상대적으로 길게 선접촉되어 안정적으로 결합될 수 있다.In this case, the terminal body 136 ′ has a ring shape, and thus, the terminal body 136 ′ may be stably coupled to the body 122 of the land 120 formed in a spherical shape.
한편, 본 발명에서 회로를 구성하기 위해서는 다수개의 소자(140)를 사용할 수 있다. 상기 소자(140)의 예는 도 11과 도 14에 잘 도시되어 있다. 일반적으로 소자(140)는 소자몸체(142)에 외부와의 전기적 연결을 위한 리드(144)가 구비되어 구성된다. 상기 소자(140)의 예로, 발광다이오드(LED), 전해콘덴서(C1), 탄탈콘덴서(C2), 트랜지스터(TR), 저항(R), 마이크로칩(IC)등이 있다.Meanwhile, in the present invention, a plurality of elements 140 may be used to construct a circuit. Examples of the device 140 are shown in FIGS. 11 and 14. In general, the device 140 is provided with a lead 144 for electrical connection to the outside of the device body 142. Examples of the device 140 include a light emitting diode (LED), an electrolytic capacitor (C1), a tantalum capacitor (C2), a transistor (TR), a resistor (R), a microchip (IC).
여기서, 상기 소자몸체(142)에서 돌출되는 리드(144)는 어느 정도의 탄성변형 및 소성변형이 가능한 것이어서, 그 단부에 리드단자(146)를 일체로 연결하면 상기 랜드(120)에 안정적으로 결합될 수 있다. 이와 같이 소자(140)의 경우에는 소자몸체(142)에서 연장된 리드(144)의 선단에 링형상의 리드단자(146)를 설치함에 의해 상기 랜드(120)와의 전기적 연결이 쉽게 이루어질 수 있다. 이때, 상기 리드(144)는 어느 정도 탄성 또는 소성변형이 이루어지면서 연결되는 랜드(120)를 달리할 수 있다.Here, the lead 144 protruding from the device body 142 is capable of a certain degree of elastic deformation and plastic deformation, and when the lead terminal 146 is integrally connected to the end thereof, the lead 144 is stably coupled to the land 120. Can be. As described above, in the case of the device 140, an electrical connection with the land 120 may be easily performed by installing a ring-shaped lead terminal 146 at the tip of the lead 144 extending from the device body 142. At this time, the lead 144 may vary the land 120 to be connected while being made to some extent elastic or plastic deformation.
한편, 상기 소자(140)의 리드(144)의 길이를 짧게 하고, 상기 리드(144)에 별도의 연결선(130')을 연결하여 상기 랜드(120)와의 전기적 연결을 할 수 있다. 이는 상기 리드(144)가 반복하여 변형되면 소성변형이 발생하거나 절단될 수 있기 때문으로, 상기 리드(144)에 연결선(130')을 연결하여 상기 랜드(120)와의 연결이 보다 쉽게 이루어지도록 하는 것이다.Meanwhile, the length of the lead 144 of the device 140 may be shortened, and a separate connection line 130 ′ may be connected to the lead 144 to make an electrical connection with the land 120. This is because plastic deformation may occur or be cut when the lead 144 is repeatedly deformed, so that the connection line 130 ′ is connected to the lead 144 so that the land 120 may be more easily connected. will be.
여기에서 사용되는 연결선(130')의 구성은 도 15와 도 16에 잘 도시되어 있는데, 그 구성은 상기 연결선(130)의 구성과 유사하고 일측의 연결단자(136) 대신에 소켓(139)을 사용하는 것이다. 상기 소켓(139)은 상기 리드(144)와 결합되는 부분이다. 상기 소켓(139)은 대략 원통형상으로 된 통체(139')에 상기 전기전도부재(132)에 결합되는 결합돌기(139")가 일체로 구비되어 구성된다. 상기 통체(139')에는 상기 리드(144)가 삽입된다.The configuration of the connection line 130 ′ used here is illustrated in FIGS. 15 and 16. The configuration is similar to that of the connection line 130, and the socket 139 is used instead of the connection terminal 136 on one side. Is to use. The socket 139 is a portion coupled to the lead 144. The socket 139 is formed of a cylindrical body 139 'having a substantially cylindrical shape and integrally provided with a coupling protrusion 139 "coupled to the conductive member 132. The cylinder 139' includes the lead. 144 is inserted.
참고로, 상기 절연피복(134)과 소켓(139)을 사용하지 않고 상기 전기전도부재(132)가 직접 리드(144)와 결합되도록 연결선(130")을 구성할 수도 있다. 이와 같은 연결선(130")은 도 17에 도시되어 있다. 상기 전기전도부재(132)는 원통코일스프링으로 되어 있어 탄성변형이 가능하면서도 원통형의 내부공간에 상기 리드(144)가 압입되어 연결될 수 있다. 이와 같은 구성은 상기 연결선(130")이 사용되는 위치가 주변과의 전기적 쇼트가 발생하지 않는 환경에서 사용될 수 있다.For reference, the connecting line 130 ″ may be configured such that the conductive member 132 is directly coupled with the lead 144 without using the insulating coating 134 and the socket 139. ") Is shown in FIG. The conductive member 132 is made of a cylindrical coil spring so that the elastic deformation is possible, but the lead 144 may be press-fitted into the cylindrical inner space. Such a configuration may be used in an environment where the connection line 130 ″ is used where no electrical short with the surroundings occurs.
이하 상기한 바와 같은 구성을 가지는 본 발명에 의한 교육용 전자회로보드 및 이를 사용한 전자회로키트를 사용하는 것을 상세하게 설명한다.Hereinafter will be described in detail using the educational electronic circuit board and the electronic circuit kit using the same according to the present invention having the configuration as described above.
도 18에는 본 실시예의 전자회로키트를 사용하여 전자회로보드(100)에서 회로를 구성한 것이 도시되어 있다. 즉, 상기 베이스판(110)에 구비된 랜드(120) 사이를 상기 연결선(130)을 사용하여 전기적으로 연결하고, 상기 소자(140)의 리드(144)를 상기 랜드(120)에 전기적으로 연결하여 회로를 구성하는 것이다.FIG. 18 shows a circuit structure of the electronic circuit board 100 using the electronic circuit kit of this embodiment. That is, the land 120 provided in the base plate 110 is electrically connected using the connection line 130, and the lead 144 of the device 140 is electrically connected to the land 120. To construct the circuit.
먼저, 상기 연결선(130)은 그 양단의 연결단자(136)가 각각 상기 랜드(120)의 몸체(122)에 자력으로 부착되어 랜드(120) 사이를 전기적으로 연결시킨다. 이와 같은 연결선(130)은 마치 인쇄회로기판의 회로패턴과 같은 역할을 하게 된다. 상기 연결선(130)은 그 길이가 다양하게 구성되어 바로 인접한 랜드(120) 사이를 전기적으로 연결하거나 여러 개의 랜드(120)를 사이에 둔 랜드(120) 사이를 전기적으로 연결할 수 있다.First, the connection line 130 is connected to the land terminal 120 by the magnetic force of the connecting terminal 136 at both ends of the land 122 of the land 120, respectively. The connection line 130 serves as a circuit pattern of a printed circuit board. The connection line 130 may be configured in various lengths to electrically connect the adjacent lands 120, or electrically connect the lands 120 having a plurality of lands 120 therebetween.
그리고, 상기 베이스판(110)에는 다수개의 소자(140)가 설치되는데, 각각의 소자(140)는 그 리드(144)의 선단에 있는 리드단자(146)가 직접 상기 랜드(120)에 자력에 의해 부착되어 전기적 연결이 이루어진다.In addition, a plurality of elements 140 are installed in the base plate 110, and each of the elements 140 has a lead terminal 146 at the tip of the lead 144 directly applied to the land 120. Attached to make an electrical connection.
상기 소자(140)의 경우 도 15 및 도 16에 도시된 연결선(130')을 사용할 수도 있다. 즉, 리드(144)의 길이를 짧게 하고, 상기 리드(144)를 연결선(130')의 소켓(139)에 압입시켜 연결선(130')과 리드(144)를 연결하여 랜드(120)와 전기적 연결을 수행하는 것이다.In the case of the device 140, the connection line 130 ′ illustrated in FIGS. 15 and 16 may be used. That is, the length of the lead 144 is shortened and the lead 144 is press-fitted into the socket 139 of the connection line 130 'to connect the connection line 130' and the lead 144 to electrically connect the land 120 to the land 120. To do the connection.
이와 같은 방식으로 각각의 소자(140)들을 상기 베이스판(110)에 있는 랜드(120)들에 자력에 의해 부착시키고, 상기 연결선(130)을 사용하여 전기적으로 연결시켜 회로를 구성할 수 있다. 이와 같은 상태가 도 18에 잘 도시되어 있다.In this manner, the elements 140 may be magnetically attached to the lands 120 in the base plate 110, and electrically connected to each other by using the connection line 130. This state is well illustrated in FIG. 18.
도 18의 경우 편의상 전원을 공급하기 위한 구성을 도시하지 않고 있는데, 상기 랜드(120)중 하나를 외부의 전원과 연결하고, 이 랜드(120)에 연결선(130)을 연결하여 회로에 전원을 공급할 수 있다.18 does not show a configuration for supplying power for convenience. One of the lands 120 may be connected to an external power source, and a connection line 130 may be connected to the lands 120 to supply power to the circuit. Can be.
한편, 상기 연결선(130)과 소자(140)를 사용하여 회로를 구성한 후에 새롭게 회로를 구성하기 위해서는 상기 연결선(130)과 소자(140) 들을 상기 랜드(120)들에서 분리한다. 상기 랜드(120)에서 상기 연결선(130)과 소자(140)를 분리하는 것은 상기 랜드(120)의 자력을 극복하면 되므로 쉽게 상기 연결선(130)과 소자(140)를 분리할 수 있다. 이렇게 연결선(130)과 소자(140)를 분리한 후에는 새로 설계된 회로에 맞춰 상기 연결선(130)과 소자(140)들을 다시 랜드(120)들에 연결시키면 된다.Meanwhile, after the circuit is formed using the connection line 130 and the element 140, the connection line 130 and the element 140 are separated from the lands 120 to form a new circuit. Separating the connecting line 130 and the element 140 from the land 120 can easily separate the connecting line 130 and the element 140 because the magnetic force of the land 120 is overcome. After separating the connection line 130 and the device 140, the connection line 130 and the device 140 may be connected to the lands 120 again according to a newly designed circuit.
본 발명에서 상기 랜드(120)와의 전기적 연결을 위해서 연결단자(136)와 리드단자(146)가 사용되는데, 이들은 모두 링형상으로 되어 있다. 이는 상기 랜드(120)의 몸체(122)가 구형상으로 되어 있는 것과 관련이 있다. 즉, 상기 몸체(122)의 외면에 상기 랜드(120)가 부착될 때, 상기 연결단자(136)와 리드단자(146)의 내부로 상기 몸체(122)의 일부가 들어가면서, 상기 연결단자(136)와 리드단자(146)는 상기 랜드(120)의 몸체(122)와 접촉하는 부분이 원을 그리게 된다. 즉, 원형을 선접촉을 상기 랜드(120)의 몸체(122)와 연결단자(136) 및 리드단자(146)가 하게 되는 것이다. 이와 같이 함에 의해 연결단자(136) 및 리드단자(146)와 랜드(120)사이의 전기적 연결이 보다 확실하게 될 수 있다. In the present invention, the connection terminal 136 and the lead terminal 146 are used for electrical connection with the land 120, all of which are ring-shaped. This is related to the body 122 of the land 120 is spherical. That is, when the land 120 is attached to the outer surface of the body 122, a portion of the body 122 enters into the connection terminal 136 and the lead terminal 146, the connection terminal 136 ) And the lead terminal 146 draws a circle in contact with the body 122 of the land 120. That is, the body 122 and the connection terminal 136 and the lead terminal 146 of the land 120 is a circular contact. By doing so, the electrical connection between the connecting terminal 136 and the lead terminal 146 and the land 120 can be more secure.
다음으로, 도 19에서 도 21을 참고하여 본 발명의 다른 실시예를 설명한다. 설명의 편의를 위해 본 실시예에서는 위에서 설명된 실시예와 대응되는 구성에 200단위의 도면부호를 부여하고 요지부분만을 설명한다.Next, another embodiment of the present invention will be described with reference to FIGS. 19 to 21. For convenience of description, the present embodiment will be given the reference numeral of 200 units in the configuration corresponding to the above-described embodiment and only the main parts will be described.
본 실시예에서는 전자회로보드(200)의 베이스판(210)의 양면에 랜드(220)가 구비된다. 본 실시예의 전자회로보드(200)는 인쇄회로기판 중에서 양면기판에 해당되는 것이다. 상기 베이스판(210)은 절연성의 합성수지로서 투명한 재질로 형성된다. 특히, 투명재질로 베이스판(210)이 만들어지면 베이스판(210)의 양면에 구비되는 소자(240)와 절연선(230) 등을 모두 쉽게 확인할 수 있다. 상기 베이스판(210)을 관통하여서는 체결공(212)이 형성된다. 상기 체결공(212)의 내면에는 체결탭(214)이 형성된다. 도면부호 216은 고정홀이다.In the present embodiment, the lands 220 are provided on both sides of the base plate 210 of the electronic circuit board 200. The electronic circuit board 200 of the present embodiment corresponds to a double-sided board of the printed circuit board. The base plate 210 is formed of a transparent material as an insulating synthetic resin. In particular, when the base plate 210 is made of a transparent material, it is possible to easily check both the element 240 and the insulating line 230 provided on both sides of the base plate 210. Fastening holes 212 are formed through the base plate 210. A fastening tab 214 is formed on an inner surface of the fastening hole 212. Reference numeral 216 denotes a fixing hole.
상기 베이스판(210)의 양측 표면에는 랜드(220)가 설치되는데, 상기 랜드(220)는 자성과 전기전도성을 가진다. 상기 랜드(220)의 구성은 위의 실시예에서와 같이 몸체(222)에서 체결보스(224)가 돌출되어 형성되는데, 상기 체결보스(224)의 외면에는 상기 체결탭(214)과 체결되는 나사부가 형성된다. Lands 220 are provided on both surfaces of the base plate 210, and the lands 220 have magnetic properties and electrical conductivity. The land 220 has a configuration in which the fastening boss 224 protrudes from the body 222 as in the above embodiment, and is formed on the outer surface of the fastening boss 224 with the fastening tab 214. Is formed.
한편, 상기 랜드(220)는 상기 베이스판(210)의 양측 표면에 각각 구비되는데, 하나의 체결공(212)에 양측 표면에서 하나씩 설치된다. 이들 각각의 랜드(220)는 체결공(212)에 상기 베이스판(210)의 일측 표면과 타측 표면에서 각각 삽입되어 체결된다. 참고로, 상기 베이스판(210)의 양측 표면에 랜드(220)가 각각 설치되는 경우에는 상기 체결보스(224)와 체결탭(214) 등을 두지 않고, 양측 표면에 있는 랜드(220)가 서로의 자력에 의해 결합되도록 할 수도 있다. On the other hand, the lands 220 are respectively provided on both surfaces of the base plate 210, one fastening hole 212 is installed one by one on both surfaces. Each of the lands 220 is inserted into and fastened to the fastening hole 212 at one surface and the other surface of the base plate 210, respectively. For reference, when the lands 220 are respectively installed on both surfaces of the base plate 210, the lands 220 on both surfaces of the lands 220 are not placed on the fastening boss 224 and the fastening tab 214. It can also be coupled by the magnetic force of.
그리고, 상기 베이스판(210)에서 상기 랜드(220) 사이는 연결선(230)에 의해 전기적 연결이 이루어진다. 상기 연결선(230)의 양단에는 연결단자(236)가 구비되는데, 상기 연결선(230)의 다른 구성은 위에서 설명될 실시예의 것과 같다.In addition, an electrical connection is made between the lands 220 in the base plate 210 by a connection line 230. Both ends of the connection line 230 is provided with a connection terminal 236, the other configuration of the connection line 230 is the same as the embodiment described above.
그리고, 상기 베이스판(210)에 설치되는 소자(240)들은 다양한 종류가 있는데, 대부분 몸체(242)에서 리드(244)가 2개 이상 연장되어 나오도록 된다. 상기 리드(244)가 상기 몸체(242)에 2개 이상 다수개 구비될 수 있다. 상기 소자(240)에는 상기 리드(244)를 짧게 하고 별도의 연결선(230')을 설치할 수도 있다.In addition, there are various types of elements 240 installed on the base plate 210, and most of the leads 244 extend from the body 242. Two or more leads 244 may be provided in the body 242. The lead 240 may be shortened and a separate connection line 230 ′ may be provided in the device 240.
이하 상기한 바와 같은 구성을 가지는 본 발명 실시예에 의한 교육용 전자회로보드 및 이를 사용한 전자회로키트를 사용하는 것을 상세하게 설명한다.Hereinafter will be described in detail using the educational electronic circuit board and the electronic circuit kit using the same according to an embodiment of the present invention having the configuration as described above.
도 21에는 본 실시예를 사용하는 것이 측면도로 도시되어 있는데, 상기 베이스판(210)의 양면에 각각 설치된 랜드(220)에 소자(240)들이 설치되어 회로를 구성하고 있다. 즉, 상기 베이스판(210)에 구비된 랜드(220) 사이를 상기 연결선(230)을 사용하여 전기적으로 연결하고, 상기 소자(240)의 리드(244)를 상기 랜드(220)에 전기적으로 연결하여 회로를 구성하는 것이다.21 illustrates a side view of the present embodiment, in which elements 240 are installed on lands 220 respectively provided on both sides of the base plate 210 to form a circuit. That is, the land 220 provided in the base plate 210 is electrically connected to each other using the connection line 230, and the lead 244 of the device 240 is electrically connected to the land 220. To configure the circuit.
먼저, 상기 연결선(230)은 그 양단의 연결단자(236)가 각각 상기 랜드(220)의 몸체(222)에 자력으로 부착되어 랜드(220) 사이를 전기적으로 연결시킨다. 이와 같은 연결선(230)은 마치 인쇄회로기판의 회로패턴과 같은 역할을 하게 된다. 상기 연결선(230)은 그 길이가 다양하게 구성되어 바로 인접한 랜드(220) 사이를 전기적으로 연결하거나 여러 개의 랜드(220)를 사이에 둔 랜드(220) 사이를 전기적으로 연결할 수 있다.First, the connection line 230 is connected to each of the connecting terminal 236 of the land 220, the body 222 of the land 220 by magnetic force to electrically connect between the land 220. The connection line 230 serves as a circuit pattern of a printed circuit board. The connection line 230 may be configured in various lengths to electrically connect between immediately adjacent lands 220 or between lands 220 having a plurality of lands 220 therebetween.
그리고, 상기 베이스판(210)에는 다수개의 소자(240)가 설치되는데, 각각의 소자(240)는 그 리드(244)의 선단에 있는 리드단자(246)가 직접 상기 랜드(220)에 자력에 의해 부착되어 전기적 연결이 이루어진다.In addition, a plurality of elements 240 are installed in the base plate 210, and each element 240 has a lead terminal 246 at the tip of the lead 244 directly applied to the land 220. Attached to make an electrical connection.
이와 같은 방식으로 각각의 소자(240)들을 상기 베이스판(210)에 있는 랜드(220)들에 자력에 의해 부착시키고, 상기 연결선(230)을 사용하여 전기적으로 연결시켜 회로를 구성할 수 있다. 이와 같은 상태가 도 21에 잘 도시되어 있다.In this manner, the elements 240 may be magnetically attached to the lands 220 in the base plate 210, and electrically connected to each other by using the connection line 230. This state is well illustrated in FIG.
도 21에서는 상기 베이스판(210)의 일측 표면에 형성된 회로와 타측 표면에형성된 회로를 서로 전기적으로 연결하는 구성이 도시되어 있지 않은데, 이는 상기 랜드(220)의 체결보스(224)가 서로 전기적으로 연결되게 하거나, 별도의 연결선(230)을 사용하여 베이스판(210)의 양측 표면에 있는 랜드(220)를 전기적으로 연결할 수 있다.In FIG. 21, a configuration for electrically connecting a circuit formed on one surface of the base plate 210 and a circuit formed on the other surface to each other is not illustrated, which means that the fastening bosses 224 of the land 220 are electrically connected to each other. Alternatively, the lands 220 on both surfaces of the base plate 210 may be electrically connected by using a separate connection line 230.
본 실시예에서도 편의상 전원을 공급하기 위한 구성을 도시하지 않고 있는데, 상기 랜드(220)중 하나를 외부의 전원과 연결하고, 이 랜드(220)에 연결선(230)을 연결하여 회로에 전원을 공급할 수 있다.In the present embodiment, a configuration for supplying power is not shown for convenience, and one of the lands 220 may be connected to an external power source, and the lands 220 may be connected to a connection line 230 to supply power to a circuit. Can be.
본 발명의 권리범위는 위에서 설명된 실시예에 한정되지 않고 청구범위에 기재된 바에 의해 정의되며, 본 발명의 기술분야에서 통상의 지식을 가진 자가 청구범위에 기재된 권리범위 내에서 다양한 변형과 개작을 할 수 있다는 것은 자명하다.The scope of the present invention is not limited to the embodiments described above, but is defined by the claims, and various changes and modifications can be made by those skilled in the art within the scope of the claims. It is self evident.
본 발명의 교육용 전자회로보드 및 이를 사용한 전자회로키트는 인쇄회로기판을 설계하는 것을 교육할 수 있는 것이다. 즉, 위에서 설명된 각종 소자를 연결선으로 연결하여 이를 베이스판 상에서 회로로 구현하여 육안으로 볼 수 있도록 하였다. 이와 같이 함에 의해 본 발명을 사용하는 자로 하여금 회로를 구성하는 능력을 키울 수 있도록 한 것으로, 회로에 대한 교육을 하는 분야에서 사용될 수 있는 것이다.Educational electronic circuit board of the present invention and the electronic circuit kit using the same can be taught to design a printed circuit board. That is, by connecting the various elements described above with a connection line to implement them as a circuit on the base plate to be seen with the naked eye. By doing so, it is possible for the user of the present invention to develop the ability to construct the circuit, and it can be used in the field of teaching the circuit.

Claims (15)

  1. 절연재질로 만들어지고 열을 지어 형성되는 체결공을 구비하는 판형상의 베이스판과,A plate-shaped base plate having fastening holes made of an insulating material and formed in rows;
    상기 베이스판의 상기 체결공에 설치되고 자력과 전기전도성을 가져 연결선 및 소자의 리드와 자력에 의해 연결되어 전기적 연결을 수행하는 랜드를 포함하는 교육용 전자회로보드.Educational circuit board comprising a land installed in the fastening hole of the base plate having a magnetic force and electrical conductivity connected by the lead and the magnetic force of the connecting line and the element to perform an electrical connection.
  2. 제 1 항에 있어서, 상기 베이스판은 투명재질로 만들어지는 교육용 전자회로보드.The educational electronic circuit board of claim 1, wherein the base plate is made of a transparent material.
  3. 제 1 항에 있어서, 상기 랜드는 구형상의 몸체와 상기 몸체에서 연장되고 상기 체결공의 내면에 형성된 체결탭과 체결되는 나사부가 외면에 형성된 체결보스를 포함하는 교육용 전자회로보드.The educational electronic circuit board of claim 1, wherein the land includes a spherical body and a fastening boss extending from the body and a threaded portion fastened to a fastening tab formed on an inner surface of the fastening hole.
  4. 제 1 항에 있어서, 상기 랜드는 상기 베이스판의 양측 표면중 적어도 일측 표면에 배열되는 교육용 전자회로보드.The educational electronic circuit board of claim 1, wherein the lands are arranged on at least one surface of both surfaces of the base plate.
  5. 절연재질로 만들어지고 열을 지어 형성되는 체결공을 구비하는 판형상의 베이스판과,A plate-shaped base plate having fastening holes made of an insulating material and formed in rows;
    상기 베이스판의 상기 체결공에 설치되고 자력과 전기전도성을 가지는 랜드와,A land installed in the fastening hole of the base plate and having magnetic force and electrical conductivity;
    상기 랜드 사이를 전기적으로 연결하는 것으로 탄성변형이 되고 전기전도성을 가지는 전기전도부재의 양단부에 상기 랜드에 부착되는 연결단자가 구비되는 연결선과,A connection line provided with connecting terminals attached to the lands at both ends of the electrically conductive member having elastic deformation and electrically conductive by electrically connecting the lands;
    몸체에서 연장되어 상기 랜드에 전기적으로 연결되는 리드를 구비하는 소자를 포함하는 교육용 전자회로키트. Educational electronic kit comprising an element having a lead extending from the body and electrically connected to the land.
  6. 제 5 항에 있어서, 상기 베이스판은 투명한 재질로 만들어지는 교육용 전자회로키트.The educational electronic circuit kit of claim 5, wherein the base plate is made of a transparent material.
  7. 제 5 항에 있어서, 상기 랜드는 구형상의 몸체와 상기 몸체에서 연장되고 상기 체결공의 내면에 형성된 체결탭과 체결되는 나사부가 외면에 형성된 체결보스를 포함하는 교육용 전자회로키트.The educational electronic circuit kit of claim 5, wherein the land includes a spherical body and a fastening boss extending from the body and a threaded portion fastened to a fastening tab formed on an inner surface of the fastening hole.
  8. 제 7 항에 있어서, 상기 랜드는 상기 베이스판의 양측 표면중 적어도 일측 표면에 배열되는 교육용 전자회로키트.The educational electronic circuit kit of claim 7, wherein the lands are arranged on at least one surface of both surfaces of the base plate.
  9. 제 5 항에 있어서, 상기 랜드는 상기 베이스판의 상기 체결공에 양측 표면에서 위치되는데 상기 랜드는 구형상의 몸체로 구성되어 양측 표면의 것이 서로 자력에 의해 베이스판에 설치되는 교육용 전자회로키트.6. The educational electronic circuit kit according to claim 5, wherein the lands are positioned at both surfaces of the fastening hole of the base plate, and the lands are formed of a spherical body so that the two surface surfaces are installed on the base plate by magnetic force.
  10. 제 5 항 내지 제 9 항중 어느 한 항에 있어서, 상기 연결선을 구성하는 전기전도부재는 전기전도성을 가지는 코일스프링이 사용되는 교육용 전자회로키트.10. The educational electronic circuit kit according to any one of claims 5 to 9, wherein the conductive member constituting the connecting line is a coil spring having electrical conductivity.
  11. 제 10 항에 있어서, 상기 연결단자는 링형상의 단자몸체에서 상기 전기전도부재에 결합되는 결합돌기가 돌출되어 형성되는 교육용 전자회로키트.The educational electronic circuit kit of claim 10, wherein the connection terminal is formed by protruding a coupling protrusion coupled to the electric conductive member from a ring-shaped terminal body.
  12. 제 11 항에 있어서, 상기 전기전도부재를 유연한 재질로 만들어진 절연피복이 둘러싸는 교육용 전자회로키트.12. The educational electronic circuit kit of claim 11, wherein an insulating coating made of a flexible material surrounds the electrically conductive member.
  13. 제 5 항 내지 제 9 항중 어느 한 항에 있어서, 상기 소자의 리드에는 별도의 연결선이 연결될 수 있는데, 상기 연결선은 전기전도성을 가지고 탄성변형가능한 전기전도부재의 일단부에 상기 리드가 결합되는 소켓이 구비되고 상기 전기전도부재의 타단부에 상기 랜드에 부착되는 링형상의 연결단자가 구비되는 교육용 전자회로키트.The method of claim 5, wherein a separate connection line may be connected to the lead of the device, wherein the connection line is electrically conductive and has a socket coupled to one end of the elastically deformable electrically conductive member. Educational circuit kit provided with a ring-shaped connecting terminal is provided on the other end of the conductive member is attached to the land.
  14. 제 13 항에 있어서, 상기 전기전도부재를 유연한 재질로 만들어진 절연피복이 둘러싸는 교육용 전자회로키트.The educational electronic circuit kit of claim 13, wherein an insulation coating made of a flexible material surrounds the electrically conductive member.
  15. 제 5 항 내지 제 9 항중 어느 한 항에 있어서, 상기 소자의 리드에는 상기 랜드에 부착되고 링형상으로 만들어진 리드단자가 구비되는 교육용 전자회로키트.The educational electronic circuit kit according to any one of claims 5 to 9, wherein the lead of the device is provided with a lead terminal attached to the land and formed in a ring shape.
PCT/KR2013/000596 2012-01-26 2013-01-25 Electronic circuit board for education and electronic circuit kit using same WO2013111984A1 (en)

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RU2621442C1 (en) * 2016-02-11 2017-06-06 Николай Михайлович Стецюк Electric circuit assembly method
CN107591068A (en) * 2016-07-06 2018-01-16 上海数好数字信息科技有限公司 Circuit for teaching experiment builds module
CN112435550A (en) * 2020-11-27 2021-03-02 宁波古月教育科技有限公司 Electronic circuit teaching device

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