CN104067330B - Electronic circuit board for education and electronic circuit kit using same - Google Patents
Electronic circuit board for education and electronic circuit kit using same Download PDFInfo
- Publication number
- CN104067330B CN104067330B CN201380006578.1A CN201380006578A CN104067330B CN 104067330 B CN104067330 B CN 104067330B CN 201380006578 A CN201380006578 A CN 201380006578A CN 104067330 B CN104067330 B CN 104067330B
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- Prior art keywords
- pad
- electronic circuit
- mentioned
- connecting line
- substrate
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Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09B—EDUCATIONAL OR DEMONSTRATION APPLIANCES; APPLIANCES FOR TEACHING, OR COMMUNICATING WITH, THE BLIND, DEAF OR MUTE; MODELS; PLANETARIA; GLOBES; MAPS; DIAGRAMS
- G09B23/00—Models for scientific, medical, or mathematical purposes, e.g. full-sized devices for demonstration purposes
- G09B23/06—Models for scientific, medical, or mathematical purposes, e.g. full-sized devices for demonstration purposes for physics
- G09B23/18—Models for scientific, medical, or mathematical purposes, e.g. full-sized devices for demonstration purposes for physics for electricity or magnetism
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09B—EDUCATIONAL OR DEMONSTRATION APPLIANCES; APPLIANCES FOR TEACHING, OR COMMUNICATING WITH, THE BLIND, DEAF OR MUTE; MODELS; PLANETARIA; GLOBES; MAPS; DIAGRAMS
- G09B1/00—Manually or mechanically operated educational appliances using elements forming, or bearing, symbols, signs, pictures, or the like which are arranged or adapted to be arranged in one or more particular ways
- G09B1/02—Manually or mechanically operated educational appliances using elements forming, or bearing, symbols, signs, pictures, or the like which are arranged or adapted to be arranged in one or more particular ways and having a support carrying or adapted to carry the elements
- G09B1/04—Manually or mechanically operated educational appliances using elements forming, or bearing, symbols, signs, pictures, or the like which are arranged or adapted to be arranged in one or more particular ways and having a support carrying or adapted to carry the elements the elements each bearing a single symbol or a single combination of symbols
- G09B1/06—Manually or mechanically operated educational appliances using elements forming, or bearing, symbols, signs, pictures, or the like which are arranged or adapted to be arranged in one or more particular ways and having a support carrying or adapted to carry the elements the elements each bearing a single symbol or a single combination of symbols and being attachable to, or mounted on, the support
- G09B1/08—Manually or mechanically operated educational appliances using elements forming, or bearing, symbols, signs, pictures, or the like which are arranged or adapted to be arranged in one or more particular ways and having a support carrying or adapted to carry the elements the elements each bearing a single symbol or a single combination of symbols and being attachable to, or mounted on, the support by means of magnets
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09B—EDUCATIONAL OR DEMONSTRATION APPLIANCES; APPLIANCES FOR TEACHING, OR COMMUNICATING WITH, THE BLIND, DEAF OR MUTE; MODELS; PLANETARIA; GLOBES; MAPS; DIAGRAMS
- G09B23/00—Models for scientific, medical, or mathematical purposes, e.g. full-sized devices for demonstration purposes
- G09B23/06—Models for scientific, medical, or mathematical purposes, e.g. full-sized devices for demonstration purposes for physics
- G09B23/18—Models for scientific, medical, or mathematical purposes, e.g. full-sized devices for demonstration purposes for physics for electricity or magnetism
- G09B23/182—Models for scientific, medical, or mathematical purposes, e.g. full-sized devices for demonstration purposes for physics for electricity or magnetism for components
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09B—EDUCATIONAL OR DEMONSTRATION APPLIANCES; APPLIANCES FOR TEACHING, OR COMMUNICATING WITH, THE BLIND, DEAF OR MUTE; MODELS; PLANETARIA; GLOBES; MAPS; DIAGRAMS
- G09B23/00—Models for scientific, medical, or mathematical purposes, e.g. full-sized devices for demonstration purposes
- G09B23/06—Models for scientific, medical, or mathematical purposes, e.g. full-sized devices for demonstration purposes for physics
- G09B23/18—Models for scientific, medical, or mathematical purposes, e.g. full-sized devices for demonstration purposes for physics for electricity or magnetism
- G09B23/183—Models for scientific, medical, or mathematical purposes, e.g. full-sized devices for demonstration purposes for physics for electricity or magnetism for circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/08—Magnetic details
- H05K2201/083—Magnetic materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10234—Metallic balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10363—Jumpers, i.e. non-printed cross-over connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/173—Adding connections between adjacent pads or conductors, e.g. for modifying or repairing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
Abstract
The present invention relates to an electronic circuit board for education and to an electronic circuit kit using same. The present invention may realize an electronic circuit in which lands (120) having a magnetic property and electric conductivity are arranged in columns and rows on a base plate (110) made of an insulation material, and an element (140) having a lead (144) is employed, the lead (144) being electrically connected to a connection line (130) for an electrical connection between the lands (120) and being electrically connected to a connection line (130') that is electrically connected to the lands (120) or arranged for an electrical connection to the lands (120). According to the above-described present invention, it can be easier to learn how to design and actually manufacture a circuit.
Description
Technical field
The present invention relates to a kind of teaching consuming energy sub-circuit board and the electronic circuit external member using this electronic circuit board, in more detail
Be related on the substrate of isolation material the pad that setting has magnetic force and electric conductivity, and will be connected on element using magnetic force
Connecting line is attached to the teaching consuming energy sub-circuit board on pad.
Background technology
Generally, as depicted in figs. 1 and 2, the circuit of the teaching consuming energy sub-circuit board using when as electronics and circuit teaching
Bread board 1 is made into as the resistance r of electronic product element, photosensitive sensors cds, light emitting diode led, rheostat
Vr, microchip ic, connecting line w etc. be inserted in the socket made at certain intervals on direction anyhow be electrically connected thus
Can constitute and decomposition circuit.
In accompanying drawing, unaccounted reference 2 is electric supply installation.
Additionally, as shown in Figures 3 and 4, another teaching consuming energy sub-circuit board 21 include on and off switch 24, multiple socket 22,
23 and the projection 25 with a certain size that arranges at certain intervals, above-mentioned projection 25 is pressed into and fixing as above-mentioned Fig. 4
Shown in multiple sizes block 26,27,28.
The socket that the lead making electronic circuit component including arranging at a prescribed interval for above-mentioned piece 26,27,28 inserts
26a, 27a, 27a', 28a, 28b, 28c and be used for stacked on top of one another and fix union joint 26b, 26c of this block 26.
Additionally, as it can be seen in figures 5 and 6, in another teaching consuming energy sub-circuit board 31, the element of such as resistance r is fabricated to
The component block 36 being made up of pad 36a, covering 36b, attachment plate 36c, metal terminal 36d, 36d', and make this component block
36 pass through capacitor terminal 33, the loudspeaker terminal being directed at above-mentioned metal terminal 36d, 36d' on above-mentioned electronic circuit board 31
32nd, switch terminal 34, power connector end 35 and be attached such that it is able to constitute circuit.
Additionally, as shown in FIG. 7 and 8, teaching consuming energy sub-circuit board 47 has made the electricity being provided with multiple electronic components
Subcomponent plate 41.Above-mentioned electronic component plate 41 makes main body b with insulant, and two ends have press-in cylindrical magnet mc1, mc2
Magnet housing p1, p2, with connecting line w1, w2 connect above-mentioned two cylindrical magnet mc1, mc2, between this connecting line w1, w2
Connect lead l1, l2 of the element just like light emitting diode led.
Above-mentioned electronic component plate 41,42,43,44,45,46 by with energising plate 46 etc. together make cylindrical magnet mc1,
Mc2 is connected to each other and is switched on such that it is able to constitute circuit.On accompanying drawing, unaccounted symbol ps is electric supply installation, and sw is switch.
But, there are the following problems for the teaching consuming energy sub-circuit board of said structure.
In the breadboard 1 of above-mentioned Fig. 1 and Fig. 2 be shown as teaching electronic circuit board, because being in socket
The lead of the electronic unit of insertion such as resistance r and light emitting diode led etc. being electrically connected, so being difficult to the company of detecting by an unaided eye
Connect state.And, the electronic unit because mussily inserting result in by the flowing feelings teaching electric current in child's indigestion circuit
Condition, and because differing too much with printed circuit board (PCB) (pcb), be difficult to educate to the ground of the circuit substrate understood on electronic product
Step.
And, the teaching consuming energy sub-circuit board 21 as shown in above-mentioned Fig. 3 and 4 is first various electronic components to be directed at various shapes
After block 26,27,28 assembling of shape, it is inserted in and carries out arrangement to be electrically connected in above-mentioned projection 25, but at above-mentioned piece 26,27,28
In still there is socket 26a, 27a, 27a', 28a, the 28a' being made as above-mentioned breadboard 1, finally with identical side
Method electrically connects.
Therefore, because result in and taught with foregoing circuit bread board 1 identical problem and bulky piece 26,27,28
Child's more indigestion electronic circuit.Additionally, in order to make complexity and need perhaps multipart electronic circuit to need using many
Individual above-mentioned electronic circuit board 21, therefore there is a problem of costly, and as above-mentioned breadboard 1, itself and printed circuit board (PCB)
(pcb) differ too many, so being difficult to educate to the stage of the circuit substrate understood on electronic product.
And, because teaching consuming energy sub-circuit board 31 as illustrated in Figures 5 and 6 can assemble in the case of not welding set
Circuit, so can be made into cannot wide variety of single-piece.
And, part is changed by block 36, therefore differs too much with the electronic circuit board in actual electronic product, thus exists
It is difficult to educate to the problem of the stage understanding electronic circuit.Additionally, since it is desired that massing is carried out to above-mentioned electronic component, so depositing
Increase in cost of manufacture and lead to the problem that the price of product raises.
Additionally, in the teaching consuming energy sub-circuit board 47 as shown in above-mentioned Fig. 7 and Fig. 8, making such as resistance r, send out by manufacturing
The element of optical diode led etc. is connected and the electronic component plate 41 by massing with cylindrical magnet mc1, mc2, and by above-mentioned cylinder
Shape Magnet mc1, mc2 are connected to each other and are attached or are laminated and circuit is electrically connected.Thus, result in while volume increases
Differ too many shape with electronic circuit.
Accordingly, there are teaching consuming energy sub-circuit board 1,21, the 31 identical problem with described above, i.e. with electronic product
On actual electronic circuits substrate difference too many, thus result in the problem being difficult to educate to the stage understanding electronic circuit.And
And, the electronic component plate 41 because intricately connecting and be laminated result in the problem being difficult to the status of electrically connecting confirming circuit.
Open
Technical problem
It is an object of the invention to solving the problems of conventional as above, by teaching consuming energy sub-circuit board
And using in the electronic circuit external member of this electronic circuit board using the connecting line being attached to by magnetic force on pad to element and weldering
Disk and pad and pad are electrically connected, thus carrying out the teaching for circuit.
Further object is that the pad with magnetic force and electric conductivity is connected to each other by using connecting line
And with being directly connected to pad and element so as to have visual confirmation that electronic circuit using connecting line.
Technical scheme
According to the feature of the present invention for realizing above-mentioned purpose, the present invention includes being made up of isolation material and having lining up
Row the tabular of engaging hole substrate, and be arranged in the described engaging hole of described substrate, have magnetic force and electric conductivity and
The pad executing electrical connection is connected with the lead of connecting line and element by magnetic force.
Described substrate is made up of transparent material.
Described pad includes spherical main body and engaging head, and described engaging head extends from described main body and is formed with outside
With the threaded portion engaging chip bonding on the inner face being formed at described engaging hole.
Described bond pad arrangement is at least one side surface in described substrate both side surface.
According to another feature of the invention, the present invention includes being made and had by isolation material joint arranged in columns
The substrate of the tabular in hole, is arranged in the described engaging hole of described substrate and has the pad of magnetic force and electric conductivity, for institute
State be electrically connected between pad and have on the two ends being capable of elastic deformation and the conductive component with electric conductivity for
It is attached to the connecting line of the connection terminal of described pad, and have and extend from main body and be used for and drawing that described pad electrically connects
The element of line.
Described substrate is made up of transparent material.
Described pad includes spherical main body and engaging head, and described engaging head extends from described main body and is formed with outside
With the threaded portion engaging chip bonding on the inner face being formed at described engaging hole.
Described bond pad arrangement is at least one side surface in described substrate both side surface.
Described pad from the described engaging hole that both side surface navigates to described substrate, because described pad is by spherical main body
Constitute and the pad being located in both side surface is arranged on substrate by magnetic force to each other.
The conductive component constituting described connecting line is using the coil spring with electric conductivity.
Described connection terminal is formed with the combination projecting and being attached to described conductive component from the terminal bodies of ring-type and dashes forward
Rise.
The insulation sleeve being made up of flexible material is enclosed with described conductive component.
Additional connecting line can be connected on the lead of described element, described connecting line has electric conductivity being capable of bullet
Property deformation one end of conductive component on be there is socket for being combined with described lead, on the other end of described conductive component
There is the connection terminal of the ring-type for being attached to described pad.
The insulation sleeve being made by flexible material is enclosed with described conductive component.
Have on the lead of described element for being attached to described pad and being made into the lead terminal of ring-type.
Beneficial effect
By the teaching consuming energy sub-circuit board according to the present invention and permissible using the electronic circuit external member of this electronic circuit board
Obtain following effect.
First, in the present invention, simply connecting line can be attached to arranged in columns on substrate by magnetic force and have
Magnetic force and the pad of electric conductivity, so that being connected to each other between pad or so that pad is connected with element, therefore make the structure to circuit
Teaching become easy.
And, in the present invention, can directly detect by an unaided eye and connect pad and the connection of pad or pad and element
Line, the person that therefore do not receive instruction can easily verify that the structure of circuit such that it is able to improve the teaching efficiency to circuit structure.
Additionally, in the present invention, pad only can be arranged on the one side of substrate or pad is respectively provided with two sides, therefore
It is capable of the form closely similar with actual single-clad board or double-sided printed-circuit board such that it is able to make circuit teach
Become to be more prone to.
And, in the present invention, connect between pad or connection pad has pliability, therefore with the connecting line of element
Can be attached with various forms such that it is able to make circuit be constituted become simple.
Brief description
Fig. 1 is the solid of the structure of the breadboard being shown as the teaching electronic circuit set according to prior art
Figure.
Fig. 2 is the detailed construction of the breadboard being shown as the teaching electronic circuit set according to prior art
Partial perspective view.
Fig. 3 is the axonometric chart of the structure illustrating another teaching consuming energy sub-circuit board according to prior art.
Fig. 4 be illustrate vertical for the structure that is assembled to various pieces on the teaching consuming energy sub-circuit board shown in above-mentioned Fig. 3
Body figure.
Fig. 5 is the plane graph of the structure illustrating another teaching electronic circuit set according to prior art.
Fig. 6 be illustrate structure for being assembled to the component block on the teaching consuming energy sub-circuit board shown in above-mentioned Fig. 5 point
Solution axonometric chart.
Fig. 7 is to illustrate for being assembled to according to the electronic component plate on another teaching consuming energy sub-circuit board of prior art
Structure.
Fig. 8 is to illustrate that the electronic component plate shown in Fig. 7 is linked and packed the teaching electronic according to prior art under state
The axonometric chart of the structure of circuit board.
Fig. 9 is the axonometric chart of the structure of the preferred embodiment illustrating the teaching consuming energy sub-circuit board according to the present invention.
Figure 10 is the partial cutaway perspective view of the detailed construction illustrating embodiment illustrated in fig. 9.
Figure 11 is the knot of the preferred embodiment of teaching electronic circuit set being shown with the electronic circuit board shown in Fig. 9
The side view of structure.
Figure 12 is the exploded perspective view illustrating to constitute the structure of connecting line of the embodiment of the present invention.
Figure 13 is the partial cutaway perspective view of the structure illustrating the connecting line shown in Figure 12.
Figure 14 is the axonometric chart of the structure illustrating the element used in the embodiment shown in Figure 11.
Figure 15 is the exploded perspective view of the structure of the connecting line used in the embodiment shown in Figure 11.
Figure 16 is the partial cutaway perspective view of the structure of the connecting line used in the embodiment shown in Figure 11.
Figure 17 is the vertical of another structure of connecting line on the lead being connected to element illustrating used in the present invention
Body figure.
Figure 18 is the axonometric chart of the service condition illustrating the embodiment shown in Figure 11.
Figure 19 is the axonometric chart of the structure of another embodiment illustrating the teaching consuming energy sub-circuit board according to the present invention.
Figure 20 is the partial cutaway perspective view of the detailed construction illustrating the embodiment shown in Figure 19.
Figure 21 is another embodiment of the teaching electronic circuit set being shown with the electronic circuit board shown in Figure 19
Structure side view.
Preferred implementation
Next, with reference to accompanying drawing to the teaching consuming energy sub-circuit board according to the present invention and the electronics using this electronic circuit board
The preferred embodiment of circuit set is described in detail.
As shown in figure 9, the electronic circuit board 100 of the present embodiment forms skeleton by substrate 110.Aforesaid substrate 110 is in this reality
Applying in example is transparent synthetic resin material, and is the tabular of tetragon.But, as long as aforesaid substrate 110 is by insulating properties
Material is made and is tabular, just unrestricted.Certainly, because can easily verify that when aforesaid substrate 110 is transparent with
When using the structure being arranged in the case of its surface and reverse side on the surface and reverse side of substrate 110, so aforesaid substrate 110 is excellent
Elect as transparent.
Engaging hole 112 for arranging the pad (land) 120 being described below is formed with aforesaid substrate 110.
Above-mentioned engaging hole 112 insertion aforesaid substrate 110 forms.It is formed with joint fastener 114 on the inner face of above-mentioned engaging hole 112.Preferably,
Make to have certain interval in above-mentioned engaging hole 112 between adjacent engaging hole.Reference 116 is fixing hole.
It is respectively arranged with pad 120 in the engaging hole 112 being formed on aforesaid substrate 110.Above-mentioned pad 120 is to lead
The conductor of electricity, and there is magnetic force.That is, above-mentioned pad 120 is Magnet that can be conductive.Above-mentioned more than 120 settings of pad are in column.?
In the present embodiment, above-mentioned pad 120 is arranged in the row that certain intervals are had on direction anyhow.Certainly, above-mentioned pad 120 is not
It is to have to arrange in column at certain intervals, but circuit is constituted preferably as shown in this embodiment between certain
Every arranged in columns.
As shown in Figure 10, the structure of said base 120 is the main body 122 prominent to the outside of aforesaid substrate 110 and insertion
And the engaging head 124 being bonded in above-mentioned engaging hole 112 forms as one.Aforementioned body 122 is spherical in the present embodiment, and
Project on the surface of aforesaid substrate 110.But, the shape of aforementioned body 122 can be fabricated to variously-shaped, can make one
It is partially into the inside of aforesaid substrate 110.Above-mentioned engaging head 124 is formed as bar-shaped and is formed as one with aforementioned body 122, and
And on outside, it is formed with the piece engaging with above-mentioned joint fastener 114.
In order to being attached between above-mentioned pad 120, to execute electrical connection, employing connecting line 130.Figure 12 and Figure 13
Show the structure of above-mentioned connecting line 130 well.Above-mentioned connecting line 130 has the conductive component 132 for electrical connection, above-mentioned
Be enclosed with conductive component 132 insulation sleeve 134 with prevent with adjacent connecting line 130 or with the element 140 being described below
Lead 144 form short circuit.That is, the above-mentioned insulation sleeve 134 of above-mentioned conductive component 132 insertion.
In the present embodiment, above-mentioned conductive component 132 is made into the shape of cylinder coil spring, and above-mentioned insulation sleeve
134 are also made up of flexible material.Thus, above-mentioned conductive component 132 can be free in the state of being wrapped up by above-mentioned insulation sleeve 134
Ground elastic deformation and be curved.
The two ends of above-mentioned connecting line 130 have connection terminal 136 to be combined with above-mentioned conductive component 132.Above-mentioned connection end
The part that son 136 is attached to above-mentioned pad 120 and is electrically connected.That is, above-mentioned by being attached to above-mentioned connection terminal 136
Pad 120 and above-mentioned conductive component 132 is electrically connected with pad 120.Above-mentioned connection terminal 136 has the terminal bodies of ring-type
136', and protrude with reference to projection 138 in the side of above-mentioned terminal bodies 136'.Above-mentioned combination projection 138 is inserted into above-mentioned leading
The inside of electric part 132 and conductive component 132 is electrically connected with terminal bodies 9136'.
Here, above-mentioned terminal bodies 136' are made into ring-type, in this way can be with the pad making globulate
The 120 relatively long ground contact of main body 122 is thus be stably combined with it.
In addition, in the present invention in order to constitute circuit, it is possible to use multiple element 140.Figure 11 and Figure 14 illustrates well
The example of said elements 140.Generally, element 140 is configured to be provided on element body 142 and the drawing of external electrical connections
Line 144.Example as said elements 140 has light emitting diode led, electrolysis condenser c1, tantalum electrolytic capacitor c2, transistor
Tr, resistance r, microchip ic etc..
Here, the lead 144 projecting from said elements main body 142 can carry out elastic deformation to a certain degree and plasticity change
Shape, can be stably bound on above-mentioned pad 120 when therefore connecting as one its end and lead terminal 146.This
In the case of element 140, by the lead terminal 146 of ring-type being arranged on the front end of the lead 144 extending from element body 142
On, it is able to easily form the electrical connection with above-mentioned pad 120.Now, above-mentioned lead 144 can be by elasticity to a certain degree
Or plastic deformation and change connected pad 120.
Furthermore it is possible to shortening the length of lead 144 of said elements 140 and connecting additional company on above-mentioned lead 144
Wiring 130' and be electrically connected with above-mentioned pad 120.This is because when making above-mentioned lead 144 repeated deformation it may happen that
Plastic deformation or be broken off, so by connecting connecting line 130' on above-mentioned lead 144, thus relatively easily formed with
The connection of above-mentioned pad 120.
The structure of connecting line 130' as used herein, this structure and above-mentioned company is shown well in Figure 15 and Figure 16
The structure of wiring 130 is similar, but employs socket 139 to instead of the connection terminal 136 on side.Above-mentioned socket 139 be with
The part that above-mentioned lead 144 combines.Above-mentioned socket 139 is configured to be integrally provided use in substantially cylindric cylinder 139'
In the combination projection 139 being attached to above-mentioned conductive component 132 ".It is inserted with above-mentioned lead 144 in above-mentioned cylinder 139'.
" it is configured to make in the case of not using above-mentioned insulation sleeve 134 and socket 139 as reference, connecting line 130
Above-mentioned conductive component 132 is directly combined with lead 144.Figure 17 illustrates this connecting line 130 ".Because above-mentioned conductive component
132 are made up of cylinder coil spring, thus can elastic deformation while that above-mentioned lead 144 can be made to be pressed into is columnar interior
To be attached in portion space.This structure can be using above-mentioned connecting line 130 " position and around the ring that is not short-circuited
Use under border.
Below, to the teaching consuming energy sub-circuit board according to the present invention with said structure and using this electronic circuit board
Electronic circuit external member is described in detail.
The feelings that circuit is constituted on electronic circuit board 100 are shown using the electronic circuit external member of the present embodiment in Figure 18
Condition.That is, it is electrically connected between the pad 120 being arranged on aforesaid substrate 110 using above-mentioned connecting line 130, and will be above-mentioned
The lead 144 of element 140 is electrically connected to above-mentioned pad 120 and constitutes circuit.
First, above-mentioned connecting line 130 passes through to make the connection terminal 136 at its two ends be attached to above-mentioned pad by magnetic force respectively
It is electrically connected between pad 120 in 120 main body 122.This connecting line 130 plays the circuit diagram with printed circuit board (PCB)
Case identical acts on.By making above-mentioned connecting line 130, there are multiple different length, can enter between adjacent pad 120
Row electrical connection or be electrically connected to being separated with centre between the pad 120 of multiple pads 120.
Additionally, being provided with multiple element 140 on aforesaid substrate 110, each element 140 passes through to make positioned at its lead 144
The lead terminal 146 of front end be attached directly on above-mentioned pad 120 by magnetic force and constitute electrical connection.
Said elements 140 can also be using the connecting line 130' shown in Figure 15 and Figure 16.That is, shorten the length of lead 144,
And above-mentioned lead 144 is pressed in the socket 139 of connecting line 130' so that connecting line 130' is connected thus executing with lead 144
Electrical connection with pad 120.
In this way, by magnetic force, each element 140 is attached on the pad 120 on aforesaid substrate 110
And be electrically connected such that it is able to constitute circuit using above-mentioned connecting line 130.Figure 18 shows this state well.
For convenience's sake, it is not shown for the structure powered in Figure 18, but can be by above-mentioned pad 120
One be connected with external power source and on this pad 120 connect connecting line 130 and circuit is powered.
In addition, in order to reconstitute circuit after constituting circuit using above-mentioned connecting line 130 and element 140, by above-mentioned company
Wiring 130 and element 140 separate from above-mentioned pad 120.Separate above-mentioned connecting line 130 and element 140 for from above-mentioned pad 120
For, because the magnetic force of above-mentioned pad 120 only need to be overcome it is possible to being easily separated above-mentioned connecting line 130 and element 140.Picture
After so separating connecting line 130 and element 140, only need to according to the circuit redesigning by above-mentioned connecting line 130 and element 140 again
Secondary it is connected on pad 120.
In the present invention in order to realize the electrical connection with above-mentioned pad 120, using connection terminal 136 and lead terminal 146,
They are ring-type.This is spherical relevant with the main body 122 of above-mentioned pad 120.That is, in the attachment of the outside of aforementioned body 122
When stating pad 120, aforementioned body 122 is partially into the inside of above-mentioned connection terminal 136 and lead terminal 146 and above-mentioned
The part that connection terminal 136 is contacted with the main body 122 of above-mentioned pad 120 with lead terminal 146 forms circle.That is, above-mentioned pad 120
Main body 122 and connection terminal 136 and lead terminal 146 carry out the linear contact lay of circle.In this way, can be more certain
Realize between connection terminal 136 and lead terminal 146 and pad 120 electrical connection.
Specific embodiment
Below, with reference to Figure 19 to Figure 21, the other embodiment of the present invention is illustrated.For convenience of description, in this enforcement
By the reference in units of 200 to structure corresponding with the embodiment of described above mark in example, and only to main points portion
Divide and illustrate.
In the present embodiment, pad 220 is arranged at the two sides of the substrate 210 of electronic circuit board 200.The electronics of the present embodiment
Circuit board 200 is equivalent to the two sides substrate in printed circuit board (PCB).Aforesaid substrate 210 as the synthetic resin of insulating properties, by transparent
Material formed.Particularly, when substrate 210 is made up of transparent material, can easily verify that and be arranged on substrate 210 two sides
Element 240 and covered wire 230 etc..Engaging hole 212 insertion aforesaid substrate 210 forms.The inner face of above-mentioned engaging hole 212 is formed
There is joint fastener 214.Reference 216 is fixing hole.
Pad 220 is provided with the both side surface of aforesaid substrate 210, and above-mentioned pad 220 has magnetic and electric conductivity.
The structure of above-mentioned pad 220 is identical with the pad in above-described embodiment, is also to project from main body 222 to be formed with engaging head 224, and
And the threaded portion for being engaged with above-mentioned joint fastener 214 is formed with the outside of above-mentioned engaging head 224.
Additionally, above-mentioned pad 220 is respectively set in the both side surface of aforesaid substrate 210, from both side surface to one
Engaging hole 212 respectively arranges one.Each pad 220 is inserted respectively into from a side surface of aforesaid substrate 210 and another side surface
In connection in engaging hole 212.As reference, when respectively pad 220 being set in the both side surface of aforesaid substrate 210, can
To make the pad 200 in both side surface pass through each other in the case of being not provided with above-mentioned engaging head 224 and joint fastener 214 etc.
Between magnetic picture combine.
And, in aforesaid substrate 210, pass through connecting line 230 between above-mentioned pad 220 and constitute electrical connection.Above-mentioned connection
The two ends of line 230 have connection terminal 236, and the knot in the other structures of above-mentioned connecting line 230 and embodiments illustrated above
Structure is identical.
And, the element 240 being arranged on aforesaid substrate 210 has many types, and major part extends 2 from main body 242
Individual above lead 244.More than 2 multiple above-mentioned leads 244 can be had on aforementioned body 242.Said elements 240 can also
In the case of shortening above-mentioned lead 244, additional connecting line 230' is set.
Below, to the teaching consuming energy sub-circuit board according to embodiments of the present invention with said structure and using this electronics electricity
The electronic circuit external member of road plate is described in detail.
Figure 21 side view represents and uses the case for this embodiment, in the weldering on the two sides being separately positioned on aforesaid substrate 210
On disk 220, element 240 is set and constitutes circuit.That is, using above-mentioned connecting line 230 to the pad being arranged on aforesaid substrate 210
It is electrically connected between 220 and the lead 244 of said elements 240 is electrically connected to above-mentioned pad 220 and constitutes circuit.
First, above-mentioned connecting line 230 is respectively attached to above-mentioned pad by making the connection terminal 236 at its two ends by magnetic force
220 main body 222 and be electrically connected between pad 220.This connecting line 230 plays the circuit pattern with printed circuit board (PCB)
Identical acts on.Constitute multiple different length by making above-mentioned connecting line 230, can carry out between adjacent pad 220
It is electrically connected between the pad 220 electrically connecting or centre is separated with multiple pads 220.
Additionally, being provided with multiple element 240 on aforesaid substrate 210, and each element 240 passes through to make positioned at its lead 244
The lead terminal 246 of front end above-mentioned pad 220 is attached directly to by magnetic force and constitutes electrical connection.
Pass through in this way magnetic force by each element 240 be attached to pad 220 on aforesaid substrate 210 and
It is electrically connected such that it is able to constitute circuit using above-mentioned connecting line 230.This situation is shown well in Figure 21.
Although being shown without making the circuit on the side surface be formed at aforesaid substrate 210 in Figure 21 and being formed at opposite side
The structure that circuit on surface is electrically connected to each other, but can by making the engaging head 224 of above-mentioned pad 220 be electrically connected to each other or
Person is electrically connected to realize using the pad 220 that additional connecting line 230 is pointed in the both side surface of substrate 210.
For convenience's sake, the also not shown structure for power supply in the present embodiment, but can be by above-mentioned weldering
One of disk 220 is connected with external power source and connects connecting line 230 on this pad 220 and circuit is powered.
The interest field of the present invention is not limited by the embodiment of described above but by the record institute in claims
Definition, it should be appreciated by those skilled in the art that can make in the interest field described in claims various deformation and
Modification.
Industrial applicibility
The teaching consuming energy sub-circuit board of the present invention and using the electronic circuit external member of this electronic circuit board can be used for printing
The related teaching of board design.That is, make it that electricity to be embodied as on substrate using the various elements that connecting line connects described above
Road is such that it is able to visually see.In this way, the ability of the structure circuit of the user of the present invention can be cultivated, and
And can be used in electric circuit teaching field.
Claims (10)
1. a kind of teaching electronic circuit set, comprising:
The substrate of tabular, is made up and has engaging hole arranged in columns of isolation material；
Pad, is arranged in the described engaging hole of described substrate, has magnetic force and electric conductivity and main body becomes spherical；
Connecting line, for being electrically connected between described pad, and being capable of elastic deformation and have the conduction of electric conductivity
Have on the two ends of part for being attached to described pad, there are ring-type terminal bodies connection terminal；And
Element, has lead, and described lead be had in front end and makes from main body extension and in order to be electrically connected with described pad
The lead terminal of ring-type.
2. teaching electronic circuit set according to claim 1, wherein, described substrate is made up of transparent material.
3. teaching electronic circuit set according to claim 1, wherein, the main body of described pad includes engaging head, institute
State engaging head to be formed with outside and the threaded portion engaging chip bonding on the inner face being formed at described engaging hole.
4. teaching electronic circuit set according to claim 3, wherein, described bond pad arrangement is in described substrate both sides table
On at least one side surface in face.
5. teaching electronic circuit set according to claim 1, wherein, described pad navigates to described from both side surface
In the described engaging hole of substrate, wherein make the described weldering being located in both side surface spherical main body because described pad is made up of
Disk is arranged on substrate by magnetic force to each other.
6. the teaching electronic circuit set according to any one of claim 1 to 5, wherein, constitutes described connecting line
Conductive component using having the coil spring of electric conductivity.
7. teaching electronic circuit set according to claim 6, wherein, described connection terminal is formed with from described terminal
Main body projects and is attached to the combination projection on described conductive component.
8. teaching electronic circuit set according to claim 7, wherein, described conductive component is enclosed with by flexible material
The insulation sleeve that matter is made.
9. the teaching electronic circuit set according to any one of claim 1 to 5, wherein, in drawing of described element
Additional connecting line can be connected on line, described additional connecting line has electric conductivity and is being capable of the conductive component of elastic deformation
One end on be there is socket for being combined with described lead, the other end of described conductive component has for being attached to
State the connection terminal of the ring-type of pad.
10. teaching electronic circuit set according to claim 9, wherein, described conductive component is enclosed with by flexibility
The insulation sleeve that material is made.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2012-0007787 | 2012-01-26 | ||
| KR1020120007787A KR101378464B1 (en) | 2012-01-26 | 2012-01-26 | Electronic circurt board for education |
| PCT/KR2013/000596 WO2013111984A1 (en) | 2012-01-26 | 2013-01-25 | Electronic circuit board for education and electronic circuit kit using same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104067330A CN104067330A (en) | 2014-09-24 |
| CN104067330B true CN104067330B (en) | 2017-01-18 |
Family
ID=48873666
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380006578.1A Expired - Fee Related CN104067330B (en) | 2012-01-26 | 2013-01-25 | Electronic circuit board for education and electronic circuit kit using same |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101378464B1 (en) |
| CN (1) | CN104067330B (en) |
| WO (1) | WO2013111984A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2621442C1 (en) * | 2016-02-11 | 2017-06-06 | Николай Михайлович Стецюк | Electric circuit assembly method |
| CN107591068A (en) * | 2016-07-06 | 2018-01-16 | 上海数好数字信息科技有限公司 | Circuit for teaching experiment builds module |
| CN112435550A (en) * | 2020-11-27 | 2021-03-02 | 宁波古月教育科技有限公司 | Electronic circuit teaching device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201177891Y (en) * | 2008-04-03 | 2009-01-07 | 余永根 | Magneto-suction type electronic circuit pattern |
| CN201226200Y (en) * | 2008-06-30 | 2009-04-22 | 余永根 | Transparent body magnetic suction circuit experimental board |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR880003083Y1 (en) * | 1985-04-27 | 1988-08-31 | 주식회사 세일로 | Connect appliances for the teaching equipment of electron-circuit |
| KR200306980Y1 (en) * | 2002-12-06 | 2003-03-15 | (주)에스디 로보테크 | Electronic Assembley Kit for Electronic Circuit Learning |
| KR200330521Y1 (en) * | 2003-07-09 | 2003-10-17 | 주식회사 마이크로로보트 | studying electrical parts for electronic circuit |
| KR100730801B1 (en) * | 2005-12-28 | 2007-06-21 | 엠알 보드 인크 | Digital electrical parts and bread-board for electronic circuit study kit |
| KR100848942B1 (en) * | 2006-11-21 | 2008-07-29 | 박일선 | Kit for learning digital and electronic circuit using magnet |
| KR200438227Y1 (en) * | 2007-08-21 | 2008-02-01 | (주)에이치아이 시스템 | Kit for robot education |
-
2012
- 2012-01-26 KR KR1020120007787A patent/KR101378464B1/en active IP Right Grant
-
2013
- 2013-01-25 CN CN201380006578.1A patent/CN104067330B/en not_active Expired - Fee Related
- 2013-01-25 WO PCT/KR2013/000596 patent/WO2013111984A1/en active Application Filing
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201177891Y (en) * | 2008-04-03 | 2009-01-07 | 余永根 | Magneto-suction type electronic circuit pattern |
| CN201226200Y (en) * | 2008-06-30 | 2009-04-22 | 余永根 | Transparent body magnetic suction circuit experimental board |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20130086802A (en) | 2013-08-05 |
| KR101378464B1 (en) | 2014-03-27 |
| CN104067330A (en) | 2014-09-24 |
| WO2013111984A1 (en) | 2013-08-01 |
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Granted publication date: 20170118 Termination date: 20210125 |