KR20160015594A - Electronic circuit construction device for improved reliability using conductive connection module - Google Patents

Electronic circuit construction device for improved reliability using conductive connection module Download PDF

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Publication number
KR20160015594A
KR20160015594A KR1020140098065A KR20140098065A KR20160015594A KR 20160015594 A KR20160015594 A KR 20160015594A KR 1020140098065 A KR1020140098065 A KR 1020140098065A KR 20140098065 A KR20140098065 A KR 20140098065A KR 20160015594 A KR20160015594 A KR 20160015594A
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South Korea
Prior art keywords
conductive
circuit
circuit board
holes
electronic
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KR1020140098065A
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Korean (ko)
Inventor
김홍민
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김홍민
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Priority to KR1020140098065A priority Critical patent/KR20160015594A/en
Publication of KR20160015594A publication Critical patent/KR20160015594A/en

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Abstract

The present invention relates to an electronic circuit construction device for improving stability by using a conductive connection module. More specifically, the present invention relates the electronic circuit construction device comprises: a first circuit board (10) for arranging an assembly block (20) while arranging a plurality of coupling holes (110) including conductive coupling holes (111) or insulating coupling holes (115); a plurality of conductive protruded rods (121) inserted into two or more coupling holes (110), respectively; and a unit circuit unit (300) coupled to a pair of the conductive protruded rods (121), and forming a circuit node structure.

Description

TECHNICAL FIELD [0001] The present invention relates to an electronic circuit configuration device using a conductive connection module,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit construction apparatus, and more particularly, to an electronic circuit construction apparatus using a conductive connection module to improve stability.

Typical circuit components for conventional circuit configurations may include deep-type devices, surface-mounted device (SMD) type devices, and the like. For example, in the case of an SMD type device used for commercial purposes, a circuit board can be manufactured using a surface-mount technology (SMT) technology on a printed circuit board (PCB). On the other hand, in the case of the deep type, a circuit board can be manufactured by soldering directly by a person, so that it can be used for a product without advanced technology, a product with low price, and an experiment.

Such SMD type and dip type devices have a problem in that the circuit configuration when connecting electric wires or coupling them to boards is complicated, and in order to complete electrical connection, there is a problem that soldering or a separate configuration such as a breadboard connector is required. Accordingly, there is a disadvantage that several additional devices are required to study, learn or develop electronic circuits.

On the other hand, an electronic circuit learning kit (kits) is provided to assist understanding of electronic circuits through learning, and various stages of products can be configured according to the difficulty of an electronic circuit to be implemented. For example, such products may include circuit diagrams, instructions, and associated electronic components. However, in order for a learner who uses an electronic circuit learning kit to complete a circuit required by a product, there is a problem that ultimately the circuit elements must be soldered.

In such a learning situation where soldering is required, there is a problem of damaging the human body such as burn caused by high-temperature equipment and respiratory damage due to lead smoke. In addition, due to the insufficient soldering technology, there is a problem that the electronic device is overheated and broken, or the electronic device is soldered to a wrong position due to misalignment of voids on the substrate. Especially, the electronic devices fixed by soldering once are difficult to separate , There is a problem that further breakage due to reheating may occur in the separation process.

The present invention has been proposed in order to solve the above-mentioned problems of the previously proposed methods, and it is an object of the present invention to provide a circuit board in which conductive protruding rods are coupled to conductive connection holes among the connection holes of a circuit board, And the electrical connection of the circuit elements is realized by the contact of the conductive connecting member surrounding the through holes with the conductive protruding rod, Which can easily electrically connect the elements, thereby eliminating risk factors such as burn and respiratory damage, preventing circuit damage due to premature soldering and incorrect fixing, and improving the stability of the circuit. An electronic circuit configuration device that improves stability by using a connection module. And that the balls for that purpose.

Further, according to the present invention, since the block connecting grooves and the block connecting protrusions of the assembled block are electrically connected or the conductive protruding bars coupled to the conductive connecting holes of the upper circuit board and the lower circuit board are electrically connected by the conductive column member, Another object of the present invention is to provide an electronic circuit constitution device which can easily realize various electronic circuits, can intuitively confirm them, can realize a complicated electronic combination including such electronic circuits, and improves stability by using a conductive connection module .

According to an aspect of the present invention, there is provided an apparatus for configuring an electronic circuit with improved stability using a conductive connection module,

A first circuit board for arranging a plurality of coupling holes including conductive coupling holes or insulating coupling holes and for arranging the assembly block;

A plurality of conductive protruding rods inserted into at least two of the coupling holes; And

And a unit circuit unit coupled to the pair of conductive protruding rods to form a circuit node structure,

The unit circuit unit includes:

A plate-like member having through-holes for fitting the pair of conductive protruding rods;

A conductive connecting member surrounding each of the through holes and having an insertion groove into which the plate member is inserted, the inner circumferential surface contacting the conductive protruding rods;

A connecting line disposed in the plate member and electrically connected to the conductive connecting member; And

And a circuit element electrically connected to the connection line and disposed on the plate-shaped member so as not to overlap the conductive protruding rods.

Preferably, the first circuit board includes:

And a device direct mounting region in which bonding pads or bonding pads for connecting the terminal pins of the electronic component are arranged so that electronic components having a larger area or a larger number of terminal pins than the circuit elements are disposed .

Preferably,

Each of the conductive protruding rods may include a latching protrusion ring to be fixed to the first circuit board while being inserted into the coupling holes.

Preferably, the circuit element comprises:

A resistor, a capacitor, a diode, an LED, a switch, a relay, an MCU, an integrated circuit, and a power supply.

Preferably, the plate-

And may have a shape symmetrical with respect to a virtual straight line connecting the centers of the through holes.

Advantageously, the prefabricated block comprises:

A plurality of block coupling grooves coupled to the conductive protruding rods; And

And a plurality of block coupling protrusions corresponding to the block coupling grooves and protruding along the direction in which the conductive protruding rods protrude with respect to the first circuit board,

And the first block engaging groove of the block engaging grooves may be configured to be electrically connected to the corresponding block engaging protrusion.

Preferably,

A second circuit board coupled to a first conductive protruding bar coupled to one of the conductive connection holes included in the first circuit board and disposed on the first circuit board so as to be parallel to the first circuit board; And a pillar member for supporting the first conductive protruding bar and electrically connecting the second conductive protruding bar coupled to the conductive connection hole of the second circuit board corresponding to the first conductive protruding bar to the first conductive protruding bar .

According to the electronic circuit configuration apparatus using the conductive connection module proposed in the present invention, the conductive protrusion rods are coupled to the conductive connection holes of the connection holes of the circuit board to which the assembly blocks can be coupled, A pair of conductive protruding rods are coupled to the through holes of the unit circuit unit including the circuit elements and the electrical connection of the circuit elements is realized by the contact of the conductive connecting member surrounding the through holes with the conductive protruding rods, It is possible to easily electrically connect the circuit elements without any risk, thereby eliminating hazards such as burns and respiratory damage, preventing circuit damage due to premature soldering and improper fixing, and improving the stability of the circuit .

Further, since the block connecting grooves and the block connecting protrusions of the assembled block are electrically connected or the conductive protruding bars coupled to the conductive connecting holes of the upper circuit board and the lower circuit board are electrically connected by the conductive column member, It can be easily implemented, intuitively confirmed, and a complicated electronic combination including such an electronic circuit can be realized.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a view showing a configuration of an electronic circuit configuration apparatus having improved stability using a conductive connection module according to an embodiment of the present invention; FIG.
BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an electronic circuit configuration apparatus,
FIG. 3 is a circuit diagram of an electronic circuit configuration apparatus having improved stability using a conductive connection module according to an embodiment of the present invention; FIG.
4 is a view showing a conductive protruding bar of an electronic circuit constitution apparatus improved in stability using a conductive connection module according to an embodiment of the present invention.
BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an electronic circuit device,
6 is a diagram illustrating an example of a unit circuit unit of an electronic circuit configuration apparatus having improved stability using a conductive connection module according to an embodiment of the present invention.
FIG. 7 is a view showing an electronic component included in an electronic circuit configuration apparatus having improved stability using a conductive connection module according to an embodiment of the present invention; FIG.
FIG. 8 is a block diagram of an assembled block included in an electronic circuit device having improved stability using a conductive connection module according to an embodiment of the present invention. FIG.
9 is a view illustrating a configuration in which a plurality of circuit boards are connected in multiple layers in an electronic circuit configuration apparatus having improved stability using a conductive connection module according to an embodiment of the present invention.
10 is a cross-sectional view of a pillar member included in an electronic circuit constitution apparatus having improved stability using a conductive connection module according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention. In the following detailed description of the preferred embodiments of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear. The same or similar reference numerals are used throughout the drawings for portions having similar functions and functions.

In addition, in the entire specification, when a part is referred to as being 'connected' to another part, it may be referred to as 'indirectly connected' not only with 'directly connected' . Also, to "include" an element means that it may include other elements, rather than excluding other elements, unless specifically stated otherwise.

FIG. 1 is a view illustrating a configuration of an electronic circuit configuration apparatus having improved stability using a conductive connection module according to an embodiment of the present invention. FIG. 2 is a block diagram illustrating a configuration of a conductive connection module according to an embodiment of the present invention. Fig. 2 is a diagram showing a planar configuration of an electronic circuit constitution device with improved stability. FIG. 2 (a) shows a state in which the conductive connection module is installed, and FIG. 2 (b) shows a state in which the conductive connection module is removed. 1 and 2, an electronic circuit construction apparatus having improved stability using a conductive connection module according to an embodiment of the present invention includes a circuit board 10, a conductive protruding bar 121, Unit 300 according to an embodiment of the present invention. The circuit board 10 may have a plurality of coupling holes 110 formed therein. The conductive protruding rods 121 may be coupled to the coupling holes 110. The conductive protruding rods 121 can be freely inserted into the engagement holes 110. The circuit board 10 may be provided with a prefabricated block 20. For example, the assembled block 20 may be a lEGO block. For example, the circuit board 10 may be an insulating substrate to which a leg block can be coupled by a conductive protruding bar 121 and a predetermined circuit wiring is disposed. The assembled block 20 may include block engaging protrusions 201 protruding along the protruding direction of the conductive protruding bar 121. Hereinafter, each component of the electronic circuit configuration apparatus using the conductive connection module according to an embodiment of the present invention with improved stability will be described in detail.

The circuit board 10 may include a plurality of coupling holes 110. These coupling holes 110 may include a conductive coupling hole 111 and an insulation coupling hole 115. The conductive coupling hole 111 may include a conductive ring 114 surrounding each hole. For example, the conductive bonding holes 111 and the insulating bonding holes 115 may be irregularly arranged on the circuit board 10. According to the embodiment, the insulating bonding holes 115 may be disposed adjacent to the rim of the circuit board 10, in which case even if predetermined circuit elements are electrically connected to the circuit board 10, An electric shock is not applied to the user who touches the rim of the terminal, so that it can be safely used.

The insulating joint holes 115 may include not only a penetrated portion of the circuit board 10 but also a threaded guide groove formed in the inner peripheral portion. In this case, the protruding bar coupled to the insulating binding holes 115 can be firmly coupled to the circuit board 10 in a screwed manner.

The circuit board 10 may further include a device direct mounting region 150 in which circuit elements may be directly disposed. The device direct mounting region 150 may be an area where a plurality of bonding balls or bonding pads are formed such that electronic components having a relatively large area or a large number of terminal pins such as an MCU (Micro Controller Unit) are disposed . For example, the device direct mounting area 150 may be formed adjacent to the coupling holes 110. The device direct mounting area 150 will be described in more detail with reference to FIG. 7 to be described later.

The unit circuit unit 300 may be coupled to the pair of conductive protruding rods 121. For example, the unit circuit unit 300 may be a first unit circuit unit 310 coupled to two adjacent conductive protruding rods 121 or a second unit circuit unit 310 coupled to three adjacent conductive protruding rods 121. [ (320). A plurality of unit circuit units 300 may be disposed on the circuit board 10. [ Each of the unit circuit units 300 may be configured to implement a predetermined circuit through circuit wiring connected to the conductive ring 114. In this way, the unit circuit unit 300 can form a predetermined circuit node structure.

FIG. 3 is a circuit diagram of an electronic circuit device having improved stability using a conductive connection module according to an embodiment of the present invention. Referring to FIG. 3, a power supply 31, a resistor 33, an LED 35, an integrated circuit 37, a capacitor, a relay, a switch, an MCU, and the like are connected to a circuit implemented by the unit circuit unit 300 . When a plurality of unit circuit units 300 are coupled to the conductive protruding rods 121 to form a circuit, for example, a circuit as shown in Fig. 3 can be implemented. 1 and 2 includes a unit circuit unit including a power supply 31, a unit circuit unit including a resistor 33, an LED 35, A unit circuit unit including the integrated circuit 37, and the like. The unit circuit units 300 may form a circuit node structure used for one circuit connection or may form a circuit node structure used for connecting different circuits.

FIG. 4 is a view showing a conductive protruding bar of an electronic circuit device having improved stability using a conductive connection module according to an embodiment of the present invention. As shown in Fig. 4, the conductive protruding rods 121 may have a columnar shape. For example, the conductive protruding rods 121 may have a cylindrical shape. However, the shape of the conductive protrusion 121 may be different depending on the shape of the coupling holes 110 formed in the circuit board 10. For example, when the engaging holes 110 have a square hole shape, the conductive protruding rods 121 may have a rectangular pillar shape corresponding thereto. The conductive protruding bar 121 may include a locking protrusion ring 122 to be fixed to the circuit board 10 while being inserted into the coupling holes 110. [ The locking protrusion ring 122 may be integrally formed with the conductive protrusion 121.

FIG. 5 is a cross-sectional view of an electronic circuit device having improved stability using a conductive connection module according to an embodiment of the present invention. Referring to FIG. In Fig. 5, a cross section of the unit circuit unit 310 shown in part A of Fig. 2 (a) is shown. 5, the unit circuit unit 310 includes a conductive connecting member 314 contacting the conductive protruding bar 121, a plate-like member 312 inserted into the insertion groove of the conductive connecting member 314, A connection line 316 and a circuit element 30 (e.g., a resistor 33) disposed in the plate member 312. The circuit board 30 may be a circuit board.

The plate member 312 may be formed with a plurality of through holes 315 for fitting the conductive protruding bars 121. The plate-shaped member 312 may include, for example, an insulating material.

The conductive connecting member 314 may surround the through holes 315, respectively. An insertion groove may be formed in the outer circumferential surface of the conductive connecting member 314 so that the sheet member 312 is inserted. For example, the cross section of the insertion groove may have a 'C' shape. The inner circumferential surface of the conductive connecting member 314 can contact the conductive protruding rods 121.

The connection line 316 is disposed on the plate member 312 and can be electrically connected to the conductive connecting member 314. That is, the connection line 316 may comprise a conductive material, for example, a metal material.

The circuit element 30 is disposed on the plate member 312 and may be electrically connected to the connection line 316. For example, the first terminal of the circuit element 30 may be connected to the left connection line 316, and the second terminal of the circuit element 30 may be connected to the right connection line 316. In this case, the circuit element 30 may be disposed on the plate-shaped member 312 so as not to overlap the conductive protruding bars 121. [ As the circuit element 30 is electrically connected to the connection line 316 as described above, the terminals of the circuit element 30 are electrically connected through the connection line 316 and the conductive connecting member 314 to the conductive protruding rods 121 As shown in FIG. The conductive ring 114 surrounding the conductive coupling hole 111 is brought into contact with the conductive protruding bar 121 so that the circuit wiring 30 connected to the conductive ring 114 can be electrically connected.

Although the cross-section of the conductive protruding rods 121 is shown in FIG. 5 as being solid, this is exemplary and, in some embodiments, the cross-section of the conductive protruding rods 121 may be hollow, But may be configured to be electrically connected to the conductive connecting member 314 through the conductive film on the surface.

FIG. 6 is a diagram illustrating an example of a unit circuit unit of an electronic circuit configuration apparatus having improved stability using a conductive connection module according to an embodiment of the present invention. As shown in FIG. 6, the plate members 312 and 322 of the unit circuit unit 300 may have various shapes. 6 (a), the plate-like member 312a of the unit circuit unit 300 has two through-holes 315, and extends along the arrangement direction of the through-holes 315. [ And a circuit element, for example, a resistor 33, may be arranged on this extension portion. 6 (b), the sheet member 312b of the unit circuit unit 300 may be configured such that the width of the extending portion along the arrangement direction of the through holes 315 is changed. In this case, the plate members 312a and 312b of the unit circuit unit 300 may have a symmetrical shape with respect to an imaginary straight line connecting the centers of the through holes 315. 6 (c), the plate-shaped member 312c of the unit circuit unit 300 may have three through-holes 315, for example. However, the shape of the unit circuit unit 300 according to the embodiments of the present invention is not limited to the shapes shown in FIG. 6, and can be modified to be variously different.

FIG. 7 is a view showing electronic components included in an electronic circuit configuration apparatus having improved stability using a conductive connection module according to an embodiment of the present invention. 7, the electronic component 40 having a relatively large area or a large number of terminal pins unlike the unit circuit unit 300 is electrically connected to the device direct mounting area 150 shown in FIG. 1 . For example, the terminal pins 401 of the electronic component 40 can be electrically coupled to adjacent conductive bonding holes 111 by being bonded to bonding pads or bonding pads arranged in the device direct mounting region 150 . Such an electronic component 40 may include, for example, an MCU, an optical sensor, a memory, and the like.

FIG. 8 is a block diagram of an assembled block included in an electronic circuit device having improved stability using a conductive connection module according to an embodiment of the present invention. Referring to FIG. As shown in FIG. 8, the block 21, which can be coupled to the circuit board 10 of the electronic circuit configuration apparatus using the conductive connection module according to an embodiment of the present invention, And the block connecting grooves 221 into which the conductive protruding rods 121 coupled to the frame 10 are inserted. The block 21 has block engaging protrusions 211 protruding from the upper surface of the block 21 along the direction in which the conductive protruding bars 121 protrude from the circuit board 10 As shown in FIG. In this case, the block engaging grooves 221 may correspond to the block engaging protrusions 211, respectively. According to the embodiment, a pair of block coupling grooves 221 and block coupling protrusions 211 corresponding to each other can be electrically connected. For example, the block engaging groove 221 and the corresponding block engaging protrusion 211 may be electrically connected to each other through a predetermined energizing path formed in the assembled block 21. As described above, the three-dimensional structure electrically connected to the unit circuit unit 300 disposed on the circuit board 10 is electrically connected to the block connecting recess 221 of the assembled block 21 and the block- .

FIG. 9 is a view illustrating a configuration in which a plurality of circuit boards are connected in multiple layers in an electronic circuit configuration apparatus having improved stability using a conductive connection module according to an embodiment of the present invention. FIG. Sectional view of a column member included in an electronic circuit constitution apparatus improved in stability by using the conductive connecting module according to an example. As shown in FIGS. 9 and 10, an electronic circuit construction apparatus using the conductive connection module according to an embodiment of the present invention has improved stability. The electronic circuit construction apparatus includes a plurality of circuit boards 10a and 10b, . In this case, the pillar member 170 coupled to the conductive protruding bar 121b coupled to the circuit board 10b of the lower layer is in direct contact with the conductive protruding bar 121a coupled to the upper circuit board 10a, Alternatively, the upper and lower circuit boards 10a and 10b may be electrically connected by contacting the conductive ring of the conductive coupling hole into which the conductive protrusion 121a is inserted.

In Fig. 10, a cross section of part B in Fig. 9 is shown. 10, the pillar member 170 includes a coupling portion 171 coupled to the conductive protruding bar 121b coupled to the lower layer circuit board 10b, a coupling portion 171 coupled to the conductive protruding portion 121b in a direction perpendicular to the circuit boards 10a and 10b A supporting portion 175 for partially supporting the upper layer circuit board 10a and an inserting portion 177 for inserting into the conductive connection groove of the upper layer circuit board 10a. The connecting portion 171, the extending portion 173, the supporting portion 175 and the inserting portion 177 of the pillar member 170 are integrally connected to each other and may include a conductive material. As described above, the pillar member 170 having a conductive material electrically connects the lower-layer circuit board 10b and the upper-layer circuit board 10a, thereby realizing various types of complex electrical assemblies (for example, robots assembled with legos) .

As described above, according to the electronic circuit constructing apparatus having improved stability by using the conductive connection module proposed in the present invention, it is possible to reduce the number of coupling holes (not shown) of the circuit board 10 The conductive protruding rods 121 are coupled to the conductive bonding holes 111 of the unit circuit unit 300 and the pair of conductive protruding rods 121 are connected to the through holes 315 of the unit circuit unit 300 including the predetermined circuit elements 30 The electrical connection of the circuit element 30 is realized by the contact of the conductive connecting member 314 surrounding the through holes 315 and the conductive protruding rods 121, The elements can be easily connected electrically, thereby preventing circuit damage due to immaturity and improper fixing of the solder, thereby improving the stability of the circuit.

The block connecting grooves 221 and the block connecting protrusions 211 of the assembled block 21 are electrically connected to each other or the conductive protruding rods 21a and 21b are connected to the conductive connecting holes of the upper circuit board 10a and the lower circuit board 10b, The conductive pillar members 170 are electrically connected to the conductive pillar members 121a and 121b so that various electronic circuits can be easily implemented and intuitively confirmed and complex electronic assemblies including such electronic circuits can be realized.

The present invention may be embodied in many other specific forms without departing from the spirit or essential characteristics of the invention.

10, 10a, 10b: circuit board 20, 21: assembled block
30: circuit element 40: electronic part
110: coupling hole 111: conductive coupling hole
114: conductive ring 115: insulative bonding hole
121: conductive protruding bar 122: hook protruding ring
125: Insulating joint groove 150: Device direct placement area
170: column member 211: block engaging projection
221: block coupling groove 312: plate-shaped member
314: conductive connecting member 315: through hole
316: connection line

Claims (7)

1. An electronic circuit arrangement comprising:
A first circuit board (10) for arranging a plurality of coupling holes (110) including conductive bonding holes (111) or insulating bonding holes (115) and for arranging the block (20);
A plurality of conductive protruding rods (121) inserted into at least two of the coupling holes (110); And
And a unit circuit unit (300) coupled to a pair of the conductive protruding rods (121) to form a circuit node structure,
The unit circuit unit 300 includes:
A plate-like member (312) having through holes (315) for fitting the pair of conductive protruding bars (121);
A conductive connecting member 314 surrounding each of the through holes 315 and having an insertion groove into which an outer surface of the plate member 312 is inserted and having an inner circumferential surface contacting the conductive protruding bars 121;
A connecting line 316 disposed in the plate member 312 and electrically connected to the conductive connecting member 314; And
And a circuit element (30) electrically connected to the connection line (316) and arranged on the plate member (312) so as not to overlap the conductive protruding rods (121) An electronic circuit configuration device with improved stability.
2. The circuit board according to claim 1, wherein the first circuit board (10)
The engagement pins or the engagement pads for engaging the terminal pins 401 of the electronic component 40 are arranged such that the electronic components 40 having an area larger than the circuit element 30 or having a larger number of terminal pins are arranged. And a device direct placement region (150) formed on the substrate.
The method according to claim 1,
Characterized in that each of the conductive protruding rods (121) includes a latching protrusion ring (122) for being fixed to the first circuit board (10) while being inserted into the coupling holes (110) Thereby improving the stability of the electronic circuit.
The circuit device according to claim 1, wherein the circuit element (30)
Wherein the electronic device includes at least one of a resistor, a capacitor, a diode, an LED, a switch, a relay, an MCU, an integrated circuit, and a power source.
The plate-shaped member (312) according to claim 1,
And has a shape symmetrical with respect to a virtual straight line connecting the centers of the through holes (315), wherein the stability is improved by using the conductive connection module.
The assembly block according to claim 1,
A plurality of block coupling grooves 221 coupled to the conductive protruding rods 121; And
And a plurality of block coupling protrusions 211 corresponding to the block coupling grooves 221 and protruding along the direction in which the conductive protruding bars 121 protrude with respect to the first circuit board 10, ,
Characterized in that the first block coupling groove (221) of the block coupling grooves (221) is electrically connected to the corresponding block coupling protrusion (211), wherein the stability is improved by using the conductive coupling module.
The method according to claim 1,
The first circuit board 10b is coupled to the first conductive protruding bar 121b coupled to any one of the conductive connection holes 111 included in the first circuit board 10b, And a second circuit board 10a disposed on the first circuit board 10a and corresponding to the first conductive protruding bar 121b, Further comprising a pillar member (170) for electrically connecting the conductive protruding bar (121a) to the first conductive protruding bar (121b).
KR1020140098065A 2014-07-31 2014-07-31 Electronic circuit construction device for improved reliability using conductive connection module KR20160015594A (en)

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Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
KR1020140098065A KR20160015594A (en) 2014-07-31 2014-07-31 Electronic circuit construction device for improved reliability using conductive connection module

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KR20160015594A true KR20160015594A (en) 2016-02-15

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200022792A (en) * 2018-08-23 2020-03-04 주식회사 엘지화학 Battery pack substrate and Battery pack substrate accessing system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200022792A (en) * 2018-08-23 2020-03-04 주식회사 엘지화학 Battery pack substrate and Battery pack substrate accessing system

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