WO2015053469A1 - Improved construction kit of modular circuit elements - Google Patents

Improved construction kit of modular circuit elements Download PDF

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Publication number
WO2015053469A1
WO2015053469A1 PCT/KR2014/007415 KR2014007415W WO2015053469A1 WO 2015053469 A1 WO2015053469 A1 WO 2015053469A1 KR 2014007415 W KR2014007415 W KR 2014007415W WO 2015053469 A1 WO2015053469 A1 WO 2015053469A1
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WO
WIPO (PCT)
Prior art keywords
coupling
module
circuit
module case
modular
Prior art date
Application number
PCT/KR2014/007415
Other languages
French (fr)
Korean (ko)
Inventor
강민수
오종하
Original Assignee
강민수
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Filing date
Publication date
Application filed by 강민수 filed Critical 강민수
Priority to CN201480052920.6A priority Critical patent/CN105659307A/en
Publication of WO2015053469A1 publication Critical patent/WO2015053469A1/en
Priority to HK16108868.4A priority patent/HK1220802A1/en

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    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09BEDUCATIONAL OR DEMONSTRATION APPLIANCES; APPLIANCES FOR TEACHING, OR COMMUNICATING WITH, THE BLIND, DEAF OR MUTE; MODELS; PLANETARIA; GLOBES; MAPS; DIAGRAMS
    • G09B23/00Models for scientific, medical, or mathematical purposes, e.g. full-sized devices for demonstration purposes
    • G09B23/06Models for scientific, medical, or mathematical purposes, e.g. full-sized devices for demonstration purposes for physics
    • G09B23/18Models for scientific, medical, or mathematical purposes, e.g. full-sized devices for demonstration purposes for physics for electricity or magnetism
    • G09B23/183Models for scientific, medical, or mathematical purposes, e.g. full-sized devices for demonstration purposes for physics for electricity or magnetism for circuits
    • G09B23/185Models for scientific, medical, or mathematical purposes, e.g. full-sized devices for demonstration purposes for physics for electricity or magnetism for circuits for building block systems
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09BEDUCATIONAL OR DEMONSTRATION APPLIANCES; APPLIANCES FOR TEACHING, OR COMMUNICATING WITH, THE BLIND, DEAF OR MUTE; MODELS; PLANETARIA; GLOBES; MAPS; DIAGRAMS
    • G09B23/00Models for scientific, medical, or mathematical purposes, e.g. full-sized devices for demonstration purposes
    • G09B23/06Models for scientific, medical, or mathematical purposes, e.g. full-sized devices for demonstration purposes for physics
    • G09B23/18Models for scientific, medical, or mathematical purposes, e.g. full-sized devices for demonstration purposes for physics for electricity or magnetism
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09BEDUCATIONAL OR DEMONSTRATION APPLIANCES; APPLIANCES FOR TEACHING, OR COMMUNICATING WITH, THE BLIND, DEAF OR MUTE; MODELS; PLANETARIA; GLOBES; MAPS; DIAGRAMS
    • G09B1/00Manually or mechanically operated educational appliances using elements forming, or bearing, symbols, signs, pictures, or the like which are arranged or adapted to be arranged in one or more particular ways
    • G09B1/32Manually or mechanically operated educational appliances using elements forming, or bearing, symbols, signs, pictures, or the like which are arranged or adapted to be arranged in one or more particular ways comprising elements to be used without a special support
    • G09B1/325Manually or mechanically operated educational appliances using elements forming, or bearing, symbols, signs, pictures, or the like which are arranged or adapted to be arranged in one or more particular ways comprising elements to be used without a special support the elements comprising interacting electronic components
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/51Fixed connections for rigid printed circuits or like structures
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure

Definitions

  • the present invention relates to an improved configuration kit of a modular circuit device, and more particularly, circuit device block modules, each of which consists of individual circuit devices for constituting an electronic circuit in a module form, and is configured in a square or rectangular block shape.
  • the present invention relates to an improved configuration kit of modular circuit elements capable of constructing electronic circuits for circuit experiments in which electrical connection connections and rigid fastening couplings are made.
  • the electronic circuit learning kit is used as an educational material, which aims to understand the electronic circuit through the practice mainly for elementary and middle school students.
  • Electronic circuit learning kits are sold in various stages depending on the difficulty level of the electronic circuit, but the configuration is accompanied by circuit diagrams, simple instructions, electronic devices (resistors, integrated ICs, capacitors, diodes, etc.) and other components. Make up your learning kit. The learner inserts each electronic device and the electronic component into a gap formed in the printed circuit board to perform soldering to complete the manufacture of the actual electronic circuit.
  • Republic of Korea Patent No. 10-1210304 discloses a configuration kit of a modular circuit device that the applicant has applied for a patent.
  • This prior document is a component kit of a modular circuit element that improves the conventional problems, or the coupling method of the modular circuit element is composed of a male fastening part and a female fastening part in each of the module case and the lead wire connection module of the module circuit element
  • As a structure to combine it is difficult to manufacture the appearance and expensive, and when a large number of blocks are combined, problems such as falling out of the combined block in the middle often occurs, it was difficult to maintain a solid fastening state.
  • the present applicant intends to propose a configuration kit of a modular circuit device of an improved structure that can solve the problem of the maintenance of the fastening state appearing in the existing coupling method of the prior application and registered prior application, and the problems arising from the appearance manufacturing.
  • the present invention is proposed to solve the above problems of the conventionally proposed methods, the individual circuit elements for constituting the electronic circuit in the form of a module, the electrical connection connection to the square or rectangular circuit element block module By connecting to connect through the I-shaped or H-shaped circuit element coupling module for the electrical connection of the electronic circuit for the circuit experiment, as well as to ensure that the coupling state of the coupling between the modules is firmly maintained It is an object of the present invention to provide an improved configuration kit of modular circuitry.
  • the present invention by configuring the circuit module coupling module in the I-shape to rotate between the upper and lower sides from side to side or in the H-shape to fasten the modules in a fixed form, the appearance of the circuit element block module in a simple form
  • Another object of the present invention is to provide an improved configuration kit of a modular circuit device, which can reduce the manufacturing cost and, as a result, facilitate coupling and separation for replacement between circuit block modules.
  • a magnetic coupling contact portion is formed on the four sides of the square or rectangular circuit element block module, between the circuit element block modules.
  • each circuitry block module comprising:
  • a circuit diagram display unit for displaying a circuit diagram corresponding to an electronic component of a circuit element installed in the module case on either one of an upper surface and a lower surface of the module case;
  • a circuit device display unit on which an actual circuit device corresponding to an electronic component of a circuit device installed in the module case is displayed on the other side of an upper surface and a lower surface of the module case;
  • It is characterized in that it comprises a coupling contact portion which is formed to enable electrical connection connection to each of the upper surface and the lower surface adjacent to the four side edge regions of the module case.
  • the module case Preferably, the module case,
  • It can be comprised in either a square or rectangular block shape.
  • the module case More preferably, the module case,
  • the coupling contact portion may be composed of any one non-conductive material selected from the group of plastics, wood, and rubber.
  • the coupling contact portion Preferably, the coupling contact portion,
  • a conductive material electrically connected and connected to the electronic component of the circuit element installed inside the module case it may be configured of any one of a magnet member or a latch member.
  • the electronic device may further include a circuit device coupling module configured to form the circuit device block modules using a conductive material to assist the electrical connection connection in the form of a module when the electronic device is configured using the circuit device block modules.
  • a circuit device coupling module configured to form the circuit device block modules using a conductive material to assist the electrical connection connection in the form of a module when the electronic device is configured using the circuit device block modules.
  • circuit device coupling module More preferably, the circuit device coupling module
  • the coupling contact portion formed in the module case may be configured in any one of the "I-shape or H-shape" capable of electrical connection connection and rigid fastening coupling.
  • circuit device coupling module Even more preferably, the circuit device coupling module,
  • the upper coupling connection part and the lower coupling connection part When configured in an I-shape, the upper coupling connection portion and the lower coupling connection portion which rotates to the left and right via each hinge axis to enable the electrical connection connection and the rigid coupling coupling with the coupling contact portion formed in the module case,
  • the upper coupling connection part and the lower coupling connection part may be provided with a coupling connection contact part configured of a magnet member or a latch member corresponding to the coupling contact part.
  • circuit device coupling module Even more preferably, the circuit device coupling module,
  • the upper coupling connecting portion and the lower coupling connecting portion that can be electrically connected to the coupling contact portion formed on the upper and lower surfaces of the module case and a rigid fastening coupling is fixed
  • the upper coupling The coupling part and the lower coupling connection part may be provided with a coupling connection contact part configured by pairing a magnet member or a latch member corresponding to the coupling contact part.
  • each circuitry block module comprising:
  • a circuit diagram display unit for displaying a circuit diagram corresponding to an electronic component of a circuit element installed in the module case on either one of an upper surface and a lower surface of the module case;
  • a circuit device display unit on which an actual circuit device corresponding to an electronic component of a circuit device installed in the module case is displayed on the other side of an upper surface and a lower surface of the module case;
  • the configuration is provided on the four side edges of the module case, including a magnetic coupling contact portion to enable electrical connection connection with other circuit element block modules for constituting the electronic circuit.
  • the module case Preferably, the module case,
  • It can be comprised in either a square or rectangular block shape.
  • the module case More preferably, the module case,
  • the magnetic coupling contact portion may be composed of any one non-conductive material selected from the group of plastics, wood, and rubber.
  • a pair of edge connector grooves is further formed on each of the upper and lower surfaces of the four side edge regions of the module case;
  • the edge connector groove portion forms one completed connection groove portion, and the elastic connector is inserted and fastened to the connection groove portion to firmly connect the plurality of module cases. Can be fixed.
  • a pair of separation removal grooves may be further formed on top so that they can be separated and removed by the connector removal tool.
  • the magnetic coupling contact portion Even more preferably, the magnetic coupling contact portion,
  • one corresponding to the up and down and left and right symmetry can be configured as a groove, the other can be configured as a projection.
  • the magnetic coupling contact portion Even more preferably, the magnetic coupling contact portion,
  • Consists of a groove and a projection at least one of which is a magnet member, and the other may be of an iron member that can be attached to the magnet member.
  • the individual circuit elements for configuring the electronic circuit in the form of a module I for electrical connection connection to the square or rectangular circuit block module
  • connection connection through the coupling element of the shape of the child or H-shape, as well as the electrical connection of the electronic circuit for the circuit experiment, as well as the coupling state of the coupling between the modules can be maintained firmly.
  • the circuit element coupling module in the I-shape by configuring the circuit element coupling module in the I-shape to rotate the upper and lower sides from side to side or H-shape to fasten the modules in a fixed form, the appearance of the circuit element block module in a simple form In addition, the manufacturing cost may be reduced, and the coupling and separation for replacement between the circuit element block modules may be easily performed.
  • a magnetic coupling contact portion is formed on the four sides of the square or rectangular circuit element block module, between the circuit element block modules.
  • FIG. 1 is a perspective view showing the configuration of an improved configuration kit of a modular circuit device according to an embodiment of the present invention.
  • FIG. 2 is a view showing the configuration of a circuit device coupling module applied to the improved configuration kit of a modular circuit device according to an embodiment of the present invention.
  • FIG 3 is a view showing the configuration of another example of a circuit coupling module applied to the improved configuration kit of the modular circuit device according to an embodiment of the present invention.
  • FIG. 4 is a diagram illustrating a configuration of using an I-shaped circuit device coupling module in an improved configuration kit of a modular circuit device according to an embodiment of the present invention.
  • FIG. 5 is a diagram illustrating a configuration of using an H-shaped circuit coupling module in an improved configuration kit of a modular circuit device according to an embodiment of the present invention.
  • Figure 6 illustrates a rectangular configuration of the module of the improved configuration kit of modular circuitry according to one embodiment of the present invention.
  • FIG. 7 illustrates a perspective view of an improved configuration kit of modular circuitry in accordance with another embodiment of the present invention.
  • FIG. 8 illustrates an exploded perspective view of an improved configuration kit of modular circuitry in accordance with another embodiment of the present invention.
  • FIG 9 shows an additional configuration applied to an improved configuration kit of modular circuitry according to another embodiment of the invention.
  • FIG. 10 illustrates an example of a connection configuration of an improved configuration kit of modular circuitry according to another embodiment of the present invention.
  • circuit element block module 110 module case
  • circuit diagram display unit 130 circuit element display unit
  • hinge shaft 210 upper coupling connection
  • connection contact portion 300 circuit element block module
  • module case 311 side border
  • pair of disconnection removal grooves 320 schematic display portion
  • circuit element display unit 340 magnetic coupling contact portion
  • FIG. 1 is a perspective view showing a configuration of an improved configuration kit of a modular circuit device according to an embodiment of the present invention
  • Figure 2 is an improved configuration kit of a modular circuit device according to an embodiment of the present invention
  • 3 is a diagram illustrating a configuration of a circuit device coupling module applied to the present invention
  • FIG. 3 illustrates a configuration of another example circuit device coupling module applied to an improved configuration kit of a modular circuit device according to an embodiment of the present invention.
  • the improved configuration kit of the modular circuit device according to an embodiment of the present invention may be configured by a plurality of circuit block module 100, a circuit device coupling
  • the module 200 may further include a plurality.
  • An improved configuration kit of modular circuit elements is a configuration kit having individual circuit elements for forming an electronic circuit in a module form.
  • This improved configuration kit of modular circuitry is too small for passive and integrated IC types for the conventional SMD type, making it difficult to use for experiments, and for the deep type, wire connection and breadboard.
  • Modular configuration kit to overcome the drawbacks of circuit configuration when plugged in, or to provide a simpler configuration that overcomes the disadvantages of requiring separate components such as soldering or breadboard connectors for connection to be.
  • the improved configuration kit of the modular circuit device a module of the type that can be connected without a small integrated IC or resistance breadboard, the size varies depending on the user's age and purpose of use To be configured. For example, when it is used for the purpose of understanding the logic gate of elementary school students, it is possible to make and provide the form of the gate by making the shape of the instrument large in the size of the palm for the purpose of use of the child, and can be provided to the university student or mechanical engineer. In the case of the design of an easy integrated circuit of the SMD type device may be provided to be made by making a smaller structure of the same type.
  • the circuit device block module 100 includes a module case 110 in which an electronic component of a circuit device is installed in a rectangular block shape. And a circuit diagram display unit 120 in which a circuit diagram corresponding to an electronic component of a circuit element installed in the module case 110 is displayed on either one of an upper surface and a lower surface of the module case 110, and a module case ( The actual circuit element corresponding to the electronic component of the circuit element installed inside the 110 is displayed on the other side of the upper and lower surfaces of the module case 110, and the circuit element display unit 130 and 4 of the module case 110. It may be configured to include a coupling contact portion 140 is formed to enable electrical connection connection to each of the upper and lower surfaces proximate the side edge region of the room.
  • the module case 110 may be configured in any one of a square or rectangular block shape. At this time, when the module case 110 is configured as a rectangular block shape, as shown in FIG. 6, the module case 110 is configured to have a size twice that of the square block shape shown in FIG. Allows you to connect two square blocks.
  • the module case 110 is composed of any non-conductive material selected from the group of plastics, wood, and rubber, except for the coupling contact portion 140.
  • the coupling contact unit 140 is a conductive material electrically connected and connected to an electronic component of a circuit device installed in the module case 110, and may be configured as one of a magnet member and a latch member.
  • the module case 110 of the circuit element block module 100 forms four coupling contact portions 140 on the upper and lower surfaces, respectively, to form a total of eight coupling contact portions 140 and is installed therein.
  • Electronic components of the circuit device to be configured to be electrically connected to the coupling contact portion 140.
  • circuit block module 100 may be installed to configure the resistor, diode, capacitor, integrated IC, transistor, coil, switch, variable resistor, LED, bulb, display, speaker, etc. as electronic components of the circuit element.
  • the circuit device coupling module 200 electrically connects the circuit device block modules 100 in the form of modules in an electronic circuit configuration using the circuit device block modules 100. It may be composed of a conductive material to assist.
  • the circuit device coupling module 200 may be used as a configuration for electrically connecting and connecting the circuit device block module 100 by configuring the configuration itself with a conductive material.
  • the circuit device coupling module 200 is an “I-shape” (see FIG. 2) or an H-shape (see FIG. 3) capable of electrical connection connection and rigid fastening coupling with the coupling contact portion 140 formed in the module case 110. ) ”Can be configured as either structure.
  • each of the coupling contact portions 140 formed in the module case 110 may be electrically connected and firmly coupled to each other.
  • the upper coupling connecting portion 210 and the lower coupling connecting portion 220 which rotates to the left and right via the hinge shaft 201 of the coupling, the upper coupling connecting portion 210 and the lower coupling connecting portion 220, the coupling contact portion 140 It can be configured to form a coupling connection contact portion 230 composed of a magnet member or a latch member corresponding to the.
  • circuit device coupling module 200 when configured in the H-shape, the electrical connection connection and the coupling contact portion 140 formed on the upper and lower surfaces of the module case 110 and The upper coupling connector 240 and the lower coupling connector 250 that can be firmly coupled and configured in a fixed form, and the upper coupling connector 240 and the lower coupling connector 250 in the magnet corresponding to the coupling contact portion 140
  • the coupling connection contact portion 260 constituting the member or the latch member in a pair may be formed.
  • FIG. 1 is a diagram illustrating a circuit device block module 100
  • FIG. 1A illustrates a configuration in which a circuit diagram display unit 120 is displayed in a circuit device block module 100
  • FIG. In the device block module 100 the circuit device display unit 130, which is the opposite side of the circuit diagram display unit 120, is displayed.
  • Figure 2 is a configuration showing a circuit device coupling module 200
  • Figure 2 (a) shows a circuit device coupling module 200 of the I-shape
  • Figure 2 (b) is a circuit device coupling of the I-shape
  • the configuration of the operation in which the module 200 rotates is shown.
  • Figure 3 is a configuration showing another example of the circuit element coupling module 200
  • Figure 3 (a) shows the H-shaped circuit element coupling module 200
  • Figure 3 (b) is of the H-shape It shows a perspective configuration of a fixed form of the circuit element coupling module 200.
  • FIG. 4 is a diagram illustrating a configuration of using an I-shaped circuit device coupling module in an improved configuration kit of a modular circuit device according to an embodiment of the present invention
  • FIG. 5 is in accordance with an embodiment of the present invention
  • FIG. 6 is a view illustrating a configuration using an H-shaped circuit coupling module in an improved configuration kit of a modular circuit device
  • FIG. 6 is a rectangle of an improved configuration kit of a modular circuit device according to an embodiment of the present invention. It is a figure which shows the module structure of a form.
  • FIG. 4 illustrates that two circuit elements are rotated in opposite directions between the upper coupling connection part 210 and the lower coupling connection part 220 of the I-shaped circuit device coupling module 200 between the two circuit device block modules 100.
  • FIG. 5 shows an upper coupling connector 240 and a lower coupling connector 250 formed in a state of being fixed to an H-shaped circuit coupling module 200 between two circuit element block modules 100. It shows the process of the fastening configuration for electrically connecting and connecting the block module 100, and firmly fastened.
  • 6 shows an example of the configuration of a rectangular circuit element block module 100 that is formed twice as large as the square circuit element block module 100.
  • FIG. 7 is a perspective view showing an improved configuration kit of a modular circuit device according to another embodiment of the present invention
  • FIG. 8 is an improved configuration kit of a modular circuit device according to another embodiment of the present invention.
  • Figure is an exploded perspective view showing the configuration.
  • the improved configuration kit of a modular circuit device according to another embodiment of the present invention may be configured by a plurality of circuit block module 300.
  • the circuit device block module 300 may include a module case 310 and an electronic module case in which an electronic component of a circuit device is installed in a rectangular block shape.
  • the circuit diagram corresponding to the electronic component of the circuit device installed inside the 310 is displayed on either one of the upper and lower surfaces of the module case 310 and the inside of the module case 310 and the circuit diagram display unit 320.
  • the circuit element display unit 330 in which the actual circuit element corresponding to the electronic component of the installed circuit element is displayed on the other side of the upper and lower surfaces of the module case 310, and the four side edges 311 of the module case 310. It is installed in the), it may be configured to include a magnetic coupling contact portion 340 to enable the electrical connection connection with the other circuit element block module 300 for configuring the electronic circuit.
  • the module case 310 may be configured in any one of a square or rectangular block shape.
  • the module case 310 is configured in a rectangular block shape, such as the module case 110 (see FIG. 6) according to an embodiment of the present invention as described above, the module case 310 is twice as large as the square block shape. By configuring the size, it is possible to connect two square blocks to one rectangular block.
  • the module case 310 is formed of any non-conductive material selected from the group of plastics, wood, and rubber, except for the magnet coupling contact 340.
  • the module case 310 further forms a pair of edge connector grooves 312 in each of the upper and lower surfaces of the four side edge 311 regions of the module case 310, and the magnet coupling contact portion 340.
  • the edge connector groove 312 forms one completed connection groove
  • the elastic connector 313 is inserted into and coupled to the connection groove to form a plurality of modules.
  • the case 310 may be firmly fixed.
  • the elastic connector 313 is configured by further forming a pair of separation removal grooves 314 on the top to be separated and removed by the connector removal tool 350 shown in FIG.
  • the magnet coupling contact 340 may be electrically connected to an electronic component of a circuit device installed in the module case 310.
  • the magnet coupling contact portion 340 is installed on each of the four side edges 311 of the module case 310, one corresponding to the top and bottom and left and right symmetry can be configured as a groove, the other can be configured as a projection have.
  • at least one magnet coupling contact portion 340 composed of a groove and a protrusion is a magnet member, and the other is composed of an iron member that can be attached to the magnet member.
  • the circuit block module 300 is an electronic component of a circuit device, such as the circuit block module 100 according to an embodiment of the present invention described above, a resistor, a diode, a capacitor, an integrated IC, a transistor, a coil, Switch, potentiometer, LED, bulb, display, speaker, etc. can be installed and configured.
  • FIG. 9 is a view showing an additional configuration applied to an improved configuration kit of a modular circuit device according to another embodiment of the present invention
  • Figure 10 is an improved configuration of a modular circuit device according to another embodiment of the present invention It is a figure which shows an example of the connection structure of a kit.
  • FIG. 9A illustrates an example of the structure of the connector removing tool 350.
  • FIG. 9B illustrates an elastic connector 313 for inserting and fastening into the edge connector groove 312 of the module case 310.
  • FIG. (C) of FIG. 9 shows the configuration of the magnet coupling contact portion 340 provided at the four side edges 311 of the module case 310.
  • FIG. 10 illustrates a configuration of an electronic circuit for a circuit experiment maintaining a tight coupling state and an electrical connection between a plurality of circuit block modules 300 in which the display of the circuit diagram display unit 320 and the circuit element display unit 330 is omitted. Indicates.
  • the external shape of the circuit block module is composed of a simple block shape of square or rectangular, so that the appearance is easy to manufacture and the expandability of the block is improved,
  • the fun can be enhanced to increase the interest of the learner, and the combination and separation between the modules can be easily performed.
  • the coupling between the circuit element block modules in a variety of fastening method and to facilitate the separation and coupling, the configuration time of the electronic circuit for a variety of circuit experiments can be shortened, the effect of learning can be improved have.

Abstract

According to an improved construction kit of modular circuit elements provided by the present invention, the individual circuit elements for forming an electronic circuit are formed in the shape of a module, and the circuit elements are configured to be connected to a square or rectangular circuit element block module by an I-shaped or H-shaped circuit element coupling module for an electrical connection such that the electrical connection of the electronic circuit for testing a circuit and a coupled state between the modules can be stably maintained.

Description

모듈 형 회로소자의 개선된 구성 키트Improved configuration kit for modular circuitry
본 발명은 모듈 형 회로소자의 개선된 구성 키트에 관한 것으로서, 보다 구체적으로는 전자회로를 구성하기 위한 개별 회로소자들을 모듈 형태로 구성하되, 정사각형 또는 직사각형의 블록 형상으로 구성되는 회로소자 블록모듈들 간의 전기적인 연결 접속 및 견고한 체결 결합이 이루어지도록 하는 회로실험을 위한 전자회로의 구성이 가능한 모듈 형 회로소자의 개선된 구성 키트에 관한 것이다.The present invention relates to an improved configuration kit of a modular circuit device, and more particularly, circuit device block modules, each of which consists of individual circuit devices for constituting an electronic circuit in a module form, and is configured in a square or rectangular block shape. The present invention relates to an improved configuration kit of modular circuit elements capable of constructing electronic circuits for circuit experiments in which electrical connection connections and rigid fastening couplings are made.
기존의 회로 구성을 위한 일반적 회로부품들은 두 가지의 타입이 적용된다. 즉, 일반적인 회로부품들은 딥(Deep) 타입의 소자와 SMD 타입의 소자로 구분되고, 상업적인 목적으로 사용할 경우 SMD 타입을 사용하며, PCB에 SMT 작업을 통해 보드로 제작한다. 반면에, 딥 타입의 겨우 보다 큰 장비나 실험에 이용된다.There are two types of general circuit components for existing circuit configurations. That is, general circuit components are divided into deep type devices and SMD type devices. When using for commercial purposes, the SMD type is used, and the PCB is manufactured as a board through SMT work on the PCB. On the other hand, the dip type is only used for larger equipment or experiments.
이와 같은 기존의 SMD 타입의 경우 수동소자 및 집적IC 타입에서 너무 작아서 실험용으로 사용하기 힘들고, 딥 타입의 경우에는 전선의 연결 및 브레드보드에 꼽거나 할 때 회로의 구성이 까다로운 점, 연결을 위해서는 납땜이나 브레드보드 커넥터 등 별도의 구성품이 필요하다는 단점이 있다. 이러한 이유로 전자회로를 연구하거나 학습, 개발하는 사람들은 보통 소켓을 사용하여 전자회로를 구성하거나 브레드보드 상에 전자회로를 구성하여 실험을 실시하고 있다.In the case of the conventional SMD type, it is too small for the passive element and the integrated IC type, so it is difficult to use it for the experiment. In the case of the dip type, the configuration of the circuit is difficult when connecting the wires and plugging the breadboard. Or a separate component such as breadboard connector is required. For this reason, people who research, learn, or develop electronic circuits usually use sockets to construct electronic circuits or electronic circuits on breadboards.
한편, 전자회로 학습 키트가 교육자재로서 사용되어 지는 것을 볼 수 있는 데, 이들은 주로 초중고생을 대상으로 하여 실습을 통한 전자회로의 이해를 도모한다. 전자회로 학습 키트는 전자회로의 난이도에 따라 여러 단계의 제품이 판매되고 있으나, 그 구성은 회로도와, 단순한 설명서, 전자소자(저항, 집적IC, 콘덴서, 다이오드 등), 및 기타 구성품을 동봉하여 하나의 학습 키트를 구성한다. 학습자는 각 전자소자 및 전자부품을 인쇄회로기판에 형성되어 있는 공극에 삽입하여 납땜을 실시함으로써 실질적인 전자회로의 제작을 완료하게 된다.On the other hand, it can be seen that the electronic circuit learning kit is used as an educational material, which aims to understand the electronic circuit through the practice mainly for elementary and middle school students. Electronic circuit learning kits are sold in various stages depending on the difficulty level of the electronic circuit, but the configuration is accompanied by circuit diagrams, simple instructions, electronic devices (resistors, integrated ICs, capacitors, diodes, etc.) and other components. Make up your learning kit. The learner inserts each electronic device and the electronic component into a gap formed in the printed circuit board to perform soldering to complete the manufacture of the actual electronic circuit.
그러나 제작과정에서 납땜기술의 미숙으로 인한 과열로 전자소자를 파손시키거나 기판상의 공극을 잘못 판단하여 전자소자를 다른 위치의 공극에 납땜하는 경우에는 전자회로가 제대로 작동하지 않으며, 대부분의 학습자는 이러한 미작동 혹은 오작동의 경우를 경험하게 된다. 특히, 한 번 납땜되어 고정된 전자소자 및 부품들은 분리하기 어려우며, 분리 과정에서 재가열에 의한 추가적인 파손을 입을 수도 있다. 그리고 상호 연결된 전자회로 상에서 개개 구성요소의 결함을 찾는 것은 회로에 대한 전문지식이 없는 사람에게는 많은 어려움을 느끼게 하고 있다.However, if the electronic device is damaged due to overheating due to inexperience of soldering technology in the manufacturing process, or if the electronic device is soldered to the air gap at another position due to misjudgement of the gap on the board, most learners do not You will experience cases of non-operation or malfunction. In particular, the electronic devices and components once soldered and fixed are difficult to separate, and may be further damaged by reheating during the separation process. And finding defects in individual components on interconnected electronic circuits presents many challenges for people without circuit expertise.
대한민국 등록특허 제10-1210304호(등록일 2012.12.04일자)는 본 출원인이 출원하여 특허등록 받은 모듈 형 회로소자의 구성 키트를 개시한다. 이러한 선행문헌은 종래의 문제점을 개선하는 모듈 형 회로소자의 구성 키트이나, 모듈 형 회로소자의 결합 방식이 모듈 회로소자의 모듈 케이스와 리드선 연결모듈 각각에 수 체결부와 암 체결부를 구성하여 블록을 결합시키는 구조로서, 외형 제작이 어렵고 단가가 비싸며, 블록을 많이 결합시킬 경우 중간에 결합된 블록이 밑으로 빠져 버리는 등의 문제가 종종 발생하여 견고한 체결 상태가 유지되기 어려운 문제가 있었다. 이에 본 출원인은 기 출원하여 등록받은 선행문헌의 기존 결합방식에서 나타나는 체결 상태의 유지 문제와, 외형 제작에서 나오는 문제를 해결할 수 있는 개선된 구조의 모듈 형 회로소자의 구성 키트를 제안하고자 한다.Republic of Korea Patent No. 10-1210304 (Date of registration date 2012.12.04) discloses a configuration kit of a modular circuit device that the applicant has applied for a patent. This prior document is a component kit of a modular circuit element that improves the conventional problems, or the coupling method of the modular circuit element is composed of a male fastening part and a female fastening part in each of the module case and the lead wire connection module of the module circuit element As a structure to combine, it is difficult to manufacture the appearance and expensive, and when a large number of blocks are combined, problems such as falling out of the combined block in the middle often occurs, it was difficult to maintain a solid fastening state. Accordingly, the present applicant intends to propose a configuration kit of a modular circuit device of an improved structure that can solve the problem of the maintenance of the fastening state appearing in the existing coupling method of the prior application and registered prior application, and the problems arising from the appearance manufacturing.
본 발명은 기존에 제안된 방법들의 상기와 같은 문제점들을 해결하기 위해 제안된 것으로서, 전자회로를 구성하기 위한 개별 회로소자들을 모듈 형태로 구성하되, 정사각형 또는 직사각형의 회로소자 블록모듈에 전기적인 연결 접속을 위한 I자 형태 또는 H자 형태의 회로소자 결합모듈을 통해 연결 접속하도록 구성함으로써, 회로실험을 위한 전자회로의 전기적인 연결 접속은 물론, 모듈들 간의 체결의 결합 상태가 견고하게 유지될 수 있도록 하는, 모듈 형 회로소자의 개선된 구성 키트를 제공하는 것을 그 목적으로 한다.The present invention is proposed to solve the above problems of the conventionally proposed methods, the individual circuit elements for constituting the electronic circuit in the form of a module, the electrical connection connection to the square or rectangular circuit element block module By connecting to connect through the I-shaped or H-shaped circuit element coupling module for the electrical connection of the electronic circuit for the circuit experiment, as well as to ensure that the coupling state of the coupling between the modules is firmly maintained It is an object of the present invention to provide an improved configuration kit of modular circuitry.
또한, 본 발명은, 회로소자 결합모듈을 상하에서 좌우로 회전하는 I자 형태 또는 고정된 형태로 모듈들 간을 체결하는 H자 형태로 구성함으로써, 회로소자 블록모듈의 외형을 단순한 형태로 구성하고, 그에 따른 제작비용이 절감됨은 물론, 회로소자 블록모듈 간의 교체를 위한 결합 및 분리가 용이하게 이루어질 수 있도록 하는, 모듈 형 회로소자의 개선된 구성 키트를 제공하는 것을 또 다른 목적으로 한다.In addition, the present invention, by configuring the circuit module coupling module in the I-shape to rotate between the upper and lower sides from side to side or in the H-shape to fasten the modules in a fixed form, the appearance of the circuit element block module in a simple form Another object of the present invention is to provide an improved configuration kit of a modular circuit device, which can reduce the manufacturing cost and, as a result, facilitate coupling and separation for replacement between circuit block modules.
뿐만 아니라, 본 발명은, 전자회로를 구성하기 위한 개별 회로소자들을 모듈 형태로 구성하되, 정사각형 또는 직사각형의 회로소자 블록모듈의 4방의 측면 테두리에 자석 결합 접점부를 형성하고, 회로소자 블록모듈들 간에 자석 결합 접점부를 통해 연결 접속하도록 구성함으로써, 회로실험을 위한 전자회로의 전기적인 연결 접속은 물론, 모듈들 간의 체결의 결합 상태가 견고하게 유지되도록 하며, 특히 자석 결합 접점부를 매개로 연결되는 회로소자 블록모듈들 간의 상부 면과 하부 면에는 복수의 탄성 연결체가 삽입 체결되어 더욱 견고한 체결 상태가 유지될 수 있도록 하는, 모듈 형 회로소자의 개선된 구성 키트를 제공하는 것을 또 다른 목적으로 한다.In addition, the present invention, but the individual circuit elements for constituting the electronic circuit in the form of a module, a magnetic coupling contact portion is formed on the four sides of the square or rectangular circuit element block module, between the circuit element block modules By configuring the connection connection through the magnet coupling contact portion, as well as the electrical connection connection of the electronic circuit for the circuit experiment, as well as the coupling state of the coupling between the modules is maintained firmly, in particular the circuit element connected via the magnet coupling contact portion Another object of the present invention is to provide an improved configuration kit of modular circuit elements, in which a plurality of elastic connectors are inserted into and fastened to the upper and lower surfaces between the block modules so that a more secure fastening state can be maintained.
상기한 목적을 달성하기 위한 본 발명의 특징에 따른 모듈 형 회로소자의 개선된 구성 키트는,An improved configuration kit of a modular circuit device according to a feature of the present invention for achieving the above object,
전자회로를 구성하기 위한 개별 회로소자들을 모듈형태로 구비하는 모듈 형 회로소자의 개선된 구성 키트로서, 각각의 회로소자 블록모듈들은,An improved configuration kit of modular circuitry having individual circuitry for the construction of an electronic circuit in a modular form, each circuitry block module comprising:
사각 형태의 블록(block) 형상으로 회로소자의 전자부품을 내부에 설치 구성하는 모듈 케이스;A module case for installing and configuring electronic components of a circuit device in a block shape having a rectangular shape;
상기 모듈 케이스의 내부에 설치된 회로소자의 전자부품에 해당하는 회로도가 상기 모듈 케이스의 상부 면과 하부 면 중 어느 하나의 일면에 표시되는 회로도 표시부;A circuit diagram display unit for displaying a circuit diagram corresponding to an electronic component of a circuit element installed in the module case on either one of an upper surface and a lower surface of the module case;
상기 모듈 케이스의 내부에 설치된 회로소자의 전자부품에 해당하는 실제 회로소자가 상기 모듈 케이스의 상부 면과 하부 면 중 다른 일면에 표시되는 회로소자 표시부; 및A circuit device display unit on which an actual circuit device corresponding to an electronic component of a circuit device installed in the module case is displayed on the other side of an upper surface and a lower surface of the module case; And
상기 모듈 케이스의 4방의 측면 테두리 영역에 근접한 상부 면과 하부 면 각각에 전기적인 연결 접속이 가능하도록 형성되는 결합 접점부를 포함하는 것을 그 구성상의 특징으로 한다.It is characterized in that it comprises a coupling contact portion which is formed to enable electrical connection connection to each of the upper surface and the lower surface adjacent to the four side edge regions of the module case.
바람직하게는, 상기 모듈 케이스는,Preferably, the module case,
정사각형 또는 직사각형의 블록 형상 중 어느 하나로 구성할 수 있다.It can be comprised in either a square or rectangular block shape.
더욱 바람직하게는, 상기 모듈 케이스는,More preferably, the module case,
상기 결합 접점부를 제외하고, 플라스틱류와 나무 재질, 및 고무 재질의 군으로부터 선택된 어느 하나의 비전도성 재질로 구성할 수 있다.Except for the coupling contact portion, it may be composed of any one non-conductive material selected from the group of plastics, wood, and rubber.
바람직하게는, 상기 결합 접점부는,Preferably, the coupling contact portion,
상기 모듈 케이스의 내부에 설치된 회로소자의 전자부품과 전기적으로 연결 접속되는 도전성 재질로서, 자석 부재 또는 걸림쇠 부재 중 어느 하나로 구성할 수 있다.As a conductive material electrically connected and connected to the electronic component of the circuit element installed inside the module case, it may be configured of any one of a magnet member or a latch member.
바람직하게는,Preferably,
상기 회로소자 블록모듈들을 사용한 전자회로 구성 시에 상기 회로소자 블록모듈들을 모듈 단위 형태로 전기적인 연결 접속을 보조하기 위한 도전성 재질로 구성하는 회로소자 결합모듈들을 더 포함하여 구성할 수 있다.The electronic device may further include a circuit device coupling module configured to form the circuit device block modules using a conductive material to assist the electrical connection connection in the form of a module when the electronic device is configured using the circuit device block modules.
더욱 바람직하게는, 상기 회로소자 결합모듈은,More preferably, the circuit device coupling module,
상기 모듈 케이스에 형성된 결합 접점부와 전기적인 연결 접속 및 견고한 체결 결합이 가능한 “I자 형태 또는 H자 형태” 중 어느 하나의 구조로 구성할 수 있다.The coupling contact portion formed in the module case may be configured in any one of the "I-shape or H-shape" capable of electrical connection connection and rigid fastening coupling.
더욱더 바람직하게는, 상기 회로소자 결합모듈은,Even more preferably, the circuit device coupling module,
I자 형태로 구성되는 경우, 상기 모듈 케이스에 형성된 결합 접점부와 전기적인 연결 접속 및 견고한 체결 결합이 가능하도록 각각의 힌지 축을 매개로 좌우로 회전하는 상부 결합 연결부 및 하부 결합 연결부를 구성하고, 상기 상부 결합 연결부 및 하부 결합 연결부에는 상기 결합 접점부에 대응하는 자석 부재 또는 걸림쇠 부재로 구성하는 결합 연결 접점부를 형성할 수 있다.When configured in an I-shape, the upper coupling connection portion and the lower coupling connection portion which rotates to the left and right via each hinge axis to enable the electrical connection connection and the rigid coupling coupling with the coupling contact portion formed in the module case, The upper coupling connection part and the lower coupling connection part may be provided with a coupling connection contact part configured of a magnet member or a latch member corresponding to the coupling contact part.
더욱더 바람직하게는, 상기 회로소자 결합모듈은,Even more preferably, the circuit device coupling module,
H자 형태로 구성되는 경우, 상기 모듈 케이스의 상/하부 면에 형성된 결합 접점부와 전기적인 연결 접속 및 견고한 체결 결합이 가능한 상부 결합 연결부 및 하부 결합 연결부를 고정된 형태로 구성하고, 상기 상부 결합 연결부와 하부 결합 연결부에는 상기 결합 접점부에 대응하는 자석 부재 또는 걸림쇠 부재를 쌍으로 구성하는 결합 연결 접점부를 형성할 수 있다.When configured in the H-shape, the upper coupling connecting portion and the lower coupling connecting portion that can be electrically connected to the coupling contact portion formed on the upper and lower surfaces of the module case and a rigid fastening coupling is fixed, the upper coupling The coupling part and the lower coupling connection part may be provided with a coupling connection contact part configured by pairing a magnet member or a latch member corresponding to the coupling contact part.
상기한 목적을 달성하기 위한 본 발명의 다른 실시예의 특징에 따른 모듈 형 회로소자의 개선된 구성 키트는,An improved configuration kit of a modular circuit device according to a feature of another embodiment of the present invention for achieving the above object,
전자회로를 구성하기 위한 개별 회로소자들을 모듈형태로 구비하는 모듈 형 회로소자의 개선된 구성 키트로서, 각각의 회로소자 블록모듈들은,An improved configuration kit of modular circuitry having individual circuitry for the construction of an electronic circuit in a modular form, each circuitry block module comprising:
사각 형태의 블록(block) 형상으로 회로소자의 전자부품을 내부에 설치 구성하는 모듈 케이스;A module case for installing and configuring electronic components of a circuit device in a block shape having a rectangular shape;
상기 모듈 케이스의 내부에 설치된 회로소자의 전자부품에 해당하는 회로도가 상기 모듈 케이스의 상부 면과 하부 면 중 어느 하나의 일면에 표시되는 회로도 표시부;A circuit diagram display unit for displaying a circuit diagram corresponding to an electronic component of a circuit element installed in the module case on either one of an upper surface and a lower surface of the module case;
상기 모듈 케이스의 내부에 설치된 회로소자의 전자부품에 해당하는 실제 회로소자가 상기 모듈 케이스의 상부 면과 하부 면 중 다른 일면에 표시되는 회로소자 표시부; 및A circuit device display unit on which an actual circuit device corresponding to an electronic component of a circuit device installed in the module case is displayed on the other side of an upper surface and a lower surface of the module case; And
상기 모듈 케이스의 4방의 측면 테두리에 설치되어, 전자회로를 구성하기 위한 다른 회로소자 블록모듈과 전기적인 연결 접속이 가능하도록 하는 자석 결합 접점부를 포함하는 것을 그 구성상의 특징으로 한다.It is characterized in that the configuration is provided on the four side edges of the module case, including a magnetic coupling contact portion to enable electrical connection connection with other circuit element block modules for constituting the electronic circuit.
바람직하게는, 상기 모듈 케이스는,Preferably, the module case,
정사각형 또는 직사각형의 블록 형상 중 어느 하나로 구성할 수 있다.It can be comprised in either a square or rectangular block shape.
더욱 바람직하게는, 상기 모듈 케이스는,More preferably, the module case,
상기 자석 결합 접점부를 제외하고, 플라스틱류와 나무 재질, 및 고무 재질의 군으로부터 선택된 어느 하나의 비전도성 재질로 구성할 수 있다.Except for the magnetic coupling contact portion, it may be composed of any one non-conductive material selected from the group of plastics, wood, and rubber.
더욱더 바람직하게는, 상기 모듈 케이스는,Even more preferably, the module case,
상기 모듈 케이스의 4방의 측면 테두리 영역의 상부 면과 하부 면의 각각에 한 쌍의 테두리 연결체 홈부를 더 형성하고,A pair of edge connector grooves is further formed on each of the upper and lower surfaces of the four side edge regions of the module case;
상기 자석 결합 접점부에 의해 복수의 모듈 케이스가 연결 접속됨에 따라 상기 테두리 연결체 홈부가 하나의 완성된 연결 홈부를 형성하게 되고, 상기 연결 홈부에 탄성 연결체가 삽입 체결되어 복수의 모듈 케이스가 견고하게 고정되도록 할 수 있다.As the plurality of module cases are connected and connected by the magnet coupling contact portion, the edge connector groove portion forms one completed connection groove portion, and the elastic connector is inserted and fastened to the connection groove portion to firmly connect the plurality of module cases. Can be fixed.
더더욱 바람직하게는, 상기 탄성 연결체는,Even more preferably, the elastic connector,
연결체 제거 도구에 의해 분리되어 제거될 수 있도록 상부에 한 쌍의 분리 제거 홈을 더 형성할 수 있다.A pair of separation removal grooves may be further formed on top so that they can be separated and removed by the connector removal tool.
더욱더 바람직하게는, 상기 자석 결합 접점부는,Even more preferably, the magnetic coupling contact portion,
상기 모듈 케이스의 4방의 측면 테두리에 각각 설치하되, 상하 및 좌우의 대칭에 대응하여 하나는 홈으로 구성하고, 다른 하나는 돌기로 구성할 수 있다.It is installed on each of the four side edges of the module case, one corresponding to the up and down and left and right symmetry can be configured as a groove, the other can be configured as a projection.
더더욱 바람직하게는, 상기 자석 결합 접점부는,Even more preferably, the magnetic coupling contact portion,
홈 및 돌기로 구성하되, 적어도 하나는 자석 부재이고, 나머지 다른 하나는 자석 부재와 부착될 수 있는 철 부재로 구성할 수 있다.Consists of a groove and a projection, at least one of which is a magnet member, and the other may be of an iron member that can be attached to the magnet member.
본 발명에서 제안하고 있는 모듈 형 회로소자의 개선된 구성 키트에 따르면, 전자회로를 구성하기 위한 개별 회로소자들을 모듈 형태로 구성하되, 정사각형 또는 직사각형의 회로소자 블록모듈에 전기적인 연결 접속을 위한 I자 형태 또는 H자 형태의 회로소자 결합모듈을 통해 연결 접속하도록 구성함으로써, 회로실험을 위한 전자회로의 전기적인 연결 접속은 물론, 모듈들 간의 체결의 결합 상태가 견고하게 유지될 수 있도록 할 수 있다.According to the improved configuration kit of the modular circuit device proposed in the present invention, the individual circuit elements for configuring the electronic circuit in the form of a module, I for electrical connection connection to the square or rectangular circuit block module By configuring the connection connection through the coupling element of the shape of the child or H-shape, as well as the electrical connection of the electronic circuit for the circuit experiment, as well as the coupling state of the coupling between the modules can be maintained firmly. .
또한, 본 발명에 따르면, 회로소자 결합모듈을 상하에서 좌우로 회전하는 I자 형태 또는 고정된 형태로 모듈들 간을 체결하는 H자 형태로 구성함으로써, 회로소자 블록모듈의 외형을 단순한 형태로 구성하고, 그에 따른 제작비용이 절감됨은 물론, 회로소자 블록모듈 간의 교체를 위한 결합 및 분리가 용이하게 이루어질 수 있도록 할 수 있다.In addition, according to the present invention, by configuring the circuit element coupling module in the I-shape to rotate the upper and lower sides from side to side or H-shape to fasten the modules in a fixed form, the appearance of the circuit element block module in a simple form In addition, the manufacturing cost may be reduced, and the coupling and separation for replacement between the circuit element block modules may be easily performed.
뿐만 아니라, 본 발명은, 전자회로를 구성하기 위한 개별 회로소자들을 모듈 형태로 구성하되, 정사각형 또는 직사각형의 회로소자 블록모듈의 4방의 측면 테두리에 자석 결합 접점부를 형성하고, 회로소자 블록모듈들 간에 자석 결합 접점부를 통해 연결 접속하도록 구성함으로써, 회로실험을 위한 전자회로의 전기적인 연결 접속은 물론, 모듈들 간의 체결의 결합 상태가 견고하게 유지되도록 하며, 특히 자석 결합 접점부를 매개로 연결되는 회로소자 블록모듈들 간의 상부 면과 하부 면에는 복수의 탄성 연결체가 삽입 체결되어 더욱 견고한 체결 상태가 유지될 수 있도록 할 수 있다.In addition, the present invention, but the individual circuit elements for constituting the electronic circuit in the form of a module, a magnetic coupling contact portion is formed on the four sides of the square or rectangular circuit element block module, between the circuit element block modules By configuring the connection connection through the magnet coupling contact portion, as well as the electrical connection connection of the electronic circuit for the circuit experiment, as well as the coupling state of the coupling between the modules is maintained firmly, in particular the circuit element connected via the magnet coupling contact portion A plurality of elastic connectors may be inserted into and coupled to the upper and lower surfaces between the block modules to maintain a more secure fastening state.
도 1은 본 발명의 일실시예에 따른 모듈 형 회로소자의 개선된 구성 키트의 구성을 사시도로 도시한 도면.1 is a perspective view showing the configuration of an improved configuration kit of a modular circuit device according to an embodiment of the present invention.
도 2는 본 발명의 일실시예에 따른 모듈 형 회로소자의 개선된 구성 키트에 적용되는 회로소자 결합모듈의 구성을 도시한 도면.2 is a view showing the configuration of a circuit device coupling module applied to the improved configuration kit of a modular circuit device according to an embodiment of the present invention.
도 3은 본 발명의 일실시예에 따른 모듈 형 회로소자의 개선된 구성 키트에 적용되는 다른 일례의 회로소자 결합모듈의 구성을 도시한 도면.3 is a view showing the configuration of another example of a circuit coupling module applied to the improved configuration kit of the modular circuit device according to an embodiment of the present invention.
도 4는 본 발명의 일실시예에 따른 모듈 형 회로소자의 개선된 구성 키트에 I자 형태의 회로소자 결합모듈을 사용하는 구성을 도시한 도면.4 is a diagram illustrating a configuration of using an I-shaped circuit device coupling module in an improved configuration kit of a modular circuit device according to an embodiment of the present invention.
도 5는 본 발명의 일실시예에 따른 모듈 형 회로소자의 개선된 구성 키트에 H자 형태의 회로소자 결합모듈을 사용하는 구성을 도시한 도면.5 is a diagram illustrating a configuration of using an H-shaped circuit coupling module in an improved configuration kit of a modular circuit device according to an embodiment of the present invention.
도 6은 본 발명의 일실시예에 따른 모듈 형 회로소자의 개선된 구성 키트의 직사각형 형태의 모듈 구성을 도시한 도면.Figure 6 illustrates a rectangular configuration of the module of the improved configuration kit of modular circuitry according to one embodiment of the present invention.
도 7은 본 발명의 다른 실시예에 따른 모듈 형 회로소자의 개선된 구성 키트의 사시도 구성을 도시한 도면.7 illustrates a perspective view of an improved configuration kit of modular circuitry in accordance with another embodiment of the present invention.
도 8은 본 발명의 다른 실시예에 따른 모듈 형 회로소자의 개선된 구성 키트의 분해사시도 구성을 도시한 도면.8 illustrates an exploded perspective view of an improved configuration kit of modular circuitry in accordance with another embodiment of the present invention.
도 9는 본 발명의 다른 실시예에 따른 모듈 형 회로소자의 개선된 구성 키트에 적용되는 부가 구성을 도시한 도면.9 shows an additional configuration applied to an improved configuration kit of modular circuitry according to another embodiment of the invention.
도 10은 본 발명의 다른 실시예에 따른 모듈 형 회로소자의 개선된 구성 키트의 연결 구성의 일례를 도시한 도면.10 illustrates an example of a connection configuration of an improved configuration kit of modular circuitry according to another embodiment of the present invention.
<부호의 설명><Description of the code>
100: 회로소자 블록모듈 110: 모듈 케이스100: circuit element block module 110: module case
120: 회로도 표시부 130: 회로소자 표시부120: circuit diagram display unit 130: circuit element display unit
140: 결합 접점부 200: 회로소자 결합모듈140: coupling contact portion 200: circuit element coupling module
201: 힌지 축 210: 상부 결합 연결부201: hinge shaft 210: upper coupling connection
220: 하부 결합 연결부 230: 결합 연결 접점부220: lower coupling connection 230: coupling connection contact
240: 상부 결합 연결부 250: 하부 결합 연결부240: upper coupling connection 250: lower coupling connection
260: 결합 연결 접점부 300: 회로소자 블록모듈260: coupling connection contact portion 300: circuit element block module
310: 모듈 케이스 311: 측면 테두리310: module case 311: side border
312: 한 쌍의 테두리 연결체 홈부 313: 탄성 연결체312: pair of edge connector grooves 313: elastic connector
314: 한 쌍의 분리 제거 홈 320: 회로도 표시부314: pair of disconnection removal grooves 320: schematic display portion
330: 회로소자 표시부 340: 자석 결합 접점부330: circuit element display unit 340: magnetic coupling contact portion
350: 연결체 제거 도구350: connector removal tool
이하, 첨부된 도면을 참조하여 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자가 본 발명을 용이하게 실시할 수 있도록 바람직한 실시예를 상세히 설명한다. 다만, 본 발명의 바람직한 실시예를 상세하게 설명함에 있어, 관련된 공지 기능 또는 구성에 대한 구체적인 설명이 본 발명의 요지를 불필요하게 흐릴 수 있다고 판단되는 경우에는 그 상세한 설명을 생략한다. 또한, 유사한 기능 및 작용을 하는 부분에 대해서는 도면 전체에 걸쳐 동일한 부호를 사용한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. However, in describing the preferred embodiment of the present invention in detail, if it is determined that the detailed description of the related known function or configuration may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted. In addition, the same reference numerals are used throughout the drawings for parts having similar functions and functions.
덧붙여, 명세서 전체에서, 어떤 부분이 다른 부분과 ‘연결’ 되어 있다고 할 때, 이는 ‘직접적으로 연결’ 되어 있는 경우뿐만 아니라, 그 중간에 다른 소자를 사이에 두고 ‘간접적으로 연결’ 되어 있는 경우도 포함한다. 또한, 어떤 구성요소를 ‘포함’ 한다는 것은, 특별히 반대되는 기재가 없는 한 다른 구성요소를 제외하는 것이 아니라 다른 구성요소를 더 포함할 수 있다는 것을 의미한다.In addition, in the specification, when a part is 'connected' to another part, it is not only 'directly connected' but also 'indirectly connected' with another element in between. Include. In addition, the term "comprising" a certain component means that the component may further include other components, except for the case where there is no contrary description.
도 1은 본 발명의 일실시예에 따른 모듈 형 회로소자의 개선된 구성 키트의 구성을 사시도로 도시한 도면이고, 도 2는 본 발명의 일실시예에 따른 모듈 형 회로소자의 개선된 구성 키트에 적용되는 회로소자 결합모듈의 구성을 도시한 도면이며, 도 3은 본 발명의 일실시예에 따른 모듈 형 회로소자의 개선된 구성 키트에 적용되는 다른 일례의 회로소자 결합모듈의 구성을 도시한 도면이다. 도 1 내지 도 3에 각각 도시된 바와 같이, 본 발명의 일실시예에 따른 모듈 형 회로소자의 개선된 구성 키트는, 회로소자 블록모듈(100)을 복수로 하여 구성될 수 있으며, 회로소자 결합모듈(200)을 복수로 더 포함하여 구성될 수 있다.1 is a perspective view showing a configuration of an improved configuration kit of a modular circuit device according to an embodiment of the present invention, Figure 2 is an improved configuration kit of a modular circuit device according to an embodiment of the present invention 3 is a diagram illustrating a configuration of a circuit device coupling module applied to the present invention, and FIG. 3 illustrates a configuration of another example circuit device coupling module applied to an improved configuration kit of a modular circuit device according to an embodiment of the present invention. Drawing. As shown in Figures 1 to 3, the improved configuration kit of the modular circuit device according to an embodiment of the present invention, may be configured by a plurality of circuit block module 100, a circuit device coupling The module 200 may further include a plurality.
본 발명의 일실시예에 따른 모듈 형 회로소자의 개선된 구성 키트는, 전자회로를 구성하기 위한 개별 회로소자들을 모듈형태로 구비하는 구성 키트이다. 이러한 모듈 형 회로소자의 개선된 구성 키트는, 기존의 SMD 타입의 경우 수동소자 및 집적IC 타입에서 너무 작아서 실험용으로 사용하기 힘들고, 또한 딥(Deep) 타입의 경우 전선의 연결 및 브레드보드(breadboard)에 꼽거나 할 때 회로의 구성이 까다로운 점, 연결을 위해서는 납땜이나 브레드보드의 커넥터 등 별도의 구성 품이 필요하다는 단점을 극복하고 보다 간단하게 구성할 수 있는 방법을 제시하기 위한 모듈 형의 구성 키트이다.An improved configuration kit of modular circuit elements according to an embodiment of the present invention is a configuration kit having individual circuit elements for forming an electronic circuit in a module form. This improved configuration kit of modular circuitry is too small for passive and integrated IC types for the conventional SMD type, making it difficult to use for experiments, and for the deep type, wire connection and breadboard. Modular configuration kit to overcome the drawbacks of circuit configuration when plugged in, or to provide a simpler configuration that overcomes the disadvantages of requiring separate components such as soldering or breadboard connectors for connection to be.
즉, 본 발명의 일실시예에 따른 모듈 형 회로소자의 개선된 구성 키트는, 작은 집적IC나 저항을 브레드보드 없이 연결 가능한 형태의 모듈을 제시하며, 크기는 사용자의 연령과 사용목적에 따라 다양하게 구성할 수 있도록 한다. 예를 들어, 초등학생의 논리 게이트 이해를 위한 목적으로 사용될 경우에는 아동의 사용 목적상 기구의 형태를 손바닥 크기로 크게 제작하여 게이트를 구성할 수 있는 형태로 제작하여 제공할 수 있으며, 대학생이나 기계 엔지니어의 쉬운 집적회로의 설계인 경우에는 SMD 타입의 소자를 동일한 형태의 구조물로 작게 제작하여 구성하도록 제공할 수도 있다.That is, the improved configuration kit of the modular circuit device according to an embodiment of the present invention, a module of the type that can be connected without a small integrated IC or resistance breadboard, the size varies depending on the user's age and purpose of use To be configured. For example, when it is used for the purpose of understanding the logic gate of elementary school students, it is possible to make and provide the form of the gate by making the shape of the instrument large in the size of the palm for the purpose of use of the child, and can be provided to the university student or mechanical engineer. In the case of the design of an easy integrated circuit of the SMD type device may be provided to be made by making a smaller structure of the same type.
회로소자 블록모듈(100)은, 도 1의 (a)와 (b)에 도시된 바와 같이, 사각 형태의 블록(block) 형상으로 회로소자의 전자부품을 내부에 설치 구성하는 모듈 케이스(110)와, 모듈 케이스(110)의 내부에 설치된 회로소자의 전자부품에 해당하는 회로도가 모듈 케이스(110)의 상부 면과 하부 면 중 어느 하나의 일면에 표시되는 회로도 표시부(120)와, 모듈 케이스(110)의 내부에 설치된 회로소자의 전자부품에 해당하는 실제 회로소자가 모듈 케이스(110)의 상부 면과 하부 면 중 다른 일면에 표시되는 회로소자 표시부(130), 및 모듈 케이스(110)의 4방의 측면 테두리 영역에 근접한 상부 면과 하부 면 각각에 전기적인 연결 접속이 가능하도록 형성되는 결합 접점부(140)를 포함하여 구성될 수 있다.As shown in (a) and (b) of FIG. 1, the circuit device block module 100 includes a module case 110 in which an electronic component of a circuit device is installed in a rectangular block shape. And a circuit diagram display unit 120 in which a circuit diagram corresponding to an electronic component of a circuit element installed in the module case 110 is displayed on either one of an upper surface and a lower surface of the module case 110, and a module case ( The actual circuit element corresponding to the electronic component of the circuit element installed inside the 110 is displayed on the other side of the upper and lower surfaces of the module case 110, and the circuit element display unit 130 and 4 of the module case 110. It may be configured to include a coupling contact portion 140 is formed to enable electrical connection connection to each of the upper and lower surfaces proximate the side edge region of the room.
여기서, 모듈 케이스(110)는 정사각형 또는 직사각형의 블록 형상 중 어느 하나로 구성할 수 있다. 이때, 모듈 케이스(110)를 도 6에 도시된 바와 같이, 직사각형의 블록 형상으로 구성하는 경우에는 도 1에 도시되는 정사각형의 블록 형상에 대해 2배의 크기로 구성함으로써, 1개의 직사각형의 블록에 2개의 정사각형의 블록을 연결할 수 있도록 한다. 또한, 모듈 케이스(110)는 결합 접점부(140)를 제외하고, 플라스틱류와 나무 재질, 및 고무 재질의 군으로부터 선택된 어느 하나의 비전도성 재질로 구성한다. 결합 접점부(140)는 모듈 케이스(110)의 내부에 설치된 회로소자의 전자부품과 전기적으로 연결 접속되는 도전성 재질로서, 자석 부재 또는 걸림쇠 부재 중 어느 하나로 구성할 수 있다. 즉, 회로소자 블록모듈(100)의 모듈 케이스(110)는 상부 면과 하부 면 각각에 4개의 결합 접점부(140)를 구성하여 총 8개의 결합 접점부(140)를 형성하고, 내부에 설치 구성하는 회로소자의 전자부품이 결합 접점부(140)에 전기적으로 연결 접속되도록 한다.Here, the module case 110 may be configured in any one of a square or rectangular block shape. At this time, when the module case 110 is configured as a rectangular block shape, as shown in FIG. 6, the module case 110 is configured to have a size twice that of the square block shape shown in FIG. Allows you to connect two square blocks. In addition, the module case 110 is composed of any non-conductive material selected from the group of plastics, wood, and rubber, except for the coupling contact portion 140. The coupling contact unit 140 is a conductive material electrically connected and connected to an electronic component of a circuit device installed in the module case 110, and may be configured as one of a magnet member and a latch member. That is, the module case 110 of the circuit element block module 100 forms four coupling contact portions 140 on the upper and lower surfaces, respectively, to form a total of eight coupling contact portions 140 and is installed therein. Electronic components of the circuit device to be configured to be electrically connected to the coupling contact portion 140.
또한, 회로소자 블록모듈(100)들은 회로소자의 전자부품으로 저항, 다이오드, 콘덴서, 집적IC, 트랜지스터, 코일, 스위치, 가변저항, LED, 전구, 디스플레이, 스피커 등을 설치 구성할 수 있다.In addition, the circuit block module 100 may be installed to configure the resistor, diode, capacitor, integrated IC, transistor, coil, switch, variable resistor, LED, bulb, display, speaker, etc. as electronic components of the circuit element.
회로소자 결합모듈(200)은, 도 2 및 도 3에 도시된 바와 같이, 회로소자 블록모듈(100)들을 사용한 전자회로 구성 시에 회로소자 블록모듈(100)들을 모듈 단위 형태로 전기적인 연결 접속을 보조하기 위한 도전성 재질로 구성할 수 있다. 여기서, 회로소자 결합모듈(200)은 구성 자체를 도전성 재질로 구성함으로써, 회로소자 블록모듈(100)들을 전기적으로 연결 접속시키는 구성으로 사용될 수 있다. 이러한 회로소자 결합모듈(200)은 모듈 케이스(110)에 형성된 결합 접점부(140)와 전기적인 연결 접속 및 견고한 체결 결합이 가능한 “I자 형태(도 2 참조) 또는 H자 형태(도 3 참조)” 중 어느 하나의 구조로 구성할 수 있다.As shown in FIGS. 2 and 3, the circuit device coupling module 200 electrically connects the circuit device block modules 100 in the form of modules in an electronic circuit configuration using the circuit device block modules 100. It may be composed of a conductive material to assist. Here, the circuit device coupling module 200 may be used as a configuration for electrically connecting and connecting the circuit device block module 100 by configuring the configuration itself with a conductive material. The circuit device coupling module 200 is an “I-shape” (see FIG. 2) or an H-shape (see FIG. 3) capable of electrical connection connection and rigid fastening coupling with the coupling contact portion 140 formed in the module case 110. ) ”Can be configured as either structure.
회로소자 결합모듈(200)을 도 2에 도시된 바와 같이, I자 형태로 구성하는 경우, 모듈 케이스(110)에 형성된 결합 접점부(140)와 전기적인 연결 접속 및 견고한 체결 결합이 가능하도록 각각의 힌지 축(201)을 매개로 좌우로 회전하는 상부 결합 연결부(210) 및 하부 결합 연결부(220)로 구성하고, 상부 결합 연결부(210) 및 하부 결합 연결부(220)에는 결합 접점부(140)에 대응하는 자석 부재 또는 걸림쇠 부재로 구성하는 결합 연결 접점부(230)를 형성하여 구성할 수 있다. 또한, 회로소자 결합모듈(200)은 도 3에 도시된 바와 같이, H자 형태로 구성하는 경우, 모듈 케이스(110)의 상/하부 면에 형성된 결합 접점부(140)와 전기적인 연결 접속 및 견고한 체결 결합이 가능한 상부 결합 연결부(240) 및 하부 결합 연결부(250)를 고정된 형태로 구성하고, 상부 결합 연결부(240)와 하부 결합 연결부(250)에는 결합 접점부(140)에 대응하는 자석 부재 또는 걸림쇠 부재를 쌍으로 구성하는 결합 연결 접점부(260)를 형성하여 구성할 수 있다.As shown in FIG. 2, when the circuit device coupling module 200 is configured in an I-shape, each of the coupling contact portions 140 formed in the module case 110 may be electrically connected and firmly coupled to each other. The upper coupling connecting portion 210 and the lower coupling connecting portion 220 which rotates to the left and right via the hinge shaft 201 of the coupling, the upper coupling connecting portion 210 and the lower coupling connecting portion 220, the coupling contact portion 140 It can be configured to form a coupling connection contact portion 230 composed of a magnet member or a latch member corresponding to the. In addition, the circuit device coupling module 200, as shown in Figure 3, when configured in the H-shape, the electrical connection connection and the coupling contact portion 140 formed on the upper and lower surfaces of the module case 110 and The upper coupling connector 240 and the lower coupling connector 250 that can be firmly coupled and configured in a fixed form, and the upper coupling connector 240 and the lower coupling connector 250 in the magnet corresponding to the coupling contact portion 140 The coupling connection contact portion 260 constituting the member or the latch member in a pair may be formed.
도 1은 회로소자 블록모듈(100)을 나타내는 구성으로, 도 1의 (a)는 회로소자 블록모듈(100)에서 회로도 표시부(120)가 표시되는 구성을 나타내고, 도 1의 (b)는 회로소자 블록모듈(100)에서 회로도 표시부(120)의 반대 일면인 회로소자 표시부(130)가 표시되는 구성을 나타낸다. 도 2는 회로소자 결합모듈(200)을 나타내는 구성으로, 도 2의 (a)는 I자 형태의 회로소자 결합모듈(200)을 나타내고, 도 2의 (b)는 I자 형태의 회로소자 결합모듈(200)이 회전하는 동작의 구성을 나타낸다. 도 3은 회로소자 결합모듈(200)의 다른 일례를 나타내는 구성으로, 도 3의 (a)는 H자 형태의 회로소자 결합모듈(200)을 나타내고, 도 3의 (b)는 H자 형태의 회로소자 결합모듈(200)의 고정된 형태의 사시도 구성을 나타낸다.FIG. 1 is a diagram illustrating a circuit device block module 100, and FIG. 1A illustrates a configuration in which a circuit diagram display unit 120 is displayed in a circuit device block module 100, and FIG. In the device block module 100, the circuit device display unit 130, which is the opposite side of the circuit diagram display unit 120, is displayed. Figure 2 is a configuration showing a circuit device coupling module 200, Figure 2 (a) shows a circuit device coupling module 200 of the I-shape, Figure 2 (b) is a circuit device coupling of the I-shape The configuration of the operation in which the module 200 rotates is shown. Figure 3 is a configuration showing another example of the circuit element coupling module 200, Figure 3 (a) shows the H-shaped circuit element coupling module 200, Figure 3 (b) is of the H-shape It shows a perspective configuration of a fixed form of the circuit element coupling module 200.
도 4는 본 발명의 일실시예에 따른 모듈 형 회로소자의 개선된 구성 키트에 I자 형태의 회로소자 결합모듈을 사용하는 구성을 도시한 도면이고, 도 5는 본 발명의 일실시예에 따른 모듈 형 회로소자의 개선된 구성 키트에 H자 형태의 회로소자 결합모듈을 사용하는 구성을 도시한 도면이며, 도 6은 본 발명의 일실시예에 따른 모듈 형 회로소자의 개선된 구성 키트의 직사각형 형태의 모듈 구성을 도시한 도면이다. 도 4는 2개의 회로소자 블록모듈(100)들 간에 I자 형태의 회로소자 결합모듈(200)의 상부 결합 연결부(210)와 하부 결합 연결부(220)가 각각 반대 방향으로 회전되어 2개의 회로소자 블록모듈(100)을 전기적으로 연결 접속하고, 견고하게 체결시키기 위한 체결 구성의 과정을 나타낸다. 도 5는 2개의 회로소자 블록모듈(100)들 간에 H자 형태의 회로소자 결합모듈(200)에 고정된 상태로 형성되는 상부 결합 연결부(240)와 하부 결합 연결부(250)가 2개의 회로소자 블록모듈(100)을 전기적으로 연결 접속하고, 견고하게 체결시키기 위한 체결 구성의 과정을 나타낸다. 도 6은 정사각형의 회로소자 블록모듈(100)의 2배의 크기로 형성되는 직사각형의 회로소자 블록모듈(100)의 구성 일례를 나타낸다.4 is a diagram illustrating a configuration of using an I-shaped circuit device coupling module in an improved configuration kit of a modular circuit device according to an embodiment of the present invention, and FIG. 5 is in accordance with an embodiment of the present invention. FIG. 6 is a view illustrating a configuration using an H-shaped circuit coupling module in an improved configuration kit of a modular circuit device, and FIG. 6 is a rectangle of an improved configuration kit of a modular circuit device according to an embodiment of the present invention. It is a figure which shows the module structure of a form. FIG. 4 illustrates that two circuit elements are rotated in opposite directions between the upper coupling connection part 210 and the lower coupling connection part 220 of the I-shaped circuit device coupling module 200 between the two circuit device block modules 100. It shows the process of the fastening configuration for electrically connecting and connecting the block module 100, and firmly fastened. 5 shows an upper coupling connector 240 and a lower coupling connector 250 formed in a state of being fixed to an H-shaped circuit coupling module 200 between two circuit element block modules 100. It shows the process of the fastening configuration for electrically connecting and connecting the block module 100, and firmly fastened. 6 shows an example of the configuration of a rectangular circuit element block module 100 that is formed twice as large as the square circuit element block module 100.
도 7은 본 발명의 다른 실시예에 따른 모듈 형 회로소자의 개선된 구성 키트의 사시도 구성을 도시한 도면이고, 도 8은 본 발명의 다른 실시예에 따른 모듈 형 회로소자의 개선된 구성 키트의 분해사시도 구성을 도시한 도면이다. 도 7 및 도 8에 도시된 바와 같이, 본 발명의 다른 실시예에 따른 모듈 형 회로소자의 개선된 구성 키트는, 회로소자 블록모듈(300)을 복수로 하여 구성될 수 있다.7 is a perspective view showing an improved configuration kit of a modular circuit device according to another embodiment of the present invention, and FIG. 8 is an improved configuration kit of a modular circuit device according to another embodiment of the present invention. Figure is an exploded perspective view showing the configuration. As shown in Figures 7 and 8, the improved configuration kit of a modular circuit device according to another embodiment of the present invention, may be configured by a plurality of circuit block module 300.
회로소자 블록모듈(300)은, 도 7 및 도 8에 도시된 바와 같이, 사각 형태의 블록(block) 형상으로 회로소자의 전자부품을 내부에 설치 구성하는 모듈 케이스(310)와, 모듈 케이스(310)의 내부에 설치된 회로소자의 전자부품에 해당하는 회로도가 모듈 케이스(310)의 상부 면과 하부 면 중 어느 하나의 일면에 표시되는 회로도 표시부(320)와, 모듈 케이스(310)의 내부에 설치된 회로소자의 전자부품에 해당하는 실제 회로소자가 모듈 케이스(310)의 상부 면과 하부 면 중 다른 일면에 표시되는 회로소자 표시부(330), 및 모듈 케이스(310)의 4방의 측면 테두리(311)에 설치되어, 전자회로를 구성하기 위한 다른 회로소자 블록모듈(300)과 전기적인 연결 접속이 가능하도록 하는 자석 결합 접점부(340)를 포함하여 구성될 수 있다.As shown in FIGS. 7 and 8, the circuit device block module 300 may include a module case 310 and an electronic module case in which an electronic component of a circuit device is installed in a rectangular block shape. The circuit diagram corresponding to the electronic component of the circuit device installed inside the 310 is displayed on either one of the upper and lower surfaces of the module case 310 and the inside of the module case 310 and the circuit diagram display unit 320. The circuit element display unit 330 in which the actual circuit element corresponding to the electronic component of the installed circuit element is displayed on the other side of the upper and lower surfaces of the module case 310, and the four side edges 311 of the module case 310. It is installed in the), it may be configured to include a magnetic coupling contact portion 340 to enable the electrical connection connection with the other circuit element block module 300 for configuring the electronic circuit.
여기서, 모듈 케이스(310)는 정사각형 또는 직사각형의 블록 형상 중 어느 하나로 구성할 수 있다. 이때, 모듈 케이스(310)는 앞서 설명한 바 있는 본 발명의 일실시예에 따른 모듈 케이스(110)(도 6 참조)와 같이 직사각형의 블록 형상으로 구성하는 경우에는 정사각형의 블록 형상에 대해 2배의 크기로 구성함으로써, 1개의 직사각형의 블록에 2개의 정사각형의 블록을 연결할 수 있도록 한다. 모듈 케이스(310)는 자석 결합 접점부(340)를 제외하고, 플라스틱류와 나무 재질, 및 고무 재질의 군으로부터 선택된 어느 하나의 비전도성 재질로 구성한다. 모듈 케이스(310)는 모듈 케이스(310)의 4방의 측면 테두리(311) 영역의 상부 면과 하부 면의 각각에 한 쌍의 테두리 연결체 홈부(312)를 더 형성하고, 자석 결합 접점부(340)에 의해 복수의 모듈 케이스(310)가 연결 접속됨에 따라 테두리 연결체 홈부(312)가 하나의 완성된 연결 홈부를 형성하게 되고, 연결 홈부에 탄성 연결체(313)가 삽입 체결되어 복수의 모듈 케이스(310)가 견고하게 고정되도록 할 수 있다. 여기서, 탄성 연결체(313)는 도 9에 도시된 연결체 제거 도구(350)에 의해 분리되어 제거될 수 있도록 상부에 한 쌍의 분리 제거 홈(314)을 더 형성하여 구성된다.Here, the module case 310 may be configured in any one of a square or rectangular block shape. In this case, when the module case 310 is configured in a rectangular block shape, such as the module case 110 (see FIG. 6) according to an embodiment of the present invention as described above, the module case 310 is twice as large as the square block shape. By configuring the size, it is possible to connect two square blocks to one rectangular block. The module case 310 is formed of any non-conductive material selected from the group of plastics, wood, and rubber, except for the magnet coupling contact 340. The module case 310 further forms a pair of edge connector grooves 312 in each of the upper and lower surfaces of the four side edge 311 regions of the module case 310, and the magnet coupling contact portion 340. As the plurality of module cases 310 are connected and connected to each other, the edge connector groove 312 forms one completed connection groove, and the elastic connector 313 is inserted into and coupled to the connection groove to form a plurality of modules. The case 310 may be firmly fixed. Here, the elastic connector 313 is configured by further forming a pair of separation removal grooves 314 on the top to be separated and removed by the connector removal tool 350 shown in FIG.
자석 결합 접점부(340)는 모듈 케이스(310)의 내부에 설치된 회로소자의 전자부품과 전기적으로 연결 접속될 수 있다. 이러한 자석 결합 접점부(340)는 모듈 케이스(310)의 4방의 측면 테두리(311)에 각각 설치하되, 상하 및 좌우의 대칭에 대응하여 하나는 홈으로 구성하고, 다른 하나는 돌기로 구성할 수 있다. 이때, 홈 및 돌기로 구성되는 자석 결합 접점부(340)는 적어도 하나는 자석 부재이고, 나머지 다른 하나는 자석 부재와 부착될 수 있는 철 부재로 구성한다.The magnet coupling contact 340 may be electrically connected to an electronic component of a circuit device installed in the module case 310. The magnet coupling contact portion 340 is installed on each of the four side edges 311 of the module case 310, one corresponding to the top and bottom and left and right symmetry can be configured as a groove, the other can be configured as a projection have. At this time, at least one magnet coupling contact portion 340 composed of a groove and a protrusion is a magnet member, and the other is composed of an iron member that can be attached to the magnet member.
회로소자 블록모듈(300)들은 앞서 설명한 바 있는 본 발명의 일실시예에 따른 회로소자 블록모듈(100)들과 같이, 회로소자의 전자부품으로 저항, 다이오드, 콘덴서, 집적IC, 트랜지스터, 코일, 스위치, 가변저항, LED, 전구, 디스플레이, 스피커 등을 설치 구성할 수 있다.The circuit block module 300 is an electronic component of a circuit device, such as the circuit block module 100 according to an embodiment of the present invention described above, a resistor, a diode, a capacitor, an integrated IC, a transistor, a coil, Switch, potentiometer, LED, bulb, display, speaker, etc. can be installed and configured.
도 9는 본 발명의 다른 실시예에 따른 모듈 형 회로소자의 개선된 구성 키트에 적용되는 부가 구성을 도시한 도면이고, 도 10은 본 발명의 다른 실시예에 따른 모듈 형 회로소자의 개선된 구성 키트의 연결 구성의 일례를 도시한 도면이다. 도 9의 (a)는 연결체 제거 도구(350)의 구성 일례를 나타내고, 도 9의 (b)는 모듈 케이스(310)의 테두리 연결체 홈부(312)에 삽입 체결되기 위한 탄성 연결체(313)의 구성을 나타내며, 도 9의 (c)는 모듈 케이스(310)의 4방의 측면 테두리(311)에 설치되는 자석 결합 접점부(340)의 구성을 나타낸다. 도 10은 회로도 표시부(320)와 회로소자 표시부(330)의 표시가 생략된 복수의 회로소자 블록모듈(300)들 간의 전기적 연결 접속 및 견고한 체결 상태를 유지하는 회로실험을 위한 전자회로의 구성을 나타낸다.9 is a view showing an additional configuration applied to an improved configuration kit of a modular circuit device according to another embodiment of the present invention, Figure 10 is an improved configuration of a modular circuit device according to another embodiment of the present invention It is a figure which shows an example of the connection structure of a kit. FIG. 9A illustrates an example of the structure of the connector removing tool 350. FIG. 9B illustrates an elastic connector 313 for inserting and fastening into the edge connector groove 312 of the module case 310. Referring to FIG. (C) of FIG. 9 shows the configuration of the magnet coupling contact portion 340 provided at the four side edges 311 of the module case 310. FIG. 10 illustrates a configuration of an electronic circuit for a circuit experiment maintaining a tight coupling state and an electrical connection between a plurality of circuit block modules 300 in which the display of the circuit diagram display unit 320 and the circuit element display unit 330 is omitted. Indicates.
상술한 바와 같은 본 발명에 따른 모듈 형 회로소자의 개선된 구성 키트는, 회로소자 블록모듈의 외형이 정사각형 또는 직사각형의 단순한 블록 형상으로 구성되어, 외형 제작이 용이하고 블록의 확장성이 향상되며, 블록의 결합에 있어서도 재미를 높여 학습자의 흥미 유발이 향상되고, 모듈들 간의 결합 및 분리가 용이하게 이루어질 수 있도록 할 수 있다. 특히, 회로소자 블록모듈들 간의 결합을 다양한 체결 방식으로 구현하고 분리 및 결합이 용이하게 이루어지도록 함으로써, 다양한 회로실험을 위한 전자회로의 구성 시간이 단축되고, 학습의 효과가 향상될 수 있도록 할 수 있다.The improved configuration kit of the modular circuit device according to the present invention as described above, the external shape of the circuit block module is composed of a simple block shape of square or rectangular, so that the appearance is easy to manufacture and the expandability of the block is improved, Also, in the combination of blocks, the fun can be enhanced to increase the interest of the learner, and the combination and separation between the modules can be easily performed. In particular, by implementing the coupling between the circuit element block modules in a variety of fastening method and to facilitate the separation and coupling, the configuration time of the electronic circuit for a variety of circuit experiments can be shortened, the effect of learning can be improved have.
이상 설명한 본 발명은 본 발명이 속한 기술분야에서 통상의 지식을 가진 자에 의하여 다양한 변형이나 응용이 가능하며, 본 발명에 따른 기술적 사상의 범위는 아래의 특허청구범위에 의하여 정해져야 할 것이다.The present invention described above may be variously modified or applied by those skilled in the art, and the scope of the technical idea according to the present invention should be defined by the following claims.

Claims (15)

  1. 전자회로를 구성하기 위한 개별 회로소자들을 모듈형태로 구비하는 모듈 형 회로소자의 개선된 구성 키트로서, 각각의 회로소자 블록모듈(100)들은,An improved configuration kit of modular circuitry having individual circuitry for building electronic circuits in a modular form, wherein each circuitry block module 100 comprises:
    사각 형태의 블록(block) 형상으로 회로소자의 전자부품을 내부에 설치 구성하는 모듈 케이스(110);A module case 110 for installing and configuring electronic components of a circuit device in a block shape having a rectangular shape;
    상기 모듈 케이스(110)의 내부에 설치된 회로소자의 전자부품에 해당하는 회로도가 상기 모듈 케이스(110)의 상부 면과 하부 면 중 어느 하나의 일면에 표시되는 회로도 표시부(120);A circuit diagram display unit 120 in which a circuit diagram corresponding to an electronic component of a circuit element installed in the module case 110 is displayed on any one of an upper surface and a lower surface of the module case 110;
    상기 모듈 케이스(110)의 내부에 설치된 회로소자의 전자부품에 해당하는 실제 회로소자가 상기 모듈 케이스(110)의 상부 면과 하부 면 중 다른 일면에 표시되는 회로소자 표시부(130); 및A circuit device display unit 130 on which an actual circuit device corresponding to an electronic component of a circuit device installed in the module case 110 is displayed on the other surface of the upper and lower surfaces of the module case 110; And
    상기 모듈 케이스(110)의 4방의 측면 테두리 영역에 근접한 상부 면과 하부 면 각각에 전기적인 연결 접속이 가능하도록 형성되는 결합 접점부(140)를 포함하는 것을 특징으로 하는, 모듈 형 회로소자의 개선된 구성 키트.Improved modular circuitry, characterized in that it comprises a coupling contact portion 140 is formed to enable electrical connection connection to each of the upper and lower surfaces close to the four side edge regions of the module case 110 Configuration kit.
  2. 제1항에 있어서, 상기 모듈 케이스(110)는,The method of claim 1, wherein the module case 110,
    정사각형 또는 직사각형의 블록 형상 중 어느 하나로 구성하는 것을 특징으로 하는, 모듈 형 회로소자의 개선된 구성 키트.An improved configuration kit for modular circuitry, characterized in that it consists of either a square or rectangular block shape.
  3. 제2항에 있어서, 상기 모듈 케이스(110)는,The method of claim 2, wherein the module case 110,
    상기 결합 접점부(140)를 제외하고, 플라스틱류와 나무 재질, 및 고무 재질의 군으로부터 선택된 어느 하나의 비전도성 재질로 구성하는 것을 특징으로 하는, 모듈 형 회로소자의 개선된 구성 키트.Except for the coupling contact portion 140, characterized in that composed of any non-conductive material selected from the group of plastics, wood, and rubber, improved component kit of modular circuitry.
  4. 제1항에 있어서, 상기 결합 접점부(140)는,The method of claim 1, wherein the coupling contact portion 140,
    상기 모듈 케이스(110)의 내부에 설치된 회로소자의 전자부품과 전기적으로 연결 접속되는 도전성 재질로서, 자석 부재 또는 걸림쇠 부재 중 어느 하나로 구성하는 것을 특징으로 하는, 모듈 형 회로소자의 개선된 구성 키트.An electrically conductive material electrically connected to and connected to an electronic component of a circuit device installed in the module case 110, characterized in that it is composed of any one of a magnet member or a latch member, improved configuration kit of a modular circuit device.
  5. 제1항 내지 제4항 중 어느 한 항에 있어서,The method according to any one of claims 1 to 4,
    상기 회로소자 블록모듈(100)들을 사용한 전자회로 구성 시에 상기 회로소자 블록모듈(100)들을 모듈 단위 형태로 전기적인 연결 접속을 보조하기 위한 도전성 재질로 구성하는 회로소자 결합모듈(200)들을 더 포함하여 구성하는 것을 특징으로 하는, 모듈 형 회로소자의 개선된 구성 키트.In the electronic circuit configuration using the circuit block module 100, the circuit element coupling module 200 further comprises a circuit board block module 100 made of a conductive material to assist the electrical connection connection in the form of a module unit Improved configuration kit of modular circuitry, characterized in that comprising a.
  6. 제5항에 있어서, 상기 회로소자 결합모듈(200)은,According to claim 5, The circuit device coupling module 200,
    상기 모듈 케이스(110)에 형성된 결합 접점부(140)와 전기적인 연결 접속 및 견고한 체결 결합이 가능한 “I자 형태 또는 H자 형태” 중 어느 하나의 구조로 구성하는 것을 특징으로 하는, 모듈 형 회로소자의 개선된 구성 키트.Modular circuit, characterized in that configured in any one of the structure of the "I-shaped or H-shaped" that can be electrically connected to the coupling contact portion 140 formed in the module case 110 and firmly coupled coupling Improved configuration kit for the device.
  7. 제6항에 있어서, 상기 회로소자 결합모듈(200)은,According to claim 6, The circuit device coupling module 200,
    I자 형태로 구성되는 경우, 상기 모듈 케이스(110)에 형성된 결합 접점부(140)와 전기적인 연결 접속 및 견고한 체결 결합이 가능하도록 각각의 힌지 축(201)을 매개로 좌우로 회전하는 상부 결합 연결부(210) 및 하부 결합 연결부(220)를 구성하고, 상기 상부 결합 연결부(210) 및 하부 결합 연결부(220)에는 상기 결합 접점부(140)에 대응하는 자석 부재 또는 걸림쇠 부재로 구성하는 결합 연결 접점부(230)를 형성하는 것을 특징으로 하는, 모듈 형 회로소자의 개선된 구성 키트.When configured in an I-shape, the upper coupling rotates to the left and right through each hinge axis 201 to enable the electrical connection connection and a rigid fastening coupling with the coupling contact portion 140 formed in the module case 110 The coupling portion 210 and the lower coupling coupling portion 220, the upper coupling coupling portion 210 and the lower coupling coupling portion 220 is a coupling connection composed of a magnet member or a latch member corresponding to the coupling contact portion 140 An improved configuration kit for modular circuitry, characterized in that it forms a contact portion (230).
  8. 제6항에 있어서, 상기 회로소자 결합모듈(200)은,According to claim 6, The circuit device coupling module 200,
    H자 형태로 구성되는 경우, 상기 모듈 케이스(110)의 상/하부 면에 형성된 결합 접점부(140)와 전기적인 연결 접속 및 견고한 체결 결합이 가능한 상부 결합 연결부(240) 및 하부 결합 연결부(250)를 고정된 형태로 구성하고, 상기 상부 결합 연결부(240)와 하부 결합 연결부(250)에는 상기 결합 접점부(140)에 대응하는 자석 부재 또는 걸림쇠 부재를 쌍으로 구성하는 결합 연결 접점부(260)를 형성하는 것을 특징으로 하는, 모듈 형 회로소자의 개선된 구성 키트.When configured in the H-shape, the upper coupling connector 240 and the lower coupling connector 250 capable of electrical connection connection and rigid coupling coupling with the coupling contact portion 140 formed on the upper / lower surfaces of the module case 110 ) Is formed in a fixed form, and the upper coupling connection part 240 and the lower coupling connection part 250 are coupled connection contact parts 260 constituting a pair of magnet members or clasp members corresponding to the coupling contact part 140. An improved configuration kit for modular circuitry, characterized in that
  9. 전자회로를 구성하기 위한 개별 회로소자들을 모듈형태로 구비하는 모듈 형 회로소자의 개선된 구성 키트로서, 각각의 회로소자 블록모듈(300)들은,An improved configuration kit of modular circuitry having individual circuitry for forming electronic circuitry in a modular form, wherein each circuitry block module 300 comprises:
    사각 형태의 블록(block) 형상으로 회로소자의 전자부품을 내부에 설치 구성하는 모듈 케이스(310);A module case 310 in which an electronic component of a circuit device is installed and configured in a block shape having a square shape;
    상기 모듈 케이스(310)의 내부에 설치된 회로소자의 전자부품에 해당하는 회로도가 상기 모듈 케이스(310)의 상부 면과 하부 면 중 어느 하나의 일면에 표시되는 회로도 표시부(320);A circuit diagram display unit 320 in which a circuit diagram corresponding to an electronic component of a circuit element installed in the module case 310 is displayed on any one of an upper surface and a lower surface of the module case 310;
    상기 모듈 케이스(310)의 내부에 설치된 회로소자의 전자부품에 해당하는 실제 회로소자가 상기 모듈 케이스(310)의 상부 면과 하부 면 중 다른 일면에 표시되는 회로소자 표시부(330); 및A circuit device display unit 330 in which an actual circuit device corresponding to an electronic component of a circuit device installed in the module case 310 is displayed on the other surface of the upper and lower surfaces of the module case 310; And
    상기 모듈 케이스(310)의 4방의 측면 테두리(311)에 설치되어, 전자회로를 구성하기 위한 다른 회로소자 블록모듈(300)과 전기적인 연결 접속이 가능하도록 하는 자석 결합 접점부(340)를 포함하는 것을 특징으로 하는, 모듈 형 회로소자의 개선된 구성 키트.It is installed on the four side edges 311 of the module case 310, and includes a magnetic coupling contact portion 340 to enable electrical connection connection with other circuit element block module 300 for constituting an electronic circuit. An improved configuration kit for modular circuitry.
  10. 제9항에 있어서, 상기 모듈 케이스(310)는,The method of claim 9, wherein the module case 310,
    정사각형 또는 직사각형의 블록 형상 중 어느 하나로 구성하는 것을 특징으로 하는, 모듈 형 회로소자의 개선된 구성 키트.An improved configuration kit for modular circuitry, characterized in that it consists of either a square or rectangular block shape.
  11. 제10항에 있어서, 상기 모듈 케이스(310)는,The method of claim 10, wherein the module case 310,
    상기 자석 결합 접점부(340)를 제외하고, 플라스틱류와 나무 재질, 및 고무 재질의 군으로부터 선택된 어느 하나의 비전도성 재질로 구성하는 것을 특징으로 하는, 모듈 형 회로소자의 개선된 구성 키트.Except for the magnetic coupling contact portion (340), characterized in that composed of any non-conductive material selected from the group of plastics, wood, and rubber, improved component kit of modular circuitry.
  12. 제11항에 있어서, 상기 모듈 케이스(310)는,The method of claim 11, wherein the module case 310,
    상기 모듈 케이스(310)의 4방의 측면 테두리(311) 영역의 상부 면과 하부 면의 각각에 한 쌍의 테두리 연결체 홈부(312)를 더 형성하고,A pair of edge connector grooves 312 are further formed in each of the upper and lower surfaces of the four side edge 311 regions of the module case 310,
    상기 자석 결합 접점부(340)에 의해 복수의 모듈 케이스(310)가 연결 접속됨에 따라 상기 테두리 연결체 홈부(312)가 하나의 완성된 연결 홈부를 형성하게 되고, 상기 연결 홈부에 탄성 연결체(313)가 삽입 체결되어 복수의 모듈 케이스(310)가 견고하게 고정되도록 하는 것을 특징으로 하는, 모듈 형 회로소자의 개선된 구성 키트.As the plurality of module cases 310 are connected and connected by the magnet coupling contact portion 340, the edge connector groove 312 forms one completed connection groove, and the elastic connection body is formed in the connection groove. 313 is inserted and fastened so that the plurality of module cases 310 is firmly fixed, improved configuration kit of modular circuitry.
  13. 제12항에 있어서, 상기 탄성 연결체(313)는,The method of claim 12, wherein the elastic connector 313,
    연결체 제거 도구(350)에 의해 분리되어 제거될 수 있도록 상부에 한 쌍의 분리 제거 홈(314)을 더 형성하는 것을 특징으로 하는, 모듈 형 회로소자의 개선된 구성 키트.And further forming a pair of disconnection removal grooves (314) thereon to be separated and removed by the connector removal tool (350).
  14. 제11항에 있어서, 상기 자석 결합 접점부(340)는,The method of claim 11, wherein the magnetic coupling contact portion 340,
    상기 모듈 케이스(310)의 4방의 측면 테두리(311)에 각각 설치하되, 상하 및 좌우의 대칭에 대응하여 하나는 홈으로 구성하고, 다른 하나는 돌기로 구성하는 것을 특징으로 하는, 모듈 형 회로소자의 개선된 구성 키트.The module case 310 is installed on each of the four side edges 311, one corresponding to the top and bottom and left and right symmetry, characterized in that composed of a groove, the other is composed of a projection, modular circuit element Improved configuration kit.
  15. 제14항에 있어서, 상기 자석 결합 접점부(340)는,The method of claim 14, wherein the magnetic coupling contact portion 340,
    홈 및 돌기로 구성하되, 적어도 하나는 자석 부재이고, 나머지 다른 하나는 자석 부재와 부착될 수 있는 철 부재로 구성하는 것을 특징으로 하는, 모듈 형 회로소자의 개선된 구성 키트.An improved configuration kit for modular circuitry, characterized in that it comprises a groove and a projection, at least one of which is a magnet member, and the other of which is an iron member that can be attached to the magnet member.
PCT/KR2014/007415 2013-10-11 2014-08-08 Improved construction kit of modular circuit elements WO2015053469A1 (en)

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