KR200452471Y1 - Embossing jig - Google Patents
Embossing jig Download PDFInfo
- Publication number
- KR200452471Y1 KR200452471Y1 KR2020100000880U KR20100000880U KR200452471Y1 KR 200452471 Y1 KR200452471 Y1 KR 200452471Y1 KR 2020100000880 U KR2020100000880 U KR 2020100000880U KR 20100000880 U KR20100000880 U KR 20100000880U KR 200452471 Y1 KR200452471 Y1 KR 200452471Y1
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- KR
- South Korea
- Prior art keywords
- jig
- embossing
- plate
- groove
- hemispherical shape
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention relates to an embossing jig, and looking at the features of the configuration, jig plate 10; The first jig groove 22 recessed in a hemispherical shape on one surface of the jig plate 10 and the bottom surface of the jig plate 10 corresponding to the first jig groove 22 is formed in a hemispherical shape. And a perforation 20 having a second jig groove 24 in which the jig hole 26 is formed in communication with the first jig groove 22.
Accordingly, the subject innovation is that the first and second jig grooves of the hemispherical shape are formed to be symmetrical with each other in the form of an hourglass, so that the spray projections are formed in the hemispherical shape during the thermal spraying process, so that the embossing jig can be easily separated after the thermal spraying process. The peeling phenomenon of the embossing protrusion due to the friction with the perforation is prevented.
Description
The present invention relates to an embossing jig, and more particularly, to an embossing jig for forming a thermal spray projection on an electrode plate of an embossing type used for stably fixing an array substrate in a TFT manufacturing process.
The electrode plate is a device that is installed on a plasma source, which is an etchinger and a CVD equipment used for manufacturing a thin film transistor (TFT), to stably fix an object such as a glass substrate. Plane type that controls the contact area with the object to be processed according to the shape of the contact surface, trench type that repeatedly constitutes the valleys and valleys at regular intervals on the contact surface, and forms a plurality of fine protrusions on the contact surface It is divided into emboss type.
For example, the electrode plate of the embossed type has only a small part of the projection contacting the workpiece, so that the contact area is minimized to prevent slippage of the workpiece, and the overall flatness and load uniformity are maintained while the workpiece is fixed. It is characterized by the fact that the workpiece is not easily contaminated due to the dispersion effect and the depressions between the protrusions.
However, conventionally, the embossing type electrode plate is manufactured by integrally forming the embossing protrusion on the body, and then subjecting the surface to ceramic spray treatment. Although the upper surface of the electrode plate is regenerated by ceramic thermal spraying after cutting a part of the electrode plate, when the electrode plate is regenerated and used several times, the conventional thermally sprayed ceramic layer is not completely removed, and the ceramic thermally thermally sprayed again with some remaining state. When the regeneration operation is repeated about 10 times, the spray thickness gradually becomes thick, and the number of times that the electrode plate can be reproduced and used is extremely limited due to the phenomenon that the embossing projection is relatively small.
In addition, if the blasting process is wrong, not only the ceramic thermal spray layer but also the protrusions formed on the body are cut and damaged, and in particular, even if only some of the protrusions are damaged, it is impossible to repair locally, and thus, the body must be newly manufactured. In addition, when the electrode plate is newly manufactured, cylindrical embossing protrusions must be formed by cutting processing using equipment such as a machining center, resulting in a decrease in workability and productivity, resulting in a rise in manufacturing cost.
Accordingly, the present applicant forms a projection layer on the electrode plate body using the embossing jig in Patent Registration No. 10-0908227, so that the electrode plate body is not replaced as a whole even if the embossing projection is deformed or damaged by several regeneration operations. The new embossing protrusions can be easily formed and semi-permanently extended, and in particular, even if the embossing protrusions are locally damaged, the damaged parts can be partially repaired. have.
However, embossing jig has a lot of problems in manufacturing and use as perforations are mainly formed through the cutting process on the jig plate.
First, the manufacturing cost is increased along with the delay in processing time due to cutting tens of thousands to hundreds of thousands of perforations.
Second, as the upper and lower diameters of the perforations are formed uniformly, as shown in FIG. 4, after the thermal spraying process, the perforations and the
The present invention has been devised to solve the above problems, and relates to an embossing jig that is easy to separate after the thermal spray treatment, as well as peeling of the thermal spray projections due to friction with the perforations and thermal expansion of the jig plate.
Features of the present invention to achieve this purpose, the
At this time, the
In addition, the first and
According to the above configuration and action, the present invention is formed so that the first and second jig grooves of the hemispherical shape are symmetrical with each other in the form of an hourglass, so that the spraying projections are formed in the hemispherical shape during the thermal spraying treatment, so that the embossing jig is separated after the thermal spraying treatment. Easily, of course, there is an effect that the peeling phenomenon of the embossing projections due to friction with the perforation is prevented.
1 is a configuration diagram showing an overall embossing jig according to the present invention.
Figure 2 is a block diagram showing a process of forming a perforation of the embossing jig according to the present invention.
Figure 3 is a block diagram showing a state of use of the embossing jig according to the present invention.
4 is a configuration diagram showing a conventional embossing jig.
Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.
The present invention relates to an embossing jig, wherein the embossing jig passes through a plurality of perforations formed through the sprayed ceramic particles to form embossed protrusions on the upper surface of the electrostatic chuck body, and the embossing jig is easily removed after the spraying process. In order to prevent the peeling phenomenon of the
In addition, the
In the non-corrosive etching process, the
In other words, as shown in (a) of FIG. 2, after the anticorrosive etching treatment is performed on the remaining portions except for the portions where the first and
Accordingly, as shown in FIG. 3, the
10: jig board 20: perforation
Claims (3)
The first jig groove 22 recessed in a hemispherical shape on one surface of the jig plate 10 and the bottom surface of the jig plate 10 corresponding to the first jig groove 22 is formed in a hemispherical shape. Embossing jig, characterized in that it comprises; a perforation (20) is provided with a second jig groove (24) in communication with the first jig groove (22) is formed a jig hole (26).
The jig plate 10 is embossed jig, characterized in that formed of a copper material having a thickness of 0.3 ~ 1mm.
The first and second jig grooves (22) and (24) are embossed jig, characterized in that formed by etching the etching (Etching) on both sides of the jig plate (10).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2020100000880U KR200452471Y1 (en) | 2010-01-26 | 2010-01-26 | Embossing jig |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2020100000880U KR200452471Y1 (en) | 2010-01-26 | 2010-01-26 | Embossing jig |
Publications (1)
Publication Number | Publication Date |
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KR200452471Y1 true KR200452471Y1 (en) | 2011-03-03 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR2020100000880U KR200452471Y1 (en) | 2010-01-26 | 2010-01-26 | Embossing jig |
Country Status (1)
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KR (1) | KR200452471Y1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111599746A (en) * | 2020-07-27 | 2020-08-28 | 西安奕斯伟硅片技术有限公司 | Susceptor, apparatus and method for epitaxial growth of wafer |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004111933A (en) | 2002-09-17 | 2004-04-08 | Hewlett-Packard Development Co Lp | Embossing mask lithography |
KR20050064912A (en) * | 2003-12-24 | 2005-06-29 | 재단법인 포항산업과학연구원 | Improvement in chuck device for treating semiconductor wafer utilizing ceamic thermal spray coating |
KR20060081562A (en) * | 2005-01-10 | 2006-07-13 | (주)엔트로피 | Method for manufacturing of electro-static chuck |
KR100908227B1 (en) | 2008-01-28 | 2009-07-20 | (주)코리아스타텍 | Electrostatic chuck reproducing method of tft fabrication equipment |
-
2010
- 2010-01-26 KR KR2020100000880U patent/KR200452471Y1/en active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004111933A (en) | 2002-09-17 | 2004-04-08 | Hewlett-Packard Development Co Lp | Embossing mask lithography |
KR20050064912A (en) * | 2003-12-24 | 2005-06-29 | 재단법인 포항산업과학연구원 | Improvement in chuck device for treating semiconductor wafer utilizing ceamic thermal spray coating |
KR20060081562A (en) * | 2005-01-10 | 2006-07-13 | (주)엔트로피 | Method for manufacturing of electro-static chuck |
KR100908227B1 (en) | 2008-01-28 | 2009-07-20 | (주)코리아스타텍 | Electrostatic chuck reproducing method of tft fabrication equipment |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111599746A (en) * | 2020-07-27 | 2020-08-28 | 西安奕斯伟硅片技术有限公司 | Susceptor, apparatus and method for epitaxial growth of wafer |
CN111599746B (en) * | 2020-07-27 | 2020-10-30 | 西安奕斯伟硅片技术有限公司 | Susceptor, apparatus and method for epitaxial growth of wafer |
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