KR200452471Y1 - Embossing jig - Google Patents

Embossing jig Download PDF

Info

Publication number
KR200452471Y1
KR200452471Y1 KR2020100000880U KR20100000880U KR200452471Y1 KR 200452471 Y1 KR200452471 Y1 KR 200452471Y1 KR 2020100000880 U KR2020100000880 U KR 2020100000880U KR 20100000880 U KR20100000880 U KR 20100000880U KR 200452471 Y1 KR200452471 Y1 KR 200452471Y1
Authority
KR
South Korea
Prior art keywords
jig
embossing
plate
groove
hemispherical shape
Prior art date
Application number
KR2020100000880U
Other languages
Korean (ko)
Inventor
김영곤
Original Assignee
(주)코리아스타텍
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)코리아스타텍 filed Critical (주)코리아스타텍
Priority to KR2020100000880U priority Critical patent/KR200452471Y1/en
Application granted granted Critical
Publication of KR200452471Y1 publication Critical patent/KR200452471Y1/en

Links

Images

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Abstract

The present invention relates to an embossing jig, and looking at the features of the configuration, jig plate 10; The first jig groove 22 recessed in a hemispherical shape on one surface of the jig plate 10 and the bottom surface of the jig plate 10 corresponding to the first jig groove 22 is formed in a hemispherical shape. And a perforation 20 having a second jig groove 24 in which the jig hole 26 is formed in communication with the first jig groove 22.
Accordingly, the subject innovation is that the first and second jig grooves of the hemispherical shape are formed to be symmetrical with each other in the form of an hourglass, so that the spray projections are formed in the hemispherical shape during the thermal spraying process, so that the embossing jig can be easily separated after the thermal spraying process. The peeling phenomenon of the embossing protrusion due to the friction with the perforation is prevented.

Description

Embossing jig {Embosing jig}

The present invention relates to an embossing jig, and more particularly, to an embossing jig for forming a thermal spray projection on an electrode plate of an embossing type used for stably fixing an array substrate in a TFT manufacturing process.

The electrode plate is a device that is installed on a plasma source, which is an etchinger and a CVD equipment used for manufacturing a thin film transistor (TFT), to stably fix an object such as a glass substrate. Plane type that controls the contact area with the object to be processed according to the shape of the contact surface, trench type that repeatedly constitutes the valleys and valleys at regular intervals on the contact surface, and forms a plurality of fine protrusions on the contact surface It is divided into emboss type.

For example, the electrode plate of the embossed type has only a small part of the projection contacting the workpiece, so that the contact area is minimized to prevent slippage of the workpiece, and the overall flatness and load uniformity are maintained while the workpiece is fixed. It is characterized by the fact that the workpiece is not easily contaminated due to the dispersion effect and the depressions between the protrusions.

However, conventionally, the embossing type electrode plate is manufactured by integrally forming the embossing protrusion on the body, and then subjecting the surface to ceramic spray treatment. Although the upper surface of the electrode plate is regenerated by ceramic thermal spraying after cutting a part of the electrode plate, when the electrode plate is regenerated and used several times, the conventional thermally sprayed ceramic layer is not completely removed, and the ceramic thermally thermally sprayed again with some remaining state. When the regeneration operation is repeated about 10 times, the spray thickness gradually becomes thick, and the number of times that the electrode plate can be reproduced and used is extremely limited due to the phenomenon that the embossing projection is relatively small.

In addition, if the blasting process is wrong, not only the ceramic thermal spray layer but also the protrusions formed on the body are cut and damaged, and in particular, even if only some of the protrusions are damaged, it is impossible to repair locally, and thus, the body must be newly manufactured. In addition, when the electrode plate is newly manufactured, cylindrical embossing protrusions must be formed by cutting processing using equipment such as a machining center, resulting in a decrease in workability and productivity, resulting in a rise in manufacturing cost.

Accordingly, the present applicant forms a projection layer on the electrode plate body using the embossing jig in Patent Registration No. 10-0908227, so that the electrode plate body is not replaced as a whole even if the embossing projection is deformed or damaged by several regeneration operations. The new embossing protrusions can be easily formed and semi-permanently extended, and in particular, even if the embossing protrusions are locally damaged, the damaged parts can be partially repaired. have.

However, embossing jig has a lot of problems in manufacturing and use as perforations are mainly formed through the cutting process on the jig plate.

First, the manufacturing cost is increased along with the delay in processing time due to cutting tens of thousands to hundreds of thousands of perforations.

Second, as the upper and lower diameters of the perforations are formed uniformly, as shown in FIG. 4, after the thermal spraying process, the perforations and the thermal spraying projections 1 mesh with each other, thereby removing the thermal spraying projections when the embossing jig is removed.

The present invention has been devised to solve the above problems, and relates to an embossing jig that is easy to separate after the thermal spray treatment, as well as peeling of the thermal spray projections due to friction with the perforations and thermal expansion of the jig plate.

Features of the present invention to achieve this purpose, the jig plate 10; The first jig groove 22 recessed in a hemispherical shape on one surface of the jig plate 10 and the bottom surface of the jig plate 10 corresponding to the first jig groove 22 is formed in a hemispherical shape. And a perforation 20 having a second jig groove 24 in which the jig hole 26 is formed in communication with the first jig groove 22.

At this time, the jig plate 10 is characterized in that formed of a copper material having a thickness of 0.3 ~ 1mm.

In addition, the first and second jig grooves 22 and 24 may be formed by etching the both surfaces of the jig plate 10.

According to the above configuration and action, the present invention is formed so that the first and second jig grooves of the hemispherical shape are symmetrical with each other in the form of an hourglass, so that the spraying projections are formed in the hemispherical shape during the thermal spraying treatment, so that the embossing jig is separated after the thermal spraying treatment. Easily, of course, there is an effect that the peeling phenomenon of the embossing projections due to friction with the perforation is prevented.

1 is a configuration diagram showing an overall embossing jig according to the present invention.
Figure 2 is a block diagram showing a process of forming a perforation of the embossing jig according to the present invention.
Figure 3 is a block diagram showing a state of use of the embossing jig according to the present invention.
4 is a configuration diagram showing a conventional embossing jig.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The present invention relates to an embossing jig, wherein the embossing jig passes through a plurality of perforations formed through the sprayed ceramic particles to form embossed protrusions on the upper surface of the electrostatic chuck body, and the embossing jig is easily removed after the spraying process. In order to prevent the peeling phenomenon of the thermal spraying projection 1 during separation of the jig, the perforation 20 is composed of one and two jig grooves 22 and 24 and a jig hole 26.

Jig plate 10 according to the present invention is formed of a copper material having a thickness of 0.3 ~ 1mm. The jig plate 10 is a plate-shaped jig, which is easily divided in consideration of the overall size of the electrostatic chuck body and is manufactured to be prevented from deformation due to bending, and is prevented from flowing during the thermal spraying process while being seated on the upper surface of the electrostatic chuck body. It is fixed by the connecting member. In addition, since the jig plate 10 is formed of a copper material having excellent thermal conductivity and a thin thickness of 0.3 to 1 mm, the defective rate due to the thermal spraying is reduced by rapid recovery from thermal deformation due to local strong heat by the thermal spraying flame.

In addition, the perforation 20 according to the present invention is the back surface of the jig plate 10 corresponding to the first jig groove 22 and the first jig groove 22 formed recessed in one surface of the jig plate 10. The second jig groove 24 is formed in a hemispherical shape, the bottom surface is in communication with the first jig groove 22 to form a jig hole 26. The first and second jig grooves 22 and 24 are formed by etching the both sides of the jig plate 10, wherein the etching is performed by performing corrosion treatment on only the necessary parts and then unnecessary. As a conventional surface treatment method of removing a portion to obtain a desired shape, a portion corresponding to the first and second jig grooves 22 and 24 of the jig plate 10 is formed by corrosion.

In the non-corrosive etching process, the jig plate 10 is immersed in the etchant to corrode both sides at the same time. However, since the corrosion time is set to be shorter than before, the hemispherical first and second jig grooves 22 and 24 are respectively formed on both sides. Is formed.

In other words, as shown in (a) of FIG. 2, after the anticorrosive etching treatment is performed on the remaining portions except for the portions where the first and second jig grooves 22 and 24 are to be formed on both surfaces of the jig plate 10, 1 and 2 jig grooves 22 and 24 are recessed in a hemispherical shape, respectively, as shown in FIG. 2 (b), and the jig holes 26 at positions in which the first and second jig grooves 22 and 24 are symmetric with each other. Are communicated with each other through the cross-sectional shape to form an hourglass shape.

Accordingly, as shown in FIG. 3, the thermal spray projections 1 sprayed on the upper surface of the electrostatic chuck body through the perforations 20 are formed in a hemispherical shape, the diameter of which is narrowed from the lower portion to the upper portion. Even if (10) is deformed, the peeling phenomenon of the thermal spray projections 1 is prevented, and after the thermal spraying treatment, the jig plate 10 is easily separated and the thermal spray projections 1 are damaged and peeled off due to friction with the perforations 20. This is avoided.

10: jig board 20: perforation

Claims (3)

  1. Jig plate 10;
    The first jig groove 22 recessed in a hemispherical shape on one surface of the jig plate 10 and the bottom surface of the jig plate 10 corresponding to the first jig groove 22 is formed in a hemispherical shape. Embossing jig, characterized in that it comprises; a perforation (20) is provided with a second jig groove (24) in communication with the first jig groove (22) is formed a jig hole (26).
  2. The method of claim 1,
    The jig plate 10 is embossed jig, characterized in that formed of a copper material having a thickness of 0.3 ~ 1mm.
  3. The method of claim 1,
    The first and second jig grooves (22) and (24) are embossed jig, characterized in that formed by etching the etching (Etching) on both sides of the jig plate (10).

KR2020100000880U 2010-01-26 2010-01-26 Embossing jig KR200452471Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2020100000880U KR200452471Y1 (en) 2010-01-26 2010-01-26 Embossing jig

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2020100000880U KR200452471Y1 (en) 2010-01-26 2010-01-26 Embossing jig

Publications (1)

Publication Number Publication Date
KR200452471Y1 true KR200452471Y1 (en) 2011-03-03

Family

ID=44244641

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2020100000880U KR200452471Y1 (en) 2010-01-26 2010-01-26 Embossing jig

Country Status (1)

Country Link
KR (1) KR200452471Y1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004111933A (en) 2002-09-17 2004-04-08 Hewlett-Packard Development Co Lp Embossing mask lithography
KR20050064912A (en) * 2003-12-24 2005-06-29 재단법인 포항산업과학연구원 Improvement in chuck device for treating semiconductor wafer utilizing ceamic thermal spray coating
KR20060081562A (en) * 2005-01-10 2006-07-13 (주)엔트로피 Method for manufacturing of electro-static chuck
KR100908227B1 (en) 2008-01-28 2009-07-20 (주)코리아스타텍 Electrostatic chuck reproducing method of tft fabrication equipment

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004111933A (en) 2002-09-17 2004-04-08 Hewlett-Packard Development Co Lp Embossing mask lithography
KR20050064912A (en) * 2003-12-24 2005-06-29 재단법인 포항산업과학연구원 Improvement in chuck device for treating semiconductor wafer utilizing ceamic thermal spray coating
KR20060081562A (en) * 2005-01-10 2006-07-13 (주)엔트로피 Method for manufacturing of electro-static chuck
KR100908227B1 (en) 2008-01-28 2009-07-20 (주)코리아스타텍 Electrostatic chuck reproducing method of tft fabrication equipment

Similar Documents

Publication Publication Date Title
KR101857335B1 (en) Method and device for providing through-openings in a substrate and a substrate produced in said manner
JP5455099B1 (en) Metal plate, metal plate manufacturing method, and mask manufacturing method using metal plate
KR101814201B1 (en) Method of reusing a consumable part for use in a plasma processing apparatus
TWI446403B (en) Showerhead electrode assemblies for plasma processing apparatuses
EP0455891B1 (en) Cone electrical contact
US6556414B2 (en) Electrostatic and vacuum chucking holding apparatus
CN101268544B (en) The active heated aluminum baffle component improved and application and manufacture method
US7881036B2 (en) Electrode sheet for electrostatic chuck, and electrostatic chuck
JP5458323B2 (en) Electrostatic chuck and manufacturing method thereof
CN105358732A (en) Film-forming mask and method for producing film-forming mask
KR20170110623A (en) Method for manufacturing variation mask
US7718007B2 (en) Substrate supporting member and substrate processing apparatus
KR100440500B1 (en) Ceramic parts production and repair for semiconductor fabrication by plasma spray process
KR100625928B1 (en) Method and apparatus for processing semiconductor substrates
KR20010014651A (en) Microstructure array, and apparatus and method for forming the microstructure array, and a mold for fabricating a microstructure array
KR20020077401A (en) Flexible electronic device
JP2004343112A (en) Printed circuit board in which cooling of electric component is improved
JPWO2004112123A1 (en) Bipolar electrostatic chuck
US20140102775A1 (en) Non-deleterious technique for creating continuous conductive circuits upon the surfaces of a non-conductive substrate
TW201145426A (en) Gas distribution showerhead with coating material for semiconductor processing
US5172473A (en) Method of making cone electrical contact
TW201246335A (en) Method and apparatus for plasma dicing a semi-conductor wafer
TW200949897A (en) Electrostatic chuck
WO2006025967A3 (en) Semiconductor processing using energized hydrogen gas and in combination with wet cleaning
TW200636857A (en) Low-pressure removal of photoresist and etch residue

Legal Events

Date Code Title Description
A201 Request for examination
A302 Request for accelerated examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20131218

Year of fee payment: 4

FPAY Annual fee payment

Payment date: 20141202

Year of fee payment: 5

FPAY Annual fee payment

Payment date: 20151210

Year of fee payment: 6

FPAY Annual fee payment

Payment date: 20180312

Year of fee payment: 8

FPAY Annual fee payment

Payment date: 20190130

Year of fee payment: 9