KR20040093724A - 밀봉 방법 - Google Patents

밀봉 방법 Download PDF

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Publication number
KR20040093724A
KR20040093724A KR10-2004-7013328A KR20047013328A KR20040093724A KR 20040093724 A KR20040093724 A KR 20040093724A KR 20047013328 A KR20047013328 A KR 20047013328A KR 20040093724 A KR20040093724 A KR 20040093724A
Authority
KR
South Korea
Prior art keywords
sealing
adhesive tape
article
substrate
epoxy
Prior art date
Application number
KR10-2004-7013328A
Other languages
English (en)
Korean (ko)
Inventor
슈이찌 기따노
고따로 시노자끼
유지 히로시게
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 컴파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쓰리엠 이노베이티브 프로퍼티즈 컴파니 filed Critical 쓰리엠 이노베이티브 프로퍼티즈 컴파니
Publication of KR20040093724A publication Critical patent/KR20040093724A/ko

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/20—Macromolecular compounds having nitrogen in the main chain according to C08L75/00 - C08L79/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2477/00—Presence of polyamide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Sealing Material Composition (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
KR10-2004-7013328A 2002-02-27 2003-02-11 밀봉 방법 KR20040093724A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002051567A JP2003253251A (ja) 2002-02-27 2002-02-27 シーリング方法
JPJP-P-2002-00051567 2002-02-27
PCT/US2003/007272 WO2003072677A1 (en) 2002-02-27 2003-02-11 Sealing method

Publications (1)

Publication Number Publication Date
KR20040093724A true KR20040093724A (ko) 2004-11-08

Family

ID=27764313

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2004-7013328A KR20040093724A (ko) 2002-02-27 2003-02-11 밀봉 방법

Country Status (6)

Country Link
EP (1) EP1478710A1 (ja)
JP (1) JP2003253251A (ja)
KR (1) KR20040093724A (ja)
CN (1) CN1649978A (ja)
AU (1) AU2003225729A1 (ja)
WO (1) WO2003072677A1 (ja)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6887914B2 (en) 2001-09-07 2005-05-03 L&L Products, Inc. Structural hot melt material and methods
US8070994B2 (en) 2004-06-18 2011-12-06 Zephyros, Inc. Panel structure
JP2006008934A (ja) * 2004-06-29 2006-01-12 Three M Innovative Properties Co シーリング材
AT504429B8 (de) * 2007-03-13 2008-09-15 Suendermann Franz Flexible klebeverbindung
EP2019027A1 (de) 2007-07-27 2009-01-28 Sika Technology AG Verstärkungselement zur Verstärkung von Hohlräumen von strukturellen Bauteilen
JP4575940B2 (ja) * 2007-08-21 2010-11-04 トヨタ自動車株式会社 シーラーおよびシール方法
GB0806434D0 (en) 2008-04-09 2008-05-14 Zephyros Inc Improvements in or relating to structural adhesives
GB0916205D0 (en) 2009-09-15 2009-10-28 Zephyros Inc Improvements in or relating to cavity filling
CN103153604B (zh) 2010-03-04 2016-04-13 泽菲罗斯公司 结构复合层压板
CN103727230B (zh) * 2012-10-10 2016-05-11 李华容 一种罐体焊缝密封的方法
US10577522B2 (en) 2013-07-26 2020-03-03 Zephyros, Inc. Thermosetting adhesive films including a fibrous carrier
GB201417985D0 (en) 2014-10-10 2014-11-26 Zephyros Inc Improvements in or relating to structural adhesives
CN107000271A (zh) 2014-11-14 2017-08-01 泽菲罗斯公司 多重注塑方法及产品
DE102015122438A1 (de) * 2015-12-21 2017-06-22 Lohmann Gmbh & Co. Kg Hitzeaktivierbares Klebeband
US10695962B2 (en) 2016-03-18 2020-06-30 Zephyros, Inc. Members for directing expandable material for baffling, sealing, reinforcing
CN107962847B (zh) 2016-10-19 2020-06-26 泽费罗斯股份有限公司 声学吸收体复合隔板组件
DE102018102238B4 (de) * 2018-02-01 2022-06-23 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Verfahren zum Verkleben und Abdichten von Naht- und Fügestellen und Anwendung eines Verfahrens
CN112611524A (zh) * 2020-11-20 2021-04-06 华能上海燃机发电有限责任公司 一种提高发电机出线套管冷却效果的方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000192013A (ja) * 1998-12-28 2000-07-11 Minnesota Mining & Mfg Co <3M> シ―ラント組成物及びそれを用いたシ―ラント物品

Also Published As

Publication number Publication date
AU2003225729A1 (en) 2003-09-09
WO2003072677A1 (en) 2003-09-04
CN1649978A (zh) 2005-08-03
EP1478710A1 (en) 2004-11-24
JP2003253251A (ja) 2003-09-10

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Legal Events

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