KR20040079728A - Cutting apparatus and mathod for semiconductor package - Google Patents

Abstract

PURPOSE: An apparatus and a method for cutting a semiconductor package are provided to cut easily a resin-molded assembly of the semiconductor package by using a water jet method. CONSTITUTION: An X-axis transfer table is moved to an X-axis. The first and the second chuck tables(16,17) are rotatably installed at the X-axis transfer table. The first and the second rotary drivers(22,23) are installed at the X-axis transfer table. The first and the second vacuum chucks are installed at the first and the second chuck tables. A water jet nozzle unit(20) injects water by using a water jet method. The first Y-axis unit(12) transfers the water jet nozzle unit to the Y-axis. The first Z-axis unit(14) elevates the first Y-axis unit. A pickup plate(18) is used for absorbing and elevating targets on the first and the second vacuum chucks. The second Y-axis unit transfers the pickup plate to the Y-axis. The second Z-axis unit(15) elevates the second Y-axis unit. A vision unit(19) is installed at one side of the first Y-axis unit. The third Z-axis unit is fixed to one side of the first Y-axis unit. An upper tank and a lower tank are used for storing the water injected from the water jet nozzle unit.

Description

Cutting device and method for semiconductor package {Cutting apparatus and mathod for semiconductor package}

The present invention relates to a semiconductor package cutting device and a cutting method, and more particularly, a method and apparatus for cutting a resin molded semiconductor package into individual unit semiconductor packages by mounting a semiconductor chip on a matrix type lead frame strip. It is about.

In the matrix type lead frame strip, a plurality of unit lead frames are interconnected through a dam bar. Such lead frame strips can be maintained integrally without being cut during the mounting, wire bonding, and resin molding processes of the semiconductor chip, thereby improving work productivity. After the resin molding process is completed, the unit semiconductor packages are wrapped in a single body of the resin molding which is integrally formed. Therefore, the resin molding and the lead frame strip embedded therein must be cut together to be separated into individual semiconductor packages. That is, the resin molding formed integrally by cutting the molding and the dambar together along the dambar portion interconnecting the unit lead frames can be separated into individual semiconductor packages. This operation is called a dicing or sawing operation.

The most widely used methods for performing dicing or sowing operations are the blade method and the laser method. The blade method is a method using a cutting tool formed of diamond, the laser method is a method of cutting the resin molding and the dam bar using a laser.

The greatest advantage of the blade method and the laser method is that the cutting depth can be adjusted at the time of cutting, thereby simplifying the necessary related devices for handling the cut and setting the cutting position. More specifically, the resin molded unitary of the lead frame strip corresponding to the cutting object is cut in the first direction while being fixed to the rotatable vacuum chuck, and then the vacuum chuck is rotated to cut the cut in the second direction. Can be performed. Since the cutting depth can be adjusted at this time, the possibility that the vacuum chuck holding the cutting object at the time of cutting is damaged by the cutting tool can be excluded.

Despite the above advantages, the biggest problem of the blade and laser cutting is that a lot of heat is generated in the cutting. That is, in the blade method, since the diamond tool and the resin molding have to be in direct contact, friction heat is excessively generated, and there is a problem in that the heat is generated in the process of burning the resin molding or the dam bar with the laser. The heat generated as described above has a problem of directly and negatively affecting the semiconductor chip embedded in the resin molding. Therefore, in order to solve this problem, on the one hand, while performing a cutting operation to generate heat, on the other hand, a device for cooling the heat generated during the cutting operation must be provided separately. For example, coolant is circulated to the cutting work site. However, the cooling water circulation method is insufficient to solve the heat problem.

The present invention has been made to solve the above problems, it is an object of the present invention to provide an improved semiconductor package cutting device.

Another object of the present invention is to provide a water-jet type semiconductor package cutting device.

Another object of the present invention is to provide an improved method for cutting semiconductor packages.

1 is an overall perspective view of a semiconductor package cutting device according to the present invention.

2A and 2B are schematic perspective views of the first and second vacuum chucks shown in FIG. 1.

2c schematically illustrates the semiconductor package in a cut state.

3 is an explanatory view schematically showing the rotation mechanism of the first and second chuck tables.

4 is a schematic configuration diagram of individual nozzles provided in the water jet nozzle apparatus 20 shown in FIG. 1.

5A and 5B are cross-sectional views taken along the line A-A in FIG. 4.

6 is a schematic perspective view of the upper tank and the lower tank installed in the upper tank inner frame 2 and the lower tank inner frame 2 in FIG. 1.

Shown in FIG. 7 schematically shows a cross-sectional view of the upper tank.

FIG. 8 is an explanatory view schematically showing the water jet nozzle device, the vision device, and the cut object placed on the X-axis transfer table shown in FIG.

9 shows a plan view of the cutting object.

10 is a flowchart illustrating a process of generating an alarm sound with a signal generated from a sensor.

11 is a graph for analyzing a signal detected by a sensor.

Shown in Figure 12 is a perspective view showing the position at which the work of each step is performed in the device according to the invention.

<Brief Description of Major Codes in Drawings>

11. X axis feed table 12. First Y axis device

13. Second Y-axis device 14. First Z-axis device

16. The first chuck table 17. The second chuck table

18. Pickup plate 19. Vision device

In order to achieve the above object, according to the present invention, the X axis transfer table capable of reciprocating in the X-axis direction; First and second chuck tables rotatably mounted to the X axis transfer table; First and second rotational driving units respectively installed on the X-axis transfer table for rotation of the first and second chuck tables; First and second vacuum chucks installed on the first and second chuck tables to vacuum-adsorb a resin molded aggregate of a semiconductor package as a to-be-cut object; A water jet nozzle device for spraying a water jet on the cutting object; A first Y axis device for feeding the water jet nozzle device in a Y axis direction; A first Z axis device capable of elevating the first Y axis device; A pickup plate for absorbing and elevating the cutting object on the first or second vacuum chuck; A second Y axis device capable of conveying the pickup plate in the Y axis direction; A second Z axis device capable of elevating the second Y axis device; A vision device mounted on one side of the first Y-axis device in a liftable manner; A third Z-axis device fixed to one side of the first Y-axis device to lift and lower the vision device; Provided is a cutting device for a semiconductor package including an upper and a lower tank for receiving a water jet ejected from the water jet nozzle apparatus.

According to one aspect of the invention, the first vacuum chuck is formed with a plurality of parallel slits penetrating it, the second vacuum chuck penetrates it and extends in a direction orthogonal to the slit on the first vacuum chuck. Parallel slits are formed.

According to another feature of the present invention, the first and second chuck tables support only the edges of the first and second vacuum chucks, respectively, and penetrating portions are formed in each so that the water jet can be discharged downward. .

According to another feature of the invention, the water jet nozzle apparatus is provided with a plurality of nozzles, the distance to each other can be adjusted except one fixed reference nozzle.

According to another feature of the invention, the end of each nozzle provided in the water jet nozzle device, the cover is formed on the inside and the discharge port is formed on the edge, the brush extending from the edge of the cover, and the water connected to the flow path A supply hose is provided, and water supplied through the flow path forms a curtain of water between the brushes.

According to another feature of the invention, the outlet formed in the cover has the shape of a plurality of distribution holes.

According to another feature of the invention, the outlet formed in the cover has the shape of a slit.

According to another feature of the invention, the first and the second chuck table has a sensor that can detect a change in the load or vibration caused by the water jet.

According to another feature of the invention, the first and the second vacuum chuck has a sensor that can detect a change in the load or vibration caused by the water jet.

According to another feature of the invention, the sensor is a load detection sensor or an accelerometer.

According to another feature of the invention, the upper surface of the upper tank is provided with an inclined surface to form a water inlet slit therebetween, the water inlet slit is located directly below the water jet nozzle apparatus.

According to another feature of the invention, the brush extends from an end of the inclined surface forming the water inlet slit formed in the upper tank.

According to another feature of the invention, the step of vacuum-adsorbing a resin molded aggregate of the semiconductor package to be cut to a first vacuum chuck having a plurality of through slits parallel to the first direction; Acquiring first positional information by imaging the cut object on the first vacuum chuck through a vision device; Correcting a position error of the first vacuum chuck on a plane coordinate system by comparing first position information of the cut object with previously input reference information; A first cutting step of cutting the cutting object on the first vacuum chuck by spraying the water jet sprayed from the water jet nozzle apparatus along the through slit formed in the first vacuum chuck; Moving the partially cut workpiece on the second vacuum chuck onto a second vacuum chuck having a plurality of parallel through slits perpendicular to the first direction; Acquiring second position information by imaging the cut object on the second vacuum chuck through a vision device; Correcting a position error of the second vacuum chuck on a plane coordinate system by comparing the second position information of the cut object with previously input reference information; And a second cutting step of cutting the cut object on the second vacuum chuck by spraying the water jet sprayed from the water jet nozzle apparatus along the through slit formed in the second vacuum chuck. Is provided.

According to another feature of the invention, by detecting the load or vibration applied by the water jet in the first and second cutting step through the sensor, an alarm is generated when the detected signal exceeds the threshold level. To do that.

According to another feature of the invention, the step of acquiring the first and second position information is made by recognizing an alignment mark formed at a predetermined position of the cut object.

Hereinafter, the present invention will be described in more detail with reference to an embodiment shown in the accompanying drawings.

1 is an overall perspective view of a semiconductor package cutting device according to the present invention.

Referring to the drawings, a semiconductor package cutting device according to the present invention includes an X-axis transfer table 11 capable of reciprocating in the X-axis direction; A first chuck table (16) and a second chuck table (17) rotatably mounted on the X-axis feed table (11); The first X-axis feeder to rotate the first chuck table 16 and the second chuck table 23 to the second chuck table 23 so as to rotationally drive the first chuck table 16. A second rotary drive unit 23 provided on the table 11; A first vacuum chuck 25a (FIG. 2A) installed on the first chuck table 16 to vacuum-adsorb the to-be-cut object, and a second vacuum chuck table 17 mounted on the second chuck table 17 to vacuum-adsorb the to-be-cut object A second vacuum chuck 25b (FIG. 2B); A water jet nozzle apparatus 20 for injecting a water jet onto the to-be-cut object to be vacuum-adsorbed onto the first vacuum chuck 25a or the second vacuum chuck 25b, and the water jet nozzle apparatus ( A first Y-axis device 12 capable of reciprocating the 20 in the Y-axis direction, a vision device 19 provided on one side of the first Y-axis device 12 in a liftable manner, and the first A first Z-axis device 14 provided in the first Y-axis device 12, the first vacuum chuck 25a, and the second vacuum chuck 25b to lift and lower the Y-axis device 12 of the device. A pick-up plate 18 capable of vacuum-suctioning and exchanging the to-be-cut objects between them, a second Y-axis device 13 capable of reciprocating the pick-up plate 18 in the Y-axis direction, and the first A second Z-axis device 15 capable of lifting and lowering the second Y-axis device 13, and one side of the first Y-axis device to lift and lower the vision device 19. The upper tank inner frame (1) and the lower tank inner frame (2) in which the third Z-axis apparatus (13), the upper and lower tanks for receiving the water jets ejected from the water jet nozzle apparatus (20), are incorporated. Equipped.

Reference numeral 25 denotes a vacuum chuck that can be installed on the first chuck table 16 or the second chuck table 17, and the cut object 26 is formed inside the space formed in the vacuum chuck 25. ) Is placed. The cut object 26 may be, for example, resin molded as a single body by mounting a plurality of semiconductor packages on a lead frame strip.

It can be seen that the water jet nozzle apparatus 20 consists of four nozzles in the example shown in the figure. The water jet nozzle device 20 is transferable in the Y axis direction by the first Y axis device 12, and the first Z axis device 14 disposed on one side of the first Y axis device 12. It can move up and down in the vertical direction. The Y-axis conveyance of the water jet nozzle apparatus 20 enables the operation | work which cut | disconnects the aggregate | assembly of the to-be-processed semiconductor package to a Y-axis direction. When the cutting operation is performed by the water jet nozzle apparatus 20, the water jet nozzle apparatus 20 is lowered by the first Z-axis apparatus 14, otherwise it is raised. The first Z-axis device 14 can be implemented, for example, by a lifting cylinder, or a mechanism consisting of a motor and a ball screw, as is known. In addition, the distances between the individual nozzles provided in the water jet nozzle apparatus 20 may be installed to be controllable. At this time, one of the plurality of nozzles is fixed with respect to the first Y axis 12 as a reference nozzle, and the other nozzles are movably installed to adjust the distance to each other.

The water jet ejected from the water jet nozzle apparatus 20 can cut the aggregate of the resin molded unit semiconductor packages into unit semiconductor packages separated from each other. That is, the aggregate of the resin-molded semiconductor package is cut | disconnected by spraying the mixture of water and a fine abrasive at high pressure.

As for the X-axis feed table 11, the 1st chuck table 16 and the 2nd chuck table 17 are installed in the upper part, and it is installed so that a movement to an X-axis direction is possible from the upper tank built-in frame 1. As shown in FIG. The transfer of the X-axis transfer table 11 can vary in a manner as is known in the art. For example, a rail guide can be provided in the upper part of the upper tank built-in frame 1, and can be transferred using a ball screw and a drive motor. In another example, the X-axis transfer table 11 can be moved to an arbitrary position by using a belt and a pulley running by the drive motor.

The first chuck table 16 and the second chuck table 17 are rotatably provided on the X-axis feed table 11. The rotation of the first chuck table 16 and the second chuck table 17 is made for the alignment of the first vacuum chuck 25a or the second vacuum chuck 25b disposed thereon. The rotational drive of the first chuck table 16 is made by the first rotational drive part 22 provided on one side of the X-axis feed table 11, and the rotational drive of the second chuck table 17 is performed by the X-axis feed table ( It may be made by the second rotary drive unit 23 installed on one side of 11). Rotation driving methods of the first and second chuck tables 16 and 17 may be made in various ways.

2A and 2B are schematic perspective views of the first and second vacuum chucks shown in FIG. 1. 2C schematically illustrates the semiconductor package in a cut state.

Referring to FIG. 2A, a plurality of X-axis slit 28a is formed on the inner bottom surface of the rectangular parallelepiped space 28 formed in the first vacuum chuck 25a. A vacuum suction port 28b is also formed on the inner bottom of the space 28. 2B, a plurality of Y-axis slits 29a are formed on the inner bottom surface of the rectangular parallelepiped space 29 formed in the second vacuum chuck 25b. In addition, the vacuum suction port 29b is formed on the inner bottom face as well. Each of the slits 28a, 29a is formed to penetrate the vacuum chucks 28, 29, and as described later, serves as a passage through which the water jet can be discharged downward through the slits 28a, 29a. Do it.

The resin molding of the semiconductor package formed as a single body is mounted inside the spaces 28 and 29 formed in the vacuum chucks 25a and 25b. At this time, the vacuum provided through the vacuum suction ports 28b and 29b is stored in the spaces 28 and 29 of the first and second vacuum chucks 25a and 25b after the unitary or single unit of the resin molding is cut off. It will play a role.

On the other hand, when any one of the vacuum chucks 25a and 25b is disposed under the water jet nozzle apparatus 20 by transferring the X-axis transfer table 11 shown in FIG. 1, the vacuum chucks 25a and 25b are provided. One of the slits 28a and 29a formed in the field and the water jet nozzle apparatus 20 are aligned with each other in the vertical direction so that a cutting operation can be performed. That is, the water jets injected from the water jet nozzle apparatus 20 are arranged to be discharged downward through the slits 28a and 29b after cutting the cutting object 26.

In this case, since the slit 28a is formed in the first vacuum chuck 25a shown in FIG. 2A in the X direction, and the plurality of nozzles are disposed in the Y direction in the water jet nozzle apparatus 20 shown in FIG. 1. When the X-axis feed table 11 is transferred, the water jet can cut along the X-axis slit 28a. Moreover, since the slit 29a is formed in the Y direction in the 2nd vacuum chuck 25b shown in FIG. 2B, the water jet nozzle apparatus 20 is carried out in the Y-axis direction by the 1st Y-axis apparatus 12. As shown in FIG. By moving, cutting can be performed, following the Y-axis slit 29a.

When the cutting operation in the first vacuum chuck 25a is completed, the monolith of the resin molded semiconductor package will be cut only in the direction indicated by x-x in FIG. 2C. As such, when the cutting operation is performed by moving the resin molding cut only in the x-x direction to the second vacuum chuck 25b, the cutting operation may be performed in the y-y direction. Finally, when the cutting operation is completed, as shown in FIG. 2C, the aggregate of the resin-molded monolayer package is uniformly cut into the unit semiconductor package 26a.

Referring again to FIG. 1, the cut object between the first vacuum chuck 25a (FIG. 2A) on the first vacuum table 16 and the second vacuum chuck 25b (FIG. 2B) on the second vacuum table 17. It can be seen that the pickup plate 18 is provided to move. The pickup plate 18 has a plurality of vacuum inlets (not shown) formed on the bottom thereof, and may absorb the resin-molded aggregate of the semiconductor package or the partially or completely cut semiconductor package by the vacuum suction force provided through the vacuum inlet. It is. The pick-up plate 18 is movable in the Y-axis direction by the second Y-axis device 13 and in the vertical direction by the second Z-axis device installed to lift the second Y-axis device 13. Can be elevated.

A third Z-axis device 27 is fixed to one side of the first Y-axis device part 12, and a vision device 19 that can be lifted and lowered by the third Z-axis device 27 is provided. . The third Z-axis device 27 uses a lifting cylinder, for example, and is known in the art. The vision device 19 is, for example, an imaging camera, which detects the position of the cut object 26 disposed on the first and second vacuum chucks 25a and 25b by the vision device 19. Can be. That is, when the to-be-cut object 26 reaches the direct part of the vision apparatus 19 by moving the X-axis feed table 11, the vision apparatus 19 will descend by the 3rd Z-axis apparatus 27, The positional information of the cutting object 26 can be detected. According to the positional information of the cutting object 26 detected by the vision apparatus 19, the 1st and 2nd chuck tables 16 and 17 are rotated, or the X-axis feed table 11 is moved to the X-axis. Direction, or by transferring the water jet nozzle apparatus 20 in the Y-axis direction, alignment on the angular coordinate system and alignment on the plane coordinate coordinate system can be achieved. This alignment operation is carried out through the slits 28a and 29a formed in the first and second vacuum chucks 25a and 25b after the water jet ejected from the water jet nozzle apparatus 20 cuts the correct position of the cut. It is intended to be discharged to the bottom.

3 is an explanatory view schematically showing the rotation mechanism of the first and second chuck tables.

Referring to the drawings, the rotation shaft 31 is formed on one side of the chuck tables 16, 17, and the gear 32 formed on the curved surface is formed on one surface of the chuck tables 16, 17. The gear 32 is engaged with another gear 33 which rotates about the rotation shaft 34. When the gear 33 is rotated using a drive motor (not shown), the chuck tables 16 and 17 may rotate about the rotation shaft 31.

On the other hand, the inner sides of the chuck tables 16 and 17 are completely formed through the penetrating portion 35, so that the water jet can be discharged downward through the space 35. That is, the chuck tables 16 and 17 support only the edges of the vacuum chucks 25a and 25b, and in other parts, the penetrating portion 35 is formed so that water jets through the chuck tables 16 and 17 are applied to the chuck tables 16 and 17. It can be discharged downwards without affecting.

3 is merely an example of the rotation mechanism of the chuck table, and it is apparent that the chuck tables 16 and 17 can be rotated in other ways.

4 is a schematic configuration diagram of individual nozzles provided in the water jet nozzle apparatus 20 shown in FIG. 1.

Referring to the drawings, the lower end of the nozzle 20a is provided with means for preventing water droplets 45, which are jetted off when the water jet cuts the object 26. FIG. Such water droplet preventing means includes a circular lid 42 having a water supply passage 43 formed therein, and a brush 44 provided at an edge of the lid 42. The brush 44 is densely installed at the edge of the circular lid 42, thereby forming an inner space of a truncated cone shape surrounded by the lid 42 and the brush 44 as a whole. The water supply hose 41 is connected to the upper part of the circular lid 42. Water supplied through the water supply hose 41 is discharged along the circular edge of the cover 42 along the flow path 43 and thus flows down the brush 44. When water flows down between the densely installed brushes 44, a curtain of water is formed, and thus water droplets 45 and abrasives which fly after the water jet 36 has collided with the surface of the cutting object 26 are formed. The back can be blocked by a curtain made of brush 44 and water.

5A and 5B are cross-sectional views taken along the line A-A in FIG. 4.

Referring to FIG. 5A, it can be seen that a plurality of distribution holes 47 for discharging water are formed at the edges of the cover 42 as circular holes. Alternatively, in the example shown in FIG. 5B, it can be seen that the dispensing slit 48 is formed in an arc shape at the edge of the lid 42. Water introduced from the water supply hose 41 shown in FIG. 4 may be discharged through the distribution hole 47 or the distribution slit 48 past the flow path 43, and the discharged water may be discharged from the brush 44. By flowing along the water curtain will form.

6 is a schematic perspective view of the upper tank and the lower tank installed in the upper tank inner frame 2 and the lower tank inner frame 2 in FIG. 1.

Referring to the drawings, the upper tank 69 and the lower tank 68 are manufactured in an interconnected state. The upper surface of the upper tank 69 is closed except for the water inlet slit 61. The upper tank 69 is arranged so that the water inlet slit 61 is located directly under the water jet nozzle apparatus 20 shown in FIG. Therefore, after the water jet injected from the water jet nozzle apparatus 20 cuts the to-be-cut object 26, the slit 28a, 29a formed in the 1st or 2nd vacuum chuck 25a, 25b, and the 1st Or it is discharged downward through the through portion 35 formed in the second chuck table (16, 17). The water jet does not fly to the outside because the top surface is closed even though it may bounce after entering the upper tank 69 through the water inlet slit 61.

On the other hand, the water inflow slit 61 is formed by the inclined surface 66. As the inclined surface 66 is formed, water scattered before entering the slit 61 may be introduced into the upper tank 69 on the inclined surface 66.

On one side of the upper tank 69 is a water supply 65, which is for supplying water to the lower tank (68). By filling the lower tank 68 with water to a predetermined level in advance, the impact by the water jet can be alleviated. In addition, one side of the upper tank 69 is formed with air and dust inlet 62, which is for sucking the outside air or dust generated in the working process. A drain 64 is formed at one lower side of the lower tank 68 to open the drain 64 when completely draining the water and the abrasive contained therein. Alternatively, the filter drain 63 formed on the upper portion of the lower tank 68 is for recycling the separated abrasive using a filter. The abrasive separated using the filter installed inside the lower tank 68 may be recycled by being discharged through the filter drain 63.

Shown in FIG. 7 schematically shows a cross-sectional view of the upper tank.

Referring to the drawings, a brush 71 is formed at the end of the inclined surface 56 in which the water inflow slit 61 is formed. The brush 71 serves to prevent the water jet once introduced into the tank from popping out.

FIG. 8 is an explanatory view schematically showing the water jet nozzle device, the vision device, and the cut object placed on the X-axis transfer table shown in FIG.

Referring to the drawings, the water jet nozzle apparatus 20 and the vision apparatus 19 must always maintain a constant distance, which is the water on the side of the first Y-axis apparatus 12 as described with reference to FIG. The jet nozzle apparatus 20 and the vision apparatus 19 are respectively provided so as to maintain a constant distance at all times.

The X-axis feed table 11 is not directly underneath the water jet nozzle apparatus 20 or the vision apparatus 19, or on the vacuum chucks 25a, 25b of the X-axis feed table 11 manually or by a handler. Place the cuttings. Next, the to-be-cut material 26 is conveyed in the X-axis direction, first, to move directly under the vision device 19 to perform the imaging operation. The positional information obtained by the imaging operation of the vision apparatus 19 is stored in the memory of a control part (not shown). The controller compares the positional information of the to-be-cut object 26 input to the memory with the reference information to align the position of the to-be-cut object 26. That is, by calculating the error between the reference position and the imaging position of the cut object 26 previously input, the trajectory through which the water jet injected from the water jet nozzle apparatus 20 passes is allowed to be allowed by the vacuum chucks 25a and 25b. It is determined whether or not it is within the cutting width. If it is within the above-mentioned range, it proceeds to the next step. If it is not within the allowable range, the emergency signal is sent or the correction work is continued until it is within the allowable range.

Correction of the error is performed by operating the first or second rotary drive units 22 and 23 shown in FIG. 1 to perform angle correction on the rotation coordinate system by rotating the first or second chuck tables 16 and 17, Correction on Cartesian coordinates is performed by carrying out the feeding of the X-axis feeding table 11 and the Y-axis feeding of the warton jet nozzle apparatus 20 by the first Y-axis apparatus 12.

9 shows a plan view of the cutting object.

Referring to the drawings, the cut object 26 is, for example, a resin molded aggregate of a semiconductor package, in which each unit semiconductor package is arranged in a matrix form. At this time, each of the unit semiconductor packages 91, 92, 93, and 94 at the corners has an alignment mark on one side. That is, as shown in a circle denoted by A, an alignment mark 95 having a triangular shape is formed on one side of the unit semiconductor package 94, which is recognizable by the vision device 19 described above. The alignment mark 95 may be formed at each position of the cutting object 26 as well as on the sides of the unit semiconductor packages at the corners, and the vision device may be formed by recognizing a plurality of alignment marks 95. It is possible to obtain the position information of the cut 26.

On the other hand, the water jet sprayed from the water jet nozzle apparatus 20 is sprayed to a portion other than the cutting object 26 to cause damage to the equipment or to prevent water and abrasives from scattering to other places, The sensor will be installed. The sensor is embedded in the first and second chuck tables 16 and 17 shown in FIG. 1 or the first and second vacuum chucks 25a and 25b shown in FIGS. 2A and 2B. . The sensor can be, for example, a force sensing resistor or an accelerometer. Such a sensor can detect whether a water jet has collided with a chuck table or a vacuum chuck by a load or a vibration applied to the sensor.

That is, while the water jet normally cuts the to-be-cut target 26, after the water jet cuts the to-be-cut target 26, the slits 28a of the first and second vacuum chucks 25a and 25b are formed. It passes through the through part 35 of the chuck tables 16 and 17 through 29a), and flows into the water inflow slit 61 of the upper tank 69 again. Therefore, the pressure of the water jet applied to the device is relatively small. On the contrary, when the water jet strikes a portion other than the slits 28a and 29a of the first and second vacuum chucks 25a and 25b, the water jets are applied to the chuck tables 16 and 17 and the vacuum chucks 25a and 25b. The pressure applied is increased. Sensors can alarm by detecting this increase in pressure as a change in vibration or load.

FIG. 10 is a flowchart illustrating a process of generating an alarm sound with a signal generated from a sensor, and FIG. 11 illustrates a graph for analyzing a signal detected by the sensor.

Referring to FIG. 10, a signal is detected by a sensor (101), and the detected signal is amplified by an amplifier (101). Next, the detected signal is compared with a threshold level predetermined by the comparator (103), and when the detection signal is above the threshold level, an alarm sound (or an alarm) is generated.

11 shows that the signal level of the signal curve 111 changes over time. When the signal curve 111 rises above the predetermined threshold level 115, the emergency situation 112 becomes. In such an emergency, the device must be taken out of service or operator action must be taken.

Shown in Figure 12 is a perspective view showing the position at which the work of each step is performed in the device according to the invention.

Referring to the drawings, the workpiece is loaded onto or detached from the vacuum chucks on the chuck tables 16 and 17 at the positions indicated by reference numeral 121. The portion indicated by reference numeral 122 corresponds to the lower portion of the pick-up plate 18, in which the pick-up plate 18 vacuum-adsorbs the cutting object by the pick-up plate 18 and the second chuck table 17. The exchange of cuttings between the two takes place.

The portion indicated by reference numeral 123 is directly underneath the vision apparatus 19, and position information of the cut object can be obtained at this position. In addition, the part shown with the reference number 124 corresponds to the lower part of the water jet nozzle apparatus 20, and it is a place where a cutting operation is made. The part labeled 125 is where the workpiece is to be transferred to another piece of equipment.

The operation of the device according to the invention will now be described schematically.

In Fig. 1, the cutting object 26 is vacuum adsorbed to either one of the first and second vacuum chucks 25a and 25b disposed on the first chuck table 16 and the second chuck table 17. It is arranged by. This loading operation takes place at the position indicated by 121 in FIG. For convenience of explanation, it is assumed that the cutting object 26 is first adsorbed to the first vacuum chuck 25a. However, in another example, it may be adsorbed to the second vacuum chuck 25b first.

Next, the X-axis transfer table 11 transfers the to-be-cut object 26 so that it may reach directly underneath the vision apparatus 19, and imaging operation is attained. The imaging operation is performed by the operation of the X-axis feed table 11 and the first Y-axis device 12 in the state where the vision device 19 is lowered by the third Z-axis device. This can be done while changing location.

After obtaining the positional information of the cut object 26 with the vision device 19, the cut object 26 is transferred directly under the water jet nozzle apparatus 20. FIG. At this time, the angle correction of the to-be-cut object 26 is performed by the 1st rotation drive parts 22 and 23, and the X-axis feed table 11 and the 1st Y-axis apparatus 12 are carried out in a rectangular coordinate system. Calibration is made. Next, the water jet nozzle apparatus 20 descends by the operation of the first Z-axis apparatus 14 to inject the water jet. The jet of water jet is discharged downward through the through part 35 of the first chuck table 16 and the X-axis slit 28a formed in the vacuum chuck 25a after cutting the cutting object 26. do.

The cutting operation in the X axis direction is repeated to form a plurality of cutting planes parallel to the X-axis direction in the cutting object 26. When the cutting operation in the X direction is completed, the cut object 26 is again conveyed to reach the lower portion of the pickup plate 18. The pick-up plate 18 is lowered by the operation of the second Z-axis device 15, and vacuum picks up the to-be-cut object 26 which has already been cut in the X-axis direction. The pickup plate 18 then rises.

After the pick-up plate 18 is raised, the X-axis transfer table 11 is transferred so that the second vacuum chuck 25b disposed on the second chuck table 17 reaches the lower portion of the pick-up plate 18. Done. Next, the pickup plate 18 is lowered to place the cut object on the second vacuum chuck 25b.

The to-be-cut object 26 vacuum-adsorbed on the 2nd vacuum chuck 25b is again conveyed directly under the vision apparatus 19, and the imaging operation by the vision apparatus 19 is performed. When the imaging operation is completed, the to-be-cut object 26 is transferred directly under the water jet nozzle apparatus 20, and the cutting operation in the Y axis direction is performed. Before the cutting operation in the Y axis direction is performed, the correction of the angle on the second rotary drive unit 23 and the correction on the Cartesian coordinate system by the X-direction feed table 11 and the first Y axis device 12 are performed. Is done. When the cutting in the Y-axis direction is finished, the unit semiconductor packages are arranged on the second vacuum chuck 25b, and they are transferred to another device for later processing.

The cutting device and the cutting method of the semiconductor package according to the present invention cut the resin-molded aggregate of the semiconductor package by using a water jet, thereby eliminating heat generation during cutting, and thus there is no possibility of damaging the semiconductor chip by heat. There is this. In addition, since a part of the water jet can be effectively prevented from scattering during the cutting operation by the water jet, a clean and stable cutting operation can be performed. Furthermore, by having a sensor means for preparing the case where the water jet strikes a portion other than the to-be-cut, safe cutting operation can be performed, and there is an advantage of minimizing vibration or pressure applied to the machine by the water jet.

Although the present invention has been described with reference to one embodiment shown in the accompanying drawings, this is only illustrative, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Could be. Therefore, the true scope of protection of the present invention should be defined only by the appended claims.

Claims (15)

An X axis feed table capable of reciprocating in the X axis direction; First and second chuck tables rotatably mounted to the X axis transfer table; First and second rotational driving units respectively installed on the X-axis transfer table for rotation of the first and second chuck tables; First and second vacuum chucks installed on the first and second chuck tables to vacuum-adsorb a resin molded aggregate of a semiconductor package as a to-be-cut object; A water jet nozzle device for spraying a water jet on the cutting object; A first Y axis device for feeding the water jet nozzle device in a Y axis direction; A first Z axis device capable of elevating the first Y axis device; A pickup plate for absorbing and elevating the cutting object on the first or second vacuum chuck; A second Y axis device capable of conveying the pickup plate in the Y axis direction; A second Z axis device capable of elevating the second Y axis device; A vision device mounted on one side of the first Y-axis device in a liftable manner; A third Z-axis device fixed to one side of the first Y-axis device to lift and lower the vision device; And an upper tank and a lower tank for receiving the water jets ejected from the water jet nozzle apparatus. The method of claim 1, The first vacuum chuck is formed with a plurality of parallel slits penetrating it, and the second vacuum chuck is formed with a plurality of parallel slits penetrating it and extending in a direction orthogonal to the slit on the first vacuum chuck. A cutting device for semiconductor packages. The method of claim 1, The first and second chuck tables support only the edges of the first and second vacuum chucks, respectively, and a through portion is formed in each of the semiconductor packages, wherein the water jet can be discharged downward. Device. The method of claim 1, The water jet nozzle apparatus is provided with a plurality of nozzles, the cutting device of the semiconductor package, characterized in that the distance to each other is adjustable except one fixed reference nozzle. The method according to claim 1 or 4, An end portion of each nozzle provided in the water jet nozzle apparatus is provided with a cover having a flow path formed therein and a discharge port formed at an edge thereof, a brush extending from the edge of the cover, and a hose for water supply connected to the flow path. A device for cutting a semiconductor package, wherein water supplied through the flow path forms a curtain of water between the brushes. The method of claim 5, wherein The outlet formed in the cover has a shape of a plurality of distribution holes cutting device of the semiconductor package, characterized in that. The method of claim 5, wherein The outlet formed in the cover has a slit-shaped cutting device of the semiconductor package, characterized in that. The method of claim 1, The first and the second chuck table is a cutting device of a semiconductor package, characterized in that a sensor for detecting a change in load or vibration caused by the water jet is built-in. The method of claim 1, The first and the second vacuum chuck is a cutting device of a semiconductor package, characterized in that a sensor for detecting a change in load or vibration caused by the water jet is built-in. The method according to claim 8 or 9, And said sensor is a load detecting sensor or an accelerometer. The method of claim 1, The upper surface of the upper tank is provided with an inclined surface for forming a water inlet slit therebetween, the water inlet slit is a cutting device of a semiconductor package, characterized in that located directly under the water jet nozzle device. The method of claim 11, And a brush extending from an end portion of an inclined surface forming a water inflow slit formed in the upper tank. Vacuum adsorbing a resin molded aggregate of a semiconductor package as a cut object to a first vacuum chuck having a plurality of through slits parallel in a first direction; Acquiring first positional information by imaging the cut object on the first vacuum chuck through a vision device; Correcting a position error of the first vacuum chuck on a plane coordinate system by comparing first position information of the cut object with previously input reference information; A first cutting step of cutting the cutting object on the first vacuum chuck by spraying the water jet sprayed from the water jet nozzle apparatus along the through slit formed in the first vacuum chuck; Moving the partially cut workpiece on the second vacuum chuck onto a second vacuum chuck having a plurality of parallel through slits perpendicular to the first direction; Acquiring second position information by imaging the cut object on the second vacuum chuck through a vision device; Correcting a position error of the second vacuum chuck on a plane coordinate system by comparing the second position information of the cut object with previously input reference information; And, And a second cutting step of cutting the cutting object on the second vacuum chuck by spraying the water jet sprayed from the water jet nozzle apparatus along the through slit formed in the second vacuum chuck. The method of claim 13, The semiconductor package, characterized in that for detecting the load or vibration applied by the water jet in the first and second cutting step through the sensor to generate an alarm when the detected signal exceeds the threshold level. Cutting method. The method of claim 13, And obtaining the first and second positional information by recognizing an alignment mark formed at a predetermined position of the cut object.