JPH065698A - Dicing method and device for semiconductor device - Google Patents

Abstract

PURPOSE:To provide a semiconductor device dicing device where a jig is not required to be replaced and which is sharply improved in dicing efficiency and enhances semiconductor devices in quality and yield restraining them from chipping. CONSTITUTION:Cutting grooves 11A are provided to a wafer 11 by a dicing device 10 for dividing the wafer 11 into separate chips 12, where a jet nozzle 15 is provided to spout water 15 of high pressure against the wafer 11 for dicing.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dicing method for a semiconductor device and a dicing apparatus for the semiconductor device for forming a kerf for dividing a wafer into individual chips.

[0002]

2. Description of the Related Art A conventional device of this type will be described with reference to FIGS. In FIG. 1, reference numeral 1 denotes a wafer on which a plurality of chips 2 each having a minimum unit functioning as an integrated circuit are formed in a grid pattern, 3 denotes a diamond blade for dividing the wafer 1 into individual chips 2, and 4 denotes A rotary shaft that transmits a rotational force to the diamond blade 3 and is supported so as to be able to move back and forth and ascend and descend in the directions A and B shown in the figure.
Is a rotatable table that is driven in the direction of arrow C in the figure in synchronism with the diamond blade 3 that rotates via the rotary shaft 4 and on which the wafer 1 is placed. The diamond blade 3 is a thin metal plate such as nickel (0.0
It has a structure in which a diamond having a grain size of 5 to 20 μm is embedded in a thickness of 3 to 0.05 mm).

Next, the operation will be described. To divide the wafer 1 into individual chips 2, first, the wafer 1 is vacuum-sucked and fixed and supported on the table 5. Then, the diamond blades 3
While rotating at a high speed of 0000 rpm, it is lowered toward the wafer 1, and when the diamond blade 3 comes into contact with a predetermined portion of the wafer 1, the table 5 moves in the direction perpendicular to the rotation axis 4 and moves to the surface of the wafer 1. Form a kerf. When this kerf is completed, the diamond blade 3 is step-fed by a preset distance via the rotary shaft 4 to move the table 5 to form the next kerf, and such operation is performed. As shown in FIG. 4, a unidirectional cut groove is formed on the entire surface of the wafer 1 and the operation is completed.

After that, by rotating the table 5 by 90 ° and repeating the above-mentioned work, as shown in FIG.
A kerf that is orthogonal to the already formed kerf is formed on the surface of the wafer 1 to form a kerf-shaped kerf and the wafer 1 is formed.
Is divided into individual chips 2 and the dicing is completed.

[0005]

However, in the conventional dicing apparatus using the diamond blade 3,
The diamond blade 3 is heavily worn, and the diamond blade 3 must be frequently replaced, which causes a problem that the operating rate of the dicing device is reduced.
Further, since the diamond blade 3 is a thin plate, it is easily damaged, and if dicing is continued without knowing the fact of the damage sometimes, the kerf is not sufficiently formed at the damaged portion, and the kerf may be chipped or chipped. There is a problem that it causes defects and leads to deterioration of product quality and yield. Further, there is a problem that the diamond blade 3 is expensive.

The present invention has been made in order to solve the above-mentioned problems, and it is not necessary to replace the jig, the operation efficiency of dicing is significantly improved, and chipping is suppressed to improve the yield with high quality. An object of the present invention is to provide a dicing method for a semiconductor device and a dicing device for the device.

[0007]

According to a first aspect of the present invention, there is provided a semiconductor device dicing method in which high-pressure water is jetted toward a wafer for dicing.

A dicing apparatus for a semiconductor device according to a second aspect of the present invention comprises an injection nozzle for injecting high pressure water for dicing the wafer toward the wafer.

[0009]

According to the first aspect of the present invention, when the high-pressure water is jetted to a predetermined portion of the wafer, the high-pressure water can form a kerf on the surface of the wafer.

According to the second aspect of the present invention, if the high-pressure water is jetted from the jet nozzle, the high-pressure water can form a kerf on the surface of the wafer.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below based on the embodiments shown in FIGS. In each of the drawings, FIG. 1 is a perspective view showing a state in which a wafer is diced using a dicing apparatus which is preferably used in one embodiment of the dicing method of the present invention,
FIG. 2 is a perspective view showing a state of selectively dicing a wafer using the dicing apparatus shown in FIG.

First, a dicing apparatus preferably used in one embodiment of the dicing method for a semiconductor device of the present invention will be described. The dicing apparatus 10 of this embodiment is shown in FIG.
As shown in FIG. 3, the kerf 11A for dividing the wafer 11 into individual chips 12 is formed. The dicing apparatus 10 includes a table 13 for supporting and fixing the wafer 11, and high pressure water 14 for dicing the wafer 11 fixed on the table 13.
Is provided to the wafer 11 and an arm 16 that supports the injection nozzle 15 is provided.

The injection nozzle 15 is moved forward and backward (in the direction of arrow A in FIG. 1), left and right (in the direction of arrow B in FIG. 1), and the wafer 11 via the arm 16 by the controller. It is controlled so that it can be moved up and down in the direction of arrow C in FIG. 1, and is configured to form the kerf 11A on the surface of the wafer 11 by jetting the high-pressure water 14 necessary for forming the kerf 11A in an extremely fine shape. . Further, the table 13 is configured to be controlled by a control device (not shown) so as to be rotatable and horizontally movable in one direction (direction D shown by an arrow in FIG. 1).

Next, one embodiment of the dicing method of the present invention will be described together with the operation of the above dicing apparatus. First,
The wafer 11 is placed on the table 13, and the wafer 11 is sucked and fixed. Next, the injection nozzle 15 is advanced by the control device via the arm 16 in the direction of arrow A in FIG. 1 and aligned with a portion on the wafer 11 where a preset kerf is to be formed. 14, the table 13 is moved in the direction of the arrow D in FIG. 1 to form the kerf 11A. Then, when this kerf is completed, the injection nozzle 15 is step-fed by a preset distance via the arm 16 to move the table 13 to form the next kerf 11A, and such an operation is sequentially performed. The unidirectional kerf is repeatedly formed on the entire surface of the wafer 11, and the operation is completed.

After that, the table 13 is rotated by 90 ° and the above-mentioned work is repeated to form a kerf orthogonal to the already formed kerf on the surface of the wafer 11 to form a crease shape. A dicing is completed by making a kerf so that the wafer 11 can be divided into individual chips.

Further, by using the dicing apparatus 10, as shown in FIG. 2, the high-pressure water 14 is sprayed only on a necessary portion of the wafer 11, for example, when only good chips are cut out. Injection nozzle 15
By controlling, it is possible to select and cut out only good chips.

As described above, according to the present embodiment, since the kerf 11A is formed on the surface of the wafer 11 by using the high pressure water 14, it is not worn like the conventional diamond blade, and therefore the jig is used. It is possible to remarkably improve the operation rate of the dicing device 10 by eliminating the trouble of exchanging the chips, and to manufacture high-quality chips with high yield without fear of causing chipping or the like.

The present invention is not limited to the above-described embodiments, and any method and dicing apparatus for injecting high-pressure water to dice is included in the present invention.

[0019]

As described above, according to the invention described in claim 1 of the present invention, high-pressure water is jetted to perform dicing, so that the operating efficiency of dicing is significantly improved and chipping is suppressed. It is possible to provide a method for dicing a semiconductor device that improves the yield with high quality.

Further, according to the second aspect of the present invention, since the high pressure water is jetted from the jet nozzle to perform dicing, it is not necessary to replace a jig such as the jet nozzle and the dicing operation is performed. It is possible to provide a dicing device for a semiconductor device that significantly improves efficiency, suppresses chipping, and improves yield with high quality.

[Brief description of drawings]

FIG. 1 is a perspective view showing a state in which a wafer is diced using a dicing apparatus which is preferably used in an embodiment of a dicing method for a dicing semiconductor device according to the present invention.

FIG. 2 is a perspective view showing a state in which a wafer is selectively diced using the dicing apparatus shown in FIG.

FIG. 3 is a perspective view showing a state in which a wafer is diced using a conventional dicing apparatus.

FIG. 4 is a perspective view showing a state in which a wafer is diced in one direction using the dicing apparatus shown in FIG.

5 is a perspective view showing a state in which a wafer is diced in a direction orthogonal to the kerf formed in FIG. 4 by using the dicing apparatus for the semiconductor device shown in FIG.

[Explanation of symbols]

 10 Dicing Device 11 Wafer 11A Cutting Groove 12 Chip 13 Table 14 High Pressure Water 15 Injection Nozzle

Claims (2)

[Claims] 1. A dicing method for a semiconductor device, wherein a dicing method for forming a groove for dividing a wafer into individual chips comprises jetting high-pressure water toward the wafer for dicing. 2. A dicing device of a semiconductor device for forming a cut groove for dividing a wafer into individual chips, comprising a jet nozzle for jetting high-pressure water for dicing the wafer toward the wafer. Semiconductor device dicing device.