KR20040073667A - 반도체 소자용 본딩 와이어 - Google Patents
반도체 소자용 본딩 와이어 Download PDFInfo
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- KR20040073667A KR20040073667A KR1020030009330A KR20030009330A KR20040073667A KR 20040073667 A KR20040073667 A KR 20040073667A KR 1020030009330 A KR1020030009330 A KR 1020030009330A KR 20030009330 A KR20030009330 A KR 20030009330A KR 20040073667 A KR20040073667 A KR 20040073667A
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- 239000004065 semiconductor Substances 0.000 title abstract description 14
- 239000010949 copper Substances 0.000 claims abstract description 33
- 239000011248 coating agent Substances 0.000 claims abstract description 16
- 238000000576 coating method Methods 0.000 claims abstract description 16
- 229910052802 copper Inorganic materials 0.000 claims abstract description 13
- 229910052737 gold Inorganic materials 0.000 claims abstract description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910052709 silver Inorganic materials 0.000 claims abstract description 9
- 229910052796 boron Inorganic materials 0.000 claims abstract description 8
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 6
- 239000000463 material Substances 0.000 claims description 29
- 239000000956 alloy Substances 0.000 claims description 10
- 229910045601 alloy Inorganic materials 0.000 claims description 10
- 239000011159 matrix material Substances 0.000 abstract 4
- 229910001316 Ag alloy Inorganic materials 0.000 abstract 1
- 229910000990 Ni alloy Inorganic materials 0.000 abstract 1
- 239000010931 gold Substances 0.000 description 17
- 241000220259 Raphanus Species 0.000 description 15
- 235000006140 Raphanus sativus var sativus Nutrition 0.000 description 15
- 230000000052 comparative effect Effects 0.000 description 15
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 9
- 239000011347 resin Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- 229910001020 Au alloy Inorganic materials 0.000 description 5
- 239000003353 gold alloy Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000001953 recrystallisation Methods 0.000 description 5
- 239000010953 base metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910052791 calcium Inorganic materials 0.000 description 3
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 241001391944 Commicarpus scandens Species 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000002788 crimping Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000007670 refining Methods 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000010944 silver (metal) Substances 0.000 description 2
- LLQHSBBZNDXTIV-UHFFFAOYSA-N 6-[5-[[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]methyl]-4,5-dihydro-1,2-oxazol-3-yl]-3H-1,3-benzoxazol-2-one Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)CC1CC(=NO1)C1=CC2=C(NC(O2)=O)C=C1 LLQHSBBZNDXTIV-UHFFFAOYSA-N 0.000 description 1
- 241000282472 Canis lupus familiaris Species 0.000 description 1
- MKYBYDHXWVHEJW-UHFFFAOYSA-N N-[1-oxo-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propan-2-yl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(C(C)NC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 MKYBYDHXWVHEJW-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000000399 optical microscopy Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
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- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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Abstract
Description
재료구성 (중량%) | 모재부 내 첨가원소 (중량%) | ||||||
Cu(모재부) | Pd(피복부) | Al | Ag | Ca | La | B | |
실시예 1 | 잔량 | 0.02 | 0.003 | 0.001 | 0.001 | 0.001 | 0.001 |
실시예 2 | 잔량 | 0.06 | 0.003 | 0.005 | 0.002 | 0.002 | 0.005 |
실시예 3 | 잔량 | 1 | 0.003 | 0.003 | 0.003 | 0.003 | 0.005 |
실시예 4 | 잔량 | 5 | 0.003 | 0.005 | 0.005 | 0.005 | 0.001 |
실시예 5 | 잔량 | 10 | 0.001 | 0.001 | 0.002 | 0.002 | 0.001 |
실시예 6 | 잔량 | 15 | 0.001 | 0.002 | 0.001 | 0.001 | 0.001 |
실시예 7 | 잔량 | 20 | 0.001 | 0.003 | 0.005 | 0.005 | 0.001 |
실시예 8 | 잔량 | 25 | 0.005 | 0.005 | 0.003 | 0.003 | 0.0005 |
실시예 9 | 잔량 | 30 | 0.005 | 0.001 | 0.003 | 0.003 | 0.0005 |
실시예 10 | 잔량 | 37 | 0.005 | 0.005 | 0.002 | 0.002 | 0.005 |
재료구성 (중량%) | 모재부 내 첨가원소 (중량%) | ||||||
Cu(모재부) | Pd(피복부) | Al | Ag | Ca | La | B | |
비교예 1 | 잔량 | 1 | 0 | 0.001 | 0.002 | 0.002 | 0.005 |
비교예 2 | 잔량 | 1 | 0.001 | 0 | 0.002 | 0.005 | 0.001 |
비교예 3 | 잔량 | 1 | 0 | 0.01 | 0.005 | 0.002 | 0.005 |
비교예 4 | 잔량 | 1 | 0.01 | 0.001 | 0.002 | 0.001 | 0.001 |
비교예 5 | 잔량 | 0.01 | 0.0003 | 0.003 | 0.003 | 0.003 | 0.005 |
비교예 6 | 잔량 | 38 | 0.0003 | 0.003 | 0.003 | 0.003 | 0.005 |
재료구성 | 첨가원소 (중량%) | |||
Au | Pt | Cu | Ca | |
종래예 1 | 잔량 | 0.001 | 0 | 0.001 |
종래예 2 | 잔량 | 0.001 | 0.001 | 0 |
파단하중 | 볼형상 | 압착볼형상 | 루프강도(gr) | 전단강도(gr) | 와이어플로율(%) | 패드균열 | |||
상온(gr) | 고온(gr) | ||||||||
실시예 | 1 | 16 | 11 | ○ | ○ | 13 | 72 | 6 | 무 |
2 | 16 | 11 | ○ | ○ | 13 | 72 | 6 | 무 | |
3 | 16 | 11 | ○ | ○ | 12 | 73 | 6 | 무 | |
4 | 16 | 10 | ○ | ○ | 13 | 74 | 6 | 무 | |
5 | 16 | 10 | ○ | ○ | 13 | 74 | 6 | 무 | |
6 | 16 | 11 | ○ | ○ | 11 | 72 | 5 | 무 | |
7 | 15 | 10 | ○ | ○ | 12 | 72 | 5 | 무 | |
8 | 16 | 11 | ○ | ○ | 12 | 73 | 6 | 무 | |
9 | 16 | 10 | ○ | ○ | 12 | 73 | 6 | 무 | |
10 | 15 | 10 | ○ | ○ | 11 | 74 | 6 | 무 | |
비교예 | 1 | 14 | 10 | × | × | 12 | 72 | 7 | 유 |
2 | 11 | 9 | × | × | 11 | 70 | 7 | 무 | |
3 | 13 | 10 | × | × | 11 | 70 | 6 | 무 | |
4 | 12 | 9 | × | × | 11 | 71 | 7 | 무 | |
5 | 16 | 11 | ○ | ○ | 12 | 73 | 6 | 유 | |
6 | 16 | 11 | ○ | ○ | 12 | 73 | 6 | 유 | |
종래예 | 1 | 10 | 8 | ○ | × | 7 | 51 | 14 | 무 |
2 | 11 | 9 | ○ | × | 7 | 54 | 12 | 무 |
Claims (1)
- a) 순도 99.999% 이상의 구리(Cu)로 이루어진 모재부; 및b) Pd, Pd-Ni계 합금, Au, Ag, 및 Au-Ag계 합금으로 이루어진 군에서 선택된 하나로 이루어지고, 상기 모재부의 외면을 감싸도록 형성된 피복부로 구성되고,상기 a) 모재부는 63-99.98 중량%이고, 상기 b) 피복부는 0.02-37 중량%이며,상기 a) 모재부에는 상기 a) 모재부 총 중량에 대하여 Al 이 0.001~0.005 중량%, Ag 이 0.001~0.005 중량%, Ca 이 0.001~0.005 중량%, B, Be, La, Ge, S, P 및 Ba 으로 이루어진 군에서 선택된 1종 이상이 0.0005-0.008 중량% 포함된 본딩 와이어.
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