KR20040021690A - 마이크로 전기기계 장치 및 마이크로 전기기계 장치 형성방법 - Google Patents
마이크로 전기기계 장치 및 마이크로 전기기계 장치 형성방법 Download PDFInfo
- Publication number
- KR20040021690A KR20040021690A KR10-2004-7001925A KR20047001925A KR20040021690A KR 20040021690 A KR20040021690 A KR 20040021690A KR 20047001925 A KR20047001925 A KR 20047001925A KR 20040021690 A KR20040021690 A KR 20040021690A
- Authority
- KR
- South Korea
- Prior art keywords
- beam member
- substrate
- mass element
- cross member
- cross
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 238000000034 method Methods 0.000 title claims description 47
- 239000000758 substrate Substances 0.000 claims abstract description 99
- 239000011800 void material Substances 0.000 claims description 15
- 238000000151 deposition Methods 0.000 claims description 10
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 10
- 229920005591 polysilicon Polymers 0.000 claims description 10
- 238000009792 diffusion process Methods 0.000 claims description 8
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 7
- 230000015572 biosynthetic process Effects 0.000 claims description 7
- 229910052796 boron Inorganic materials 0.000 claims description 7
- 238000010884 ion-beam technique Methods 0.000 claims description 4
- 102100024210 CD166 antigen Human genes 0.000 description 33
- 101000980840 Homo sapiens CD166 antigen Proteins 0.000 description 33
- 239000000463 material Substances 0.000 description 10
- 230000008859 change Effects 0.000 description 9
- 230000008569 process Effects 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 8
- 238000005530 etching Methods 0.000 description 7
- 230000002093 peripheral effect Effects 0.000 description 7
- 230000008021 deposition Effects 0.000 description 6
- 238000000206 photolithography Methods 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000004380 ashing Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
- B81B3/0067—Mechanical properties
- B81B3/007—For controlling stiffness, e.g. ribs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0228—Inertial sensors
- B81B2201/0235—Accelerometers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
- B81C2201/0128—Processes for removing material
- B81C2201/0143—Focussed beam, i.e. laser, ion or e-beam
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0808—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate
- G01P2015/0811—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass
- G01P2015/0817—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass for pivoting movement of the mass, e.g. in-plane pendulum
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Micromachines (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/924,370 | 2001-08-07 | ||
| US09/924,370 US6632698B2 (en) | 2001-08-07 | 2001-08-07 | Microelectromechanical device having a stiffened support beam, and methods of forming stiffened support beams in MEMS |
| PCT/US2002/024653 WO2003014009A2 (en) | 2001-08-07 | 2002-08-02 | A microelectromechanical device having a stiffened support beam, and methods of forming stiffened support beams in mems |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20040021690A true KR20040021690A (ko) | 2004-03-10 |
Family
ID=25450137
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR10-2004-7001925A Ceased KR20040021690A (ko) | 2001-08-07 | 2002-08-02 | 마이크로 전기기계 장치 및 마이크로 전기기계 장치 형성방법 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US6632698B2 (enExample) |
| EP (1) | EP1429991A2 (enExample) |
| JP (1) | JP2005527384A (enExample) |
| KR (1) | KR20040021690A (enExample) |
| CN (1) | CN1267336C (enExample) |
| AU (1) | AU2002321901A1 (enExample) |
| TW (1) | TWI222425B (enExample) |
| WO (1) | WO2003014009A2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR200458667Y1 (ko) * | 2010-05-20 | 2012-02-14 | 은윤재 | 일회용 종이컵 |
Families Citing this family (220)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6674562B1 (en) | 1994-05-05 | 2004-01-06 | Iridigm Display Corporation | Interferometric modulation of radiation |
| US6680792B2 (en) | 1994-05-05 | 2004-01-20 | Iridigm Display Corporation | Interferometric modulation of radiation |
| US8014059B2 (en) | 1994-05-05 | 2011-09-06 | Qualcomm Mems Technologies, Inc. | System and method for charge control in a MEMS device |
| US7550794B2 (en) | 2002-09-20 | 2009-06-23 | Idc, Llc | Micromechanical systems device comprising a displaceable electrode and a charge-trapping layer |
| US7297471B1 (en) | 2003-04-15 | 2007-11-20 | Idc, Llc | Method for manufacturing an array of interferometric modulators |
| US7123216B1 (en) | 1994-05-05 | 2006-10-17 | Idc, Llc | Photonic MEMS and structures |
| US7138984B1 (en) | 2001-06-05 | 2006-11-21 | Idc, Llc | Directly laminated touch sensitive screen |
| US7460291B2 (en) | 1994-05-05 | 2008-12-02 | Idc, Llc | Separable modulator |
| US7471444B2 (en) | 1996-12-19 | 2008-12-30 | Idc, Llc | Interferometric modulation of radiation |
| US7532377B2 (en) | 1998-04-08 | 2009-05-12 | Idc, Llc | Movable micro-electromechanical device |
| WO1999052006A2 (en) | 1998-04-08 | 1999-10-14 | Etalon, Inc. | Interferometric modulation of radiation |
| WO2003007049A1 (en) | 1999-10-05 | 2003-01-23 | Iridigm Display Corporation | Photonic mems and structures |
| AU2002316102A1 (en) * | 2001-05-14 | 2002-11-25 | The Regents Of The University Of Michigan | High-performance fully-compliant micro-mechanisms for force/displacement amplification |
| US6794119B2 (en) | 2002-02-12 | 2004-09-21 | Iridigm Display Corporation | Method for fabricating a structure for a microelectromechanical systems (MEMS) device |
| US6574033B1 (en) | 2002-02-27 | 2003-06-03 | Iridigm Display Corporation | Microelectromechanical systems device and method for fabricating same |
| JP3919616B2 (ja) * | 2002-07-05 | 2007-05-30 | キヤノン株式会社 | マイクロ構造体及びその製造方法 |
| US7781850B2 (en) | 2002-09-20 | 2010-08-24 | Qualcomm Mems Technologies, Inc. | Controlling electromechanical behavior of structures within a microelectromechanical systems device |
| US7177068B2 (en) * | 2002-12-20 | 2007-02-13 | Robert Bosch Gmbh | Apparatus, method and system for providing enhanced mechanical protection for thin beams |
| TW200413810A (en) | 2003-01-29 | 2004-08-01 | Prime View Int Co Ltd | Light interference display panel and its manufacturing method |
| TW594360B (en) | 2003-04-21 | 2004-06-21 | Prime View Int Corp Ltd | A method for fabricating an interference display cell |
| TW570896B (en) | 2003-05-26 | 2004-01-11 | Prime View Int Co Ltd | A method for fabricating an interference display cell |
| US7221495B2 (en) | 2003-06-24 | 2007-05-22 | Idc Llc | Thin film precursor stack for MEMS manufacturing |
| US6930368B2 (en) * | 2003-07-31 | 2005-08-16 | Hewlett-Packard Development Company, L.P. | MEMS having a three-wafer structure |
| TWI231865B (en) | 2003-08-26 | 2005-05-01 | Prime View Int Co Ltd | An interference display cell and fabrication method thereof |
| TW593126B (en) * | 2003-09-30 | 2004-06-21 | Prime View Int Co Ltd | A structure of a micro electro mechanical system and manufacturing the same |
| US20050073078A1 (en) * | 2003-10-03 | 2005-04-07 | Markus Lutz | Frequency compensated oscillator design for process tolerances |
| US7012726B1 (en) | 2003-11-03 | 2006-03-14 | Idc, Llc | MEMS devices with unreleased thin film components |
| US7142346B2 (en) | 2003-12-09 | 2006-11-28 | Idc, Llc | System and method for addressing a MEMS display |
| US7161728B2 (en) | 2003-12-09 | 2007-01-09 | Idc, Llc | Area array modulation and lead reduction in interferometric modulators |
| US7532194B2 (en) | 2004-02-03 | 2009-05-12 | Idc, Llc | Driver voltage adjuster |
| US7482730B2 (en) * | 2004-02-09 | 2009-01-27 | Microvision, Inc. | High performance MEMS scanner |
| US7026189B2 (en) | 2004-02-11 | 2006-04-11 | Hewlett-Packard Development Company, L.P. | Wafer packaging and singulation method |
| US7119945B2 (en) | 2004-03-03 | 2006-10-10 | Idc, Llc | Altering temporal response of microelectromechanical elements |
| US7706050B2 (en) | 2004-03-05 | 2010-04-27 | Qualcomm Mems Technologies, Inc. | Integrated modulator illumination |
| US7476327B2 (en) | 2004-05-04 | 2009-01-13 | Idc, Llc | Method of manufacture for microelectromechanical devices |
| US7060895B2 (en) | 2004-05-04 | 2006-06-13 | Idc, Llc | Modifying the electro-mechanical behavior of devices |
| US7164520B2 (en) | 2004-05-12 | 2007-01-16 | Idc, Llc | Packaging for an interferometric modulator |
| US7442918B2 (en) * | 2004-05-14 | 2008-10-28 | Microvision, Inc. | MEMS device having simplified drive |
| US7256922B2 (en) | 2004-07-02 | 2007-08-14 | Idc, Llc | Interferometric modulators with thin film transistors |
| KR101354520B1 (ko) | 2004-07-29 | 2014-01-21 | 퀄컴 엠이엠에스 테크놀로지스, 인크. | 간섭 변조기의 미소기전 동작을 위한 시스템 및 방법 |
| US7515147B2 (en) | 2004-08-27 | 2009-04-07 | Idc, Llc | Staggered column drive circuit systems and methods |
| US7560299B2 (en) | 2004-08-27 | 2009-07-14 | Idc, Llc | Systems and methods of actuating MEMS display elements |
| US7889163B2 (en) | 2004-08-27 | 2011-02-15 | Qualcomm Mems Technologies, Inc. | Drive method for MEMS devices |
| US7499208B2 (en) | 2004-08-27 | 2009-03-03 | Udc, Llc | Current mode display driver circuit realization feature |
| US7551159B2 (en) | 2004-08-27 | 2009-06-23 | Idc, Llc | System and method of sensing actuation and release voltages of an interferometric modulator |
| US7602375B2 (en) | 2004-09-27 | 2009-10-13 | Idc, Llc | Method and system for writing data to MEMS display elements |
| US7653371B2 (en) | 2004-09-27 | 2010-01-26 | Qualcomm Mems Technologies, Inc. | Selectable capacitance circuit |
| US20060076634A1 (en) | 2004-09-27 | 2006-04-13 | Lauren Palmateer | Method and system for packaging MEMS devices with incorporated getter |
| US7369294B2 (en) | 2004-09-27 | 2008-05-06 | Idc, Llc | Ornamental display device |
| US7554714B2 (en) | 2004-09-27 | 2009-06-30 | Idc, Llc | Device and method for manipulation of thermal response in a modulator |
| US7369296B2 (en) | 2004-09-27 | 2008-05-06 | Idc, Llc | Device and method for modifying actuation voltage thresholds of a deformable membrane in an interferometric modulator |
| US7405861B2 (en) | 2004-09-27 | 2008-07-29 | Idc, Llc | Method and device for protecting interferometric modulators from electrostatic discharge |
| US8878825B2 (en) | 2004-09-27 | 2014-11-04 | Qualcomm Mems Technologies, Inc. | System and method for providing a variable refresh rate of an interferometric modulator display |
| US7446927B2 (en) | 2004-09-27 | 2008-11-04 | Idc, Llc | MEMS switch with set and latch electrodes |
| US7321456B2 (en) | 2004-09-27 | 2008-01-22 | Idc, Llc | Method and device for corner interferometric modulation |
| US7368803B2 (en) | 2004-09-27 | 2008-05-06 | Idc, Llc | System and method for protecting microelectromechanical systems array using back-plate with non-flat portion |
| US7259449B2 (en) | 2004-09-27 | 2007-08-21 | Idc, Llc | Method and system for sealing a substrate |
| US7460246B2 (en) | 2004-09-27 | 2008-12-02 | Idc, Llc | Method and system for sensing light using interferometric elements |
| US7626581B2 (en) | 2004-09-27 | 2009-12-01 | Idc, Llc | Device and method for display memory using manipulation of mechanical response |
| US7545550B2 (en) | 2004-09-27 | 2009-06-09 | Idc, Llc | Systems and methods of actuating MEMS display elements |
| US7310179B2 (en) | 2004-09-27 | 2007-12-18 | Idc, Llc | Method and device for selective adjustment of hysteresis window |
| US7136213B2 (en) | 2004-09-27 | 2006-11-14 | Idc, Llc | Interferometric modulators having charge persistence |
| US7359066B2 (en) | 2004-09-27 | 2008-04-15 | Idc, Llc | Electro-optical measurement of hysteresis in interferometric modulators |
| US7405924B2 (en) | 2004-09-27 | 2008-07-29 | Idc, Llc | System and method for protecting microelectromechanical systems array using structurally reinforced back-plate |
| US7612932B2 (en) | 2004-09-27 | 2009-11-03 | Idc, Llc | Microelectromechanical device with optical function separated from mechanical and electrical function |
| US7130104B2 (en) * | 2004-09-27 | 2006-10-31 | Idc, Llc | Methods and devices for inhibiting tilting of a mirror in an interferometric modulator |
| US7343080B2 (en) | 2004-09-27 | 2008-03-11 | Idc, Llc | System and method of testing humidity in a sealed MEMS device |
| US20060176487A1 (en) | 2004-09-27 | 2006-08-10 | William Cummings | Process control monitors for interferometric modulators |
| US7936497B2 (en) | 2004-09-27 | 2011-05-03 | Qualcomm Mems Technologies, Inc. | MEMS device having deformable membrane characterized by mechanical persistence |
| US7424198B2 (en) | 2004-09-27 | 2008-09-09 | Idc, Llc | Method and device for packaging a substrate |
| US7453579B2 (en) | 2004-09-27 | 2008-11-18 | Idc, Llc | Measurement of the dynamic characteristics of interferometric modulators |
| US7675669B2 (en) | 2004-09-27 | 2010-03-09 | Qualcomm Mems Technologies, Inc. | Method and system for driving interferometric modulators |
| US7161730B2 (en) | 2004-09-27 | 2007-01-09 | Idc, Llc | System and method for providing thermal compensation for an interferometric modulator display |
| US7724993B2 (en) | 2004-09-27 | 2010-05-25 | Qualcomm Mems Technologies, Inc. | MEMS switches with deforming membranes |
| US7417783B2 (en) | 2004-09-27 | 2008-08-26 | Idc, Llc | Mirror and mirror layer for optical modulator and method |
| US7420728B2 (en) | 2004-09-27 | 2008-09-02 | Idc, Llc | Methods of fabricating interferometric modulators by selectively removing a material |
| US7944599B2 (en) | 2004-09-27 | 2011-05-17 | Qualcomm Mems Technologies, Inc. | Electromechanical device with optical function separated from mechanical and electrical function |
| US7535466B2 (en) | 2004-09-27 | 2009-05-19 | Idc, Llc | System with server based control of client device display features |
| US7420725B2 (en) | 2004-09-27 | 2008-09-02 | Idc, Llc | Device having a conductive light absorbing mask and method for fabricating same |
| US7710629B2 (en) | 2004-09-27 | 2010-05-04 | Qualcomm Mems Technologies, Inc. | System and method for display device with reinforcing substance |
| US7692839B2 (en) | 2004-09-27 | 2010-04-06 | Qualcomm Mems Technologies, Inc. | System and method of providing MEMS device with anti-stiction coating |
| US7719500B2 (en) | 2004-09-27 | 2010-05-18 | Qualcomm Mems Technologies, Inc. | Reflective display pixels arranged in non-rectangular arrays |
| US7630119B2 (en) | 2004-09-27 | 2009-12-08 | Qualcomm Mems Technologies, Inc. | Apparatus and method for reducing slippage between structures in an interferometric modulator |
| US7553684B2 (en) | 2004-09-27 | 2009-06-30 | Idc, Llc | Method of fabricating interferometric devices using lift-off processing techniques |
| US7349136B2 (en) | 2004-09-27 | 2008-03-25 | Idc, Llc | Method and device for a display having transparent components integrated therein |
| US7843410B2 (en) | 2004-09-27 | 2010-11-30 | Qualcomm Mems Technologies, Inc. | Method and device for electrically programmable display |
| US7583429B2 (en) | 2004-09-27 | 2009-09-01 | Idc, Llc | Ornamental display device |
| US7289259B2 (en) | 2004-09-27 | 2007-10-30 | Idc, Llc | Conductive bus structure for interferometric modulator array |
| US7345805B2 (en) | 2004-09-27 | 2008-03-18 | Idc, Llc | Interferometric modulator array with integrated MEMS electrical switches |
| US7808703B2 (en) | 2004-09-27 | 2010-10-05 | Qualcomm Mems Technologies, Inc. | System and method for implementation of interferometric modulator displays |
| US7289256B2 (en) | 2004-09-27 | 2007-10-30 | Idc, Llc | Electrical characterization of interferometric modulators |
| US7684104B2 (en) | 2004-09-27 | 2010-03-23 | Idc, Llc | MEMS using filler material and method |
| US7299681B2 (en) | 2004-09-27 | 2007-11-27 | Idc, Llc | Method and system for detecting leak in electronic devices |
| US7302157B2 (en) | 2004-09-27 | 2007-11-27 | Idc, Llc | System and method for multi-level brightness in interferometric modulation |
| US7564612B2 (en) | 2004-09-27 | 2009-07-21 | Idc, Llc | Photonic MEMS and structures |
| US7317568B2 (en) | 2004-09-27 | 2008-01-08 | Idc, Llc | System and method of implementation of interferometric modulators for display mirrors |
| US8008736B2 (en) | 2004-09-27 | 2011-08-30 | Qualcomm Mems Technologies, Inc. | Analog interferometric modulator device |
| US7304784B2 (en) | 2004-09-27 | 2007-12-04 | Idc, Llc | Reflective display device having viewable display on both sides |
| US7916103B2 (en) | 2004-09-27 | 2011-03-29 | Qualcomm Mems Technologies, Inc. | System and method for display device with end-of-life phenomena |
| US8310441B2 (en) | 2004-09-27 | 2012-11-13 | Qualcomm Mems Technologies, Inc. | Method and system for writing data to MEMS display elements |
| US7486429B2 (en) | 2004-09-27 | 2009-02-03 | Idc, Llc | Method and device for multistate interferometric light modulation |
| US7586484B2 (en) | 2004-09-27 | 2009-09-08 | Idc, Llc | Controller and driver features for bi-stable display |
| US7355780B2 (en) | 2004-09-27 | 2008-04-08 | Idc, Llc | System and method of illuminating interferometric modulators using backlighting |
| US7373026B2 (en) | 2004-09-27 | 2008-05-13 | Idc, Llc | MEMS device fabricated on a pre-patterned substrate |
| US7701631B2 (en) | 2004-09-27 | 2010-04-20 | Qualcomm Mems Technologies, Inc. | Device having patterned spacers for backplates and method of making the same |
| US7679627B2 (en) | 2004-09-27 | 2010-03-16 | Qualcomm Mems Technologies, Inc. | Controller and driver features for bi-stable display |
| US7893919B2 (en) | 2004-09-27 | 2011-02-22 | Qualcomm Mems Technologies, Inc. | Display region architectures |
| US8124434B2 (en) | 2004-09-27 | 2012-02-28 | Qualcomm Mems Technologies, Inc. | Method and system for packaging a display |
| US7492502B2 (en) | 2004-09-27 | 2009-02-17 | Idc, Llc | Method of fabricating a free-standing microstructure |
| US7415186B2 (en) | 2004-09-27 | 2008-08-19 | Idc, Llc | Methods for visually inspecting interferometric modulators for defects |
| US7920135B2 (en) | 2004-09-27 | 2011-04-05 | Qualcomm Mems Technologies, Inc. | Method and system for driving a bi-stable display |
| US7372613B2 (en) | 2004-09-27 | 2008-05-13 | Idc, Llc | Method and device for multistate interferometric light modulation |
| US7813026B2 (en) | 2004-09-27 | 2010-10-12 | Qualcomm Mems Technologies, Inc. | System and method of reducing color shift in a display |
| US7527995B2 (en) | 2004-09-27 | 2009-05-05 | Qualcomm Mems Technologies, Inc. | Method of making prestructure for MEMS systems |
| US7327510B2 (en) | 2004-09-27 | 2008-02-05 | Idc, Llc | Process for modifying offset voltage characteristics of an interferometric modulator |
| US7417735B2 (en) | 2004-09-27 | 2008-08-26 | Idc, Llc | Systems and methods for measuring color and contrast in specular reflective devices |
| US7532195B2 (en) | 2004-09-27 | 2009-05-12 | Idc, Llc | Method and system for reducing power consumption in a display |
| US7668415B2 (en) | 2004-09-27 | 2010-02-23 | Qualcomm Mems Technologies, Inc. | Method and device for providing electronic circuitry on a backplate |
| US7422962B2 (en) * | 2004-10-27 | 2008-09-09 | Hewlett-Packard Development Company, L.P. | Method of singulating electronic devices |
| US7273762B2 (en) * | 2004-11-09 | 2007-09-25 | Freescale Semiconductor, Inc. | Microelectromechanical (MEM) device including a spring release bridge and method of making the same |
| TW200628877A (en) | 2005-02-04 | 2006-08-16 | Prime View Int Co Ltd | Method of manufacturing optical interference type color display |
| US7636101B2 (en) | 2005-02-09 | 2009-12-22 | Microvision, Inc. | MEMS scanner adapted to a laser printer |
| FR2883560A1 (fr) * | 2005-03-24 | 2006-09-29 | St Microelectronics Sa | Microsysteme electromecanique comprenant une poutre se deformant par flexion |
| US7920136B2 (en) | 2005-05-05 | 2011-04-05 | Qualcomm Mems Technologies, Inc. | System and method of driving a MEMS display device |
| US7948457B2 (en) | 2005-05-05 | 2011-05-24 | Qualcomm Mems Technologies, Inc. | Systems and methods of actuating MEMS display elements |
| EP1878001A1 (en) | 2005-05-05 | 2008-01-16 | QUALCOMM Incorporated, Inc. | Dynamic driver ic and display panel configuration |
| US7884989B2 (en) | 2005-05-27 | 2011-02-08 | Qualcomm Mems Technologies, Inc. | White interferometric modulators and methods for forming the same |
| JP2009503564A (ja) | 2005-07-22 | 2009-01-29 | クアルコム，インコーポレイテッド | Ｍｅｍｓデバイスのための支持構造、およびその方法 |
| KR20080040715A (ko) | 2005-07-22 | 2008-05-08 | 콸콤 인코포레이티드 | Ｍｅｍｓ 장치를 위한 지지 구조물 및 그 방법들 |
| EP1910218A1 (en) * | 2005-07-22 | 2008-04-16 | Qualcomm Mems Technologies, Inc. | Mems devices having support structures and methods of fabricating the same |
| EP2495212A3 (en) | 2005-07-22 | 2012-10-31 | QUALCOMM MEMS Technologies, Inc. | Mems devices having support structures and methods of fabricating the same |
| US7355779B2 (en) | 2005-09-02 | 2008-04-08 | Idc, Llc | Method and system for driving MEMS display elements |
| US7630114B2 (en) | 2005-10-28 | 2009-12-08 | Idc, Llc | Diffusion barrier layer for MEMS devices |
| US7361900B2 (en) * | 2005-12-14 | 2008-04-22 | Northrop Grumman Corporation | “I” beam bridge interconnection for ultra-sensitive silicon sensor |
| US8391630B2 (en) | 2005-12-22 | 2013-03-05 | Qualcomm Mems Technologies, Inc. | System and method for power reduction when decompressing video streams for interferometric modulator displays |
| US7795061B2 (en) | 2005-12-29 | 2010-09-14 | Qualcomm Mems Technologies, Inc. | Method of creating MEMS device cavities by a non-etching process |
| US7636151B2 (en) | 2006-01-06 | 2009-12-22 | Qualcomm Mems Technologies, Inc. | System and method for providing residual stress test structures |
| US7916980B2 (en) | 2006-01-13 | 2011-03-29 | Qualcomm Mems Technologies, Inc. | Interconnect structure for MEMS device |
| US7382515B2 (en) | 2006-01-18 | 2008-06-03 | Qualcomm Mems Technologies, Inc. | Silicon-rich silicon nitrides as etch stops in MEMS manufacture |
| US8194056B2 (en) | 2006-02-09 | 2012-06-05 | Qualcomm Mems Technologies Inc. | Method and system for writing data to MEMS display elements |
| US7582952B2 (en) | 2006-02-21 | 2009-09-01 | Qualcomm Mems Technologies, Inc. | Method for providing and removing discharging interconnect for chip-on-glass output leads and structures thereof |
| US7547568B2 (en) | 2006-02-22 | 2009-06-16 | Qualcomm Mems Technologies, Inc. | Electrical conditioning of MEMS device and insulating layer thereof |
| US7550810B2 (en) | 2006-02-23 | 2009-06-23 | Qualcomm Mems Technologies, Inc. | MEMS device having a layer movable at asymmetric rates |
| US7450295B2 (en) | 2006-03-02 | 2008-11-11 | Qualcomm Mems Technologies, Inc. | Methods for producing MEMS with protective coatings using multi-component sacrificial layers |
| US7643203B2 (en) | 2006-04-10 | 2010-01-05 | Qualcomm Mems Technologies, Inc. | Interferometric optical display system with broadband characteristics |
| US7903047B2 (en) | 2006-04-17 | 2011-03-08 | Qualcomm Mems Technologies, Inc. | Mode indicator for interferometric modulator displays |
| US7623287B2 (en) | 2006-04-19 | 2009-11-24 | Qualcomm Mems Technologies, Inc. | Non-planar surface structures and process for microelectromechanical systems |
| US7711239B2 (en) | 2006-04-19 | 2010-05-04 | Qualcomm Mems Technologies, Inc. | Microelectromechanical device and method utilizing nanoparticles |
| US7417784B2 (en) | 2006-04-19 | 2008-08-26 | Qualcomm Mems Technologies, Inc. | Microelectromechanical device and method utilizing a porous surface |
| US7527996B2 (en) | 2006-04-19 | 2009-05-05 | Qualcomm Mems Technologies, Inc. | Non-planar surface structures and process for microelectromechanical systems |
| US8049713B2 (en) | 2006-04-24 | 2011-11-01 | Qualcomm Mems Technologies, Inc. | Power consumption optimized display update |
| US7369292B2 (en) | 2006-05-03 | 2008-05-06 | Qualcomm Mems Technologies, Inc. | Electrode and interconnect materials for MEMS devices |
| US7321457B2 (en) | 2006-06-01 | 2008-01-22 | Qualcomm Incorporated | Process and structure for fabrication of MEMS device having isolated edge posts |
| US7649671B2 (en) | 2006-06-01 | 2010-01-19 | Qualcomm Mems Technologies, Inc. | Analog interferometric modulator device with electrostatic actuation and release |
| US7405863B2 (en) | 2006-06-01 | 2008-07-29 | Qualcomm Mems Technologies, Inc. | Patterning of mechanical layer in MEMS to reduce stresses at supports |
| US7471442B2 (en) | 2006-06-15 | 2008-12-30 | Qualcomm Mems Technologies, Inc. | Method and apparatus for low range bit depth enhancements for MEMS display architectures |
| US7702192B2 (en) | 2006-06-21 | 2010-04-20 | Qualcomm Mems Technologies, Inc. | Systems and methods for driving MEMS display |
| US7835061B2 (en) | 2006-06-28 | 2010-11-16 | Qualcomm Mems Technologies, Inc. | Support structures for free-standing electromechanical devices |
| US7385744B2 (en) | 2006-06-28 | 2008-06-10 | Qualcomm Mems Technologies, Inc. | Support structure for free-standing MEMS device and methods for forming the same |
| US7777715B2 (en) | 2006-06-29 | 2010-08-17 | Qualcomm Mems Technologies, Inc. | Passive circuits for de-multiplexing display inputs |
| US7527998B2 (en) | 2006-06-30 | 2009-05-05 | Qualcomm Mems Technologies, Inc. | Method of manufacturing MEMS devices providing air gap control |
| US7388704B2 (en) | 2006-06-30 | 2008-06-17 | Qualcomm Mems Technologies, Inc. | Determination of interferometric modulator mirror curvature and airgap variation using digital photographs |
| JP4327183B2 (ja) * | 2006-07-31 | 2009-09-09 | 株式会社日立製作所 | 内燃機関の高圧燃料ポンプ制御装置 |
| US7566664B2 (en) | 2006-08-02 | 2009-07-28 | Qualcomm Mems Technologies, Inc. | Selective etching of MEMS using gaseous halides and reactive co-etchants |
| US7763546B2 (en) | 2006-08-02 | 2010-07-27 | Qualcomm Mems Technologies, Inc. | Methods for reducing surface charges during the manufacture of microelectromechanical systems devices |
| US7903532B2 (en) * | 2006-10-11 | 2011-03-08 | Seagate Technology Llc | Elevated electrodes for probe position sensing |
| US7983138B2 (en) * | 2006-10-11 | 2011-07-19 | Seagate Technology Llc | Surface spacing using rigid spacers |
| US7629197B2 (en) | 2006-10-18 | 2009-12-08 | Qualcomm Mems Technologies, Inc. | Spatial light modulator |
| US7545552B2 (en) | 2006-10-19 | 2009-06-09 | Qualcomm Mems Technologies, Inc. | Sacrificial spacer process and resultant structure for MEMS support structure |
| US8115987B2 (en) | 2007-02-01 | 2012-02-14 | Qualcomm Mems Technologies, Inc. | Modulating the intensity of light from an interferometric reflector |
| US7742220B2 (en) | 2007-03-28 | 2010-06-22 | Qualcomm Mems Technologies, Inc. | Microelectromechanical device and method utilizing conducting layers separated by stops |
| US7715085B2 (en) | 2007-05-09 | 2010-05-11 | Qualcomm Mems Technologies, Inc. | Electromechanical system having a dielectric movable membrane and a mirror |
| US7643202B2 (en) | 2007-05-09 | 2010-01-05 | Qualcomm Mems Technologies, Inc. | Microelectromechanical system having a dielectric movable membrane and a mirror |
| US7719752B2 (en) | 2007-05-11 | 2010-05-18 | Qualcomm Mems Technologies, Inc. | MEMS structures, methods of fabricating MEMS components on separate substrates and assembly of same |
| US7643199B2 (en) | 2007-06-19 | 2010-01-05 | Qualcomm Mems Technologies, Inc. | High aperture-ratio top-reflective AM-iMod displays |
| US7782517B2 (en) | 2007-06-21 | 2010-08-24 | Qualcomm Mems Technologies, Inc. | Infrared and dual mode displays |
| US7630121B2 (en) | 2007-07-02 | 2009-12-08 | Qualcomm Mems Technologies, Inc. | Electromechanical device with optical function separated from mechanical and electrical function |
| US8068268B2 (en) | 2007-07-03 | 2011-11-29 | Qualcomm Mems Technologies, Inc. | MEMS devices having improved uniformity and methods for making them |
| EP2183623A1 (en) | 2007-07-31 | 2010-05-12 | Qualcomm Mems Technologies, Inc. | Devices for enhancing colour shift of interferometric modulators |
| US8072402B2 (en) | 2007-08-29 | 2011-12-06 | Qualcomm Mems Technologies, Inc. | Interferometric optical modulator with broadband reflection characteristics |
| US7773286B2 (en) | 2007-09-14 | 2010-08-10 | Qualcomm Mems Technologies, Inc. | Periodic dimple array |
| US7847999B2 (en) | 2007-09-14 | 2010-12-07 | Qualcomm Mems Technologies, Inc. | Interferometric modulator display devices |
| US8058549B2 (en) | 2007-10-19 | 2011-11-15 | Qualcomm Mems Technologies, Inc. | Photovoltaic devices with integrated color interferometric film stacks |
| KR20100090257A (ko) | 2007-10-19 | 2010-08-13 | 퀄컴 엠이엠스 테크놀로지스, 인크. | 광기전력 소자가 통합된 디스플레이 |
| US8054527B2 (en) | 2007-10-23 | 2011-11-08 | Qualcomm Mems Technologies, Inc. | Adjustably transmissive MEMS-based devices |
| DE102007052367A1 (de) * | 2007-11-02 | 2009-05-07 | Robert Bosch Gmbh | Mikromechanisches System |
| US8941631B2 (en) | 2007-11-16 | 2015-01-27 | Qualcomm Mems Technologies, Inc. | Simultaneous light collection and illumination on an active display |
| US7715079B2 (en) | 2007-12-07 | 2010-05-11 | Qualcomm Mems Technologies, Inc. | MEMS devices requiring no mechanical support |
| US8164821B2 (en) | 2008-02-22 | 2012-04-24 | Qualcomm Mems Technologies, Inc. | Microelectromechanical device with thermal expansion balancing layer or stiffening layer |
| TWI474964B (zh) * | 2008-03-03 | 2015-03-01 | Hk Applied Science & Tech Res | 微機電致動裝置 |
| US7944604B2 (en) | 2008-03-07 | 2011-05-17 | Qualcomm Mems Technologies, Inc. | Interferometric modulator in transmission mode |
| US7612933B2 (en) | 2008-03-27 | 2009-11-03 | Qualcomm Mems Technologies, Inc. | Microelectromechanical device with spacing layer |
| US7898723B2 (en) | 2008-04-02 | 2011-03-01 | Qualcomm Mems Technologies, Inc. | Microelectromechanical systems display element with photovoltaic structure |
| US7969638B2 (en) | 2008-04-10 | 2011-06-28 | Qualcomm Mems Technologies, Inc. | Device having thin black mask and method of fabricating the same |
| US8023167B2 (en) | 2008-06-25 | 2011-09-20 | Qualcomm Mems Technologies, Inc. | Backlight displays |
| US7768690B2 (en) | 2008-06-25 | 2010-08-03 | Qualcomm Mems Technologies, Inc. | Backlight displays |
| US7746539B2 (en) | 2008-06-25 | 2010-06-29 | Qualcomm Mems Technologies, Inc. | Method for packing a display device and the device obtained thereof |
| US7859740B2 (en) | 2008-07-11 | 2010-12-28 | Qualcomm Mems Technologies, Inc. | Stiction mitigation with integrated mech micro-cantilevers through vertical stress gradient control |
| US7855826B2 (en) | 2008-08-12 | 2010-12-21 | Qualcomm Mems Technologies, Inc. | Method and apparatus to reduce or eliminate stiction and image retention in interferometric modulator devices |
| US8358266B2 (en) | 2008-09-02 | 2013-01-22 | Qualcomm Mems Technologies, Inc. | Light turning device with prismatic light turning features |
| US20100181652A1 (en) * | 2009-01-16 | 2010-07-22 | Honeywell International Inc. | Systems and methods for stiction reduction in mems devices |
| WO2010096439A1 (en) * | 2009-02-17 | 2010-08-26 | Leversense, Llc | Resonant sensors and methods of use thereof for the determination of analytes |
| JP2010210424A (ja) * | 2009-03-10 | 2010-09-24 | Panasonic Electric Works Co Ltd | 加速度センサ |
| US8270056B2 (en) | 2009-03-23 | 2012-09-18 | Qualcomm Mems Technologies, Inc. | Display device with openings between sub-pixels and method of making same |
| US8736590B2 (en) | 2009-03-27 | 2014-05-27 | Qualcomm Mems Technologies, Inc. | Low voltage driver scheme for interferometric modulators |
| GB2470398B (en) * | 2009-05-21 | 2014-03-19 | Ge Infrastructure Sensing Inc | A resonant sensor for measuring the pressure of a fluid |
| KR20120090772A (ko) | 2009-05-29 | 2012-08-17 | 퀄컴 엠이엠에스 테크놀로지스, 인크. | 조명장치 및 그의 제조방법 |
| US8270062B2 (en) | 2009-09-17 | 2012-09-18 | Qualcomm Mems Technologies, Inc. | Display device with at least one movable stop element |
| US8488228B2 (en) | 2009-09-28 | 2013-07-16 | Qualcomm Mems Technologies, Inc. | Interferometric display with interferometric reflector |
| KR20130100232A (ko) | 2010-04-09 | 2013-09-10 | 퀄컴 엠이엠에스 테크놀로지스, 인크. | 전기 기계 디바이스의 기계층 및 그 형성 방법 |
| EP2606485A1 (en) | 2010-08-17 | 2013-06-26 | Qualcomm Mems Technologies, Inc. | Actuation and calibration of a charge neutral electrode in an interferometric display device |
| US9057872B2 (en) | 2010-08-31 | 2015-06-16 | Qualcomm Mems Technologies, Inc. | Dielectric enhanced mirror for IMOD display |
| US8963159B2 (en) | 2011-04-04 | 2015-02-24 | Qualcomm Mems Technologies, Inc. | Pixel via and methods of forming the same |
| US9134527B2 (en) | 2011-04-04 | 2015-09-15 | Qualcomm Mems Technologies, Inc. | Pixel via and methods of forming the same |
| US8659816B2 (en) | 2011-04-25 | 2014-02-25 | Qualcomm Mems Technologies, Inc. | Mechanical layer and methods of making the same |
| US8736939B2 (en) | 2011-11-04 | 2014-05-27 | Qualcomm Mems Technologies, Inc. | Matching layer thin-films for an electromechanical systems reflective display device |
| JP2014103434A (ja) * | 2012-11-16 | 2014-06-05 | Seiko Epson Corp | 振動子、振動子の製造方法、電子機器、及び移動体 |
| DE102016014001B4 (de) * | 2016-11-23 | 2020-11-12 | Blickfeld GmbH | MEMS Scanmodul für einen Lichtscanner mit mindestens zwei Stützelementen |
| JP7158479B2 (ja) * | 2018-07-09 | 2022-10-21 | 住友精密工業株式会社 | Ｍｅｍｓ素子及びそれを用いたシャッタ装置 |
| WO2022264796A1 (ja) * | 2021-06-16 | 2022-12-22 | ローム株式会社 | 加速度センサ |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0623782B2 (ja) * | 1988-11-15 | 1994-03-30 | 株式会社日立製作所 | 静電容量式加速度センサ及び半導体圧力センサ |
| EP0683921B1 (en) * | 1993-02-04 | 2004-06-16 | Cornell Research Foundation, Inc. | Microstructures and single mask, single-crystal process for fabrication thereof |
| US5563343A (en) * | 1993-05-26 | 1996-10-08 | Cornell Research Foundation, Inc. | Microelectromechanical lateral accelerometer |
| US5726480A (en) * | 1995-01-27 | 1998-03-10 | The Regents Of The University Of California | Etchants for use in micromachining of CMOS Microaccelerometers and microelectromechanical devices and method of making the same |
| US5862003A (en) * | 1995-06-23 | 1999-01-19 | Saif; Muhammad T. A. | Micromotion amplifier |
| US6000280A (en) * | 1995-07-20 | 1999-12-14 | Cornell Research Foundation, Inc. | Drive electrodes for microfabricated torsional cantilevers |
| EP0880671A2 (en) * | 1995-07-20 | 1998-12-02 | Cornell Research Foundation, Inc. | Microfabricated torsional cantilevers for sensitive force detection |
| JP3512968B2 (ja) * | 1996-04-11 | 2004-03-31 | 株式会社日本自動車部品総合研究所 | 半導体装置の製造方法 |
| DE19632060B4 (de) * | 1996-08-09 | 2012-05-03 | Robert Bosch Gmbh | Verfahren zur Herstellung eines Drehratensensors |
| US6093330A (en) * | 1997-06-02 | 2000-07-25 | Cornell Research Foundation, Inc. | Microfabrication process for enclosed microstructures |
| US6180536B1 (en) * | 1998-06-04 | 2001-01-30 | Cornell Research Foundation, Inc. | Suspended moving channels and channel actuators for microfluidic applications and method for making |
| US6445106B1 (en) * | 2000-02-18 | 2002-09-03 | Intel Corporation | Micro-electromechanical structure resonator, method of making, and method of using |
| US6308631B1 (en) * | 2000-07-20 | 2001-10-30 | The United States Of America As Represented By The Secretary Of The Navy | Mems vertical to horizontal motion translation device |
| US6388789B1 (en) * | 2000-09-19 | 2002-05-14 | The Charles Stark Draper Laboratory, Inc. | Multi-axis magnetically actuated device |
-
2001
- 2001-08-07 US US09/924,370 patent/US6632698B2/en not_active Expired - Fee Related
-
2002
- 2002-06-28 TW TW091114384A patent/TWI222425B/zh not_active IP Right Cessation
- 2002-08-02 KR KR10-2004-7001925A patent/KR20040021690A/ko not_active Ceased
- 2002-08-02 CN CNB028198379A patent/CN1267336C/zh not_active Expired - Fee Related
- 2002-08-02 JP JP2003518970A patent/JP2005527384A/ja active Pending
- 2002-08-02 WO PCT/US2002/024653 patent/WO2003014009A2/en not_active Ceased
- 2002-08-02 AU AU2002321901A patent/AU2002321901A1/en not_active Abandoned
- 2002-08-02 EP EP02756932A patent/EP1429991A2/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR200458667Y1 (ko) * | 2010-05-20 | 2012-02-14 | 은윤재 | 일회용 종이컵 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI222425B (en) | 2004-10-21 |
| CN1267336C (zh) | 2006-08-02 |
| CN1564779A (zh) | 2005-01-12 |
| WO2003014009A3 (en) | 2004-04-08 |
| EP1429991A2 (en) | 2004-06-23 |
| US20030032215A1 (en) | 2003-02-13 |
| AU2002321901A1 (en) | 2003-02-24 |
| WO2003014009A2 (en) | 2003-02-20 |
| US6632698B2 (en) | 2003-10-14 |
| JP2005527384A (ja) | 2005-09-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR20040021690A (ko) | 마이크로 전기기계 장치 및 마이크로 전기기계 장치 형성방법 | |
| KR101454497B1 (ko) | 집적 회로-ｍｅｍｓ 플랫폼상에 구조물을 지지하는 검사-질량체 및 이의 제조 방법 | |
| JP5985147B2 (ja) | 構造の平面外変位のための停止部を有する可動部を備える微小機械構造およびその製造プロセス | |
| US7146856B2 (en) | Dynamically balanced capacitive pick-off accelerometer | |
| JP5138144B2 (ja) | 双安定微小電子機械システムに基づくシステム、その作動方法及びその製造方法 | |
| JP5462780B2 (ja) | マイクロエレクトロメカニカルシステム用マイクロミラー | |
| US6650806B2 (en) | Compliant push/pull connector microstructure | |
| JP2005510990A (ja) | 多方向熱アクチュエータ | |
| US20050139542A1 (en) | Stiffened surface micromachined structures and process for fabricating the same | |
| CN101583558A (zh) | 具有多个导电区域的结构部件 | |
| JP6067026B2 (ja) | マイクロ電気機械システム（ｍｅｍｓ） | |
| KR20030067665A (ko) | 제어된 절곡을 갖는 지향식 작동 수직 열 액츄에이터 | |
| US20090322260A1 (en) | Electrostatic microactuator | |
| TW201922610A (zh) | 微機械ｚ軸慣性感測器 | |
| KR20030090624A (ko) | 부유형 마이크로머신 구조물 | |
| JP2002509808A (ja) | 集積大面積ミクロ構造体およびミクロメカニカルデバイス | |
| US10544037B2 (en) | Integrated semiconductor device and manufacturing method | |
| EP1331201A2 (en) | Resonant thermal out-of-plane buckle-beam acuator | |
| Comtois et al. | Design techniques for surface-micromachining MEMS processes | |
| EP0800651B1 (en) | A micromechanical accelerometer | |
| JP2004502146A (ja) | 電子超小型部品ならびに該電子超小型部品を内蔵したセンサ及びアクチュエータ | |
| Millet et al. | Reliability of self-assembled 3D microstructures: snap-through modeling and experimental validation |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20040206 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20070802 Comment text: Request for Examination of Application |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20081209 Patent event code: PE09021S01D |
|
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
Patent event date: 20090327 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20081209 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |