KR20040014412A - 반도체 패키지를 위한 리드 및 방열판 - Google Patents

반도체 패키지를 위한 리드 및 방열판 Download PDF

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Publication number
KR20040014412A
KR20040014412A KR10-2003-7006558A KR20037006558A KR20040014412A KR 20040014412 A KR20040014412 A KR 20040014412A KR 20037006558 A KR20037006558 A KR 20037006558A KR 20040014412 A KR20040014412 A KR 20040014412A
Authority
KR
South Korea
Prior art keywords
microelectronic
lead
base
copper
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR10-2003-7006558A
Other languages
English (en)
Korean (ko)
Inventor
수브라마니안자이
Original Assignee
허니웰 인터내셔널 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 허니웰 인터내셔널 인코포레이티드 filed Critical 허니웰 인터내셔널 인코포레이티드
Publication of KR20040014412A publication Critical patent/KR20040014412A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR10-2003-7006558A 2000-11-14 2001-10-30 반도체 패키지를 위한 리드 및 방열판 Withdrawn KR20040014412A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US24904300P 2000-11-14 2000-11-14
US60/249,043 2000-11-14
PCT/US2001/044849 WO2002041394A2 (en) 2000-11-14 2001-10-30 Lid and heat spreader design for a semiconductor package

Publications (1)

Publication Number Publication Date
KR20040014412A true KR20040014412A (ko) 2004-02-14

Family

ID=22941809

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2003-7006558A Withdrawn KR20040014412A (ko) 2000-11-14 2001-10-30 반도체 패키지를 위한 리드 및 방열판

Country Status (7)

Country Link
US (2) US6958536B2 (https=)
EP (1) EP1336199A2 (https=)
JP (1) JP2004528702A (https=)
KR (1) KR20040014412A (https=)
CN (1) CN1575520A (https=)
AU (1) AU2002217965A1 (https=)
WO (1) WO2002041394A2 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD509482S1 (en) * 2003-03-06 2005-09-13 Datech Technology Co., Ltd. Heat sink cap
US6888238B1 (en) * 2003-07-09 2005-05-03 Altera Corporation Low warpage flip chip package solution-channel heat spreader
WO2005086217A1 (en) * 2004-02-03 2005-09-15 Infineon Technologies Ag Matrix-type semiconductor package with heat spreader
KR100799614B1 (ko) 2006-05-23 2008-01-30 삼성전기주식회사 열 방출 기능을 가진 멤스 모듈 패키지
WO2009099934A2 (en) * 2008-01-31 2009-08-13 Raytheon Company Methods and apparatus for heat transfer for a component
WO2012074775A1 (en) 2010-11-19 2012-06-07 Analog Devices, Inc. Packaged integrated device with electrically conductive lid
CN104192790A (zh) * 2014-09-15 2014-12-10 华东光电集成器件研究所 一种mems器件热应力隔离结构
US9837333B1 (en) 2016-09-21 2017-12-05 International Business Machines Corporation Electronic package cover having underside rib
US10622282B2 (en) * 2017-07-28 2020-04-14 Qualcomm Incorporated Systems and methods for cooling an electronic device
US20230320039A1 (en) * 2022-04-05 2023-10-05 Honeywell International Inc. Integrated heat spreader
US12341075B1 (en) 2024-12-03 2025-06-24 Auradine, Inc. Systems and methods for cooling electronic circuits

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR860002865A (ko) 1984-09-04 1986-04-30 로버어트 티이 오어너 열발산장치가 일체로 부착된 집적회로 패키지
US5831836A (en) * 1992-01-30 1998-11-03 Lsi Logic Power plane for semiconductor device
US5459352A (en) * 1993-03-31 1995-10-17 Unisys Corporation Integrated circuit package having a liquid metal-aluminum/copper joint
US5485037A (en) 1993-04-12 1996-01-16 Amkor Electronics, Inc. Semiconductor device having a thermal dissipator and electromagnetic shielding
US5956576A (en) * 1996-09-13 1999-09-21 International Business Machines Corporation Enhanced protection of semiconductors with dual surface seal
US6075289A (en) 1996-10-24 2000-06-13 Tessera, Inc. Thermally enhanced packaged semiconductor assemblies
TW359863B (en) 1997-11-28 1999-06-01 Utron Technology Inc Multi-chip stack package
JP3097644B2 (ja) * 1998-01-06 2000-10-10 日本電気株式会社 半導体装置接続構造及び接続方法
US6068051A (en) 1998-03-23 2000-05-30 Intel Corporation Channeled heat sink
JP2000022044A (ja) 1998-07-02 2000-01-21 Mitsubishi Electric Corp 半導体装置とその製造方法
US6118177A (en) * 1998-11-17 2000-09-12 Lucent Technologies, Inc. Heatspreader for a flip chip device, and method for connecting the heatspreader
US6091603A (en) 1999-09-30 2000-07-18 International Business Machines Corporation Customizable lid for improved thermal performance of modules using flip chips
US6222263B1 (en) 1999-10-19 2001-04-24 International Business Machines Corporation Chip assembly with load-bearing lid in thermal contact with the chip
US6784540B2 (en) * 2001-10-10 2004-08-31 International Rectifier Corp. Semiconductor device package with improved cooling

Also Published As

Publication number Publication date
EP1336199A2 (en) 2003-08-20
US20040187309A1 (en) 2004-09-30
WO2002041394A2 (en) 2002-05-23
WO2002041394A3 (en) 2003-05-15
JP2004528702A (ja) 2004-09-16
AU2002217965A1 (en) 2002-05-27
US6958536B2 (en) 2005-10-25
CN1575520A (zh) 2005-02-02
US20040070069A1 (en) 2004-04-15

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