KR20040010588A - Device and method for scribing fragile material substrate - Google Patents

Abstract

The scribe line SL is formed by continuously cooling the cooling spot CP near the heating area while heating to a temperature lower than the softening point of the brittle substrate 50 by the laser spot LS along the area where the scribe line is formed on the surface of the brittle substrate 50. To form cracks. In this case, an initial crack TR is formed at the site where the initial crack is to be formed in the brittle substrate after the heating with the laser spot LS and at the point where the scribe is to be formed at the point before or after cooling by the cooling spot CP. do.

Description

Scribing apparatus and scribing method of a brittle material substrate {DEVICE AND METHOD FOR SCRIBING FRAGILE MATERIAL SUBSTRATE}

Formed by bonding a pair of glass substrates, a liquid crystal panel, which is a kind of FPD, is manufactured by cutting to a predetermined size after a pair of mother glass, each of which is large, are bonded to each other. do. In the case of cutting the mother glass substrate, a scribe line is formed on the mother glass substrate by a cutter in advance. When forming a scribe line with a cutter or cutting a mother glass substrate after forming a scribe line, fine glass powder and glass cullets may generate | occur | produce, and may cause various defects.

In order to avoid the generation of fine glass powder or glass cullets when scribing and cutting with a cutter, a method of using a laser beam to form a scribe line instead of the method of using such a cutter has recently been used. It is put to practical use. 3 is a schematic diagram showing a method of forming a scribe line on a glass substrate using a laser beam. For a scribe line formed as a result of a scribe operation using a laser or a blade, various pretreatment operations are performed before the scribe line is formed. In the description relating to such a processing operation, description will be made using a term called a scribe forming line or a scribe setting line with respect to where a scribe line is to be formed. The initial crack TR is formed in advance along the scribe formation line at the edge of the glass substrate 50, and the laser beam LB from the laser oscillator 61 along the scribe schedule line from the initial crack. This is investigated. The laser beam LB irradiated from the laser oscillation device 61 forms an elliptic laser spot LS on the glass substrate 50 along a scribe schedule line formed on the glass substrate 50. The glass substrate 50 is relatively moved along the longitudinal direction of the laser spot LS with respect to the laser beam LB radiated from the laser oscillation device 61.

Further, a cooling medium such as cooling water is injected from the cooling nozzle 62 near the region where the laser beam LB is irradiated on the surface of the glass substrate 50 and heated.

The compressive stress is generated on the surface of the glass substrate to which the laser beam is irradiated by the heating by the laser beam, and the tensile stress is generated by spraying the cooling medium in the vicinity thereof. As the tensile stress is generated in the region where the compressive stress is generated and in the vicinity of the region, a stress gradient is generated between the respective regions, and vertical cracks are formed on the glass substrate 50 along the scribe line. The process proceeds from the initial crack TR formed at the edge of the glass substrate 50.

In this way, since the vertical cracks formed on the surface of the glass substrate 50 are minute, they are usually invisible to the naked eye and are called blind cracks.

When a blind crack as a scribe line is formed in the glass substrate 50, the glass substrate 50 is supplied to the next cutting process and a force is applied to the glass substrate so that a bending moment acts in the width direction of the blind crack. As a result, the glass substrate 50 is cut along the blind crack.

In such a scribing apparatus, an initial crack TR is formed at an edge portion of the glass substrate 50, and a laser beam is irradiated on the surface of the glass substrate 50 on which the initial crack TR is formed along the scribe line to be heated. In this case, since the vicinity of the initial crack on the surface of the glass substrate 50 is rapidly heated by the laser beam, there is a fear that unnecessary cracks are newly generated from the initial crack TR. As such, the cracks generated from the initial crack cannot be controlled and are not formed along the scribe schedule line. Therefore, the glass substrate on which the cracks are generated becomes defective.

In addition, after forming a blind crack along the X direction, when forming a blind crack along the Y direction orthogonal to the said blind crack, as shown in FIG. 4, the glass substrate in the scribe plan line of the Y direction newly as shown in FIG. Although the initial crack may be formed at a position immediately after the intersection of the edge of the end and the blind crack in the X direction, even in this case, if the portion where the initial crack is formed is rapidly heated by irradiation of the laser beam, it is newly unnecessary from the initial crack. This may occur.

In addition, when the X direction of the glass substrate becomes a full body cut (blind crack reaches the back of the glass) by laser irradiation, even when a blind crack is formed in the Y direction or a full body cut is attempted. It is necessary to newly form an initial crack at a position immediately after the intersection of the end of the glass substrate in the Y-direction scribe line and the full body cut in the X direction, but in this case, the portion where the initial crack is formed is irradiated with the laser beam. When heated suddenly by, there is a fear that unnecessary cracks are newly generated from the initial crack.

The present invention is to solve this problem, the object is that the surface of the brittle material substrate, such as glass substrate is heated rapidly to form a blind crack, even if the scribing operation is started newly generated unnecessary crack from the initial crack It is an object of the present invention to provide a scribing apparatus and a scribing method of a brittle material substrate.

This invention is used when cutting brittle material substrates, such as a glass substrate and a semiconductor wafer used for a flat panel display (henceforth FPD). To a scribe device and a scribe method.

1 is a front view showing an example of an embodiment of a scribing apparatus for a brittle material substrate of the present invention.

2A (a) to (d) are schematic diagrams each showing a scribe line forming work step by the scribing apparatus of the present invention.

2B (a) to (f) are schematic diagrams each showing a scribe line forming work step by the scribing apparatus of the present invention.

3 is a schematic diagram showing a state of formation of a conventional blind crack.

4 is a schematic diagram showing a state of formation of a conventional initial crack.

Fig. 5A is a schematic plan view showing an example of a brittle material substrate, and Fig. 5B is a side view thereof.

FIG. 6 is a partially enlarged view on a glass substrate schematically showing a situation where a blind crack is formed in a form intersecting in two directions. FIG.

The scribing apparatus for a brittle material substrate of the present invention includes heating means for continuously heating at a temperature lower than a softening point of the brittle material substrate along a region where a scribe line is formed on the surface of the brittle material substrate; Cooling means for cooling the vicinity of the brittle material substrate surface region heated by the means, and after the predetermined place of the brittle material surface is heated by the heating means to form an initial crack along the scheduled scribe line at the predetermined place. It is characterized by comprising a crack forming means.

A second heating means for heating the vicinity of the region cooled by the cooling means is provided.

The crack forming means is characterized by having a short wavelength pulse laser oscillator.

Brittle to form cracks along the scribe formation scheduled line by continuously cooling the area near the heating area while heating to a temperature lower than the softening point of the brittle material substrate along the area where the scribe line is formed on the surface of the brittle material substrate. As a method of scribing a material substrate,

The scribing method of the brittle material substrate of the present invention is characterized in that an initial crack along the scribe formation scheduled line is formed at the scheduled point after the initial crack formation scheduled place is first heated in the brittle material substrate.

The initial crack is characterized by being formed by a short wavelength pulse laser beam.

The initial crack is characterized in that formed on the edge of the brittle substrate.

The initial crack is characterized in that it is formed so as to intersect with the scribe line already formed immediately after the formed scribe line.

EMBODIMENT OF THE INVENTION Hereinafter, the Example of this invention is described based on drawing.

1 is a schematic configuration diagram showing an embodiment of a brittle material substrate scribe device of the present invention. This scribing apparatus is used for cutting a glass substrate used for FPD, for example, and reciprocates along a predetermined horizontal direction (Y direction) on a horizontal mounting table 11 as shown in FIG. A slide table 12 is provided.

The slide table 12 is supported by a pair of guide rails 14 and 15 arranged in parallel in the Y direction on the upper surface of the mounting table 11 to slide along the guide rails 14 and 15 in a horizontal state. Can be. In the middle of both guide rails 14 and 15, a ball screw 13 is provided in parallel with the guide rails 14 and 15 so as to be rotated by a motor (not shown). The ball screw 13 is capable of forward rotation and reverse rotation, and a ball nut 16 is attached to the ball screw 13 in a state of being screwed together. The ball nut 16 is integrally attached to the slide table 12 without being rotated, and slides in both directions along the ball screw 13 by forward and reverse rotation of the ball screw 13. Accordingly, the slide table 12 integrally attached to the ball nut 16 slides along the guide rails 14 and 15 in the Y direction.

On the slide table 12, a pedestal 19 is arranged in a horizontal state. The pedestal 19 is supported by a pair of guide rails 21 arranged in parallel on the slide table 12 and can slide. Each guide rail 21 is arrange | positioned along the X direction orthogonal to the Y direction which is the slide direction of the slide table 12. As shown in FIG. Further, a ball screw 22 is disposed in the center between each guide rail 21 in parallel with each guide rail 21, and the ball screw 22 is rotated forward and reverse by the motor 23.

The ball nut 22 is attached to the ball screw 22 in a screwed state. The ball nut 24 is integrally attached to the base 19 in a non-rotating state, and moves in both directions along the ball screw 22 by forward and reverse rotation of the ball screw 22. Accordingly, the pedestal 19 slides in the X direction along each guide rail 21.

A rotating mechanism 25 is provided on the base 19, and a rotating table 26 on which the glass substrate 50 to be cut is mounted is placed horizontally on the rotating mechanism 25. have. The rotary mechanism 25 is configured to rotate the rotary table 26 about the central axis in the vertical direction, so that the rotary table 26 can be rotated so as to have an arbitrary rotation angle θ with respect to the reference position. The glass substrate 50 is fixed on the turntable 26 by a suction chuck, for example.

On the upper side of the turntable 26, a support 31 is arranged at a suitable distance from the turntable 26. The support 31 is supported at the lower end of the optical holder 33 which is arranged in a vertical state and is kept horizontal. The upper end of the optical holder 33 is attached to the lower surface of the mounting table 32 provided on the mounting table 11. On the mounting table 32, a first heating laser oscillator 34 for oscillating a laser beam for scribing is provided, and from the first heating laser oscillator 34, The laser beam to be oscillated is irradiated with an optical device supported in the optical holder 33.

The laser beam irradiated into the optical holder 33 is irradiated onto the glass substrate 50 placed on the turntable 26 at the bottom surface of the optical holder 33. The glass substrate 50 is irradiated as an elliptical laser spot extending in a predetermined direction by an optical device supported in the optical holder 33.

In addition, the support 31 is provided with a cooling nozzle 37 which can be changed in proximity to the optical holder 33. From this cooling nozzle 37, cooling media such as cooling water, He gas, N ₂ gas and CO ₂ gas are injected onto the glass substrate 50. The cooling medium sprayed from the cooling nozzle 37 is injected at a position near the longitudinal end of the laser spot irradiated from the optical holder 33 to the glass substrate 50 to form a cooling spot on the surface of the glass substrate 50. do.

Further, the support 31 is connected to an optical holder 33 which is connected to a laser laser for crack 41 which oscillates the short wavelength of the YAG laser for forming an initial crack between the optical holder 33 and the cooling nozzle 37. 42 is installed. The short wavelength of the YAG laser is more likely to form cracks than the high density short pulse laser of the YAG fundamental wave. A short wavelength pulse laser oscillated from the crack laser oscillator 41 is irradiated onto the glass substrate 50 through the optical holder 42. The laser beam irradiated from the optical holder 42 is irradiated between the longitudinal end of the laser spot irradiated to the glass substrate 50 from the optical holder 33 and the cooling spot to which the cooling water is injected by the cooling nozzle 37. The surface area of the glass substrate 50 is obtained.

In addition, the support base 31 is provided with an optical holder 44 adjacent to the cooling nozzle 37 and connected to the second laser oscillator 43 for heating. The laser beam irradiated from the second heating laser oscillator 43 is irradiated onto the surface of the glass substrate 50 through the optical holder 44. The place irradiated with the laser beam irradiated from the optical holder 44 is an area close to the area where the coolant is sprayed by the cooling nozzle 37.

The positioning of the slide table 12 and the pedestal 19, the control of the rotating mechanism 25, the scribing laser oscillator 34, the cracking laser oscillator 41, the second heating laser oscillator 43, and the like are controlled by a control unit not shown in the drawing. Controlled.

In the case of scribing the glass substrate 50 by such a scribing apparatus, information such as the size of the glass substrate 50 to be cut into a predetermined size, the formation position of the scribe line, the formation position of the initial crack and the like are first input to the controller.

The glass substrate 50 cut to a predetermined size is placed on the rotary table 26 of the scribing apparatus and fixed by the suction means. In this state, alignment marks formed on the glass substrate 50 are captured by the CCD cameras 38 and 39. The photographed alignment marks are displayed by monitors 28 and 29.

After that, the glass substrate 50 fixed to the support 31 is moved so that an intersection point of the edge of the glass substrate 50 with a predetermined scribe line to be formed is located below the optical holder 33 and an elliptical laser beam irradiated from the optical holder 33. The position of the turntable 26 is determined so that the longitudinal direction of the spot is in the X direction along the scribe line. Positioning of the turntable 26 is performed by the slide of the slide table 12, the slide of the base 19, and the rotation of the turntable 26 by the rotating mechanism 25. As shown in FIG.

In this state, the laser beam is irradiated from the first heating laser oscillator 34, while the rotary table 26 slides along the + X direction. As a result, as shown in Fig. 2A (a), an elliptic laser spot LS is formed on the surface of the edge portion of the glass substrate 50 along the scribe scheduled line SL.

The laser spot LS is, for example, an elliptical shape having a long diameter of 30.0 mm and a short diameter of 1.0 mm, and irradiated so that the long axis coincides with the scribe scheduled line SL. In this case, the heating temperature by the laser spot LS is lower than the temperature at which the glass substrate 50 is melted, that is, lower than the softening point of the glass substrate. As a result, the surface of the glass substrate 50 irradiated with the laser spot LS is heated without melting.

In this case, since the initial crack is not formed on the surface of the glass substrate 50, there is no fear that unnecessary cracks will arise again from the initial crack even if the surface of the glass substrate 50 is heated by the laser spot LS. By LS, the surface of the glass substrate 50 can be heated sufficiently so that blind cracks can be formed reliably.

As the glass substrate 50 is moved in the + X direction, the laser spot LS moves the surface of the glass substrate 50 along the scribe scheduled line SL, and as shown in FIG. 2A (b), the edge of the glass substrate 50 is a laser oscillator for cracking 41. It is in a state facing the lower end of the optical holder 42 connected to.

In this state, the short-wavelength pulse laser of YAG is oscillated from the crack laser oscillator 41, and the pulse laser is irradiated onto the scribe plan line SL at the edge part of the glass substrate 50. As a result, the scribe scheduled line SL surface is melted or sublimed at the edge portion of the glass substrate 50 to form the initial crack TR.

After that, the glass substrate 50 is slid again in the + X direction, so that the laser spot LS moves the surface of the glass substrate 50 along the scribe scheduled line SL, and the initial portion of the glass substrate 50 at the edge portion thereof as shown in Fig. 2A (c). The cooling nozzle 37 is brought into a state where the crack TR is formed, and a cooling medium, for example, cooling water, is injected together with compressed air from the cooling nozzle 37.

The cooling nozzle 37 sprays the cooling medium onto the scribe scheduled line SL spaced at, for example, 2.5 mm in the long axis direction of the laser spot LS to the area irradiated with the laser spot LS. As a result, the surface of the glass substrate 50 is cooled to form a cooling point CP. As a result, a temperature gradient occurs in the region between the laser spot LS and the cooling point CP.

The compressive stress is generated in the region of the surface of the glass substrate 50 heated by the laser spot LS, and the tensile stress is generated at the cooling point CP in which the coolant is injected. In this way, if compressive stress occurs in the heating zone by the laser spot LS and tensile stress occurs in the cooling point CP by the cooling water, the compression occurring in the thermal diffusion region between the laser spot LS and the cooling point CP The stress causes a large tensile stress to the region on the side opposite to the laser spot LS with respect to the cooling point CP. By the action of the tensile stress, the blind crack is advanced along the scribe scheduled line SL from the initial crack TR formed at the edge of the glass substrate 50.

Subsequently, the glass substrate 50 is slid in the + X direction so that the laser spot LS moves the surface of the glass substrate 50 along the scribe line SL and also the cooling point CP by the cooling medium sprayed from the cooling nozzle 37. 2A (d), the lower end of the optical holder 44 connected to the second laser oscillator 43 faces the portion where the initial crack TR is formed at the edge of the glass substrate 50 as shown in FIG. 2A (d). The laser beam oscillated from the second heating laser oscillator 43 is irradiated to the edge portion where the initial crack TR is formed on the surface of the glass substrate 50. As a result, a heating spot HS is formed on the blind crack.

When the blind crack formed in the glass substrate 50 is heated in this way, the blind crack diffuses from the surface of the glass substrate 50 in the thickness direction and reaches the rear surface of the glass substrate 50.

Subsequently, the first heating by the laser beam, the cooling by the cooling medium, and the second heating by the laser beam are sequentially performed along the scribe line SL of the glass substrate 50, so that the blind crack is along the scribe line SL. It is formed to reach the back of 50.

2A (a) to (d), unlike in the case of the conventional laser scribing method, since an initial crack is formed after laser irradiation, an unpredictable and uncontrollable crack can be prevented from developing from where the initial crack is formed. have. In the case of Fig. 2A (a), since the laser beam is irradiated to the place where the initial crack is to be formed before the formation of the crack, compressive stress is generated in the vicinity thereof. As such, the compressive stress occurs around the place where the initial crack is to be formed. It is sometimes difficult to form an initial crack in the case of forming an initial crack at the end of the substrate surface at room temperature. In order to avoid this problem, a separate method described below can be employed.

2B (a) to (f) are schematic diagrams showing a scribing method capable of stabilizing the laser scribing operation by forming an initial crack after laser irradiation as in the case of FIGS. 2A (a) to (d). In the following description, duplicate explanation is omitted about the same case as in the case of FIGS. 2A (a) to (d).

FIG. 2B (a) shows a situation in which an elliptic laser spot LS is formed along the scribe scheduled line SL on the edge surface of the glass substrate 50 as shown in FIG. 2A (a). In this case, when a portion of the laser spot LS is formed in the end face and the predetermined place is heated for a predetermined time, the laser beam oscillated from the first heating laser oscillation device 34 is stopped from being irradiated onto the glass substrate 50. Immediately after the irradiation of the laser beam onto the glass substrate 50 is stopped, the glass substrate 50 is slid in the + X direction (right side of the drawing), so that the cooling nozzle 37 is placed on the edge of the glass substrate 50 as shown in FIG. 2B (b). In the opposite state, a cooling medium, for example cooling water, is injected together with compressed air from the cooling nozzle 37. As a result, the surface of the glass substrate 50 is cooled to form a cooling point CP.

Next, the glass substrate 50 is slid in the -X direction so that the edge portion of the glass substrate faces the lower end portion of the optical holder 42 connected to the crack laser oscillator 41 as shown in Fig. 2B (c). In this state, the short-wavelength pulse beam of YAG is oscillated from the crack laser oscillator 41, and a pulse beam is irradiated to the starting point position of the scribing line SL in the edge part of the glass substrate 50. FIG. As a result, the start point position of the scribe line SL at the edge of the glass substrate 50 is melted or sublimed to form an initial crack TR.

After that, as shown in Fig. 2B (d), the glass substrate 50 is further slid in the -X direction so that the position where the laser spot LS is formed becomes near the position where the initial crack is formed, and as shown in Fig. 2B (d), the crack When the place is moved to a position included in the laser spot LS, the laser beam is irradiated from the first heating laser oscillator 34, and thus the laser spot LS is formed on the substrate 50. Subsequently, the substrate 50 is moved in the + X direction in the opposite direction to that until then to prepare for crack formation.

That is, as shown in FIG. 2B (e), the laser spot LS moves the surface of the glass substrate 50 along the scribe scheduled line SL, and the cooling nozzle 37 moves to the place where the initial crack TR is formed. Is sprayed on. Subsequently, the cooling point CP by the cooling medium injected from the cooling nozzle 37 also moves along the scribe scheduled line SL to the initial crack TR at the edge of the glass substrate 50.

After the cooling point CP moves to the initial crack TR at the edge of the glass substrate 50, as shown in Fig. 2B (f), the laser oscillator for the second heating is formed at the portion where the initial crack TR is formed at the edge of the glass substrate 50. The edge where the lower end of the optical holder 44 connected to 43 is moved to the opposite position, and the heating spot HS by the laser beam irradiated from the second heating laser oscillator 43 forms the initial crack TR on the surface of the glass substrate 50. It is formed in the part. As a result, a heating spot HS is formed on the blind cracks. When the blind crack formed in the glass substrate 50 is heated in this way, the blind crack diffuses from the surface of the glass substrate 50 in the thickness direction and reaches the rear surface of the glass substrate 50.

Subsequently, the first cracking by the laser beam, the cooling water by the cooling water, and the second heating by the laser beam are sequentially performed along the scribe line SL of the glass substrate 50, so that the blind cracks are formed along the scribe line SL of the glass substrate 50. It is formed in the state which reached even the back surface (not shown).

In the device configuration of the scribing apparatus using the laser shown in Fig. 1, the cooling nozzle 37 is attached to the optical holder 33 of the first heating laser oscillator 34 and the optical holder 42 of the cracking laser oscillator 41. It is also possible to employ a configuration. For example, the cooling nozzle 37 may be provided after the optical holder 33, and then the optical holder 42 may be provided. The case of the device configuration in the latter case will be described in detail with respect to the difference from the above description explained with reference to Figs. 2B (a) to (f) as follows.

As in Fig. 2B (a), the substrate 50 where the laser spot LS is formed is heated. Thereafter, the substrate 50 is moved in the + X direction to cool the cross section of the substrate 50 on which the cooling point CP is formed, similarly to the situation in Fig. 2B (b). Subsequently, the substrate 50 is moved in the + X direction again, and as shown in Fig. 2B (c '), the laser oscillator 41 for cracking starts when the cross section of the substrate 50 reaches near the bottom of the optical holder 42 of the laser oscillator 41 for cracking. Laser beam is irradiated. As a result, the initial crack TR is formed in the cross section of the substrate 50. Thereafter, the substrate 50 is moved in the reverse -X direction to the rear end portion of the laser spot LS until the cross section of the substrate 50 is located. As shown in Fig. 2B (d), irradiation of the laser beam from the first heating laser oscillator 34 is started from there, and the substrate 50 is moved in the + X direction again. Thereafter, as described with reference to FIGS. 2B (e) and 2B (f), a scribe line is formed to further increase the depth of the crack.

In this way, when a blind crack reaching the rear surface of the glass substrate 50 in the X direction with respect to the glass substrate 50 is formed, i.e., when the glass substrate 50 is in a full body cut state, it crosses or is orthogonal to the X direction. It becomes difficult to form a blind crack which reaches | attains the back surface of the glass substrate 50 later in a Y direction.

This situation will be described in detail with reference to FIG. FIG. 6 is a partially enlarged view of a glass substrate 50 schematically showing a situation in which blind cracks are formed in a form intersecting in two directions. In this case, near the intersection where the blind crack which is formed first along the X direction (horizontal direction in the drawing) and reaches the rear surface of the glass substrate 50 and the scribe scheduled line in the Y direction (vertical direction in the drawing) intersect, and the scribe In the cross section of the glass substrate 50 to be started, an initial crack is formed by the following two methods as described above based on the data input to the control unit. That is, (1) a laser oscillator 41 for heating and cracking by laser spot LS (or a cutter which can be used for scribing a brittle material substrate, for example, a blade cutter or a point cutter). After the initial crack TR is formed or (2) preheating by the laser spot LS and cooling of the initial crack formation region is performed, the laser oscillator 41 for cracking can be used for scribing a brittle material substrate. An initial crack TR is formed by a cutter, for example, a blade such as a wheel cutter or a point cutter.

At this time, in the formation of blind cracks in the X direction and the Y direction, only the initial crack formation region of the glass substrate 50 is cooled after being preheated by the first heating laser spot, and thereafter, the initial crack is formed by the YAG laser. Therefore, there is no fear of new cracking from the initial crack because the compressive stress acts on the scribe scheduled line in the vicinity of the initial crack formation region that is not cooled.

Thereafter, similarly, vertical cracks are formed to form checkered blind cracks on the glass substrate 50.

In the above embodiment, the second heating laser oscillator 43 is provided, and an example of generating blind cracks such as reaching the rear surface of the glass substrate 50 is shown, but the first heating laser oscillator 34 and the laser oscillator 41 for cracking are shown. When the blind crack is formed by the configuration of the cooling nozzle 37, the above-described portion of the glass substrate 50 near the intersection point of the scribe scheduled line along the Y direction crossing or orthogonal to the blind crack formed in the X direction and the scribe starts. In some cases, initial cracks may be formed by irradiation timing.

The initial crack TR may be formed by the laser oscillator 41 for cracking after preheating by the laser spot LS and cooling of the initial crack formation region. For example, when a part of the line of the blind crack once formed in the X direction and the Y direction is joined again, the blind crack is again formed in the joined part.

Also in this case, in the formation of the blind crack in the X direction or the Y direction, after preheating by the first heating laser spot, only the initial crack formation region of the glass substrate 50 is cooled, and then the initial crack is formed by the YAG laser. Therefore, since the compressive stress acts on the scribing scheduled line in the vicinity of the initial crack formation region that is not cooled, there is no fear of new cracking from the initial crack.

In the formation of the blind cracks (including the full body cut) in the X direction and the Y direction, the region where the initial crack is formed is preheated to the first heating laser spot and then cooled by using a cooling means, followed by the YAG laser. By forming an initial crack by means of the new crack there is no fear of unnecessary unnecessary occurrence. In addition, although the YAG laser was used as the means for forming the initial crack in the present embodiment, a cutter which can be used for scribing the brittle material substrate, for example, a wheel cutter or a point cutter, may be used as the means for forming the initial crack.

In addition, a glass substrate constituting each mother glass substrate when a glass substrate and a pair of mother glass substrates are bonded to a brittle material substrate, and as shown in Figs. 5 (a) and (b). The glass substrate 72 which is a mother glass substrate, a semiconductor wafer, when the glass substrate 71 which cut | disconnected one mother glass substrate to the predetermined magnitude | size was bonded to the other mother glass substrate 72, Ceramic substrates and the like.

In this case, in the cross-section of the glass substrate 50 where the scribe starts and the part immediately after the intersection where the blind crack reaching the back surface of the glass substrate 50 and the scribe scheduled line in the Y direction cross each other, Based on the input data, the short wavelength pulse laser irradiated from the laser oscillator 41 for cracking is controlled and irradiated at the above-mentioned timing, and an initial crack is formed. That is, when the blind crack is formed along the Y direction as if reaching the blind crack formed along the X direction, the blind crack along the X direction is interposed therebetween and thus the surface of the glass substrate 50 is not formed. The initial cracks are newly formed at the above timings as they are in contact with the blind cracks at right angles, and new blind cracks are sequentially formed from the initial cracks.

At this time, in the formation of the blind cracks in the X-direction and the Y-direction, since the initial crack is formed by the YAG laser after the first heating laser spot passes, there is no fear of new cracking from the initial crack.

Even in this case, in the formation of the blind cracks in the X and Y directions, since the initial crack is formed by the YAG laser after the first heating laser spot passes, there is no fear of newly occurring cracks from the initial crack. In addition, although the YAG laser is used as a means for forming the initial crack in the present embodiment, a cutter which can be used for scribing a brittle material substrate, for example, a wheel cutter or a point cutter, may be used as the means for forming the initial crack. . In that case, a tip holder with a cutter blade is attached near the optical holder 33 in place of the crack forming laser as the device configuration. The tip holder is provided with a mechanism capable of lifting and lowering, and thus, when it is necessary to form an initial crack, it is necessary that the tip holder be used in such a manner that the tip of the blade can come into contact with the corresponding place on the substrate.

In addition, a glass substrate constituting each mother glass substrate when the glass substrate and a pair of mother glass substrates are bonded to the brittle material substrate, and one mother glass substrate as shown in Figs. 5 (a) and (b). The glass substrate 71 which cut | disconnected the glass substrate 71 cut | disconnected to the predetermined | prescribed magnitude | size to the other mother glass substrate 72 is contained, The glass substrate 72 which is a mother glass substrate, a semiconductor wafer, ceramics, etc. are contained.

The scribing apparatus and the scribing method of this invention are a liquid crystal display board | substrate which bonded glass substrates mutually, a transmissive liquid crystal display board | substrate, organic EL, and PDP (plasma display panel). panel)), a scribe such as a field emission display (FED) substrate, a reflective liquid crystal display substrate in which a glass substrate and a silicon substrate are bonded together, and the like.

In the scribing apparatus and scribing method of the brittle material substrate of the present invention, after forming the blind cracks by heating and cooling the brittle material substrate, the initial crack is formed after the brittle material substrate is heated. When heating, there is no fear of newly generating unnecessary cracks from the initial crack. In addition, even in the case of forming a blind crack such as reaching the rear surface of the brittle material substrate, the initial crack can be easily formed immediately after the intersection point, so that the blind crack reaching the rear surface of the glass substrate can be reliably crossed. Can be formed.

Claims (7)

Heating means for continuously heating at a temperature lower than the softening point of the brittle material substrate along a region where a scribe line is formed on the surface of the brittle material substrate; Cooling means for cooling the vicinity of the brittle material substrate surface region heated by the heating means; A crack forming means for forming an initial crack along the scribe shaping line after the predetermined place on the surface of the brittle material is heated by the heating means; A scribe device for a brittle material substrate, comprising: The method of claim 1, Heating means for heating the vicinity of the area cooled by the cooling means is installed A scribe device for a brittle material substrate, characterized in that. The method of claim 1 The crack forming means is provided with a short wavelength pulse laser oscillator (pulse laser oscillator) A scribe device for a brittle material substrate, characterized in that. Cracks are formed along the scribe formation scheduled line by continuously cooling the region near the heating region while heating to a temperature lower than the softening point of the brittle material substrate along the region where the scribe line is formed on the surface of the brittle material substrate. As a scribing method of a brittle material substrate to form, And an initial crack formed along the scribe formation scheduled line at the predetermined point at the time after the initial crack formation scheduled place is first heated in the brittle material substrate. The method of claim 4 The initial crack is a scribe method of a brittle material substrate, characterized in that formed by a short wavelength pulse laser beam (pulse laser beam). The method of claim 5, The initial crack is formed at the edge of the brittle substrate A method for scribing a brittle material substrate, characterized in that. The method of claim 6 The initial crack is in direct contact with the scribe line already formed immediately after the formed scribe line. A method for scribing a brittle material substrate, characterized in that.