CN101234850B - Laser cutting method for glass substrate - Google Patents
Laser cutting method for glass substrate Download PDFInfo
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- CN101234850B CN101234850B CN2008100805147A CN200810080514A CN101234850B CN 101234850 B CN101234850 B CN 101234850B CN 2008100805147 A CN2008100805147 A CN 2008100805147A CN 200810080514 A CN200810080514 A CN 200810080514A CN 101234850 B CN101234850 B CN 101234850B
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- glass substrate
- cutting
- laser cutting
- breach
- initial breach
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Abstract
The invention discloses a laser cutting method of a glass substrate, which comprises a first cutting channel and a second cutting channel defining the glass substrate, wherein, a first cutting direction of the first cutting channel and a second cutting direction of the second cutting channel are essentially vertical to each other; then a first initial gap is formed on edge of the glass substrate corresponding to the first cutting channel, and a second initial gap is formed at a crossing place at which each second cutting channel enters the first cutting channel along the second cutting direction; the gap direction of the second initial gap is the same with the second cutting direction.
Description
Technical field
The present invention relates to a kind of laser cutting method of glass substrate, relate in particular to a kind of laser cutting method that is applied to slim glass substrate.
Background technology
Advantages such as liquid-crystal display has that high image quality, volume are little, in light weight, low voltage drive, low consumpting power and applied range, so be widely used in Portable TV, mobil phone, shot with video-corder in consumer electronics such as enlarging machine, notebook computer, console display and projection TV or the computer product, become the main flow of indicating meter.
Face glass (panel) is a considerable spare part in the liquid-crystal display, because the cross section quality of mechanical type cutting is relatively poor, now cutting modes that use the laser brisement to cut into glass substrate (sheet) face glass of fritter more.Common laser cutting mode includes full cutting (full cut) and draws two kinds of patterns of sliver (scribe and break) at quarter at present.
With reference to Fig. 1, it is the synoptic diagram that shows known laser cutting method.Traditional laser cutting method is to form initial breach (initial crack) 110 earlier at the edge of glass substrate 100.Then, laser-beam generating apparatus 120 emitted laser bundles 122 are advanced and the surface of glass substrate 100 along the direction of initial breach 110, and 130 of refrigerating units and then laser beam 122 are advanced.
Because during laser beam 122 glass substrate 100, can in glass substrate 100, produce compression stress (compressive stress), and it is follow-up during with refrigerating unit 130 cooled glass substrates 100, can in glass substrate 100, produce tensile stress (tensile stress), under the effect of these two kinds of stress, can lure initial breach 110 into along the direct of travel growth of laser beam 122, and in drawing sliver process at quarter, form crackle 140 with crack depth (scribing depth) with refrigerating unit 130.
Along with the thickness of glass substrate is more and more thinner, when use to draw carving the laser cutting of sliver, unsettled full cutting meeting is carved sliver and is occurred simultaneously with drawing.Full cutting then can make the formed crackle of follow-up laser processing can't stride across the section of full cutting if drawing a leading portion step of carving sliver, and makes to draw and carve the sliver failure.
Equally, after glass substrate is thinned to a certain degree, only can use the mode glass-cutting substrate of full cutting, and the full cutting method of glass substrate is after along first cut direction glass substrate being cut into strip earlier at present, separately the strip glass substrate of cutting open is cut into the face glass of fritter again.This cutting mode can make the time of cutting greatly elongate, and influences the output of face glass.
Summary of the invention
Therefore, the object of the present invention is to provide a kind of laser cutting method of glass substrate, make the situation that crackle can't continue to grow up in order to solve because of the full cutting of glass substrate.
According to a preferred embodiment of the invention, a kind of laser cutting method of glass substrate is proposed, this method comprises a plurality of first cutting grooves and a plurality of second cutting groove that defines glass substrate, and wherein first cut direction of first cutting groove is vertical in fact with second cut direction of second cutting groove; Then, form a plurality of first initial breach at the edge of glass substrate, wherein the position of the first initial breach is corresponding with first cutting groove, and the breach direction of the first initial breach is identical with first cut direction; And enter the confluce of first cutting groove along second cut direction at each second cutting groove, and forming the second initial breach respectively, the breach direction of the second initial breach is identical with second cut direction.
Form the step of the first initial breach and the second initial breach, can use servomotor and the cutting needle that links to each other, servomotor and the cutters that link to each other, servomotor and the cutting roller that links to each other, or use the laser cutting cutter to finish.Glass substrate can be a pair of sheet glass, and the total thickness of two sheet glasss is preferably less than 0.4 millimeter (mm).The shape of the first initial breach and the second initial breach is preferably linear.The degree of depth of the first initial breach and the second initial breach is about 10 μ m, and its length is about 2～4 millimeters (mm).
After the laser cutting method of glass substrate can be included in and form the first initial breach, along the first cutting groove cutting glass by laser substrate.The second initial breach can form before or after the step of the first cutting groove cutting glass by laser substrate.After the laser cutting method of glass substrate also is included in and forms the second initial breach, along the second cutting groove cutting glass by laser substrate.
Even the situation of full cutting occurs at the glass substrate of laser cutting first cut direction, the laser cutting method of this glass substrate still can be by entering the confluce formed second initial breach of first cutting groove along second cut direction at second cutting groove, make the laser cutting of second cut direction can stride across first cutting groove that is cut fully, make the second initial breach can continue to grow up, thereby the laser cutting operation of second cut direction can be finished smoothly along second cutting groove.
Description of drawings
Fig. 1 is the synoptic diagram that shows known laser cutting method.
Fig. 2 and Fig. 3 are respectively the schema and enforcement synoptic diagram of the preferred embodiment of the laser cutting method that shows glass substrate of the present invention.
Fig. 4 is the schema of another preferred embodiment that shows the laser cutting method of glass substrate of the present invention.
Fig. 5 is the schema of another preferred embodiment that shows the laser cutting method of glass substrate of the present invention.
Wherein, description of reference numerals is as follows:
100: glass substrate 110: initial breach
120: laser-beam generating apparatus 122: laser beam
130: refrigerating unit 140: crackle
210～250: step 300: glass substrate
312: the first cut direction of 310: the first cutting grooves
320: the second cutting grooves of 314: the first initial breach
324: the second initial breach of 322: the second cut direction
Embodiment
Below will principle of the present invention clearly be described by drawings and detailed description, the technician of any the technical field of the invention is after understanding the preferred embodiments of the present invention, the technology that can be instructed according to the present invention, the present invention is made various variations and remodeling, and these change and remodeling does not break away from spirit of the present invention and scope.
In the known technology, if the thickness of glass substrate is thin excessively, then glass substrate may be when draw carving sliver, direct of travel along laser beam and refrigerating unit is fully cut apart, make the crackle of growing up to cross over and cut glass substrate separately fully, therefore, the method in past is after along first cut direction glass substrate being cut into strip earlier, separately the strip glass substrate of cutting open is cut into the face glass of fritter again.But this cutting mode can make the time of cutting greatly elongate, and influences the output of face glass.
Therefore, the present invention just proposes a kind of laser cutting method of glass substrate, can't cross over the glass substrate of full cutting to solve the laser cutting crackle, or carves sliver and occur astatically with drawing because of full cutting, and the situation that causes the glass substrate cutting to be failed.
With reference to Fig. 1, it is the synoptic diagram that shows known laser cutting method.Traditional laser cutting method is to form initial breach 110 earlier at the edge of glass substrate 100.Then, laser-beam generating apparatus 120 emitted laser bundles 122 are advanced and the surface of glass substrate 100 along the direction of initial breach 110, and 130 of refrigerating units and then laser beam 122 are advanced.
Because during laser beam 122 glass substrate 100, can in glass substrate 100, produce compression stress, and it is follow-up during with refrigerating unit 130 cooled glass substrates 100, can in glass substrate 100, produce tensile stress, under the effect of these two kinds of stress, can lure initial breach 110 into along the direct of travel growth of laser beam 122, and in drawing sliver process at quarter, form crackle 140 with so-called crack depth with refrigerating unit 130.
If the thickness of glass substrate 100 is thin excessively, then glass substrate 100 can fully be cut apart along the laser beam 122 and the direct of travel of refrigerating unit 130, make the crackle of growing up to cross over and cut glass substrate separately fully, therefore, the method in past is after along first cut direction glass substrate being cut into strip earlier, separately the strip glass substrate of cutting open is cut into the face glass of fritter again.Yet this cutting mode can make the time of cutting greatly elongate, and influences the output of face glass.
Therefore, the present invention just proposes a kind of laser cutting method of glass substrate, can't cross over the glass substrate of full cutting to solve the laser cutting crackle, or carves sliver and occur astatically with drawing because of full cutting, and the situation that causes the glass substrate cutting to be failed.
With reference to Fig. 2 and Fig. 3, it is respectively the schema and enforcement synoptic diagram that shows glass substrate laser cutting method preferred embodiment of the present invention simultaneously.The laser cutting method of glass substrate mainly comprises the following step:
Step 210: a plurality of first cutting grooves 310 and a plurality of second cutting grooves 320 of definition on the glass substrate 300, wherein first cut direction 312 of first cutting groove 310 and second cut direction 322 of second cutting groove 320 are for vertical in fact, as shown in Figure 3.
Step 220: form a plurality of first initial breach 314 at the edge of glass substrate 300, wherein the position of the first initial breach 314 is the position corresponding to first cutting groove 310, and the breach direction of the first initial breach 314 is identical with first cut direction 312 of first cutting groove 310.
Step 230: enter the confluce of first cutting groove 310 at each second cutting groove 320 along second cut direction 322, form the second initial breach 324 respectively, wherein the breach direction of the second initial breach 324 is identical with second cut direction 322.
According to the present invention, the laser cutting method of glass substrate is preferably the glass substrate 300 of the glass substrate 300, particularly thinner thickness that are applied in two sheet glasss.For example, the thickness of each sheet glass is preferably less than 0.2 millimeter (mm) in the glass substrate 300 of the two sheet glasss in the present embodiment, and the total thickness of glass substrate 300 is preferably less than 0.4 millimeter (mm).The shape of the first initial breach 314 and the second initial breach 324 is preferably linear, and the degree of depth of the first initial breach 314 and the second initial breach 324 is about 10 μ m, and the length of the first initial breach 314 and the second initial breach 324 is about 2～4 millimeters.
The step 220 that forms the first initial breach 314 can utilize cutting assembly to finish with the step 230 that forms the second initial breach 324.For example, cutting assembly can be cutting roller, the cutters that are erected under the servomotor, or cutting needle, and adjust the following amount and the displacement of servomotor by editor's program in advance, on predefined first cutting groove 310 and second cutting groove 320, to form the first initial breach 314 and the second initial breach 324 respectively.In step 220 and step 230, also can use the laser cutting cutter to form the first initial breach 314 and the second initial breach 324.
Fig. 4 is the schema of another preferred embodiment that shows the laser cutting method of glass substrate of the present invention.After present embodiment is included in and forms the first initial breach, along the first cutting groove cutting glass by laser substrate (step 240).Step 240 can be finished before at the formation second initial breach (step 230).In step 240, comprise along the first cutting groove cutting glass by laser substrate, the first initial breach is grown up along first cutting groove.This laser cutting can be full cutting.
Fig. 5 is the schema of another preferred embodiment that shows the laser cutting method of glass substrate of the present invention.In the present embodiment, can after forming the second initial breach (step 230), finish along the first cutting groove glass-cutting substrate (step 240).Present embodiment along the second cutting groove cutting glass by laser substrate (step 250), makes the second initial breach grow up along second cutting groove after can being included in and forming the second initial breach (step 230).In a preferred embodiment, after step 240, carry out step 250.
With reference to Fig. 3 and Fig. 5, in step 240, along first cut direction, 312 cutting glass by laser substrates 300 time, the first initial breach 314 can be grown up along first cutting groove 310, to cut apart glass substrate 300 simultaneously.In step 250, along second cut direction, 322 cutting glass by laser substrates 300 time, even if the situation of full cutting in laser cutting process, occurs, still can each second initial breach 324 all can be grown up by being pre-formed the second initial breach 324 that enters the confluce of first cutting groove 310 at second cutting groove 320 along second cutting groove 320.
When cutting the glass substrate 300 of second cut direction 322, can pass through the sectional mode, pass through the preformed second initial breach 324 in first cutting groove, 310 backs that stride across intersection, make the second initial breach 324 grow up again, make the crackle of second cut direction 322 be striden across first cutting groove 310 that is cut fully and finish smoothly along second cutting groove 320.After waiting to finish the laser cutting of first cut direction 312 and second cut direction 322, glass substrate 300 can be split into the face glass of a plurality of fritters.
By the invention described above preferred embodiment as can be known, use the present invention and have following at least advantage: even the situation of full cutting occurs at the glass substrate of laser cutting first cut direction, the laser cutting method of this glass substrate still can be by entering the confluce formed second initial breach of first cutting groove along second cut direction at second cutting groove, make the laser cutting operation of second cut direction be striden across first cutting groove that is cut fully, make the second initial breach can continue to grow up, the laser cutting operation of second cut direction can be finished smoothly along second cutting groove.
Though disclose the present invention by embodiment; but these embodiment are not in order to limit the present invention; the technician of the technical field of the invention without departing from the spirit and scope of the present invention; can carry out various changes and remodeling to the present invention; and can conceive other different embodiment, so protection scope of the present invention should be as the criterion with claims institute restricted portion.
Claims (14)
1. the laser cutting method of a glass substrate comprises:
A plurality of first cutting grooves and a plurality of second cutting groove of definition glass substrate, first cut direction of wherein said first cutting groove is vertical in fact with second cut direction of described second cutting groove;
Form a plurality of first initial breach at an edge of this glass substrate, the position of the wherein said first initial breach is corresponding with described first cutting groove, and the breach direction of the described first initial breach is identical with this first cut direction; And
Enter the confluce of described first cutting groove at each described second cutting groove along this second cut direction, form the second initial breach respectively, the breach direction of the described second initial breach is identical with this second cut direction.
2. the laser cutting method of glass substrate as claimed in claim 1 wherein forms the described first initial breach and comprises use servomotor and the cutting needle that links to each other with the step of the described second initial breach.
3. the laser cutting method of glass substrate as claimed in claim 1 wherein forms the described first initial breach and comprises use servomotor and the cutters that link to each other with the step of the described second initial breach.
4. the laser cutting method of glass substrate as claimed in claim 1 wherein forms the described first initial breach and comprises use servomotor and the cutting roller that links to each other with the step of the described second initial breach.
5. the laser cutting method of glass substrate as claimed in claim 1, the step that wherein forms the described first initial breach and the described second initial breach comprise and use the laser cutting cutter.
6. the laser cutting method of glass substrate as claimed in claim 1, wherein this glass substrate is two sheet glasss.
7. the laser cutting method of glass substrate as claimed in claim 6, wherein the total thickness of this pair sheet glass is less than 0.4 millimeter.
8. the laser cutting method of glass substrate as claimed in claim 1, being shaped as of the wherein said first initial breach and the described second initial breach is linear.
9. the laser cutting method of glass substrate as claimed in claim 8, the degree of depth of the wherein said first initial breach and the described second initial breach is 10 microns.
10. the laser cutting method of glass substrate as claimed in claim 8, the length of the wherein said first initial breach and the described second initial breach is 2 millimeters to 4 millimeters.
11. the laser cutting method of glass substrate as claimed in claim 1, also be included in form the described first initial breach after, along described first this glass substrate of cutting groove laser cutting.
12. the laser cutting method of glass substrate as claimed in claim 11, the wherein said second initial breach was forming before the step of described first this glass substrate of cutting groove laser cutting.
13. the laser cutting method of glass substrate as claimed in claim 11, the wherein said second initial breach is forming after the step of described first this glass substrate of cutting groove laser cutting.
14. the laser cutting method of glass substrate as claimed in claim 1, also be included in form the described second initial breach after, along described second this glass substrate of cutting groove laser cutting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100805147A CN101234850B (en) | 2008-02-20 | 2008-02-20 | Laser cutting method for glass substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100805147A CN101234850B (en) | 2008-02-20 | 2008-02-20 | Laser cutting method for glass substrate |
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| Publication Number | Publication Date |
|---|---|
| CN101234850A CN101234850A (en) | 2008-08-06 |
| CN101234850B true CN101234850B (en) | 2010-12-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2008100805147A Expired - Fee Related CN101234850B (en) | 2008-02-20 | 2008-02-20 | Laser cutting method for glass substrate |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104591531A (en) * | 2015-01-20 | 2015-05-06 | 信利半导体有限公司 | Cutting process |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1525944A (en) * | 2001-07-18 | 2004-09-01 | 三星钻石工业股份有限公司 | Device and method for scribing fragile material substrate |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1525944A (en) * | 2001-07-18 | 2004-09-01 | 三星钻石工业股份有限公司 | Device and method for scribing fragile material substrate |
Non-Patent Citations (2)
| Title |
|---|
| JP特开2001－58281A 2001.03.06 |
| 焦俊科等.激光切割玻璃的研究进展.玻璃.2007,(4),8-12. * |
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| CN101234850A (en) | 2008-08-06 |
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Granted publication date: 20101208 Termination date: 20210220 |