CN112719642A - Glass optical filter microcrack laser cutting method - Google Patents
Glass optical filter microcrack laser cutting method Download PDFInfo
- Publication number
- CN112719642A CN112719642A CN202011529990.XA CN202011529990A CN112719642A CN 112719642 A CN112719642 A CN 112719642A CN 202011529990 A CN202011529990 A CN 202011529990A CN 112719642 A CN112719642 A CN 112719642A
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- CN
- China
- Prior art keywords
- optical filter
- laser
- cut
- wire holes
- microcrack
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
Abstract
The invention discloses a glass optical filter microcrack laser cutting method, which comprises the following steps: attaching the optical filter to the adhesive tape, and then placing the optical filter on a processing platform; setting laser parameters of a picosecond laser processing system; moving the optical filter to be cut to the transmitting end of the laser; focusing laser emitted by a laser on the surface of the optical filter to be cut, and electrifying the laser to operate to generate a plurality of screw holes on the surface of the optical filter to be cut; the plurality of wire holes form micro cracks on the optical filter to be cut; the plurality of wire holes form micro cracks on the optical filter to be cut; and applying external force to the two sides of the microcracks of the optical filter to be cut so as to cut off the optical filter. According to the invention, the optical filter is fixed through the adhesive tape, so that the optical filter can be prevented from moving, and the cutting accuracy is improved; the laser is electrified to operate so as to generate a plurality of wire holes on the surface of the optical filter to be cut, the plurality of wire holes form microcracks on the optical filter to be cut, subsequent steps such as polishing are not needed, and the production process is simpler.
Description
Technical Field
The invention relates to the technical field of optical filter cutting, in particular to a glass optical filter microcrack laser cutting method.
Background
The cutting of the blue glass optical filter generally adopts the cutting wheel scribing and the splitting, and the technology has the main advantages of maturity, stability and low cost. And scribing a certain pressure on the surface of the glass by a diamond cutter wheel, so that the glass is cracked along with mechanical indentation, and cutting the square. Since the strength of the optical filter itself is not high, if the indentation is too deep, the strength of the glass tends to be rapidly reduced, and therefore, the indentation is shallow, and it is necessary to perform splitting after cutting.
The main advantages of the cutting technology of the blue glass optical filter are maturity, stability and low cost, but the cutting technology has the problems of low strength, edge breakage, corner breakage and the like. Therefore, in recent years, a technique of stealth cutting of glass by a laser beam of YAG1064nm has been developed to avoid cutting defects such as an excessively low cutting strength and chipping. In the application process of the technology, the cutting strength is not greatly improved, because the control of the crack in the recessive cutting is very important, and if the control is not good, the crack can extend along a long way to reduce the strength of the glass. And when the thickness of the glass is thinner and thinner, the realization difficulty of the recessive cutting is increased, because the focusing is likely to be generated on the surface and the recessive cutting crack can not be formed. The cost of the current excellent recessive technology is relatively high, and the current excellent recessive technology has the defects that the current excellent recessive technology cannot meet the requirement of industry development.
Disclosure of Invention
The invention aims to provide a glass optical filter microcrack laser cutting method to solve the problems in the prior art.
In order to achieve the purpose, the invention provides the following technical scheme: a glass filter microcrack laser cutting method comprises the following steps:
s1: attaching the optical filter to the adhesive tape, and then placing the optical filter on a processing platform;
s2: setting laser parameters of a picosecond laser processing system;
s3: moving the optical filter to be cut to the transmitting end of the laser;
s4: focusing laser emitted by a laser on the surface of the optical filter to be cut, and electrifying the laser to operate to generate a plurality of screw holes on the surface of the optical filter to be cut; the plurality of wire holes form micro cracks on the optical filter to be cut; the plurality of wire holes form micro cracks on the optical filter to be cut;
s5: and applying external force to the two sides of the microcracks of the optical filter to be cut so as to cut off the optical filter.
Preferably, the laser is a picosecond laser.
Preferably, the pulse width of the laser is less than 20 picoseconds.
Preferably, the wavelength of the laser is 400-700nm, and the distance between adjacent laser processing points is set to be 5-10 μm.
Compared with the prior art, the invention has the beneficial effects that: the optical filter is fixed by the adhesive tape, so that the optical filter can be prevented from moving, and the cutting accuracy is improved; the laser is electrified to operate to generate a plurality of wire holes on the surface of the optical filter to be cut, the plurality of wire holes form microcracks on the optical filter to be cut, then the optical filter in a required shape is prepared, subsequent steps of polishing and the like are not needed, and the production process is simpler.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a flow chart of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings of the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention. Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
Referring to fig. 1, in an embodiment of the present invention, a method for laser cutting micro cracks of a glass filter includes the following steps:
s1: attaching the optical filter to the adhesive tape, and then placing the optical filter on a processing platform;
s2: setting laser parameters of a picosecond laser processing system;
s3: moving the optical filter to be cut to the transmitting end of the laser;
s4: focusing laser emitted by a laser on the surface of the optical filter to be cut, and electrifying the laser to operate to generate a plurality of screw holes on the surface of the optical filter to be cut; the plurality of wire holes form micro cracks on the optical filter to be cut; the plurality of wire holes form micro cracks on the optical filter to be cut;
s5: and applying external force to the two sides of the microcracks of the optical filter to be cut so as to cut off the optical filter.
Preferably, the laser is a picosecond laser.
Preferably, the pulse width of the laser is less than 20 picoseconds.
Preferably, the wavelength of the laser is 400-700nm, and the distance between adjacent laser processing points is set to be 5-10 μm.
The working principle of the invention is as follows: attaching the optical filter to the adhesive tape, and then placing the optical filter on a processing platform; setting laser parameters of a picosecond laser processing system; moving the optical filter to be cut to the transmitting end of the laser; focusing laser emitted by a laser on the surface of the optical filter to be cut, and electrifying the laser to operate to generate a plurality of screw holes on the surface of the optical filter to be cut; the plurality of wire holes form micro cracks on the optical filter to be cut; the plurality of wire holes form micro cracks on the optical filter to be cut; applying external force to the two sides of the microcrack of the optical filter to be cut so as to cut off the optical filter; the optical filter is fixed by the adhesive tape, so that the optical filter can be prevented from moving, and the cutting accuracy is improved; the laser is electrified to operate to generate a plurality of wire holes on the surface of the optical filter to be cut, the plurality of wire holes form microcracks on the optical filter to be cut, then the optical filter in a required shape is prepared, subsequent steps of polishing and the like are not needed, and the production process is simpler.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (4)
1. A glass filter microcrack laser cutting method is characterized in that: the method comprises the following steps:
s1: attaching the optical filter to the adhesive tape, and then placing the optical filter on a processing platform;
s2: setting laser parameters of a picosecond laser processing system;
s3: moving the optical filter to be cut to the transmitting end of the laser;
s4: focusing laser emitted by a laser on the surface of the optical filter to be cut, and electrifying the laser to operate to generate a plurality of screw holes on the surface of the optical filter to be cut; the plurality of wire holes form micro cracks on the optical filter to be cut; the plurality of wire holes form micro cracks on the optical filter to be cut;
s5: and applying external force to the two sides of the microcracks of the optical filter to be cut so as to cut off the optical filter.
2. The method according to claim 1, wherein: the laser adopts a picosecond laser.
3. The method according to claim 1 or 2, wherein: the pulse width of the laser is less than 20 picoseconds.
4. The method according to claim 1, wherein: the wavelength of the laser is 400-700nm, and the distance between adjacent laser processing points is set to be 5-10 mu m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011529990.XA CN112719642A (en) | 2020-12-22 | 2020-12-22 | Glass optical filter microcrack laser cutting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011529990.XA CN112719642A (en) | 2020-12-22 | 2020-12-22 | Glass optical filter microcrack laser cutting method |
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| Publication Number | Publication Date |
|---|---|
| CN112719642A true CN112719642A (en) | 2021-04-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202011529990.XA Pending CN112719642A (en) | 2020-12-22 | 2020-12-22 | Glass optical filter microcrack laser cutting method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113620585A (en) * | 2021-08-26 | 2021-11-09 | 宁波舜宇奥来技术有限公司 | Picosecond laser cutting method for glass |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020047479A (en) * | 2000-12-13 | 2002-06-22 | 김경섭 | Laser cutting method for non-metallic materials |
| US20130126573A1 (en) * | 2010-07-12 | 2013-05-23 | Filaser Inc. | Method of material processing by laser filamentation |
| CN106966580A (en) * | 2017-04-28 | 2017-07-21 | 武汉理工大学 | A kind of method of femtosecond laser glass-cutting |
| CN206732374U (en) * | 2017-02-24 | 2017-12-12 | 武汉鸿镭激光科技有限公司 | A kind of picosecond laser fly-cutting glass machine |
| CN111439924A (en) * | 2020-04-28 | 2020-07-24 | 深圳市东赢激光设备有限公司 | Use method of large-format glass ultrafast picosecond laser cutting machine |
-
2020
- 2020-12-22 CN CN202011529990.XA patent/CN112719642A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020047479A (en) * | 2000-12-13 | 2002-06-22 | 김경섭 | Laser cutting method for non-metallic materials |
| US20130126573A1 (en) * | 2010-07-12 | 2013-05-23 | Filaser Inc. | Method of material processing by laser filamentation |
| CN206732374U (en) * | 2017-02-24 | 2017-12-12 | 武汉鸿镭激光科技有限公司 | A kind of picosecond laser fly-cutting glass machine |
| CN106966580A (en) * | 2017-04-28 | 2017-07-21 | 武汉理工大学 | A kind of method of femtosecond laser glass-cutting |
| CN111439924A (en) * | 2020-04-28 | 2020-07-24 | 深圳市东赢激光设备有限公司 | Use method of large-format glass ultrafast picosecond laser cutting machine |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113620585A (en) * | 2021-08-26 | 2021-11-09 | 宁波舜宇奥来技术有限公司 | Picosecond laser cutting method for glass |
| CN113620585B (en) * | 2021-08-26 | 2023-03-14 | 宁波舜宇奥来技术有限公司 | Method for picosecond laser cutting of glass |
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