CN220112546U

CN220112546U - Cutting subsystem and cutting equipment

Info

Publication number: CN220112546U
Application number: CN202223365803.6U
Authority: CN
Inventors: 孙晶露
Original assignee: Changzhou Jingce New Energy Technology Co ltd
Current assignee: Changzhou Jingce New Energy Technology Co ltd
Priority date: 2022-12-15
Filing date: 2022-12-15
Publication date: 2023-12-01
Anticipated expiration: 2032-12-15

Abstract

The utility model relates to the technical field of laser beam processing equipment, in particular to a cutting subsystem and cutting equipment, which comprise a first laser, a second laser and a third laser, wherein the first laser is a CO2 laser, the second laser is a short-wavelength laser, and the third laser is an infrared laser.

Description

Cutting subsystem and cutting equipment

Technical Field

The utility model relates to the technical field of laser beam processing equipment, in particular to a cutting subsystem and cutting equipment.

Background

Currently, there are two main types of mobile phone full screen substrates on the market. One type of flexible screen with a glass substrate is commonly known as a hard screen. The other is a fully flexible screen without glass substrate commonly called a flexible screen. In both substrate fabrication, a laser cutting apparatus (Cell Laser Cutting) is required to cut a large plate containing multiple units into individual units for subsequent fabrication.

Different equipment is used for laser cutting of two substrates due to different structural characteristics of the two substrates in the current market. The hard screen mainly comprises a PET protective film layer, a PI layer, a circuit layer and a glass substrate. The hard screen cutting equipment uses a CO2 laser to complete PET layer cutting, and then uses a high-power ultraviolet skin second laser to complete PI and glass cutting. The flexible screen comprises upper and lower PET protective films and a PI circuit layer in the middle. Soft screen cutting also uses a CO2 laser to cut the upper PET and an ultraviolet laser to cut the PI and lower PET. Some of the fabrication processes require a green laser to cut the terminal circuit portion. The base glass thickness of the hard screen is often 0.3mm-1.1mm, and the high-power high-peak-energy ultraviolet laser is required to cut for many times. The flexible screen requires high frequency low peak energy ultraviolet light to cut the PI layer and the lower PET layer, and a vibrating mirror is generally used to realize high-speed multiple cutting to ensure that the PI layer, particularly the lower PET layer, has a smaller heat affected zone. The main problems of the existing equipment are that the cost of a UV laser is very high, the efficiency of cutting a glass substrate is low, the overall yield is affected, meanwhile, mechanical stress splitting is needed for subsequent splitting, the quality after splitting is poor, burrs are easy to appear on the edge, and even splitting failure occurs.

The utility model provides a new cutting mode and is compatible with hard screen and soft screen cutting at the same time in order to solve the problems of cost and efficiency.

Disclosure of Invention

The purpose of the utility model is that: overcomes the defects in the prior art, and provides a cutting subsystem and a cutting device which can improve the cutting efficiency, reduce the equipment cost and improve the product yield.

In order to solve the technical problems, the utility model adopts the following technical scheme:

in one aspect, the utility model provides a cutting subsystem, which comprises a first laser, a second laser and a third laser, wherein laser beams of the first laser, the second laser and the third laser are coplanar, the first laser and the second laser are positioned on one side of a cut object, the third laser is positioned on the other side of the cut object, and focusing light spots of the first laser, the second laser and the third laser are positioned on the cut object when cutting is performed.

Further, the first laser is a CO2 laser.

Further, the second laser is a purple light or green light laser.

Further, the third laser is an infrared skin second laser or a femtosecond laser.

Further, the diameter of the light spot focused by the first laser is not more than 200 micrometers.

Further, the diameter of the light spot focused by the second laser is not more than 50 micrometers.

Further, the diameter of the light spot focused by the third laser is not more than 10 micrometers.

Further, the cut object is a hard screen display screen or a soft screen display screen.

In another aspect, the present utility model also provides a cutting apparatus, characterized in that: comprises a feeding system, a finishing subsystem, a discharging subsystem and a cutting subsystem.

Further, the arrangement subsystem comprises a film tearing device, a splitting device, a waste material removing device, a cleaning device and a detecting device.

The technical scheme of the utility model has the beneficial effects that:

1. according to the utility model, the infrared laser is arranged, so that when the hard screen is cut, the ultra-fast infrared laser is used for wire cutting, and the glass layer can be cut only by single work, so that the single cutting time is shortened, and the cutting efficiency is improved.

2. Because the infrared laser is arranged in some embodiments of the utility model, when the hard screen is cut, only single wire cutting is needed, the cutting edge is smoother, the splinter is easier, and the yield is higher.

3. Some embodiments of the present utility model use two lasers to cut the PET and PI layers separately, each with a reduced thickness to be cut, and a lower power laser, such as a low power violet or green laser, may be selected to reduce the cost of manufacturing the device when the second laser is selected.

4. In some embodiments of the utility model, the first laser and the third laser are respectively arranged at two sides of the large plate, the first laser and the third laser can cut without mutual interference, and the precision requirement on the lasers is reduced.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art. Wherein the method comprises the steps of

FIG. 1 is a schematic structural diagram of embodiment 1 of the present utility model;

fig. 2 is a schematic structural diagram of embodiment 2 of the present utility model.

11. A first laser; 12. a second laser; 13. a third laser;

21. a first layer; 22. a second layer; 23. and a third layer.

Detailed Description

The utility model will now be described in further detail with reference to the accompanying drawings. The drawings are simplified schematic representations which merely illustrate the basic structure of the utility model and therefore show only the structures which are relevant to the utility model. The present utility model will be described in detail by means of a schematic structural diagram, etc., which is only an example, and should not limit the scope of the present utility model. In addition, the three-dimensional space of length, width and depth should be included in actual fabrication.

In one aspect, the present utility model provides a cutting subsystem for cutting a large panel of a display screen, and the present description is drawn and described with respect to a cutting subsystem for cutting a large panel of a display screen.

The first layer 21, the second layer 22 and the third layer 23 correspond to the PET layer, PI, the circuit layer and the PET layer of the soft screen, and correspond to the PET layer, PI, the circuit layer and the glass layer of the hard screen.

Referring to fig. 1-2, a cutting subsystem includes a first laser 11, a second laser 12 and a third laser 13, laser beams of the first laser 11, the second laser 12 and the third laser 13 are coplanar, the first laser 11 is a CO2 laser, the second laser 12 is a short wavelength laser, the third laser 13 is an infrared laser, and focusing spots of the first laser 11, the second laser 12 and the third laser 13 are located on the cut object when cutting is performed.

The second laser 12 is a violet laser with a power of less than 15W.

Or the second laser 12 is a green laser.

The third laser 13 is an infrared skin second laser or a femtosecond laser.

Wherein the diameter of the focused light spot of the first laser 11 is not more than 200 micrometers, the diameter of the focused light spot of the second laser 12 is not more than 50 micrometers, and the diameter of the focused light spot of the third laser 13 is not more than 10 micrometers.

Compared to high power (30W or more) violet lasers, which cost more than 100 tens of thousands, low power violet and green lasers of 15W provide a greater cost advantage in that only the second layer 22 needs to be cut.

Compared with the prior art that one laser needs to cut multiple layers, when the hard screen is cut, three lasers are arranged to cut three layers of the large plate respectively, the thickness of each laser to be cut is reduced, and the lasers with lower cost can be selected when the lasers are selected.

Taking a hard screen glass substrate cutting as an example, in the prior art, a high-power ultraviolet laser is generally used to cut the second layer 22 and the third layer 23 at the same time, the ultraviolet laser needs to select an ultraviolet laser with the power of 30W to complete the cutting of the second layer 22 and the third layer 23 at the same time, while the present utility model sets the third laser 13 to separately cut the third layer 23, the second laser 12 can select an ultraviolet laser or a green laser with the power of about 10W to cut the second layer 22PI and the circuit layer, and the third laser 13 selects an infrared laser to cut the third layer 23.

The third laser 13 is separately provided to cut the third layer 23, and the third laser 13 is an infrared laser, which has the following advantages: the third layer 23 of hard screen is the glass layer, and infrared laser can realize single infrared wire-forming cutting when cutting glass, compares in using the tens of cuts that ultraviolet laser carried out, selects the cutting efficiency of infrared laser to use higher, and the cutting face is more clean and tidy, the later stage lobe of a leaf of being convenient for, and infrared laser's cost is showing and is less than ultraviolet laser.

The infrared laser can be an infrared ultrafast laser with the wavelength of below 30W.

According to the arrangement of the three lasers, the present utility model can be divided into the following embodiments:

example 1

In this embodiment the three lasers are located on the same side of the large plate.

Referring to fig. 1, the first laser 11, the second laser 12 and the third laser 13 are arranged in a row in sequence, and when the three lasers and the large plate move relatively, part or all of the three lasers cut the large plate.

The cutting method applied to soft screen cutting in the embodiment is as follows: 1. the first laser 11 cuts the first layer 21; 2. the second laser 12 simultaneously cuts the second layer 22 and the third layer 23 along the cutting path of the first laser 11.

The cutting method applied to hard screen cutting in the embodiment is as follows: 1. the first laser 11 cuts the first layer 21; 2. the second laser 12 cuts the second layer 22 along the cutting path of the first laser 11; 3. the third laser 13 cuts the third layer 23 along the cutting path of the second laser 12.

The three lasers in example 2 are distributed on both sides of the large plate.

Example 2

Referring to fig. 2, the first laser 11 and the third laser 13 are respectively located at two sides of the cut object, the second laser 12 is located behind the first laser 11, specifically, the first laser 11 and the second laser 12 are located above or below the large plate at the same time, and the third laser 13 is located at the other side of the large plate.

The cutting method applied to hard screen cutting in the embodiment is as follows: 1. the first laser 11 cuts the first layer 21; 2. the second laser 12 cuts the second layer 22 along the cutting path of the first laser 11; 3. the third laser 13 cuts the third layer 23 from the other side of the large plate.

The wire-cutting of glass requires a clean, clear and flat working surface, i.e. the quality requirement on the cutting path after the cutting of the first laser 11 and the second laser 12 is higher in the case of front cutting, and the cutting effect of the third laser 13 is affected by pollution or uneven cutting. In embodiment 2, the third laser 13 is cut from the back surface without being affected by the quality of the previous two cuts, and a better cutting effect can be obtained.

On the other hand, the utility model also provides cutting equipment, which comprises a feeding system, a finishing subsystem, a discharging subsystem and the cutting subsystem, wherein the finishing subsystem comprises a film tearing device, a splitting device, a waste removing device, a cleaning device and a detecting device.

With the above-described preferred embodiments according to the present utility model as an illustration, the above-described descriptions can be used by persons skilled in the relevant art to make various changes and modifications without departing from the scope of the technical idea of the present utility model. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model. The technical scope of the present utility model is not limited to the description, but must be determined according to the scope of claims.

Claims

1. A cutting subsystem, characterized by: the laser comprises a first laser, a second laser and a third laser, wherein the first laser and the second laser are positioned on one side of a cut object, the third laser is positioned on the other side of the cut object, and focusing light spots of the first laser, the second laser and the third laser are positioned on the cut object when cutting is carried out.

2. A cutting subsystem according to claim 1, wherein: the first laser is a CO2 laser.

3. A cutting subsystem according to claim 1, wherein: the second laser is a purple light or green light laser.

4. A cutting subsystem according to claim 1, wherein: the third laser is an infrared skin second laser or a femtosecond laser.

5. A cutting subsystem according to claim 1, wherein: the diameter of the light spot focused by the first laser is not more than 200 micrometers.

6. A cutting subsystem according to claim 1, wherein: and the diameter of the light spot focused by the second laser is not more than 50 microns.

7. A cutting subsystem according to claim 1, wherein: and the diameter of the light spot focused by the third laser is not more than 10 microns.

8. A cutting subsystem according to claim 1, wherein: the cut object is a hard screen display screen or a soft screen display screen.

9. A cutting apparatus, characterized in that: comprising a loading system, a finishing subsystem, a blanking subsystem and a cutting subsystem according to any of claims 1-8.

10. A cutting apparatus as claimed in claim 9, wherein: the arrangement subsystem comprises a film tearing device, a splitting device, a waste removing device, a cleaning device and a detecting device.