KR200371726Y1 - Multi-purpose adhesive tape capable of adhering on both sides - Google Patents
Multi-purpose adhesive tape capable of adhering on both sides Download PDFInfo
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- KR200371726Y1 KR200371726Y1 KR20-2004-0024226U KR20040024226U KR200371726Y1 KR 200371726 Y1 KR200371726 Y1 KR 200371726Y1 KR 20040024226 U KR20040024226 U KR 20040024226U KR 200371726 Y1 KR200371726 Y1 KR 200371726Y1
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- adhesive tape
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- pressure
- resistance value
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/02—Layer formed of wires, e.g. mesh
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/21—Paper; Textile fabrics
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/28—Metal sheet
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/03—3 layers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/105—Metal
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2405/00—Adhesive articles, e.g. adhesive tapes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/41—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the carrier layer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/26—Presence of textile or fabric
- C09J2400/263—Presence of textile or fabric in the substrate
Abstract
도전성 지지부재와, 이 도전성 지지부재의 표면에 형성되며 소정의 전기 저항값을 갖는 압력 점착 테이프층, 및 도전성 지지부재의 이면에 형성되며 소정의 전기 저항값을 갖는 열접착 필름층을 포함하는 양면 접착이 가능한 다목적 점착테이프가 개시된다. 이러한 구성에 의하면, 도전성 접착 필름을 열접착에 의하여 접착할 수 없는 경우에도 적용할 수 있고, 하나의 제품이 두개의 기능을 동시에 가져 원가절감 효과에도 큰 이점이 있다.A double-sided surface comprising a conductive support member, a pressure-sensitive adhesive tape layer formed on the surface of the conductive support member and having a predetermined electrical resistance value, and a heat-adhesive film layer formed on the rear surface of the conductive support member and having a predetermined electrical resistance value. A multipurpose adhesive tape capable of bonding is disclosed. According to such a structure, it is applicable also when a conductive adhesive film cannot be adhere | attached by heat adhesion, and one product has two functions simultaneously, and there is a big advantage also in cost reduction effect.
Description
본 고안은 양면 접착이 가능한 다목적 점착테이프에 관한 것으로, 보다 상세하게는 도전성 지지부재와, 도전성 지지부재의 표면에 형성되며 소정의 전기 저항값을 갖는 압력 점착 테이프층 및 도전성 지지부재의 이면에 형성되며 소정의 전기 저항값을 갖는 열접착 필름층을 포함하는 양면 접착이 가능한 다목적 점착테이프에 관한 것이다.The present invention relates to a multi-purpose adhesive tape capable of double-sided adhesion, and more particularly, to a conductive support member, a pressure-sensitive adhesive tape layer having a predetermined electrical resistance value and formed on the back surface of the conductive support member. The present invention relates to a multi-purpose adhesive tape capable of double-sided adhesive including a thermal adhesive film layer having a predetermined electrical resistance value.
본 출원인에 의한 실용신안등록출원 제2003-19668호에서는 와이어들이 서로 교차되어 직조되고 도금 처리된 복수의 도전성 와이어 메시가 도전성 폴리머수지에 의해 함침되어 시트형상으로 구성된 도전성 열접착 필름이 개시되어 있다.Utility Model Registration Application No. 2003-19668 by the present applicant discloses a conductive heat-adhesive film composed of a plurality of conductive wire meshes woven and cross-plated with wires impregnated with a conductive polymer resin in a sheet shape.
이러한 구성에 의하면, 도전성 열접착 필름이 열에 의하여 도전성 열접착 수지가 열 변형 혹은 용융되었을 때 도전성 와이어 메시에 의해 도전성 열접착 수지의 형상이 어느 곳에서나 균일한 형상과 두께로 유지되어 균일한 접착 특성 및 균일한 전기적 특성 등 균일한 제품의 품질을 얻을 수 있고, 또한 도전성 와이어 메시에 의하여 도전성 열접착 필름이 구조적 강도를 가져 잘 찢어지거나 늘어나지 않는 이점이 있고 열접착 수지에 의해 와이어 메시의 양 끝단이 잘 풀리지 않는 이점이 있다.According to this constitution, when the conductive thermal adhesive resin is thermally deformed or melted by heat, the conductive thermal adhesive resin is kept in a uniform shape and thickness anywhere by the conductive wire mesh, so that the uniform adhesive properties are achieved. And uniform product quality such as uniform electrical characteristics, and the conductive wire mesh has a structural strength that does not easily tear or elongate due to the structural strength. There is an advantage that does not work well.
그러나, 이 구성에서는 적용된 도전성 열접착 수지, 예를 들어, 도전성 핫멜트는 열에 의해서만 열변형 또는 용융되어 대상물과 접착이 가능하기 때문에 열접착을 수행할 수 없는 경우에는 대상물과 접착되지 못한다는 단점이 있다.However, in this configuration, the applied conductive heat-adhesive resin, for example, the conductive hot melt is heat-deformed or melted only by heat, and thus can be adhered to the object. .
따라서 본 고안은 이러한 종래의 문제점을 해결하기 위하여 제안되는 것으로, 열접착뿐만 아니라 압력 점착도 가능한 양면 접착이 가능한 다목적 점착테이프를 제공하는데 그 목적이 있다.Therefore, the present invention is proposed to solve such a conventional problem, and an object of the present invention is to provide a multi-purpose adhesive tape capable of double-sided adhesive capable of pressure bonding as well as thermal bonding.
본 고안의 다른 목적은 적용되는 도전성 파우더의 양을 적절하게 조절하여 다양한 전기 저항값을 갖도록 하여 전자파 차폐, 전기 접지, 정전기 방지 및 전자파 흡수용으로 이용할 수 있는 다목적 점착테이프를 제공하는 것이다.Another object of the present invention is to provide a multi-purpose adhesive tape that can be used for electromagnetic shielding, electrical grounding, antistatic and electromagnetic wave absorption by appropriately adjusting the amount of the conductive powder applied to have various electrical resistance values.
본 고안의 다른 목적과 특징은 이하에 서술되는 바람직한 실시예를 통하여 보다 명확하게 이해될 것이다.Other objects and features of the present invention will be more clearly understood through the preferred embodiments described below.
도 1은 본 고안의 일 실시예에 따른 양면 접착이 가능한 다목적 점착테이프의 일부분을 나타내는 사시도이다.1 is a perspective view showing a part of a multi-purpose adhesive tape capable of double-sided adhesive according to an embodiment of the present invention.
도 2는 도 1의 양면 접착이 가능한 다목적 점착테이프의 분해 사시도이다.FIG. 2 is an exploded perspective view of a multi-purpose adhesive tape capable of double-sided adhesion of FIG. 1.
도 3은 본 고안에 따른 양면 접착이 가능한 다목적 점착테이프의 실제 사용방법을 보여주는 사시도이다.Figure 3 is a perspective view showing the actual use of the multi-purpose adhesive tape capable of double-sided adhesive according to the present invention.
본 고안에 따르면, 도전성 지지부재와, 이 도전성 지지부재의 표면에 형성되며 소정의 전기 저항값을 갖는 압력 점착 테이프층, 및 도전성 지지부재의 이면에 형성되며 소정의 전기 저항값을 갖는 열접착 필름층을 포함하는 양면 접착이 가능한 다목적 점착테이프가 개시된다.According to the present invention, a pressure-sensitive adhesive tape layer formed on the surface of the conductive support member, the conductive support member, and having a predetermined electrical resistance value, and a heat-adhesive film formed on the back surface of the conductive support member and having a predetermined electrical resistance value Disclosed is a multi-purpose adhesive tape capable of double-sided adhesive comprising a layer.
바람직하게, 열접착 필름은 비도전성 핫 멜트 수지에 도전성 파우더가 균일하게 분산되어 구성되고, 압력 점착 테이프는 비도전성 폴리머 수지에 도전성 파우더가 균일하게 분산되어 구성된다.Preferably, the heat-adhesive film is formed by uniformly dispersing conductive powder in the non-conductive hot melt resin, and the pressure-sensitive adhesive tape is formed by uniformly dispersing conductive powder in the non-conductive polymer resin.
바람직하게, 열접착 필름층과 압력 점착 테이프층의 전기 저항값이 각각 0.01 오옴 내지 1 오옴으로 설정되도록 도전성 파우더의 양을 제어하며 전자파 차폐용이나 전기 접지용으로 이용되거나, 전기 저항값이 각각 10 오옴 내지 109오옴으로 설정되도록 도전성 파우더의 양을 제어하며 정전기 방지용으로 이용될 수 있다.Preferably, the amount of the conductive powder is controlled so that the electrical resistance values of the heat-adhesive film layer and the pressure-sensitive adhesive tape layer are set to 0.01 ohm to 1 ohm, respectively. The amount of conductive powder is controlled to be set from 10 to 10 9 ohms and can be used for antistatic.
또한, 도전성 파우더로 페라이트나 연자성 금속 파우더가 적용되어 전자파 흡수용으로 이용될 수 있다.In addition, ferrite or soft magnetic metal powder may be applied as the conductive powder to be used for absorbing electromagnetic waves.
바람직하게, 도전성 파우더는 카본, 구리, 니켈, 알루미늄 또는 은 중 어느 하나 또는 이들의 조합으로 이루어진다.Preferably, the conductive powder consists of any one or combination of carbon, copper, nickel, aluminum or silver.
도전성 지지부재는 서로 교차되어 직조되고 도금 처리된 도전성 와이어 메시, 직조되거나 부직포 형태로 이루어진 도전성 천 또는 금속박 중의 어느 하나일 수 있다.The conductive support member may be any one of a conductive wire mesh interwoven with each other and woven and plated, a conductive cloth or a metal foil made of a woven or nonwoven fabric.
이하 첨부된 도면을 참조하여 본 고안의 일 실시예를 설명한다.Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings.
도 1은 본 고안의 일 실시예에 따른 양면 접착이 가능한 다목적 점착테이프의 일부분을 나타내는 사시도이고, 도 2는 도 1의 양면 접착이 가능한 다목적 점착테이프의 분해 사시도이다. 설명의 편의를 위하여 도전성 와이어 메시를 도전성 지지부재로 이용하는 경우를 예로 든다.1 is a perspective view illustrating a part of a multi-purpose adhesive tape capable of double-sided adhesive according to an embodiment of the present invention, and FIG. 2 is an exploded perspective view of the multi-purpose adhesive tape capable of double-sided adhesion of FIG. 1. For convenience of description, the case where the conductive wire mesh is used as the conductive support member is taken as an example.
도시된 바와 같이, 와이어들(10, 40)이 서로 교차되어 직조되고 도금 처리된 도전성 와이어 메시(50)의 표면에는 압력 점착 테이프층(Pressure Sensitive Adhesive tape; 20)이 형성되고, 도전성 와이어 메시(50)의 이면에는 열접착 필름층(30)이 형성된다. 물론, 이 실시예와 반대로 표면과 이면에 형성되는 층이 서로 바뀔 수 있다.As shown, a pressure sensitive adhesive tape 20 is formed on the surface of the conductive wire mesh 50 that is woven and plated with the wires 10 and 40 intersected with each other, and a conductive wire mesh ( The thermal adhesive film layer 30 is formed on the back surface of 50). Of course, in contrast to this embodiment, the layers formed on the front and back surfaces may be interchanged.
상기한 바와 같이, 이 실시예에서는 압력 접착 테이프층(20)과 열접착 필름층(30)의 경계에 도전성 와이어 메시(50)가 적용되는 것을 예로 들었으나, 다른 형태의 도전성 지지부재가 적용될 수 있음은 물론이다.As described above, in this embodiment, the conductive wire mesh 50 is applied to the boundary between the pressure-sensitive adhesive tape layer 20 and the heat-adhesive film layer 30 as an example, but other types of conductive support members may be applied. Of course.
예를 들어, 직조되거나 부직포 형태로 이루어진 도전성 천이나 알루미늄 등의 금속박이 적용될 수 있다.For example, a conductive cloth or a metal foil such as aluminum, which is woven or nonwoven, may be applied.
이와 같은 구성의 점착테이프는 외부에서 보면 직조된 도전성 와이어 메시(50)는 보이지 않게 되고 전체적으로 얇은 시트형상을 이룬다.The pressure-sensitive adhesive tape of such a configuration makes the woven conductive wire mesh 50 invisible and forms a thin sheet as a whole.
바람직하게, 도전성 와이어(10, 40)는 비도전성 폴리에스테르(PET)나 나일론의 폴리머 와이어(Polymer wire)의 표면에 무전해 도금공정을 통하여 니켈, 구리 또는 은이 도금되거나 이들 금속이 서로 여러 층으로 적층되도록 도금된다.Preferably, the conductive wires 10 and 40 are plated with nickel, copper, or silver, or the metals are formed in multiple layers by electroless plating on the surface of a non-conductive polyester (PET) or nylon polymer wire. Plated to be stacked.
또한, 도전성 와이어의 메시 사이즈(mesh count per inch)는 #50에서 #250 사이인 것이 바람직하며, 도전성 와이어의 와이어 직경(diameter of wire)은 25 미크론에서 110 미크론 사이인 것이 바람직하다.In addition, the mesh count per inch of the conductive wire is preferably between # 50 and # 250, and the diameter of the wire of the conductive wire is preferably between 25 and 110 microns.
바람직하게, 열접착 필름은 열에 의하여 열변형 또는 용융되어 대상물에 열접착될 수 있는 비도전성 핫 멜트 수지에 도전성 파우더가 균일하게 분산 혼합되어 일정한 전기 저항값을 갖도록 할 수 있다. 이 경우, 비도전성 핫 멜트의 재료로는 폴리우레탄, 폴리에스터, 폴리스틸렌 또는 EVA 중 어느 하나이거나 또는 이들 재료를 혼합하여 사용할 수 있다.Preferably, the heat-adhesive film may be uniformly dispersed and mixed with a non-conductive hot melt resin that may be thermally deformed or melted by heat to be heat-bonded to an object so as to have a constant electric resistance value. In this case, the material of the non-conductive hot melt may be any one of polyurethane, polyester, polystyrene or EVA, or a mixture of these materials.
또한, 점착 테이프는 비도전성 폴리머 수지에 도전성 파우더가 균일하게 혼합되어 일정한 전기 저항값을 갖도록 할 수 있으며, 이 경우 비도전성 수지의 재료로는 아크릴 또는 실리콘이 이용될 수 있다.In addition, the adhesive tape may be uniformly mixed with the conductive powder in the non-conductive polymer resin to have a constant electrical resistance value, in this case, acrylic or silicone may be used as the material of the non-conductive resin.
바람직하게, 도전성 파우더는 카본, 니켈, 구리, 알루미늄 또는 은 중 어느 하나이거나 혹은 이들을 혼합한 것일 수 있다.Preferably, the conductive powder may be any one of carbon, nickel, copper, aluminum, or silver, or a mixture thereof.
본 발명에 따르면, 적용되는 도전성 파우더의 양에 따라 전기 저항값을 변화시켜 여러 가지의 목적에 이용할 수 있다.According to the present invention, the electric resistance value is changed depending on the amount of the conductive powder applied, and can be used for various purposes.
예를 들어, 전기 저항값이 0.01 오옴에서 1오옴 사이에서는 전자파 차폐용이나 전기 접지용으로 이용할 수 있으며, 전기 저항값이 10 오옴에서 109오옴까지는 정전기 방지용으로 이용할 수 있다.For example, an electric resistance value of 0.01 ohm to 1 ohm can be used for electromagnetic shielding or electrical grounding, and an electric resistance value of 10 ohm to 10 9 ohm can be used for antistatic.
또한, 도전성 파우더로 반도전성의 세라믹 파우더인 페라이트나 연자성 금속 파우더를 적용함으로써 전자파 흡수용으로 이용할 수 있다.In addition, it can be used for electromagnetic wave absorption by applying a ferrite or a soft magnetic metal powder, which is a semiconductive ceramic powder, as the conductive powder.
이와 같은 구성에 의하면, 도전성 열접착 필름층에 의해 열을 이용하여 대상물에 접착할 수 있고, 도전성 압력 점착 테이프층에 의해 열이 아닌 압력을 이용하여 대상물에 접착할 수 있다.According to such a structure, it can adhere | attach an object with heat using a conductive heat adhesive film layer, and can adhere to an object using pressure rather than heat with a conductive pressure-sensitive adhesive tape layer.
또한, 열접착 필름층과 압력 점착테이프층에 적용되는 도전성 파우더의 양을 적절하게 조절하여 다양한 전기 저항값을 갖도록 하여 전자파 차폐, 전기 접지, 정전기 방지 및 전자파 흡수용으로 이용할 수 있다.In addition, by appropriately adjusting the amount of the conductive powder applied to the thermal adhesive film layer and the pressure-sensitive adhesive tape layer to have a variety of electrical resistance values can be used for electromagnetic shielding, electrical grounding, antistatic and electromagnetic wave absorption.
본 고안에 따른 다목적 점착테이프를 제조하는 방법을 개략적으로 설명하면 다음과 같다.Referring to the method of manufacturing a multi-purpose adhesive tape according to the present invention as follows.
먼저 도전성 지지부재를 연속적으로 이동시키면서 표면에 액상의 압력 점착물질을 코팅하여 액상의 압력 점착테이프층을 형성한다.First, the liquid pressure-sensitive adhesive material is coated on the surface while the conductive support member is continuously moved to form a liquid pressure-sensitive adhesive tape layer.
이어 표면과 이면이 바뀌도록 뒤집은 상태로 연속적으로 이동하면서 액상의 열접착 필름물질을 코팅하여 열접착 필름층을 형성한다.Subsequently, the surface and the rear surface are continuously turned in an inverted state to form a thermal adhesive film layer by coating a liquid thermal adhesive film material.
이와 같이 함으로써 도전성 지지부재를 경계로 하여 압력 점착테이프층과 열접착 필름층이 일체로 접착된 점착테이프가 제작된다.In this way, a pressure-sensitive adhesive tape in which the pressure-sensitive adhesive tape layer and the heat-adhesive film layer are integrally bonded with the conductive support member as a boundary is produced.
도 3은 본 고안에 따른 양면 접착이 가능한 다목적 점착테이프의 실제 사용방법을 보여주는 사시도이다. 여기에서는 전기 접지용으로 이용하는 경우를 설명한다.Figure 3 is a perspective view showing the actual use of the multi-purpose adhesive tape capable of double-sided adhesive according to the present invention. Here, the case where it is used for electrical grounding is demonstrated.
전자부품(110)이 실장된 인쇄회로기판(100)의 접지패턴(120)을 대상물(200)의 접지패턴(210)에 전기적으로 연결하는 경우를 설명한다.A case in which the ground pattern 120 of the printed circuit board 100 on which the electronic component 110 is mounted is electrically connected to the ground pattern 210 of the object 200 will be described.
본 고안의 양면 접착이 가능한 다목적 점착테이프(1)의 압력 점착 테이프층(20)이 접지패턴(210)에 전기적으로 연결되도록 대상물(200)에 가압하여 부착한다. 이 상태에서 연결 와이어(150)의 일단을 인쇄회로기판(100)의 접지패턴(120)에 연결하고, 타단은 양면 접착이 가능한 다목적 점착테이프(1)의 열접착 필름층(30) 위에 대고 가열수단(300)을 이용하여 열을 가하면, 열접착 필름층(30)의 해당 부분은 열변형 또는 용융되어 연결 와이어(150)의 타단은 열접착 필름층(30)에 접착된다.The pressure-sensitive adhesive tape layer 20 of the multi-purpose adhesive tape 1 capable of double-sided adhesion of the present invention is attached to the object 200 by being pressed to be electrically connected to the ground pattern 210. In this state, one end of the connection wire 150 is connected to the ground pattern 120 of the printed circuit board 100, and the other end is heated on the thermal adhesive film layer 30 of the multipurpose adhesive tape 1 capable of double-sided adhesion. When heat is applied using the means 300, the corresponding portion of the heat-adhesive film layer 30 is thermally deformed or melted so that the other end of the connection wire 150 is bonded to the heat-adhesive film layer 30.
전자부품(110)의 접지단은 접지패턴(120)과 연결 와이어(150)와 도전성을 갖는 열접착 필름층(30)과 압력 점착 테이프층(20)을 거쳐 접지패턴(220)에 전기적으로 연결된다.The ground end of the electronic component 110 is electrically connected to the ground pattern 220 through the ground pattern 120, the connection wire 150, and the conductive adhesive film layer 30 and the pressure-sensitive adhesive tape layer 20. do.
이와 같이, 전기적인 연결을 위하여 종래와 같이 땜납을 이용할 필요가 없으며, 솔더링 시와 같이 고온의 열을 필요로 하지 않는다는 이점이 있다.As such, there is no need to use solder as in the prior art for electrical connection, and there is an advantage in that high temperature heat is not required as in soldering.
이상에서는 본 고안의 바람직한 실시예를 중심으로 설명하였지만, 본 고안의 정신을 벗어나지 않는 범위 내에서 다양한 변경이나 변형을 가할 수 있다. 따라서,본 고안의 범위는 상기한 실시예에 국한되어서는 안되며, 이하에 서술되는 실용신안등록청구범위에 의해 결정되어야 한다.In the above described with reference to a preferred embodiment of the present invention, various changes or modifications can be made within the scope without departing from the spirit of the present invention. Therefore, the scope of the present invention should not be limited to the above embodiment, but should be determined by the utility model registration claims described below.
이상에서 설명한 바와 같이, 본 고안에 따르면 열접착에 의하여 접착할 수 없는 경우에 압력 점착 테이프층을 이용하여 접착할 수 있다는 이점이 있다.As described above, according to the present invention, there is an advantage in that the adhesive can be adhered using a pressure-sensitive adhesive tape layer when it cannot be bonded by thermal bonding.
또한, 열접착 필름층과 압력 점착테이프층에 적용되는 도전성 파우더의 양을 적절하게 조절하여 다양한 전기 저항값을 갖도록 하여 전자파 차폐, 전기 접지, 정전기 방지 및 전자파 흡수용으로 이용할 수 있다.In addition, by appropriately adjusting the amount of the conductive powder applied to the thermal adhesive film layer and the pressure-sensitive adhesive tape layer to have a variety of electrical resistance values can be used for electromagnetic shielding, electrical grounding, antistatic and electromagnetic wave absorption.
특히, 하나의 제품이 두개의 기능을 동시에 가져 원가절감 효과에도 큰 이점이 있다.In particular, since one product has two functions at the same time, there is a big advantage in cost reduction effect.
또한, 도전성 지지부재에 의해 용융 후에도 균일한 형태와 두께를 유지시켜 대상물에 균일한 전기적, 기구적 특성을 제공할 수 있으며, 인장강도 같은 기계적 강도를 향상시킬 수 있다.In addition, the conductive support member may maintain a uniform shape and thickness even after melting, to provide uniform electrical and mechanical properties to the object, and improve mechanical strength such as tensile strength.
Claims (7)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20-2004-0024226U KR200371726Y1 (en) | 2004-08-24 | 2004-08-24 | Multi-purpose adhesive tape capable of adhering on both sides |
| PCT/KR2004/002281 WO2006022463A1 (en) | 2004-08-24 | 2004-09-08 | Multi-purpose adhesive tape capable of adhering on both sides |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20-2004-0024226U KR200371726Y1 (en) | 2004-08-24 | 2004-08-24 | Multi-purpose adhesive tape capable of adhering on both sides |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR200371726Y1 true KR200371726Y1 (en) | 2005-01-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| KR20-2004-0024226U KR200371726Y1 (en) | 2004-08-24 | 2004-08-24 | Multi-purpose adhesive tape capable of adhering on both sides |
Country Status (2)
| Country | Link |
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| KR (1) | KR200371726Y1 (en) |
| WO (1) | WO2006022463A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100882483B1 (en) * | 2007-06-05 | 2009-02-17 | 주식회사 아원 | Manufacturing method of emi shielding fabric sheet with adhesive attached hot-melt adhesive layer |
| WO2013025330A2 (en) * | 2011-08-12 | 2013-02-21 | 3M Innovative Properties Company | Optically clear conductive adhesive and articles therefrom |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8545974B2 (en) | 2005-02-09 | 2013-10-01 | Laird Technologies, Inc. | Flame retardant EMI shields |
| US7897882B1 (en) * | 2006-04-06 | 2011-03-01 | Majilitie Corporation | Electromagnetic interference and radio frequency absorbing material and process for forming the same |
| JP2007294808A (en) | 2006-04-27 | 2007-11-08 | Nitto Denko Corp | Structure with property to conduct or absorb electromagnetic wave |
| JP2007299907A (en) | 2006-04-28 | 2007-11-15 | Nitto Denko Corp | Structure having property of conducting or absorbing electromagnetic wave |
| CN101144214A (en) * | 2006-09-12 | 2008-03-19 | 福懋兴业股份有限公司 | Method for manufacturing ultra-thin flexible conductive cloth |
| US20170191228A1 (en) * | 2016-01-04 | 2017-07-06 | Pentair Thermal Management Llc | Anti-Icing Walkway with Integrated Control and Switching |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57125280A (en) * | 1981-01-27 | 1982-08-04 | Nitto Electric Ind Co Ltd | Tape having adhesive layers on both sides of substrate |
| US5246771A (en) * | 1988-04-18 | 1993-09-21 | Teraoka Seisakusho Co., Ltd. | Adhesive tape for preventing implosion and removing electrostatic charge |
| JPH0436630A (en) * | 1990-05-31 | 1992-02-06 | Hitachi Ltd | Life testing device |
| KR950009830B1 (en) * | 1992-03-02 | 1995-08-29 | 이용인 | Conductive adhesive tape |
| US5478639A (en) * | 1993-05-12 | 1995-12-26 | Teraoka Seisakusho Co., Ltd. | Adhesive tape for preventing implosion of cathode ray tube |
| JPH10219212A (en) * | 1997-02-06 | 1998-08-18 | Nitto Denko Corp | Tacky tape having electroconductive fine wire |
| KR100247488B1 (en) * | 1997-12-22 | 2000-03-15 | 이용인 | An electro-conductive adhesive tape |
| KR100550808B1 (en) * | 2003-11-17 | 2006-02-09 | 주식회사 에스테크 | The multi-layer type sheet for shielding from electromagnetic waves and the method for making it |
-
2004
- 2004-08-24 KR KR20-2004-0024226U patent/KR200371726Y1/en not_active IP Right Cessation
- 2004-09-08 WO PCT/KR2004/002281 patent/WO2006022463A1/en active Application Filing
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100882483B1 (en) * | 2007-06-05 | 2009-02-17 | 주식회사 아원 | Manufacturing method of emi shielding fabric sheet with adhesive attached hot-melt adhesive layer |
| WO2013025330A2 (en) * | 2011-08-12 | 2013-02-21 | 3M Innovative Properties Company | Optically clear conductive adhesive and articles therefrom |
| WO2013025330A3 (en) * | 2011-08-12 | 2013-07-11 | 3M Innovative Properties Company | Optically clear conductive adhesive and articles therefrom |
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| WO2006022463A1 (en) | 2006-03-02 |
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