JPH0339890Y2 - - Google Patents

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Publication number
JPH0339890Y2
JPH0339890Y2 JP1982100419U JP10041982U JPH0339890Y2 JP H0339890 Y2 JPH0339890 Y2 JP H0339890Y2 JP 1982100419 U JP1982100419 U JP 1982100419U JP 10041982 U JP10041982 U JP 10041982U JP H0339890 Y2 JPH0339890 Y2 JP H0339890Y2
Authority
JP
Japan
Prior art keywords
adhesive
film
heat
wiring pattern
anisotropically conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1982100419U
Other languages
Japanese (ja)
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JPS594664U (en
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Filing date
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Priority to JP1982100419U priority Critical patent/JPS594664U/en
Publication of JPS594664U publication Critical patent/JPS594664U/en
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Publication of JPH0339890Y2 publication Critical patent/JPH0339890Y2/ja
Granted legal-status Critical Current

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Description

【考案の詳細な説明】 本考案は異方導電熱接着型コネクタ、特には回
路基板同志あるいは回路基板と表示素子間などの
電気的接続を行なうための異方導電熱接着型コネ
クタに関するものである。
[Detailed description of the invention] The present invention relates to an anisotropically conductive heat-adhesive connector, particularly an anisotropically conductive heat-adhesive connector for electrically connecting circuit boards to each other or between a circuit board and a display element. .

回路基板の入出力配線端子とLCD,LEDなど
の表示素子の入出力配線端子との接続について
は、両者を接続するためのソケツト状の別部品を
別途用意するか、あるいはこの両者の対応する端
子を一対づつ半田付けするという方法が汎用化さ
れているが、作業が煩雑なうえに後者の半田付け
方法には回路基板の材質を耐熱性のものとする必
要があつた。これらの煩雑さを避けるために配線
端子部同志を熱接着型コネクタで接続する方法、
例えば回路基板上の端子部のみの上に導電性加熱
型接着剤を設ける方法や、端子自体を熱接着型導
電性材料で構成する方法、または回路基板の配線
端子間に絶縁性の熱圧型接着層を設けて対応する
端子同志を強制的に接着固定する方法が提案され
ている。しかし、前二者の方法では実装時におい
て回路基板や接続しようとするべきでない回路と
コネクタとの接触による短絡が生じ易いので注意
して取扱わねばならないうえに、接続部間の隙間
を埋めるためにその接続部を包みこむように別途
絶縁性の保護膜を設けらければ短絡を生じやすい
という不利があり、後者の方法では接着剤の塗布
部分が限定されるために高度の技術が要求され、
特に回路が高度に複雑で高精度のものはでき上が
つた製品が高価なものになつてしまうという欠点
がある。
To connect the input/output wiring terminals of the circuit board and the input/output wiring terminals of display elements such as LCDs and LEDs, either prepare a separate socket-shaped part to connect the two, or use the corresponding terminals for both. The method of soldering one pair at a time has become common, but the work is complicated, and the latter method requires that the material of the circuit board be heat-resistant. In order to avoid these complications, there is a method of connecting the wiring terminals with thermal adhesive connectors.
For example, a method in which a conductive heating adhesive is provided only on the terminal section on the circuit board, a method in which the terminal itself is made of a thermally adhesive conductive material, or an insulating thermopressure adhesive between the wiring terminals on the circuit board. A method has been proposed in which layers are provided and corresponding terminals are forcibly bonded and fixed to each other. However, with the first two methods, short circuits are likely to occur during mounting due to contact between the connector and the circuit board or circuits that should not be connected, so they must be handled with care. If a separate insulating protective film is not provided to wrap around the connection, there is a disadvantage that short circuits are likely to occur, and the latter method requires advanced technology because the area where the adhesive can be applied is limited.
In particular, circuits with highly complex and high precision circuits have the disadvantage that the finished product becomes expensive.

本考案はこのような不利、欠点を解決した異方
導電熱接着極コネクタに関するものであり、これ
は熱接着性可撓性フイルム材料100容量部に、繊
維径が5〜100μmで繊維長が15〜300μm、アス
ペクト比が3以上である導電性繊維状体からなる
導電性付与剤0.05〜40容量部を繊維の長手方向が
フイルム沿面に平行となるように分散混合してな
る熱接着性可撓性異方導電性フイルム状体を、配
線パターン上に設けてなることを特徴とするもの
である。
The present invention relates to an anisotropically conductive heat-adhesive terminal connector that solves these disadvantages and shortcomings.This invention consists of 100 volume parts of a heat-adhesive flexible film material with a fiber diameter of 5 to 100 μm and a fiber length of 15 μm. A thermoadhesive flexible product made by dispersing and mixing 0.05 to 40 parts by volume of a conductivity imparting agent made of a conductive fibrous material with a diameter of ~300 μm and an aspect ratio of 3 or more so that the longitudinal direction of the fibers is parallel to the film surface. It is characterized in that a sexually anisotropically conductive film-like body is provided on a wiring pattern.

以下これを添付の図面にもとづいて説明する
と、第1図は本考案になるコネクタの斜視図、第
2図は本考案になるコネクタと表示素子(図示せ
ず)の接続端子との接続時の部分拡大縦断面を示
したものである。
This will be explained below based on the attached drawings. Figure 1 is a perspective view of the connector according to the present invention, and Figure 2 is a diagram showing the connection between the connector according to the present invention and the connection terminal of a display element (not shown). It shows a partially enlarged longitudinal section.

すなわち、第1図には配線パターン2を有する
回路基板1上に熱接着性可撓性の異方導電性フイ
ルム状体3を設けてなる本考案のコネクタが示さ
れている。この基板1の材質は本考案のコネクタ
とLCD,LEDなどの表示装置との接続が熱圧着
によつて行われるものであるということから、接
続時の熱によつて軟化しない耐熱性のもので、好
ましくは凹凸を吸収し得る可撓性のもの、例えば
ポリアミド、ポリイミド、ポリエステルなどの耐
熱性プラスチツクやシリコーンゴム、耐熱性ニト
リルゴムなどの合成ゴムで作つた、厚さ5〜
100μm好ましくは10〜50μmのフイルム状体とさ
れる。
That is, FIG. 1 shows a connector of the present invention in which a heat-adhesive flexible anisotropically conductive film-like body 3 is provided on a circuit board 1 having a wiring pattern 2. As shown in FIG. Since the connector of the present invention is connected to a display device such as an LCD or LED by thermocompression bonding, the material of this board 1 must be heat-resistant so that it will not soften due to the heat generated during connection. , preferably made of a flexible material capable of absorbing unevenness, such as a heat-resistant plastic such as polyamide, polyimide, or polyester, or a synthetic rubber such as silicone rubber or heat-resistant nitrile rubber, and having a thickness of 5 to 50%.
The film is 100 μm, preferably 10 to 50 μm.

他方、配線パターン2は基材1の上に銅、アル
ミニウム、ステンレスなどの金属箔を接着一体化
させたのちエツチング法などで所望の配線パター
ンに形成したもの、あるいは銅、ニツケル、銀、
金、カーボンなどの導電性粒子をエポキシ系、ウ
レタン系などのバインダーに混合した塗料をグラ
ビア法、スクリーン法などの印刷手段で所望の配
線パターンを形成したものとされるが、これは従
来公知の配線パターンに形成したもの、必要に応
じてさらにその表面に金メツキ、ハンダメツキ、
カーボンコートなどの保護膜を設けたものであつ
もよい。
On the other hand, the wiring pattern 2 can be formed by bonding and integrating a metal foil such as copper, aluminum, or stainless steel onto the base material 1, and then forming the desired wiring pattern by etching or the like, or by forming a desired wiring pattern using copper, nickel, silver, or the like.
It is said that a desired wiring pattern is formed using a printing method such as a gravure method or a screen method using a paint in which conductive particles such as gold or carbon are mixed with a binder such as epoxy or urethane. The wiring pattern is formed, and if necessary, the surface is further plated with gold, solder, etc.
It may be provided with a protective film such as a carbon coat.

つぎに、この配線パターン2を有する基板1の
上に設けられる熱接着性可撓性異方導電性フイル
ム状体3は加熱により接着性を生じるプラスチツ
クまたはゴムとこれに分散混合された繊維状の導
電性付与剤5からなるが、このプラスチツクとし
ては例えばポリアミド、ポリエステル、エチレン
−酢酸ビニル共重合体、エチレン−アクリレート
共重合体やエチレン−メタクリレート共重合体、
エチレン−エポキシ共重合体などのポリオレフイ
ン系共重合体、エポキシ樹脂などが挙げられ、他
方ゴムとしてはシリコーンゴム、クロロブレンゴ
ム、ニトリルゴムあるいはそれらの変性複合物な
どが挙げられるが、これらは使用目的に適する接
着強度を得るために必要とされる温度、圧力など
の諸条件にもとづいて適宜選択される。他方、異
方導電性付与剤5としては金、銀、銅、鉛、アル
ミニウム、マグネシウム、ニツケル、タングステ
ン、チタン、青銅、コバルト、ステンレススチー
ル、窒化チタン、窒化ほう素などの金属、合金
類、セラミツク類(必要に応じて表面に金属蒸
着、複合化により導電性付与処理が施される)で
ウイスカー法、蒸着法、溶融紡糸法、引き抜き
法、剪断法などで作られた繊維径が5〜100μm、
繊維長が15〜300μm、好ましくは15〜100μmで、
アスペクト比(繊維長/繊維径の比)が3以上で
ある導電性繊維状体が挙げられる。なお、これら
の導電性付与剤の混合量は上記フイルム材料100
容量部に対して0.05容量部より少ないとその導通
密度が小さいものとなつてその電気的接続の信頼
性が小さくなり、他方40容量部より大きい場合に
はこれを熱圧してときにその導電性付与剤間に不
必要な連鎖が生じ熱圧方向に対して直角な方向で
の絶縁が困難となり、異方導電性が保持できなく
なるので、これはフイルム材料100容量部に対し
0.05〜40容量部、好ましくは0.5〜30容量部、さ
らに好ましくは2〜25容量部とされる。しかし
て、導電性付与剤としての導電性繊維状体を使用
するに当つては導電性繊維の長手方向をフイルム
状体表面とほぼ平行に配向させる必要があるが、
これは上記したフイルム材料中に上記した繊維径
が5〜100μm、繊維長が15〜300μmでアスペク
ト比が3以上の範囲内にある導電性繊維状体をフ
イルム材料100容量部に対して0.05〜40容量部配
合したのち、これを流動状態で流れ方向に剪断応
力を押加して流出させて、導電性繊維をその流出
方向に配向させればよい。
Next, the heat-adhesive flexible anisotropically conductive film-like material 3 provided on the substrate 1 having the wiring pattern 2 is made of plastic or rubber that becomes adhesive when heated, and a fibrous material dispersed and mixed therein. The conductivity imparting agent 5 is made of a material such as polyamide, polyester, ethylene-vinyl acetate copolymer, ethylene-acrylate copolymer, ethylene-methacrylate copolymer,
Examples include polyolefin copolymers such as ethylene-epoxy copolymers, epoxy resins, etc. Rubbers include silicone rubber, chloroprene rubber, nitrile rubber, and modified composites thereof, depending on the purpose of use. It is selected as appropriate based on various conditions such as temperature and pressure required to obtain adhesive strength suitable for. On the other hand, the anisotropic conductivity imparting agent 5 includes metals, alloys, and ceramics such as gold, silver, copper, lead, aluminum, magnesium, nickel, tungsten, titanium, bronze, cobalt, stainless steel, titanium nitride, and boron nitride. Fibers with a diameter of 5 to 100 μm are made by whisker method, vapor deposition method, melt spinning method, drawing method, shearing method, etc. ,
The fiber length is 15 to 300 μm, preferably 15 to 100 μm,
Examples include conductive fibrous bodies having an aspect ratio (fiber length/fiber diameter ratio) of 3 or more. The mixing amount of these conductivity imparting agents is 100% of the above film material.
If it is less than 0.05 parts per capacitance, the conduction density will be low and the reliability of the electrical connection will be low, while if it is more than 40 parts per capacitance, its conductivity will be reduced when it is heated and pressed. Unnecessary chains occur between the imparting agents, making it difficult to insulate in the direction perpendicular to the heat-pressing direction, making it impossible to maintain anisotropic conductivity.
The amount is 0.05 to 40 parts by volume, preferably 0.5 to 30 parts by volume, and more preferably 2 to 25 parts by volume. However, when using a conductive fibrous material as a conductivity imparting agent, it is necessary to orient the longitudinal direction of the conductive fibers almost parallel to the surface of the film material.
This means that conductive fibrous materials having a fiber diameter of 5 to 100 μm, a fiber length of 15 to 300 μm, and an aspect ratio of 3 or more are added to the film material in an amount of 0.05 to 0.05 to 100 parts by volume of the film material. After blending 40 parts by volume, this may be flowed out by applying shear stress in the flow direction in a fluid state, and the conductive fibers may be oriented in the flow direction.

この異方導電性フイルム状体の厚さは、それが
厚すぎると上記した導電性付与剤の保留が難しく
なつて導通の安定性が損なわれるので、10〜
300μm、好ましくは10〜100μmさらに好ましく
は10〜70μmとされる。なお、この異方導電性フ
イルム状体を配線基板に仮固定する必要がある場
合にはその必要個所に別途粘着剤層を設けること
がよく、この粘着剤に上記した導電性付与剤を混
入することは任意とされる。異方導電性フイルム
状体はその厚み方向に熱圧すると、その中に含ま
れている導電性付与剤間の接触によつてその厚み
方向には導電性を示すが、これと直角な方向であ
る横方向には依然としして絶縁性を示す。なお、
この異方導電性フイルム状体は熱接着性でもある
ので、これを表示装置の端子部に重ねて熱圧する
と、この両者が接着されると同時に、厚み方向の
みに導通性となるので、本考案のコネクタの配線
パターン2と表示素子の接触端子とが電気的に確
実に接続される。第2図はこれを示したもので配
線パターン2の上に積層された異方導電性フイル
ム状体3、およびこの上に置かれた表示素子(図
示せず)の接続端子4を熱圧すると、この異方導
電性フイルム状体3が熱接着性であると同時に、
この熱圧によつて異方導電性フイルム状体3の中
に分散混合され、配向配置されていた導電性付与
剤5はその配向配置状態を保つたまま、相互に接
触して、この熱圧方向にのみ導電を示すようにな
るので、この異方導電性フイルム状体3を介して
配線パターン2と表示素子の接続端子4とで電気
的に接続されるという実用性が発揮される。
The thickness of this anisotropically conductive film-like body should be set to 10 to
The thickness is 300 μm, preferably 10 to 100 μm, and more preferably 10 to 70 μm. If it is necessary to temporarily fix this anisotropic conductive film to a wiring board, a separate adhesive layer is often provided at the necessary locations, and the above-mentioned conductivity imparting agent is mixed into this adhesive. This is considered optional. When an anisotropically conductive film material is hot-pressed in its thickness direction, it exhibits conductivity in its thickness direction due to contact between the conductivity-imparting agents contained therein, but in the direction perpendicular to this, it exhibits conductivity. It still exhibits insulating properties in some lateral directions. In addition,
This anisotropically conductive film-like material is also thermally adhesive, so when it is placed over the terminals of a display device and hot-pressed, the two are bonded together and at the same time becomes conductive only in the thickness direction. The wiring pattern 2 of the invented connector and the contact terminals of the display element are electrically connected reliably. Figure 2 shows this, and when the anisotropically conductive film-like body 3 laminated on the wiring pattern 2 and the connection terminal 4 of the display element (not shown) placed on this are hot-pressed. , this anisotropically conductive film-like body 3 is thermally adhesive, and at the same time,
The conductivity imparting agent 5, which has been dispersed and mixed and oriented in the anisotropically conductive film-like body 3 by this heat pressure, comes into contact with each other while maintaining its oriented state, and Since conductivity is exhibited only in the direction, the wiring pattern 2 and the connection terminal 4 of the display element are electrically connected through the anisotropically conductive film-like body 3, which is practical.

本考案に用いられる導電性付与剤としての導電
性繊維状体の長さ、径、アスペクト比については
上記した範囲のものを用いる必要があるが、これ
は導電性繊維状体のアスペクト比が約2.8より小
さいとフイルム材料中にこれを配合したのちこれ
を流動状態で流れ方向に流出させても、流れ方向
に沿うように配向せず、したがつてフイルム沿面
に平行となるように配向し難くなるので、実用上
このアスペクト比は3以上とされる。また同様に
繊維径が約4μmより小さいと極少すぎて流れ
(乱流)の影響をうけやすいし、乱流のまま方向
が固定されやすく、繊維長が13μmより小さい場
合には流れに影響されずランダムに配向されてし
まうし、他方、繊維長が300μmを超えると隣接
する繊維とからみやすくなり、流れ方向に配向さ
せるのが困難となるばかりでなく、異方導電性が
損なわれ、隣接端子間の絶縁性が保持できなくな
つて極小ピツチの接続が困難となり、繊維径が
100μmを超えると大きくなりすぎて流れの抵抗
性が大きくなりすぎ、かえつて乱流を促進する結
果となり、配向がうまくいかなくなるので、この
導電性繊維状体は実用的には繊維径が5〜100μ
mで繊維長が15〜300μmのものとされる。
The length, diameter, and aspect ratio of the conductive fibrous material used as the conductivity imparting agent used in the present invention must be within the above-mentioned range. If it is smaller than 2.8, even if it is blended into a film material and then flowed out in a fluid state in the flow direction, it will not be oriented along the flow direction, and therefore it will be difficult to align it parallel to the film surface. Therefore, in practice, this aspect ratio is set to 3 or more. Similarly, if the fiber diameter is smaller than about 4 μm, it is too small and easily affected by the flow (turbulent flow), and the direction is likely to be fixed in the turbulent flow, and if the fiber length is smaller than 13 μm, it is not affected by the flow. On the other hand, if the fiber length exceeds 300 μm, it becomes easy to get entangled with adjacent fibers, making it difficult to orient the fibers in the flow direction. It becomes difficult to connect extremely small pitches, and the fiber diameter decreases.
If it exceeds 100 μm, it will become too large and the flow resistance will become too large, promoting turbulent flow and making it difficult to achieve proper orientation. 100μ
The fiber length is 15 to 300 μm.

本考案になるコネクタは、ここに使用される導
電性付与剤としての導電性繊維状体の配合比、繊
維径、繊維長、アスペクト比を前記したものに特
定しているので、熱圧時には必ずこの導電性繊維
状体がフイルム沿面に平行に配向されるが、これ
はあたかも配合された繊維径に相当する厚さの可
撓性異方導電性フイルム状体層d1,d2…(第2図
参照)を剪断をかけて多層に重ね塗りしたと同様
の状態となるので導電性繊維の分散配向が良好な
ものとなり、導電性繊維状体がより均一に分散さ
れ、しかもこれが導電性繊維状体であるが故に繊
維同志が稜線接触するので、導電性粒子のような
点接触のものにくらべて同一水投平影面に存在す
る繊維同志の接触部位が長いものとなり、したが
つて信頼性の高い導通が得られる。
In the connector of the present invention, the blending ratio, fiber diameter, fiber length, and aspect ratio of the conductive fibrous material used as the conductivity imparting agent are specified as described above, so it is necessary to This conductive fibrous material is oriented parallel to the film surface, as if the flexible anisotropic conductive film material layers d 1 , d 2 . . . (See Figure 2) is sheared and coated in multiple layers, resulting in a good dispersion orientation of the conductive fibers, and the conductive fibers are more evenly dispersed. Since the fibers are in contact with each other along their ridges due to their shape, the contact area between the fibers on the same horizontal projection plane is longer than that of point contacts such as conductive particles, which increases reliability. High conductivity can be obtained.

なお、上記においては配線パターンと表示素子
の接続端子との接続、導通について説明したが、
これは例えば太陽電池や他の電気、電子部品の接
続端子の接続などにも使用することができること
はもちろんのことである。なお、これらの熱圧方
法には通常、熱ゴテが用いられるが、熱プレス、
高周波ウエルダー、超音波ウエルダー、インパル
スシーラーなど従来公知の熱圧方法を用いてもよ
い。
In addition, although the connection and continuity between the wiring pattern and the connection terminal of the display element have been explained above,
It goes without saying that this can also be used, for example, to connect connection terminals of solar cells and other electrical and electronic components. Note that a hot trowel is usually used in these hot pressing methods;
Conventionally known heat pressing methods such as a high frequency welder, an ultrasonic welder, and an impulse sealer may be used.

本考案になるコネクタは単なる絶縁性の接着剤
を用いた場合にくらべて導通の信頼性が高く、本
考案のコネクタを得るには単に異方導電性フイル
ム状体を、目的とする配線パターンを有する回路
基板上に設けるだけでよいのであるから、この回
路基板上の配線パターンのパターン形状に規制さ
れないという有利性が与えられ、結果において設
計の自由度が高まる。さらには本考案に用いられ
る異方導電性フイルム状体が容易に製造され、し
たがつて収率も高いということから経済的にも廉
価であるという有利性をもつものである。
The connector according to the present invention has higher continuity reliability than when a simple insulating adhesive is used, and to obtain the connector according to the present invention, it is necessary to simply attach an anisotropically conductive film-like body to a desired wiring pattern. Since it is only necessary to provide the wiring pattern on the circuit board that has the wiring pattern, it has the advantage of not being restricted by the pattern shape of the wiring pattern on the circuit board, and as a result, the degree of freedom in design increases. Furthermore, the anisotropically conductive film-like body used in the present invention is easily produced and has a high yield, so it has the advantage of being economically inexpensive.

つぎに本考案の実施例をあげる。 Next, examples of the present invention will be given.

実施例 1 厚さ50μmのポリエステルフイルムにカーボン
塗料で16mmピツチの平行縞状の配線パターンを印
刷した回路基板を作り、これにポリエステル系の
熱接着剤100容量部に平均径9μm、平均長60μm
のカーボン繊維10容量部を分散混合し、フイルム
状に成形して得た異方導電性フイルム状体を積層
して本考案になる異方導電熱接着型コネクタを得
た。
Example 1 A circuit board was made by printing a parallel striped wiring pattern with a pitch of 16 mm using carbon paint on a polyester film with a thickness of 50 μm, and on this, 100 parts by volume of polyester thermal adhesive with an average diameter of 9 μm and an average length of 60 μm were applied.
The anisotropically conductive heat-adhesive connector of the present invention was obtained by dispersing and mixing 10 parts by volume of carbon fibers and forming the resulting anisotropically conductive film-like body into a film.

ついで、この接続端子部の相当部位上に、12mm
ピツチ間隔の接続端子をもつLCD表示素子の接
続端子を重ねて140℃、20Kg/cm2で10秒間加熱し
たところ、この回路基板とLCD表示素子とは完
全に接着し、それらの端子電極部における電気抵
抗は4.5KΩとなり、これらが接続していることが
判つたし、これには不必要なリークはひとつも起
きていないことが判つた。
Next, place a 12mm wire on the corresponding part of this connection terminal.
When the connection terminals of an LCD display element with pitch-spaced connection terminals were stacked and heated at 140°C and 20 kg/cm 2 for 10 seconds, the circuit board and LCD display element were completely bonded, and the terminal electrodes of those The electrical resistance was 4.5KΩ, indicating that they were connected, and that there was no unnecessary leakage.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の異方導電熱接着型コネクタの
斜視図、第2図はこれと表示素子の接続端子との
接続時の部分拡大縦断面図を示したものである。 1……基板、2……配線パターン、3……熱接
着性可撓性異方導電性フイルム状体、4……表示
素子の接続端子、5……導電性付与剤。
FIG. 1 is a perspective view of the anisotropically conductive heat-adhesive connector of the present invention, and FIG. 2 is a partially enlarged longitudinal cross-sectional view of the connector when it is connected to a connecting terminal of a display element. DESCRIPTION OF SYMBOLS 1... Substrate, 2... Wiring pattern, 3... Heat-adhesive flexible anisotropically conductive film-like body, 4... Connection terminal for display element, 5... Conductivity imparting agent.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 熱接着性可撓性フイルム材料100容量部に、繊
維径が5〜100μm、繊維長が15〜300μmでアス
ペクト比が3以上である導電性繊維状体よりなる
導電性付与剤0.05〜40容量部を繊維の長手方向が
フイルム沿面と平行となるように分散配合してな
る熱接着性可撓性異方導電性フイルム状体を、配
線パターン上に設けてなることを特徴とする異方
導電熱接着型コネクタ。
0.05 to 40 parts by volume of a conductivity imparting agent made of a conductive fibrous material having a fiber diameter of 5 to 100 μm, a fiber length of 15 to 300 μm, and an aspect ratio of 3 or more to 100 parts by volume of a heat-adhesive flexible film material. An anisotropically conductive heating device characterized in that a heat-adhesive flexible anisotropically conductive film-like body formed by dispersing and blending fibers such that the longitudinal direction of the fibers is parallel to the film creeping surface is provided on a wiring pattern. Adhesive connector.
JP1982100419U 1982-07-02 1982-07-02 thermal adhesive connector Granted JPS594664U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982100419U JPS594664U (en) 1982-07-02 1982-07-02 thermal adhesive connector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982100419U JPS594664U (en) 1982-07-02 1982-07-02 thermal adhesive connector

Publications (2)

Publication Number Publication Date
JPS594664U JPS594664U (en) 1984-01-12
JPH0339890Y2 true JPH0339890Y2 (en) 1991-08-22

Family

ID=30237562

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982100419U Granted JPS594664U (en) 1982-07-02 1982-07-02 thermal adhesive connector

Country Status (1)

Country Link
JP (1) JPS594664U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS574199B2 (en) * 1976-12-15 1982-01-25

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54108957U (en) * 1978-01-20 1979-07-31
JPS6035990Y2 (en) * 1980-06-06 1985-10-25 松下電器産業株式会社 High frequency heating device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS574199B2 (en) * 1976-12-15 1982-01-25

Also Published As

Publication number Publication date
JPS594664U (en) 1984-01-12

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