KR890000596Y1 - Wiring plate - Google Patents

Abstract

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Description

Wiring board

1 is an exploded perspective view of various electronic components mounted on a wiring board and a double wiring board according to an embodiment of the present invention.

2 is an enlarged cross-sectional view of a connecting material layer deposited on a substrate.

3 is an enlarged cross-sectional view of main parts in a state where the connection terminal of the wiring board and the terminal of the electronic component are connected.

4 to 7 illustrate a state in which various electronic components of a wiring board are installed.

4 is a cross-sectional view of a state in which a display body is mounted on a substrate (1).

5 is a cross-sectional view of a semiconductor integrated circuit device mounted on a wiring board.

6 is a cross-sectional view of a state in which a sub-wiring board is installed.

7 is a cross-sectional view of a state in which chip components are mounted on a wiring board.

* Explanation of symbols for main parts of drawings

1 substrate 2 wiring pattern

2a, 2b, 2c, 2d: connection terminal 3, 3a, 3b, 3c, 3d: connection material layer

4: hot melt adhesive 5: conductive particles

The present invention relates to a wiring board. It has been known that a heat seal is conventionally used as a means for connecting an electronic component to a connection terminal of a wiring board.

The heat seal is a hot melt conductive adhesive and an insulating adhesive that are alternately or in-phase installed on a flexible substrate, one end of which is mounted on an electronic component and the other An end part is used for connecting both by connecting to the connection terminal of a wiring board. There is also a means for directly adhering anisotropic adhesive having conductivity only in the pressed direction to the connection terminal of the wiring board. In this way, in the electrical connection using the heat seal, since the heat seal itself is structurally complex, it is expensive itself and requires connection work at two places between the electronic component side and the wiring board side. The disadvantage is that the work is not efficient. Moreover, in the electrical connection using an anisotropic adhesive, not only the number of bonding processes increases, but also in order to obtain a certain adhesive force, it is known that it is inadequate for an assembly line, since an electronic component must be connected within predetermined time after apply | coating an adhesive agent to a connection terminal.

The present invention has been made in consideration of the above circumstances, and an object thereof is to provide a wiring board which can be carried out inexpensively and efficiently in connecting electronic components to connection terminals of a wiring board.

In the wiring board of the present invention, a connecting material layer having substantially insulating property in a normal state to the connecting portion of the wiring board but having conductivity only partially in the thickness direction by thermal compression is deposited with a substantially uniform thickness, and the connecting material layer is dried. It is processed. Hereinafter, one embodiment of a wiring board in the present invention will be described with reference to the drawings.

FIG. 1 is an exploded perspective view of a wiring board and various electronic components connected to the wiring board. In the drawing (1), the substrate is formed with a thickness of 50-150 by a resin film such as polyester, vinyl chloride or polyimide. A predetermined wiring pattern 2 is provided on the upper surface of the substrate 1. The wiring pattern 2 is formed by etching or printing a conductive material such as metal foil or carbon ink, and is formed by slightly protruding on the upper surface 1a of the substrate 1, and the upper surface 1a of the substrate 1. Stretched over (2a)... , (2b)... , (2c)... And (2d)... Are connection terminals at the ends of the wiring patterns 2 or connection terminals connected to the wiring patterns 2, respectively, which are also formed by slightly upwards from the upper surface 1a of the substrate.

In the figure, 3a, 3b, 3c and 3d denote connection terminals 2a,. , (2b)... , (2c)... And (2d)... Is a connection layer for depositing on and mounting each electronic component. The connection material layers 3a, 3b, 3c, and 3d are obtained by mixing metallic fine particles such as nickel, aluminum, solder, or graphite powder in an insulating hot melt adhesive. , (2b)... , (2c)... And (2d)... Each of the joints was formed to a substantially uniform thickness by screen printing and then dried at 70-130 ° C.

FIG. 2 is an enlarged cross-sectional view showing the structure of the connecting material layer, in which (3) denotes reference numerals representing the connecting material layers 3a, 3b, 3c and 3d, and (4). Denotes an insulating hot melt adhesive. (5)... Is the conductive particles incorporated in the hot melt adhesive 4, and the conductive particles 5,. Is uniformly dispersed in the adhesive 4, and at least one of the upper surface side or the lower side is coated with the hot melt adhesive 4, which can be reactivated, in the connecting material layer 3. The conductive particles 5... The dispersed state of is the same also when cut | disconnected in the direction orthogonal to this figure, and each electroconductive particle 5... Are mixed in a substantially uniform state in each dispersed state.

Therefore, in this state at normal temperature, that is, at normal temperature, the connection material layer 3 shows insulation in either direction. As an example, the thickness of the connection material layer 3 may be about 30, and the size of each conductive particle 5 may be 10-20 in the short direction 20, but the thickness of the layer and the size of the particles are limited to this. It is not. In addition, the hot-melt adhesive 4 constituting the connecting material layer 3 is melted by relatively low temperature heat processing at about 100-150 ° C. (6), (7), (8), and (9) in the drawing indicate connection terminals 2a,... Of the substrate 1 described above. , (2b)... , (2c)... And (2d)... The electronic components respectively installed on the screen are displayed, and the display body, semiconductor integrated circuit device, sub-wiring board, and chip component 8 of the liquid crystal diagram are respectively displayed. The display body 6, the semiconductor integrated circuit device 7, the sub-circuit board 8, and the chip component 9 are ... Connection terminal 2a... , (2b)... , (2c)... And (2d)... Terminals (2a) to be electrically connected to each other; , (2b)... , (2c)... And (2d)... Terminals (6a) to be electrically connected to each other; , (7a)... , (8a)... And (9a)... Equipped with. The terminals of the electronic parts are arranged in correspondence with the connection terminals of the substrate 1 from above each of the printed connection layer layers 3a, 3b, and 3c, and thereafter, from the back side of the substrate 1, a jig is placed. Bar is installed by heating and pressing, which will be described in more detail with reference to FIG. 3 shows an enlarged cross-sectional view of the main portion in the case where the display body 6 is connected to the substrate 1. In FIG. 3, the substrate 1 and the display body 6 are inverted up and down with respect to FIG.

A plurality of connection terminals 2a on the substrate 1. Are each heretic (2a)... The corresponding electrode terminal 6a of the display body 6 through the connecting material layer 3a printed over the entirety of the above. The position of the substrate 1 is aligned so as to face the substrate 1, and the substrate 1 is thermocompressed by the heat-compression strip 10 from the rear surface 1b side of the substrate 1. Since the board | substrate 1 is formed of the thin resin film, heat is transmitted to the connection material layer 3a, and the hot-melt adhesive 4 is melted. As mentioned above, each connection terminal 2a of the board | substrate 1... Is formed to protrude upward from the upper surface 1a, and the terminal 6a of the display body 6 is also usually formed to protrude. In other words, the connection terminals 2a that face each other. And terminal 6a... The gap between the terminal faces of the wires is small, so that the hot melt adhesive 4 between the terminal faces flows between the terminal faces into the region where the terminals are not opposed. Therefore, between these terminal surfaces, electroconductive particle 5... Exposed from the temporary hot melt adhesive layer 4, the connection material layer 3a becomes conductive in the thickness direction, and the terminal 6a of the display body 6. And connection terminal 2a of wiring board 1... Is electrically connected and electrically connected. When the heat crimp jig 10 is separated from the substrate 1 and cooled, the hot melt adhesive layer 4 solidifies and the display body 6 is fixed to the substrate 1 while maintaining this state. . Thus, sectional drawing of the state which attached the display body to the board | substrate 1 is shown in FIG. When other electronic components are mounted on the board | substrate 1, it can mount also like a case of a display body. 5, 6, and 7 show cross-sectional views of the semiconductor integrated circuit device 7, the sub-wiring substrate 8, and the chip component 9 mounted on the substrate 1, respectively. The semiconductor integrated circuit device 7 has terminals 7a,... Connecting terminals 2b on the substrate 1 arranged at the same pitch. After aligning through the connection material layer 3b, it heat-presses and mounts. The connecting material layer 3b may be printed on the entire surface on which the semiconductor integrated circuit device 7 is mounted, as shown in FIG. 1 or the terminal 2b. It may be printed only on the part corresponding to.

In addition, the sub-board | substrate board 8 has the terminal 8a ... Is connected to a wiring pattern (not shown) and connected to the connection terminal 2C of the substrate 1 by the connecting material layer 3c. The sub-wiring substrate 8 may be made of a hard material such as a phenol resin, or may be made of a flexible material such as a resin film. In the case of a hard board | substrate, heat compression is performed from the back surface side of the board | substrate 1, In the case of a resin film, you may heat-compress from the upper surface 8b side of the sub-ban board | substrate 8. In this case, the connection material layer 3C may be provided on the sub wiring board 8. The terminals 9a and 9b of the chip component 9 are fixed to the connection terminals 2d and 2d of the substrate 1 by the connection material layer 3d. Although the terminals 9a and 9a are not formed in the protruding state, since the connection terminals 2d and 2d are formed to protrude, the terminal 9a and the connection terminal 2d are conductive particles 5. … It is conducted through. When the electronic components such as the display body 6, the semiconductor integrated circuit device 7, the sub-wiring board 8, and the chip component 9 are mounted on the substrate 1, the electronic components are aligned one by one. In addition to the thermocompression bonding at this time, a plurality of electronic components can be aligned and mounted at the same time by thermocompression bonding. In the latter case, the connection work is extremely efficient. As the electronic device having the connection structure between the wiring board and the electronic component shown in the present embodiment, there are a small electronic calculator, an electronic entertainment machine, and the like. However, the present invention is not limited to this, but for an electronic device having one electronic component, the wiring board of the present invention can obtain a very excellent effect. In addition, the electronic components mounted on the wiring board are not limited to those described above, but can be applied to various other electronic components such as a solar cell and a buzzer. In this embodiment, the connection terminals protrude from the upper surface of the substrate. Although formed, the terminal of the electronic component to be mounted protrudes, it is not necessary to protrude the connecting terminal of the wiring board. As a means for providing the connection layer in the connection terminal of the wiring board, a roll coat or the like may be used instead of screen printing.

As described above, according to the wiring board of the present invention, since the connecting means is formed on the substrate, in the device of the electronic component, the terminal of the electronic component may be simply thermally crimped after arranging the terminals of the electronic component corresponding to the connection terminal of the substrate. Since the connection material layer is a simple thing which only mixes electroconductive particle substantially uniformly in insulating hot melt type adhesive agent, the whole device can be made very cheap.

Claims (4)

An insulating resin film, a wiring pattern disposed on the resin film, and a plurality of connection terminals connected to or extending from the wiring pattern, which are substantially insulated in all directions at room temperature or are melted by hot pressing The crimped portion is provided with a contact material layer exhibiting conductivity only in the thickness direction, and the connection material layer is coated on at least the connection terminals with a substantially uniform thickness and dried. The wiring engine according to claim 1, wherein the connection material layer is deposited by printing. The wiring engine according to claim 1 or 2, wherein the connecting material layer is substantially uniformly mixed with conductive particles dispersed in an insulating hot melt adhesive which is reactivated by heating. The wiring engine according to claim 3, wherein the thickness of the connecting member layer is about 30, and the width and length of the conductive particles are in the range of 10-20.