CN209964372U - Sectional type flexible circuit board for smart phone - Google Patents
Sectional type flexible circuit board for smart phone Download PDFInfo
- Publication number
- CN209964372U CN209964372U CN201920531747.8U CN201920531747U CN209964372U CN 209964372 U CN209964372 U CN 209964372U CN 201920531747 U CN201920531747 U CN 201920531747U CN 209964372 U CN209964372 U CN 209964372U
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- board body
- way board
- line way
- flexible
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Abstract
The utility model discloses a sectional type flexible line way board towards smart mobile phone, including the flexible line way board body, the top of flexible line way board body is provided with the bond line, one side that the flexible line way board body was kept away from to the bond line is provided with outer substrate layer, one side that the bond line was kept away from on outer substrate layer is provided with the PET polyester thin layer, the bottom of flexible line way board body is provided with the glue film, one side that the flexible line way board body was kept away from to the glue film is provided with the heat dissipation layer, one side that the glue film was kept away from on the heat dissipation. The utility model discloses a set up mutually supporting on flexible line way board body, bond line, outer substrate layer, PET polyester film layer, glue film, heat dissipation layer and flexible magnet layer, reached high temperature resistant effectual advantage, solved current towards the poor problem of the high temperature resistant effect of smart mobile phone sectional type flexible line way board, made things convenient for people to use it, improved the practicality towards smart mobile phone sectional type flexible line way board.
Description
Technical Field
The utility model relates to a circuit board technical field specifically is towards smart mobile phone's sectional type flexible line way board.
Background
The flexible circuit board is a printed circuit made of flexible insulating base materials, has the advantages that many rigid printed circuit boards do not have, can be freely bent, wound and folded, can be randomly arranged according to the space layout requirements, and can be randomly moved and stretched in a three-dimensional space, so that the integration of component assembly and wire connection is achieved, the double-sided flexible circuit board is the most common circuit board in the existing sectional type circuit board, the existing sectional type flexible circuit board for the smart phone is poor in high-temperature resistant effect, and the flexible circuit board is inconvenient to use by people, so that the practicability of the sectional type flexible circuit board for the smart phone is reduced.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a towards sectional type flexible line way board of smart mobile phone possesses the effectual advantage of high temperature resistant, has solved the current poor problem of high temperature resistant effect towards smart mobile phone sectional type flexible line way board.
In order to achieve the above object, the utility model provides a following technical scheme: sectional type flexible line way board towards smart mobile phone, including the flexible line way board body, the top of flexible line way board body is provided with the bond line, one side that the flexible line way board body was kept away from to the bond line is provided with outer substrate layer, one side that the bond line was kept away from on outer substrate layer is provided with the PET polyester film layer, the bottom of flexible line way board body is provided with the glue film, one side that the flexible line way board body was kept away from to the glue film is provided with the heat dissipation layer, one side that the glue film was kept away from on the heat dissipation.
Preferably, outer base material layer includes the enclosing cover rete, the one side that outer base material layer was kept away from to the enclosing cover rete is provided with the outer circuit layer, the one side that the enclosing cover rete was kept away from to the outer circuit layer is provided with the weld preventing layer, the one side that the outer circuit layer was kept away from to the weld preventing layer is provided with the waterproof layer.
Preferably, the PET polyester film layer comprises a glass fiber cloth base layer, a composite base layer is arranged on one side, away from the PET polyester film layer, of the glass fiber cloth base layer, and an epoxy resin layer is arranged on one side, away from the glass fiber cloth base layer, of the composite base layer.
Preferably, the back surface of the outer substrate layer is bonded with the inner cavity of the outer cover film layer, the surface of the outer cover film layer is bonded with the inner cavity of the outer circuit layer, the surface of the outer circuit layer is bonded with the inner cavity of the solder mask layer, and the surface of the solder mask layer is bonded with the inner cavity of the outer circuit layer.
Preferably, the surface of the PET polyester film layer is bonded with the inner cavity of the glass fiber cloth base layer, the surface of the glass fiber cloth base layer is bonded with the inner cavity of the composite base layer, and the surface of the composite base layer is bonded with the inner cavity of the epoxy resin layer.
Compared with the prior art, the beneficial effects of the utility model are as follows:
1. the utility model discloses a set up mutually supporting on flexible line way board body, bond line, outer substrate layer, PET polyester film layer, glue film, heat dissipation layer and flexible magnet layer, reached high temperature resistant effectual advantage, solved current towards the poor problem of the high temperature resistant effect of smart mobile phone sectional type flexible line way board, made things convenient for people to use it, improved the practicality towards smart mobile phone sectional type flexible line way board.
2. The utility model discloses a setting is because PET polyester film layer, can avoid outer circuit board to corrode the inlayer circuit in the preparation circuit, has played the effect of protection to the flexible line way board body, and through setting up flexible magnet layer, flexible good flexible has increased the life of flexible line way board body, through setting up the heat dissipation layer, has improved the radiating speed of flexible line way board body, has increased the radiating effect of flexible line way board body, has solved the poor problem of flexible line way board body radiating effect.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a cross-sectional view of the outer substrate layer structure of the present invention;
fig. 3 is a sectional view of the PET polyester film layer structure of the present invention.
In the figure: the flexible printed circuit board comprises a flexible printed circuit board body 1, an adhesive layer 2, an outer substrate layer 3, an outer cover film layer 301, an outer circuit layer 302, an anti-welding layer 303, a waterproof layer 304, a polyester film layer 4, a glass fiber cloth base layer 401, a composite base layer 402, an epoxy resin layer 403, a glue layer 5, a heat dissipation layer 6 and a flexible magnet layer 7.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, a sectional flexible printed circuit board facing a smart phone includes a flexible printed circuit board body 1, a bonding layer 2 is disposed on a top of the flexible printed circuit board body 1, an outer substrate layer 3 is disposed on a side of the bonding layer 2 away from the flexible printed circuit board body 1, the outer substrate layer 3 includes an outer cover film 301, an outer circuit layer 302 is disposed on a side of the outer cover film 301 away from the outer substrate layer 3, a solder mask layer 303 is disposed on a side of the outer circuit layer 302 away from the outer cover film 301, a waterproof layer 304 is disposed on a side of the solder mask layer 303 away from the outer circuit layer 302, a back surface of the outer substrate layer 3 is bonded to an inner cavity of the outer cover film 301, a surface of the outer cover film 301 is bonded to an inner cavity of the outer circuit layer 302, a surface of the outer circuit layer 302 is bonded to an inner cavity of the solder mask layer, a surface of the solder mask layer 303 is bonded to an inner cavity of, due to the arrangement of the PET polyester film layer 4, the phenomenon that an outer circuit board corrodes an inner circuit when the circuit is manufactured can be avoided, and the flexible circuit board body 1 is protected, wherein the PET polyester film layer 4 comprises the glass fiber cloth base layer 401, the composite base layer 402 is arranged on one side, away from the PET polyester film layer 4, of the glass fiber cloth base layer 401, the epoxy resin layer 403 is arranged on one side, away from the glass fiber cloth base layer 401, of the composite base layer 402, the surface of the PET polyester film layer 4 is connected with the inner cavity of the glass fiber cloth base layer 401 in an adhesion mode, the surface of the glass fiber cloth base layer 401 is connected with the inner cavity of the composite base layer 402 in an adhesion mode, the glue layer 5 is arranged at the bottom of the flexible circuit board body 1, the heat dissipation layer 6 is arranged on one side, away from the flexible circuit board body 1, and the heat dissipation speed of the flexible, the radiating effect of the flexible circuit board body 1 is increased, the problem of poor radiating effect of the flexible circuit board body 1 is solved, one side of the radiating layer 6, which is far away from the glue layer 5, is provided with the flexible magnet layer 7, through setting the flexible magnet layer 7, good flexibility is realized, the service life of the flexible circuit board body 1 is prolonged, through setting the flexible circuit board body 1, the bonding layer 2, the outer base material layer 3, the PET polyester film layer 4, the glue layer 5, the mutual cooperation of the radiating layer 6 and the flexible magnet layer 7, the advantage of good high temperature resistance effect is achieved, the problem of poor high temperature resistance effect of the existing sectional flexible circuit board for the smart phone is solved, the sectional flexible circuit board for the smart phone is convenient for people to use the flexible circuit board, and the practicability of the sectional type flexible circuit.
When in use, the waterproof layer 304 is arranged, the waterproof effect of the flexible circuit board body 1 is improved, the problem of poor waterproof effect of the flexible circuit board body 1 is solved, the PET polyester film layer 4 is arranged, the phenomenon that an outer layer circuit board corrodes an inner layer circuit when the circuit is manufactured can be avoided, the flexible circuit board body 1 is protected, the flexible magnet layer 7 is arranged, the flexibility is good, the service life of the flexible circuit board body 1 is prolonged, the heat dissipation speed of the flexible circuit board body 1 is improved by arranging the heat dissipation layer 6, the heat dissipation effect of the flexible circuit board body 1 is improved, the problem of poor heat dissipation effect of the flexible circuit board body 1 is solved, the high temperature resistance and the corrosion resistance effect of the flexible circuit board body 1 are improved by arranging the mutual matching of the glass fiber cloth base layer 401, the composite base layer 402 and the epoxy resin layer 403, and the problem of poor high temperature resistance effect of the flexible circuit board body 1, thereby achieving the advantage of good high temperature resistance effect.
All the standard parts used in the present application document can be purchased from the market, all the parts in the present application document can be customized according to the description of the specification and the accompanying drawings, the specific connection mode of each part adopts the conventional means such as bolts, rivets, welding and the like mature in the prior art, and the machines, the parts and the equipment adopt the conventional models in the prior art, and the detailed description is not provided.
In summary, the following steps: this towards sectional type flexible line way board of smart mobile phone through setting up mutually supporting of flexible line way board body 1, bond line 2, outer substrate layer 3, PET polyester film layer 4, glue film 5, heat dissipation layer 6 and flexible magnet layer 7, has solved the current poor problem of the high temperature resistant effect towards sectional type flexible line way board of smart mobile phone.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
The principles and embodiments of the present invention have been explained herein using specific examples, which are presented only to assist in understanding the methods and their core concepts. It should be noted that there are infinite specific structures due to the limited character expressions, and it will be apparent to those skilled in the art that various improvements, decorations or changes can be made without departing from the principles of the present invention, and the technical features can be combined in a suitable manner; the application of these modifications, variations or combinations, or the application of the concepts and solutions of the present invention in other contexts without modification, is not intended to be considered as a limitation of the present invention.
Claims (5)
1. Towards sectional type flexible line way board of smart mobile phone, including flexible line way board body (1), its characterized in that: the top of flexible line way board body (1) is provided with bond line (2), one side that flexible line way board body (1) was kept away from in bond line (2) is provided with outer substrate layer (3), one side that bond line (2) was kept away from in outer substrate layer (3) is provided with PET polyester film layer (4), the bottom of flexible line way board body (1) is provided with glue film (5), one side that flexible line way board body (1) was kept away from in glue film (5) is provided with heat dissipation layer (6), one side that glue film (5) were kept away from in heat dissipation layer (6) is provided with flexible magnet layer (7).
2. The smartphone-oriented segmented flexible wiring board of claim 1, wherein: outer base material layer (3) are including enclosing cover rete (301), one side that outer base material layer (3) were kept away from in enclosing cover rete (301) is provided with outer circuit layer (302), one side that outer base material layer (301) were kept away from in outer circuit layer (302) is provided with weld preventing layer (303), one side that outer circuit layer (302) were kept away from in weld preventing layer (303) is provided with waterproof layer (304).
3. The smartphone-oriented segmented flexible wiring board of claim 1, wherein: the PET polyester film layer (4) comprises a glass fiber cloth base layer (401), a composite base layer (402) is arranged on one side, away from the PET polyester film layer (4), of the glass fiber cloth base layer (401), and an epoxy resin layer (403) is arranged on one side, away from the glass fiber cloth base layer (401), of the composite base layer (402).
4. The smartphone-oriented segmented flexible wiring board of claim 1, wherein: the back of outer base material layer (3) is connected with the inner chamber bonding of enclosing cover rete (301), the surface of enclosing cover rete (301) is connected with the inner chamber bonding of outer circuit layer (302), the surface of outer circuit layer (302) is connected with the inner chamber bonding of weld preventing layer (303), the surface of weld preventing layer (303) is connected with the inner chamber bonding of outer circuit layer (302).
5. The smartphone-oriented segmented flexible wiring board of claim 1, wherein: the surface of the PET polyester film layer (4) is bonded with the inner cavity of the glass fiber cloth base layer (401), the surface of the glass fiber cloth base layer (401) is bonded with the inner cavity of the composite base layer (402), and the surface of the composite base layer (402) is bonded with the inner cavity of the epoxy resin layer (403).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920531747.8U CN209964372U (en) | 2019-04-18 | 2019-04-18 | Sectional type flexible circuit board for smart phone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920531747.8U CN209964372U (en) | 2019-04-18 | 2019-04-18 | Sectional type flexible circuit board for smart phone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209964372U true CN209964372U (en) | 2020-01-17 |
Family
ID=69241363
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920531747.8U Expired - Fee Related CN209964372U (en) | 2019-04-18 | 2019-04-18 | Sectional type flexible circuit board for smart phone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209964372U (en) |
-
2019
- 2019-04-18 CN CN201920531747.8U patent/CN209964372U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Segmented flexible circuit board for smart phones Effective date of registration: 20210420 Granted publication date: 20200117 Pledgee: Shenzhen small and medium sized small loan Co.,Ltd. Pledgor: SHENZHEN PBH ELECTRONICS Co.,Ltd. Registration number: Y2021440020020 |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200117 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20230428 Granted publication date: 20200117 Pledgee: Shenzhen small and medium sized small loan Co.,Ltd. Pledgor: SHENZHEN PBH ELECTRONICS CO.,LTD. Registration number: Y2021440020020 |