CN217936410U

CN217936410U - Shielding conductive material for electronic product

Info

Publication number: CN217936410U
Application number: CN202221805488.1U
Authority: CN
Inventors: 王伟; 吴娜娜; 陈艳
Original assignee: Hanping Kunshan Electronic Co ltd
Current assignee: Hanping Kunshan Electronic Co ltd
Priority date: 2022-07-13
Filing date: 2022-07-13
Publication date: 2022-11-29
Anticipated expiration: 2032-07-13

Abstract

The utility model discloses a shielding conducting material for electronic product, become the hollow electrically conductive substrate that leads to the chamber including the middle part, wire substrate one side is provided with the conducting resin, still including curling into the insulating cloth of platykurtic structure, the insulating cloth can be placed in the hollow intracavity that leads to further be: electrically conductive substrate is electrically conductive cloth or foil, the utility model discloses a combination of electrically conductive cloth, conducting resin, insulating cloth can make this structure collect the shielding, function such as electrically conductive through electrically conductive cloth as outer package material and be as one, and through the experiment, this structure shielding effectiveness is greater than 60dB (30 MHZ ~ 1.5 GHZ), surface resistance is less than 0.07 omega.

Description

Shielding conductive material for electronic product

Technical Field

The utility model relates to a conductive shielding material field, in particular to shielding conductive material for electronic product.

Background

With the process of ultra-thinning of the popular products of electronic products, the material is required to be light and thin, wherein the material is used as a main part of buffering foam. However, as is well known, more buffering foam in the market is of a type that the conductive fabric wraps the fixed foam core, the height of the conductive material is fixed, and the height cannot be adjusted according to requirements, so that a buffering material capable of adjusting the thickness according to requirements is developed, a product can provide two thickness options, and the requirement for the conductive material with real matching property of the structure buffering size of an electronic product is met.

SUMMERY OF THE UTILITY MODEL

The utility model provides a technical problem provide a shielding conducting material for electronic product.

The utility model provides a technical scheme that its technical problem adopted is: the utility model provides a shielding conducting material for electronic product, includes that the middle part becomes the electrically conductive substrate that the cavity was led to the hollow, electrically conductive substrate one side is provided with the conducting resin, still includes the insulating cloth that curls into the platykurtic structure, the insulating cloth can place in the cavity is led to the hollow further is: the conductive base material is conductive cloth or metal foil.

Further, the method comprises the following steps: the conductive cloth comprises polyester fiber cloth, and an electroplating metal layer is arranged on the surface of the polyester fiber cloth.

Further, the method comprises the following steps: the insulating cloth comprises fiber cloth and a hot melt adhesive layer coated on the fiber cloth.

Further, the method comprises the following steps: the thickness of the insulating cloth is 0.1 mm-1.5 mm.

Further, the method comprises the following steps: the conductive adhesive is a cloth-based double-sided conductive adhesive tape.

The utility model has the advantages that:

1. the utility model discloses a combination of electrically conductive cloth, conducting resin, insulating cloth can make this structure collect the shielding, function such as electrically conductive through electrically conductive cloth as outer package material and be as one, and through the experiment, this structure shielding effectiveness is greater than 60dB (30 MHZ ~ 1.5 GHZ), surface resistance is less than 0.07 omega.

2. The conductive back adhesive adopted in the invention is a cloth-based double-sided conductive adhesive tape, and the resistance is less than 0.08 omega/inch ² _。

3. The inner core adopted in the invention is insulating cloth which has the characteristics of temperature resistance, solvent resistance, ageing resistance and the like.

4. The outer coating material is made of conductive cloth material, and has price advantage compared with metal foil and other materials.

Drawings

Fig. 1 is a schematic structural diagram of a shielding conductive material for an electronic product according to an embodiment of the present application.

Labeled in the figure as: 1. a conductive substrate; 2. a conductive adhesive; 3. and (7) insulating cloth.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

As shown in fig. 1, the embodiment of the present application discloses a shielding conductive material for electronic products, which comprises a conductive substrate 1 with a hollow through cavity in the middle, wherein a conductive adhesive 2 is disposed on one side of the conductive substrate, and an insulating cloth 3 curled into a flat structure is further included, and the insulating cloth 3 can be placed in the hollow through cavity.

The structure is particularly applied to the interior of an electronic product and can be used for connecting two conductive products, and the insulating cloth 3 can be selectively inserted or not inserted according to different thickness requirements of the products, so that 2 kinds of height selection are formed.

The above-mentioned design of this structure makes a product can realize two kinds of working height and product design, this structure collects the shielding, electrically conduct, functions such as buffering are as an organic whole, this product uses the back, make the use that electronic product reduces PCB and pencil, reduce the thickness after the electronic product equipment, thereby realize the frivolous characteristic of product, because present PCBA mainly is that circuit board welded element passes through the circuit realization electronic function on the board, but can not only have a circuit board on the electronic product, if connect two circuit boards and have only two kinds of schemes at present, firstly pass through the connector, another kind is the pencil, if the connector then can have the height, have certain space between board and the board promptly, can have the fracture, the problem of oxidation, if the pencil, need have certain space to place. The design of the product can avoid the problems, and the conductive cloth is not required to be welded between the two circuit boards and is placed in the gap to be locked by the circuit board screws. After locking, the conductive cloth is pressed between the two circuit boards and is respectively contacted with the two circuit boards to realize the conduction of the two circuit boards, and through experiments, the shielding effectiveness of the structure is more than 60dB (30 MHZ-1.5 GHZ) and the surface resistance is less than 0.05 omega.

Specifically, the conductive base material 1 is conductive cloth or metal foil, the conductive cloth comprises polyester fiber cloth, and an electroplating metal layer is arranged on the surface of the polyester fiber cloth.

The conductive cloth is preferably selected, and compared with materials such as metal foil, the conductive cloth has price advantage.

In this embodiment, the insulating cloth 3 includes a fiber cloth and a hot melt adhesive layer coated on the fiber cloth, and the thickness of the insulating cloth 3 is 0.1mm to 1.5mm, and the specific thickness may be 0.1mm, 0.3mm, 0.7mm, 1.2mm, 1.5mm, and the like.

The insulating cloth 3 has a good insulating voltage-resistant effect, and is more suitable for being used in electronic products.

In this embodiment, the conductive adhesive 2 is a cloth-based double-sided conductive adhesive tape.

The cloth-based double-sided conductive adhesive tape has the characteristic of small resistance, and the resistance can be less than 0.08 omega/inch ² Therefore, the method can be more suitable for being used in the conductive environment.

The above-mentioned embodiments further describe the objects, technical solutions and advantages of the present invention in detail, it should be understood that the above-mentioned embodiments are only specific embodiments of the present invention, and are not intended to limit the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A shielding conductive material for electronic products, characterized by: the conductive substrate (1) with the hollow through cavity in the middle is included, conductive adhesive (2) is arranged on one side of the conductive substrate, the insulating cloth (3) which is curled into a flat structure is further included, and the insulating cloth (3) can be placed in the hollow through cavity.

2. The shielding conductive material for electronic products as claimed in claim 1, wherein: the conductive base material (1) is conductive cloth or metal foil.

3. The shielding conductive material for electronic products as claimed in claim 2, wherein: the conductive cloth comprises polyester fiber cloth, and an electroplating metal layer is arranged on the surface of the polyester fiber cloth.

4. The shielding conductive material for electronic products as claimed in claim 1, wherein: the insulating cloth (3) comprises fiber cloth and a hot melt adhesive layer coated on the fiber cloth.

5. The shielding conductive material for electronic products as claimed in claim 1, wherein: the thickness of the insulating cloth (3) is 0.1 mm-1.5 mm.

6. The shielding conductive material for electronic products as claimed in claim 1, wherein: the conductive adhesive (2) is a cloth-based double-sided conductive adhesive tape.