KR20030096003A - Nozzle Equipment And Substrate Treatment Equipment - Google Patents

Abstract

SUMMARY OF THE INVENTION The present invention provides a nozzle apparatus capable of supplying a processing liquid obtained by diluting an additive fluid with a dilution fluid without using a mixing tank.

In the nozzle device for injecting the processing liquid toward the substrate,

Nozzle body,

The mixing chamber 68 provided in the nozzle body 61;

An injection unit 69 installed in the nozzle body and communicating with the mixing chamber;

A first connection hole (65) installed in the nozzle body for supplying a dilution fluid to the mixing chamber;

A second connection hole 66 provided in the nozzle body for supplying an additive fluid diluted by the dilution fluid;

And a third connection hole 67 provided in the nozzle body for supplying a pressurized gas for pressurizing the processing liquid produced by diluting the additive fluid with the dilution fluid in the mixing chamber and injecting the sprayed liquid from the injection unit. .

Description

Nozzle Equipment and Substrate Treatment Equipment {Nozzle Equipment And Substrate Treatment Equipment}

The present invention relates to a nozzle apparatus for spraying a processing liquid toward a substrate, and a processing apparatus for processing a substrate using the nozzle apparatus.

BACKGROUND In manufacturing a semiconductor device, a liquid crystal display device, or the like, there is a lithography process for forming a circuit pattern on a substrate such as a semiconductor wafer or a glass substrate. The lithographic process is, as is well known, by applying a resist to the substrate, irradiating light through a mask in which a circuit pattern is formed on the resist, and then removing a portion of the resist that is not irradiated or a portion to which the light is irradiated. The circuit pattern is formed on the substrate by repeating a series of processes such as etching the removed portion several times.

In each of the above steps, if the substrate is contaminated, the circuit pattern cannot be formed accurately, resulting in defective products. Therefore, when forming a circuit pattern in each process, it is performed to wash | clean the said board | substrate in the clean state in which microparticles | fine-particles, such as a resist and dust, do not remain.

When the substrate is subjected to cleaning or other treatment than cleaning, a different kind of processing liquid is used depending on the processing purpose. As the treatment liquid, a treatment liquid in which an additive fluid is diluted with a dilution fluid is used, such as a treatment liquid in which hydrofluoric acid is diluted with pure water, a treatment liquid in which a high concentration of ammonia gas is dissolved in and diluted with pure water.

On the other hand, when the substrate is treated with a treatment liquid, the treatment liquid is pressurized with a pressurized gas made of an inert gas such as nitrogen gas and sprayed. As a result, the processing effect of the substrate can be improved or the amount of the processing liquid used can be reduced.

In the case of spraying the processing liquid by pressurizing the pressurized gas, a nozzle apparatus is used. This nozzle apparatus has a pair of supply parts to which said process liquid and pressurized gas are supplied. The processing liquid is supplied from one supply part, and pressurized gas is supplied from the other supply part. As a result, the processing liquid is pressurized by the pressurized gas and sprayed toward the substrate.

The processing liquid supplied to the nozzle device is mixed with the addition fluid and the dilution fluid to a predetermined concentration by a mixing tank in advance, and is fed to the nozzle device from the mixing tank.

However, in order to make the processing liquid by mixing the addition fluid and the dilution fluid constituting the processing liquid into the mixing tank in advance, the mixing tank is provided upstream of the nozzle apparatus, and the processing liquid mixed in the mixing tank is supplied to the nozzle apparatus. You must supply to.

Therefore, according to such a structure, since a mixing tank becomes indispensable, a cost increase or the place where a mixing tank installation place must be secured by that much may result in enlargement and complexity of an apparatus.

SUMMARY OF THE INVENTION The present invention provides a nozzle apparatus and a processing apparatus in which the nozzle apparatus is used so as to pressurize and inject a processing liquid diluted with a dilution fluid into a pressurized fluid without using a mixing tank. .

1 is a cross-sectional view showing a schematic configuration of a processing apparatus according to an embodiment of the present invention.

2A is a side view of the nozzle apparatus.

Fig. 2B is a longitudinal sectional view of the nozzle device.

2C is a plan view of the nozzle apparatus.

<Description of Symbols for Main Parts of Drawings>

61 nozzle body 62 metal wire (conductive member)

65: 1st connection hole (1st supply part) 66: 2nd connection hole (2nd supply part)

67: third connection hole (third supply part) 68: mixing chamber

69: injection part 76: nozzle part

The present invention is a nozzle device for injecting a processing liquid toward a substrate,

Nozzle body,

A mixing chamber installed in the nozzle body;

An injection unit installed in the nozzle body and communicating with the mixing chamber;

A first supply unit installed at the nozzle body to supply a dilution fluid to the mixing chamber;

A second supply unit installed at the nozzle body to supply an additive fluid diluted by the dilution fluid;

A third supply unit installed at the nozzle body to supply a pressurized gas to pressurize the processing liquid produced by diluting the additive fluid with the dilution fluid in the mixing chamber and sprayed from the injection unit;

The nozzle apparatus provided with the.

The present invention is a nozzle device for injecting a processing liquid for processing a substrate,

A nozzle body made of synthetic resin provided with a supply portion to which a treatment liquid is supplied and an injection portion into which the treatment liquid is injected;

A conductive member provided in the nozzle body so as to be earthable;

The nozzle apparatus provided with the.

In the processing apparatus which processes a board | substrate with a processing liquid,

A rotating body supporting and rotating the substrate substantially horizontally;

It is provided with the nozzle apparatus arrange | positioned facing the said board | substrate supported by this rotating body so that it can be driven in the radial direction of a board | substrate,

The nozzle device,

Nozzle body,

A mixing chamber installed in the nozzle body;

An injection unit installed in the nozzle body and communicating with the mixing chamber;

A first supply unit installed at the nozzle body to supply a dilution fluid to the mixing chamber;

A second supply unit installed at the nozzle body to supply an additive fluid diluted by the dilution fluid;

A third supply unit installed at the nozzle body to supply a pressurized gas to pressurize the processing liquid produced by diluting the additive fluid with the dilution fluid in the mixing chamber and sprayed from the injection unit;

The substrate processing apparatus characterized by the above-mentioned.

In the processing apparatus which processes a board | substrate with a processing liquid,

A rotating body supporting and rotating the substrate substantially horizontally;

It is provided with the nozzle apparatus arrange | positioned facing the said board | substrate supported by this rotating body so that it can be driven in the radial direction of a board | substrate,

The nozzle device,

A nozzle body made of synthetic resin provided with a supply portion to which a treatment liquid is supplied and an injection portion into which the treatment liquid is injected;

A conductive member provided in the nozzle body so as to be earthable;

The substrate processing apparatus characterized by the above-mentioned.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described, referring drawings.

Fig. 1 shows a spin type processing apparatus of one embodiment of the present invention, which has a cup body 1. The cup body 1 is formed by the lower cup 3 provided on the bottom plate 2 of the treatment tank (the treatment tank shows only the bottom plate), and the upper and lower drive mechanisms not shown on the upper side of the lower cup 3. It consists of an upper cup (4) installed to be driveable.

In the center of the bottom wall of the lower cup 3 and the bottom plate 2, a through hole 5 penetrating them is formed, and the peripheral wall 3a of the lower cup 3 has a double structure peripheral wall of the upper cup 4. (4a) slides freely and forms the labyrinth structure by these peripheral walls.

The upper surface of the upper cup 4 is opened, and the upper cup 4 is driven in the downward direction, whereby a substrate W such as a semiconductor wafer, for example, a process such as cleaning is performed in the cup body 1 as described later. ) Can be taken out by a robot (not shown) or the raw substrate W can be supplied.

One end of the plurality of discharge pipes 6 is connected to the bottom wall of the lower cup 3 at predetermined intervals in the circumferential direction, and the other end thereof communicates with a suction pump (not shown). Thereby, the processing liquid which wash | cleaned the said board | substrate W or the cleaning liquid which scatters from the said board | substrate W at the time of the drying process after a washing process is discharged | emitted through the said discharge pipe 6.

A base 7 is disposed below the bottom plate 2. The base 7 is provided with mounting holes 8 at positions corresponding to the passage holes 5 of the cup body 1. The upper end of the stator 9a of the pulse control motor 9 constituting the driving means is fitted into this mounting hole 8 so as to be fixed.

The stator 9a has a cylindrical shape, and inside the rotor 9b which is similarly cylindrical, is rotatably fitted. On the upper end surface of this rotor 9b, a cylindrical connecting body 11 is fixed to the lower surface by joining together. The lower end surface 11a of this connecting body 11 is formed with a larger diameter than the inner diameter of the stator 9a. This blade 11a slides freely in contact with the upper end surface of the stator 9a, thereby allowing the rotor 9b to be pulled out of the stator 9a without interfering with the rotation of the rotor 9b. It is regulated.

The connecting body 11 protrudes inward from the passage hole 5 of the cup body 1, and a disk-shaped rotating body 12 is fixed to the upper surface. Six holding members 13 (only two are shown) are rotatably provided in the peripheral part of the upper surface of this rotating body 12 at predetermined intervals in the circumferential direction, and in this embodiment at 60 degree intervals. The upper surface of the holding member 13 is provided with a conical support pin 14 protruding from the center portion, and a reverse tapered lock pin 15 is provided at a position eccentric from the center.

The substrate W is supplied into the cup body 1 by a robot (not shown). As for the board | substrate W supplied into the cup body 1, the lower surface of the periphery part is supported by the said support pin 14. In this state, the holding member 13 is rotated so that the lock pin 15 is eccentrically rotated to engage the outer circumferential surface of the substrate W. As shown in FIG. As a result, the substrate W is held by the rotating body 12.

A pressure spring 16 is installed on the outer circumferential surface of the connecting body 11. The pressure spring 16 exerts a force on a lower surface side of the rotating body 12 in a predetermined rotational direction with a large cog wheel (not shown) provided so as to be rotatable with respect to the rotating body 12. A small cog wheel (not shown) is engaged with this large cog wheel, and this small cog wheel is provided at a lower end portion protruding on the lower surface side of the rotating body 12 of the holding member 13. Thereby, the holding member 13 is exerted a force in the lock direction in which the lock pin 15 engages with the outer circumferential surface of the substrate W by the pressure spring 16.

The lock state of the substrate W is released by the lock pin 15 by the release mechanism 17. The release mechanism 17 includes a release cylinder 18, an arm 19 driven by the release cylinder 18, and a release pin 21 provided on an upper end of the arm 19.

In the state where the release cylinder 18 is actuated and the release pin 21 prevents the rotation of the large cog wheel, the rotary body 12 is pressed by the pulse control motor 9 to the pressing spring 16. The holding member 13 is rotated in response to the rotation by a predetermined angle, thereby releasing the locked state of the substrate W by the lock pin 15.

The through hole 12a is formed in the center of the rotating body 12. A hollow fixed shaft 22 passes through the rotor 9b, and an upper end of the fixed shaft 22 is located in the passage hole 12a of the rotor 12. As shown in FIG. The nozzle head 23 is provided in the upper end of the fixed shaft 22. The nozzle head 23 is provided with a plurality of lower nozzle bodies 24 for spraying the cleaning liquid toward the lower surface of the substrate W held by the rotating body 12.

The upper surface side of the rotating body 12 is wrapped by the turbulence prevention cover 29. The turbulence preventing cover 29 is formed with an opening 29a for exposing the nozzle head 23 and an opening 29b for exposing the holding member 13. The upper surface of the turbulence prevention cover 29 is spaced apart from the lower surface of the substrate W supported by the support pin 14 at a slight interval, and the lower surface of the substrate W is accompanied by the rotation of the rotor 12. To prevent turbulence on the side.

On the upper surface side of the substrate W held in the cup body 1, a nozzle device 31 is provided so as to be able to swing along the radial direction of the substrate W. As shown in FIG. The processing liquid is injected from the nozzle apparatus 31, and the processing liquid is configured to perform a process such as washing on the upper surface of the substrate W.

As shown in FIG. 1, the nozzle apparatus 31 is the horizontal portion 43 of the arm body 41 as a mounting member formed almost in an inverted L shape by the vertical portion 42 and the horizontal portion 43. As shown in FIG. The axis line is mounted almost perpendicularly to the mounting portion 43a formed at the tip of the.

The vertical portion 42 of the arm body 41 passes through the insertion hole 47 formed in the base 7, and the hollow shaft motor drives the arm body 41 to oscillate within a predetermined angle. It is connected to the rotor which is not shown of the 1st drive source 48 which consists of these. This first drive source 48 is attached to the movable plate 49. The movable plate 49 is provided to be slidable in the vertical direction by a linear guide (not shown) on the fixed plate 51 provided perpendicular to the base 7.

The fixing plate 51 is provided with a second drive source 52. A ball screw (not shown) is connected to the drive shaft 52a of the second drive source 52. The ball screw is screwed into a nut body (not shown) provided on the movable plate 49. Therefore, when the second drive source 52 is operated to rotate the ball screw, the movable plate 49 is driven in the vertical direction indicated by the arrow.

That is, the nozzle device 31 is oscillated and driven along the radial direction of the substrate W above the substrate W held in the cup body 1 by the first drive source 48, and at the same time, the second device It is driven up and down by the drive source 52, and is hold | maintained at the predetermined height position.

The nozzle device 31 has a nozzle body 61 as shown in Figs. 2A to 2C. The nozzle body 61 is formed of synthetic resin having chemical resistance such as vinyl chloride or fluorine resin. When the nozzle body 61 is formed, a plurality of metal wires 62 electrically connected to each other as conductive members are embedded in the nozzle body 61. One end of one of the metal wires 62 is an earth portion 63 drawn out of the nozzle body 61. The earth portion 63 is earthed through the arm body 41.

The nozzle body 61 is formed in a columnar shape, and a spherical portion having a rectangular cross-sectional shape is formed in the middle portion thereof. On one side 64a of the spherical portion 64, an opening is formed in the first connection hole 65 as the first supply portion. A second connection hole 66 as a second supply portion is formed in an opening on the other side surface 64b facing the one side surface 65a on which the first connection hole 65 is formed. In addition, an opening is formed in the upper end surface of the nozzle body 32 as a third connection hole 67 as a third supply portion.

The first to third connection holes 65 to 67 communicate with the mixing chamber 68 formed at the center of the spherical portion 64 of the nozzle body 61. One end of the injection section 69 communicates with the mixing chamber 68. The other end of the injection section 69 is open to the tip surface of the nozzle body 61. Moreover, the injection part 69 forms the cone shape which gradually expands diameter by winding from the end which communicated with the mixing chamber 68 to the other end opened to the tip surface of the nozzle main body 61. FIG.

In the first and second connection holes 65 and 66, first and second supply pipes 71 and 72 shown by chain lines in Fig. 2B are connected to one ends thereof, respectively. The dilution fluid such as pure water is supplied to the mixing chamber 68 from the first supply pipe 71.

From the second supply pipe 72 to the mixing chamber 68 is an additive fluid diluted by the dilution fluid, for example, a liquid such as ammonia water, hydrochloric acid, hydrogen peroxide water, ozone water, or ozone, nitrogen, oxygen, hydrogen And gases such as carbon dioxide are supplied. As a result, in the mixing chamber 68, a processing liquid in which the dilution fluid and the additive fluid are mixed is produced.

A connecting sphere 73 is connected to the third connecting hole 67. The connecting portion 73 is formed with a connecting portion 74 that is opened at the rear end surface. The connection part 74 is connected with the 3rd supply pipe 75 which supplies inert gas, such as nitrogen gas and argon gas, pressurized by predetermined | prescribed pressure to the said mixing chamber 68. As shown in FIG.

At the tip of the connection sphere 73, a noble portion 76 located in the mixing chamber 68 is provided. The nozzle portion 76 is formed to have a slightly smaller external dimension than the internal diameter of the mixing chamber 68. A circumferential groove 77 is formed in the outer circumferential surface of the nozzle portion 76, and a nozzle hole 78 communicating with the connection portion 74 is formed in the tip of the nozzle 76. From this nozzle hole 78, a pressurized gas is sprayed toward one end of the injection section 69.

From the first supply pipe (71) and the second supply pipe (72), the dilution fluid and the addition fluid are directed toward the circumferential groove (77) of the outer circumferential surface of the nozzle portion (76) located in the mixing chamber (68), respectively. Supplied. Therefore, since the dilution fluid and the addition fluid flow along the circumferential groove 77 and are mixed, the dilution fluid and the addition fluid become a processing liquid sufficiently mixed in the mixing chamber 68 and then flow to the injection part 69.

The processing liquid mixed in the mixing chamber 68 and flowing to the injection unit 69 is pressurized by the pressurized gas injected from the nozzle hole 78. Therefore, the processing liquid becomes a particle shape and sprays toward the substrate W at the tip of the spraying section 69.

The injection section 69 is formed in a conical shape. Therefore, even if the processing liquid is pressurized by the pressurized gas to form particulates, the injection shape onto the substrate W is defined as a cone by the shape of the injection section 69 and does not diffuse. That is, the injection shape of the processing liquid onto the substrate W is kept constant. As a result, the portion of the substrate W facing the tip opening of the jetting portion 69 is reliably processed by the processing liquid.

According to the processing apparatus of the above constitution, the nozzle apparatus 31 for supplying the processing liquid to the substrate W held by the rotating body 12 includes a first supply pipe for supplying a fluid for dilution to the nozzle body 61. 71), a second supply pipe 72 for supplying an additive fluid, and a third supply pipe 75 for supplying a pressurized gas are connected.

The dilution fluid supplied from the first supply pipe 71 to the mixing chamber 68 of the nozzle body 61 and the additive fluid supplied from the second supply pipe 72 to the mixing chamber 68 are the mixing chamber. It mixes in and becomes a process liquid.

The processing liquid produced in the mixing chamber 68 is pressurized by the pressurized gas supplied from the third supply pipe 75 and injected from the nozzle hole 78 of the nozzle portion 76 of the connector 73. The processing liquid becomes particulate by the action of the pressurized gas and is sprayed toward the upper surface of the substrate W from the other end of the injection section 69 in which one end is communicated with the mixing chamber 68, so that the upper surface of the substrate W is It is processed by the processing liquid.

That is, according to the nozzle apparatus of the said structure, the dilution fluid and the addition fluid can be mixed in the mixing chamber 68 of the nozzle apparatus 31. FIG. Therefore, since the mixing tank does not have to be provided upstream of the nozzle apparatus 31 as in the conventional art of mixing and supplying the diluent fluid and the additive fluid in advance, the cost can be reduced and the configuration can be simplified.

The processing liquid produced in the mixing chamber 68 is pressurized by the pressurized gas and sprayed from the injection unit 69. Therefore, since the processing liquid rises in pressure and becomes particulate, acting on the substrate W, the processing effect on the substrate W can be improved. In addition, since the processing liquid is pressurized with a pressurized gas, the amount of the processing liquid used can be reduced as compared with the case where the processing liquid is pressurized and supplied to the substrate (W).

The dilution fluid and the addition fluid supplied to the mixing chamber 68 are supplied toward the circumferential groove 77 formed on the outer circumferential surface of the nozzle portion 76 protruding in the mixing chamber 68 together. Therefore, since it flows along the circumferential groove 77 and is sufficiently mixed and then flows to the injection section 69, the dilution fluid and the addition fluid of the processing liquid injected from the injection section 69 toward the substrate W and Mixing is not insufficient. That is, in the mixing chamber 68, the injection portion 69 is supplied with a homogeneous treatment liquid in which the dilution fluid and the addition fluid are sufficiently mixed.

The processing liquid mixed in the mixing chamber 68 and pressurized by the pressurized gas and injected into the substrate W from the spraying section 69 is defined as having a conical shape corresponding to the shape of the spraying section 69. do. Therefore, in the injection part 69, since the process liquid is injected without spread | diffusion with respect to the board | substrate W, mist generation can be controlled.

That is, when the processing liquid sprayed toward the substrate W is diffused from the sprayer 69 of the nozzle device 31, mist is generated and the mist adheres to the inner surface of the cup body 1. Therefore, when the substrate W is treated with the treatment liquid and then dried, the mist on the inner surface of the cup body 1 scatters, which may adhere to the substrate W and cause contamination.

However, as described above, since the processing liquid is prevented from spreading by making the injection portion 69 into a conical shape, the generation of mist is suppressed, so that the mist adheres and contaminates the substrate W during the drying process. It can prevent.

The nozzle body 61 of the nozzle device 31 is made of synthetic resin in order to have corrosion resistance to the processing liquid and the like. In this case, the processing liquid flows through the nozzle body 61, and static electricity is generated by frictional resistance. When the specific resistance of the processing liquid is high, since static electricity is charged to the processing liquid, the circuit pattern formed on the substrate W may be destroyed by the static electricity.

However, in the nozzle apparatus 31 of the present invention, the metal wire 62 is embedded in the nozzle body 61 made of synthetic resin, and a part thereof is taken out to the earth portion 63 to form the earth portion 63. Earth was made through the arm body 41. Therefore, since static electricity is not charged to the processing liquid, it is possible to prevent the substrate W treated with the processing liquid from being damaged by the static electricity.

As described above, according to the present invention, in the mixing chamber of the nozzle body, the addition fluid is diluted with the dilution fluid to form a treatment liquid, and the treatment liquid is pressurized with a pressurized gas to be injected from the injection unit.

Therefore, a processing liquid in which an additive fluid and a dilution fluid are mixed without using a mixing tank can be made and sprayed toward the substrate, so that the configuration can be simplified, the cost can be reduced, and the like.

Claims (8)

In the nozzle device for injecting the processing liquid toward the substrate, Nozzle body, A mixing chamber installed in the nozzle body; An injection unit installed in the nozzle body and communicating with the mixing chamber; A first supply unit installed at the nozzle body to supply a dilution fluid to the mixing chamber; A second supply unit installed at the nozzle body to supply an additive fluid diluted by the dilution fluid; A third supply unit installed at the nozzle body to supply a pressurized gas to pressurize the processing liquid produced by diluting the additive fluid with the dilution fluid in the mixing chamber and sprayed from the injection unit; Nozzle device comprising a. 2. The third supply portion is provided with a connecting sphere having a nozzle portion for protruding into the mixing chamber and injecting the pressurized gas toward the processing liquid mixed in the mixing chamber and flowing into the spraying portion. Nozzle unit. The nozzle apparatus according to claim 2, wherein a peripheral groove is formed on an outer circumferential surface of the nozzle portion, and the first connecting portion and the second connecting portion are formed to face the peripheral groove. The nozzle apparatus according to claim 1, wherein the nozzle body is formed of synthetic resin, and the nozzle body is embedded with an earthable conductive member. The nozzle apparatus according to claim 1, wherein the spraying portion is formed in a conical shape which gradually expands in diameter from one end communicating with the mixing chamber toward the other end opened on the tip surface of the nozzle body. A nozzle apparatus for injecting a processing liquid for processing a substrate, A nozzle body made of synthetic resin provided with a supply portion to which a treatment liquid is supplied and an injection portion into which the treatment liquid is injected; A conductive member provided in the nozzle body so as to be earthable; Nozzle device comprising a. In the processing apparatus which processes a board | substrate with a processing liquid, A rotating body supporting and rotating the substrate substantially horizontally; It is provided with the nozzle apparatus arrange | positioned facing the said board | substrate supported by this rotating body so that it can be driven in the radial direction of a board | substrate, The nozzle device, Nozzle body, A mixing chamber installed in the nozzle body; An injection unit installed in the nozzle body and communicating with the mixing chamber; A first supply unit installed at the nozzle body to supply a dilution fluid to the mixing chamber; A second supply unit installed at the nozzle body to supply an additive fluid diluted with the dilution fluid; A third supply unit installed at the nozzle body to supply a pressurized gas to pressurize the processing liquid produced by diluting the additive fluid with the dilution fluid in the mixing chamber and sprayed from the injection unit; Substrate processing apparatus comprising a. In the processing apparatus which processes a board | substrate with a processing liquid, A rotating body supporting and rotating the substrate substantially horizontally; It is provided with the nozzle apparatus arrange | positioned facing the said board | substrate supported by this rotating body so that it can be driven in the radial direction of a board | substrate, The nozzle device, A nozzle body made of synthetic resin provided with a supply portion to which a treatment liquid is supplied and an injection portion into which the treatment liquid is injected; A conductive member provided in the nozzle body so as to be earthable; Substrate processing apparatus comprising a.