1308358 玖、發明說明： C發明所屬之技術領域3 發明領域 本發明係有關於一種可朝基板噴射處理液之喷嘴裝置 及一種使用該噴嘴裝置處理基板之處理裝置。 C先前技術3 發明背景 在製造半導體裝置或液晶顯示裝置等的過程中，有一 種用以在半導體晶圓或玻璃基板等基板形成電路圖案之微 · 10影成像術。眾所週知，該微影成像術係反覆進行在基板塗 布抗蝕劑，而光則透過形成有電路圖案之遮蔽罩而照射在 該抗蝕劑上，接著除去抗蝕劑未受光照射的部份或受光照 射到的部份，然後再蝕刻除去部份等一連串過程，藉此在 刖述基板形成電路圖案者。 15 在前述一連串過程中，一旦前述基板被污染則無法精 密地形成電路圖案，並成為產生不良品的原因。因此，卷 在各過程中形成電路圖案時，要對前述基板進行洗淨處理 Φ 使其成為不殘留抗蝕劑或塵埃等微粒子之乾淨狀態。 在洗淨基板或進行洗淨以外之處理之過程中，隨著診 20處理目的而使用不同種類之處理液。該處理液可使用:該 釋流體稀釋過的添加流體，如以純水稀釋氟氫酸之處理稀 或在純水中溶解稀釋高濃度氨氣之處理液等。 液 另-方面，在以處理液處理基板的過程中，可利用 如氮氣等不活性氣體形成之加壓氣體加壓喷射該處理液由 1308358 藉此提升基板的處理效果並滅少處理液之使用量。 在以加壓氣體加壓喷射處理液的過程中，可使用噴嘴 裝置。該喷嘴裝置具有一對可供給前述處理液及加壓氣體 之供給部，其中一供給部係供給處理液，而另一供給部則 5係供給加壓氣體。藉此，處理液可利用加壓氣體加壓並朝 基板喷射。 供給至前述喷嘴裝置之處理液’係透過混合槽將添加 流體及稀釋流體混合至事先預定之濃度，並由該混合槽壓 送至前述喷嘴裝置。 10 然而，若要將用以構成處理液之添加流體及稀釋流體 在混合槽事先混合而製成處理液，則不得不在喷嘴裝置之 上流側設置前述混合槽，並供給在該混合槽混合而成之處 理液至前述喷嘴裝置。 因此，若根據該構造，則混合槽成為必要而不可缺少 15 者，如此一來’將導致成本的上升，並且因不得不確保混 合槽的設置地點，而使得裝置大型化和複雜化。 本發明，係提供一種不需使用混合槽，而可藉由加壓 流體來加壓喷射以稀釋用流體稀釋添加流體而成之處理液 的喷嘴裝置及一種使用該噴嘴裝置之處理裝置。 20 【發明内容】 發明概要 本發明，係一種用以朝基板喷射處理液之喷嘴裝置， 包含有： 喷嘴本體； 1308358 混合室，係設置於該噴嘴本體者； 噴射。卩，係設置於前述噴嘴本體且與前述混合室連通 者， 第1供給部，係設置於前述喷嘴本體且用以將稀釋用 5流體供給至前述混合室者； 第2供給部，係設置於前述喷嘴本體，用以供給藉前 述稀釋用流體而稀釋之添加流體者；及 第3供給部，係設置於前述喷嘴本體，用以供給加壓 氣體者，該加壓氣體係加壓在前述混合室以前述稀釋用流 10體稀釋前述添加流體而製成之前述處理液以使其從前述喷 射部喷射出者。 本發明’係一種噴嘴裝置，可噴射用以處理基板之處 理液者，包含有·· 合成樹脂製之噴嘴本體，係設有可供給處理液之供給 15 部及可喷射該處理液之噴射部者；及 導電性構件，係設置於該喷嘴本體並可接地者。 本發明’係一種用以藉處理液處理基板之處理裝置， 包含有： 旋轉體，係大略水平地支持並旋轉驅動基板者；及 2〇 喷嘴裝置’係對向於㈣旋_切之前述基板而 配置，且可驅動地設置於基板之徑向者， 又，前述喷嘴裝置，包含有： 喷嘴本體； 混合室，係設置於該喷嘴本體者； 1308358 則述混合室連 噴射部，係設置於前述喷嘴本體且與 通者； 10 第1供給部’係設置於前述噴嘴轉且用以將稀釋 用流體供給至前述混合室者； 第2供給部，係設置於前述噴嘴本體 則述稀釋用流體而稀釋之添加流體者； 第3供給部，係設置於前述喷嘴本體 ，用以供給藉 及 ’用以供給加壓 至以前述稀釋用流 氣體者，該加壓氣體係加壓在前述混合 體稀釋前述添加流體而製成之前述處理液 射部喷射出者。 本發明，係一種可藉處理液處理基板之處理裝置 包含有： 以使其從前述喷 旋轉體，係大略水平地支持並旋轉驅動基板者；及 噴嘴裝置，係對向於由該旋轉體支持之前述基板而 15 配置，且可驅動地設置於基板之徑向者， 又，前述喷嘴裝置，包含有： 合成樹脂製之噴嘴本體，係設有可供給處理液之供 給部及可喷射該處理液之喷射部者；及 導電性構件，係設置於該喷嘴本體並可接地者。 20 【實施方式】 較佳實施例之詳細說明 以下’參照圖式說明本發明之實施型態。 第1圖係本發明一實施型態之旋轉型處理裝置且該處 理裴置具有蓋體1。該蓋體丨係由設置於處理槽底板2(處理 1308358 槽僅圖示底板）上之下蓋3及設置在該下蓋3上側且藉由未 圖示之上下驅動機構而可上下驅動之上蓋4所組成者。 在前述下蓋3底壁之中心部及底板2形成可貫通兩者之 通孔5，又前述上蓋4之雙重構造周壁乜嵌插在前述下蓋^ 5之周壁3a而可自由滑動且由這些周壁形成迷宮式構造。 前述上蓋4之上面形成有開口，且藉由朝下降方向驅 動上蓋4，如後所述地，可利用未圖示之自動裝置取出在 蓋體1内進行如洗淨等處理之半導體晶圓等基板w，並可 供給未處理之基板W。 1〇 前述下蓋3之底壁在周方向上以一定間隔連接有多數 排出管6之一端，而另—端則與未圖示之吸引抽水機連通。 因此’用以洗淨處理前述基板W之處理液或在洗淨處理後 的乾燥處理時從前述基板w飛散之洗淨液，皆可透過前述 排出管6排出。 15 在前述底板2下方配置有基座7，在該基座7上形成有 位於與前述蓋體1之通孔5對應之位置處之安裝孔8，且在 該安裝孔8嵌入固定用以構成驅動裝置之脈衝控制馬達9之 固定子9a上端部。 前述固定子9a呈筒狀，且相同呈筒狀之旋轉子9b嵌插 在其内部而可自由旋轉，該旋轉子9b上端面與筒狀連結體 11之下端面接合並一體地固定。在該連結體11下端面形成 有較前述固定子9a内徑尺寸大之凸緣部11a。且該凸緣部 Ha與前述固定子％上端面可滑動地連接，因此不會阻止 旋轉子9a的旋轉，但可限制該旋轉子卯從固定子％上脫 9 l3〇8358 落。 意前述連結體11從前述蓋體1之通孔5朝内部突出，且在 2端面安裝料有圓板狀之旋_12。該旋_12上面 3邊部在周方向上以—定間隔設置多數，在此實施形態 糸⑽度間隔可旋轉地設置六根保持構件⑽示僅出 ^根）。在該保持構件13上面於中心部突出設置有圓錐狀 15支持銷14 ’且在偏離中心位置上則設有倒錐狀之鎖銷 1〇内月J述基板以藉由未圖示之機械手供給至前述蓋體1 被供給至蓋體丨内之基板w，其周邊部下面由前述支 雜銷14支持。在此狀態下，藉由前述保持構件13旋轉以使 鎖15偏心補，可卡合於基㈣之相面。因此，基板 可固持在旋轉體12上。 U 纟前述連結體U外周面設置有賦勢彈簧16。該赋勢彈 〃 16 ’在前述旋轉體！2下關，相對於該旋轉體U朝一定 旋轉方向賦與可旋㈣設置之親絲(未圖*)勢能。該親 輪與子齒輪(未圖示）唾合，且該子齒輪設置於前述保持 構件13朝前述旋轉體12下面側突出之下端部。因此，前述 2保持構件U可藉由前述賦勢彈簧16朝使鎖_卡合於基板 〇 %外周面之鎖合方向賦與勢能。 藉由解除機構π可解除以前述鎖鎖ls對鎖固基板額 狀態’該解除機構Π係由解除缸體18，由該解除缸體娜 動之把手19及设置於該把手19上端之解除銷21所構成者。 在前述解除缸體18作動且解除銷21阻止前述親齒輪旋 1308358 轉之狀態下，前述旋轉體12利用脈衝控制馬達9對抗前述 賦勢彈簧16之賦勢力而旋轉驅動預定角度，並且前述保持 構件13旋轉而可解除由前述鎖銷15鎖固基板W之狀態。 在前述旋轉體12中心部形成有通孔i2a。中空狀之固 5定軸22通過前述旋轉子9b，且該固定軸22上端部位於前述 旋轉體12之通孔12a内’而固定轴22上端設置有喷嘴頭23。 在該喷嘴頭23設置有多數下部喷嘴體24，而該下部噴嘴體 24，係用以朝固持於前述旋轉體12之基板w下面噴射洗淨 液者。 1〇 亂流防止蓋29覆蓋在前述旋轉體12上面側，該亂流防 止蓋29上形成有使前述噴嘴頭23露出之開口部29a及使前 述保持構件露出之開口部2%。該亂流防止蓋29之上面係 以微小間隔與由前述支持銷14支持之基板…下面隔離，且 可防止因伴隨旋轉體12旋轉而在基板界下面侧產生之亂 15流。 在被固持於前述蓋體1内之基板W上面側，設置有可 沿基板界徑方向搖動之噴嘴裝置31。從該噴嘴裝置31可喷 射出處理液’且利用該處理液可在前述基板W上面進行如 洗淨等之處理。 2〇 前述喷嘴裝置31，如第1圖所示，係大致垂直於轴線 地安裝在由垂直部42及水平部43大致構成倒L字狀之安裝 構件而作成之臂體41之形成於前述水平部43先端部之安裝 部43a上。 前述臂體41之垂直部42通過在前述基座7形成之插通 1308358 M w ㈣Μ度内搖動驅動該臂體41之中* μ〉Ί1轉源48之未圖示旋轉子連結 ^ 動源姆钱49，㈣可純49藉未目^第^ 導引裝f而可朝上下方向滑動地設置於固定板51上。、、 在别述固定板51上設有第2驅動源52，該第2驅 ㈣動㈣a與未圖示之圓形螺絲連結，而該圓形螺、= »又置於刖柯動板49之未圖㈣帽龍合。因此， 第2驅動源52以旋轉驅動圓形螺絲的話，則可朝箭頭所示 上下方向驅動前述可動板49 ^ 、 10BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a nozzle device capable of ejecting a treatment liquid toward a substrate and a treatment device for processing the substrate using the nozzle device. C. Prior Art 3 Background of the Invention In the process of manufacturing a semiconductor device, a liquid crystal display device, or the like, there is a micro-image for forming a circuit pattern on a substrate such as a semiconductor wafer or a glass substrate. It is known that the lithography method repeatedly applies a resist on a substrate, and light is irradiated onto the resist through a mask having a circuit pattern formed thereon, and then the portion of the resist that is not irradiated with light is irradiated or irradiated with light. The portion to be reached is then etched away to remove a portion of the process, thereby forming a circuit pattern on the substrate. In the above-described series of processes, once the substrate is contaminated, the circuit pattern cannot be formed precisely and becomes a cause of defective products. Therefore, when the circuit pattern is formed in each process, the substrate is subjected to a cleaning process Φ so that it is in a clean state in which no fine particles such as resist or dust remain. Different types of treatment liquids are used for the purpose of treatment for the treatment of the substrate, or for the treatment other than washing. The treatment liquid may be used: an added fluid diluted with the fluid, such as a treatment diluted with pure water to dilute hydrofluoric acid or a treatment solution for dissolving a high concentration of ammonia in pure water. In another aspect, in the process of treating the substrate with the treatment liquid, the treatment liquid can be pressurized and sprayed by a pressurized gas formed by an inert gas such as nitrogen to raise the treatment effect of the substrate by using 1308358, and the use of the treatment liquid is eliminated. the amount. A nozzle device can be used in the process of injecting the treatment liquid with pressurized gas. The nozzle device has a pair of supply portions for supplying the processing liquid and the pressurized gas, wherein one supply portion supplies the processing liquid, and the other supply portion supplies the pressurized gas. Thereby, the treatment liquid can be pressurized by the pressurized gas and sprayed toward the substrate. The treatment liquid supplied to the nozzle device is mixed with the addition fluid and the dilution fluid through a mixing tank to a predetermined concentration, and is sent to the nozzle device by the mixing tank. 10 However, if the additive fluid and the dilution fluid for constituting the treatment liquid are mixed in advance in the mixing tank to form a treatment liquid, the mixing tank must be provided on the flow side of the nozzle device, and the mixture is supplied in the mixing tank. The treatment liquid is supplied to the nozzle device. Therefore, according to this configuration, the mixing tank becomes necessary and indispensable, and as a result, the cost rises, and the apparatus is enlarged and complicated because the installation place of the mixing tank has to be secured. SUMMARY OF THE INVENTION The present invention provides a nozzle device which can be pressurized by a pressurized fluid to dilute a treatment liquid obtained by diluting a fluid with a fluid without using a mixing tank, and a treatment apparatus using the nozzle device. 20 SUMMARY OF THE INVENTION The present invention is a nozzle device for spraying a processing liquid toward a substrate, comprising: a nozzle body; a 1308358 mixing chamber provided in the nozzle body; and spraying.卩 is provided in the nozzle body and communicates with the mixing chamber, and the first supply unit is provided in the nozzle body to supply the 5 fluid for dilution to the mixing chamber; the second supply unit is provided in The nozzle body is for supplying a fluid to be diluted by the dilution fluid; and the third supply unit is provided in the nozzle body for supplying a pressurized gas, and the pressurized gas system is pressurized in the mixing. In the chamber, the treatment liquid prepared by diluting the fluid to be added by the dilution flow 10 is sprayed from the injection unit. The present invention is a nozzle device capable of ejecting a treatment liquid for processing a substrate, and includes a nozzle body made of synthetic resin, and is provided with a supply portion for supplying a treatment liquid and an injection portion capable of ejecting the treatment liquid. And an electrically conductive member disposed on the nozzle body and grounded. The present invention is a processing apparatus for processing a substrate by a processing liquid, comprising: a rotating body that supports and rotationally drives the substrate substantially horizontally; and a 2-inch nozzle device that is opposite to the substrate of the (four) spinning-cutting Further, the nozzle device is disposed in a radial direction of the substrate, and the nozzle device includes: a nozzle body; a mixing chamber is disposed in the nozzle body; and 1308358, the mixing chamber and the injection portion are disposed on The first main supply unit is provided in the nozzle to rotate the fluid for supplying the dilution fluid to the mixing chamber, and the second supply unit is provided in the nozzle body to describe the dilution fluid. And the third fluid supply unit is provided in the nozzle body for supplying and pressurizing the gas to the dilution gas to pressurize the mixture in the mixture The treatment liquid ejecting unit prepared by diluting the above-mentioned added fluid is ejected. According to the present invention, a processing apparatus for processing a substrate by a processing liquid includes: a device for supporting and rotationally driving a substrate substantially horizontally from the ejection rotating body; and a nozzle device opposite to the rotating body The substrate is disposed at 15 and is drivably disposed in a radial direction of the substrate. The nozzle device includes a nozzle body made of synthetic resin, a supply unit capable of supplying a processing liquid, and a sprayable process. The liquid spray portion; and the conductive member are provided on the nozzle body and can be grounded. [Embodiment] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the drawings. Fig. 1 is a view showing a rotary type processing apparatus according to an embodiment of the present invention, and the processing apparatus has a cover 1. The cover body is provided on the lower surface cover 3 of the processing tank bottom plate 2 (the processing 1308358 groove is only shown), and is disposed on the upper side of the lower cover 3, and can be driven up and down by an upper and lower driving mechanism not shown. 4 members. A through hole 5 is formed in a central portion of the bottom wall of the lower cover 3 and the bottom plate 2, and a double structural peripheral wall of the upper cover 4 is inserted into the peripheral wall 3a of the lower cover 5 to be slidable. The peripheral wall forms a labyrinth structure. An opening is formed in the upper surface of the upper cover 4, and the upper cover 4 is driven in the downward direction. As will be described later, a semiconductor wafer such as a cleaning process can be taken out in the cover 1 by an automatic device (not shown). The substrate w is supplied to the unprocessed substrate W. 1B The bottom wall of the lower cover 3 is connected to one end of a plurality of discharge pipes 6 at regular intervals in the circumferential direction, and the other end is connected to a suction pump (not shown). Therefore, the cleaning liquid which is scattered from the substrate w during the cleaning treatment of the substrate W or the drying treatment after the cleaning treatment can be discharged through the discharge tube 6. A pedestal 7 is disposed under the bottom plate 2, and a mounting hole 8 at a position corresponding to the through hole 5 of the cover body 1 is formed on the pedestal 7, and the mounting hole 8 is embedded and fixed for forming The pulse of the drive unit controls the upper end of the stator 9a of the motor 9. The stator 9a has a cylindrical shape, and the same cylindrical rotor 9b is inserted and rotatably provided therein. The upper end surface of the rotor 9b is joined to the lower end surface of the cylindrical coupling body 11 and integrally fixed. A flange portion 11a having a larger inner diameter than the stator 9a is formed on the lower end surface of the connecting body 11. Further, the flange portion Ha is slidably coupled to the upper end face of the stator portion, so that the rotation of the rotor 9a is not prevented, but the rotation of the rotor member is restricted from the stator % by 9 l3 〇 8358. It is intended that the above-described connecting body 11 protrudes inward from the through hole 5 of the cover body 1 and has a disk-shaped turn 12 on the end surface of the cover body. The three side portions of the upper side of the turn 12 are provided at a constant interval in the circumferential direction. In this embodiment, six holding members (10) are rotatably provided at intervals of 10 degrees. A conical 15 support pin 14 ′ is protruded from the center portion of the holding member 13 and an inverted tapered pin 1 is provided at an off-center position. The inner substrate is provided by a robot (not shown). The substrate w supplied to the lid body 1 is supplied to the lid body, and the lower surface of the peripheral portion is supported by the branch pins 14. In this state, the holding member 13 is rotated to make the lock 15 eccentrically compensated, and it can be engaged with the phase of the base (4). Therefore, the substrate can be held on the rotating body 12. U 纟 The outer peripheral surface of the connecting body U is provided with a biasing spring 16 . The directional bomb 〃 16 ' is in the aforementioned rotating body! 2 is turned off, and the potential energy of the spin-wire (not shown) is set in a certain rotation direction with respect to the rotating body U. The parent wheel is sprinkled with a sub-gear (not shown), and the sub-gear is provided at an end portion of the holding member 13 that protrudes toward the lower surface side of the rotating body 12. Therefore, the above-mentioned holding member U can impart potential energy to the locking direction of the outer circumference of the substrate 〇 by the biasing spring 16 described above. By releasing the mechanism π, the locking mechanism ls can be released to the locking substrate state. The releasing mechanism is released from the cylinder 18, and the handle 19 for releasing the cylinder and the releasing pin disposed at the upper end of the handle 19 are released. 21 members. In the state in which the release cylinder 18 is actuated and the release pin 21 is prevented from rotating the first gear rotation 1308358, the rotary body 12 is rotationally driven by a predetermined angle by the pulse control motor 9 against the biasing force of the biasing spring 16, and the aforementioned holding member 13 is rotated to release the state in which the substrate W is locked by the lock pin 15. A through hole i2a is formed in a central portion of the rotating body 12. The hollow shaft 5 defines the shaft 22 through the rotor 9b, and the upper end of the fixed shaft 22 is located in the through hole 12a of the rotating body 12, and the nozzle head 23 is provided at the upper end of the fixed shaft 22. A plurality of lower nozzle bodies 24 are provided in the nozzle head 23, and the lower nozzle bodies 24 are used to eject the cleaning liquid toward the substrate w held by the rotating body 12. The turbulence prevention cover 29 covers the upper surface side of the rotator 12, and the turbulence prevention cover 29 is formed with an opening 29a for exposing the nozzle head 23 and an opening 2% for exposing the holding member. The upper surface of the turbulence preventing cover 29 is isolated from the lower surface of the substrate supported by the support pin 14 at a minute interval, and the flow generated on the lower surface side of the substrate due to the rotation of the rotating body 12 can be prevented. A nozzle device 31 that can be swung in the direction of the substrate diameter is provided on the upper surface side of the substrate W held in the lid body 1. The processing liquid ' can be ejected from the nozzle device 31, and the processing liquid can be subjected to a treatment such as washing on the substrate W. In the first nozzle device 31, as shown in Fig. 1, an arm body 41 which is formed by attaching a substantially L-shaped mounting member to the vertical portion 42 and the horizontal portion 43 substantially perpendicularly to the axis is formed in the foregoing The horizontal portion 43 is attached to the mounting portion 43a of the tip end portion. The vertical portion 42 of the arm body 41 is driven by the insertion of the pedestal 7 through the opening of 1,308,358 M w (four), and the unillustrated rotating sub-connector of the arm body 41 is driven. The money 49, (4) can be purely 49, and can be slidably disposed on the fixed plate 51 in the up-and-down direction. A second drive source 52 is provided on the fixed plate 51, and the second drive (four) move (four) a is coupled to a circular screw (not shown), and the circular screw and the mark are placed on the cymbal plate 49. The figure is not shown (four) cap dragon. Therefore, when the second drive source 52 rotationally drives the circular screw, the movable plate 49 ^ , 10 can be driven in the up and down direction as indicated by the arrow.
即’前述喷嘴裝置3卜係在固持於蓋體^之基板w 上方藉由第1驅動祕沿該基板w之徑方向搖動驅動，同 時藉由第2驅動源52朝上下方向驅動，且固持於預定高度 位置處。 &That is, the nozzle device 3 is driven by the first driving edge in the radial direction of the substrate w while being held by the first driving source in the radial direction of the substrate w, and is driven in the vertical direction by the second driving source 52, and is held by The predetermined height position. &
前述喷嘴裝置3卜包含有如第2A圖〜第2C圖所示之喷 !5嘴本親，且該喷嘴本體61係由含有如氣乙稀或氣系樹脂 等耐藥品性之合成樹脂所形成者。喷嘴本體61成形時，在 該喷嘴本體61内埋設有作為導電性構件之多數相互電氣連 接之金屬導線62。其中，一條金屬導線62之一端形成導出 於喷嘴本體61外部之接地部63，而該接地部63則透過前述 20 臂體41接地。 前述喷嘴本體61形成柱狀，且在其中途部形成截面形 狀為矩形狀之矩形部64。在該矩形部64之一側面64a上開 口形成作為第1供給部之第1連接孔65，與形成有第1連接 孔65之一側面64a對向之另一側面64b則開口形成作為第2 12 1308358 i、給π之第2連接孔的。此外，在前述喷嘴本體w之上端 面上開口形成作為第3供給部之第3連接孔67。 月J述第1至帛3連接孔65〜67與形成於前述喷嘴本體61 矩U64之中、部的混合室仍連通。該混合室仍與喷射部 5 69-端連通，而該噴射部69另—端則於喷嘴本體61前端面 開口。再者，喷射部69，從與混合室68連通之一端至開口 於喷嘴本體61前端面之另一端逐漸擴徑形成圓錐狀。 &述第1帛2連接孔65、66，如第2B圖虛線所示，其 一端部分別與第1、第2供給管Μ、72連接，因此可從第i 10供給管71供給如純水等稀釋用流體至前述混合室的。 由前述稀釋用流體稀釋之添加流體，如氨水、鹽酸、 過氧化氫水、臭氧水等液體，或臭氧、氣、氧、氫、二氧 化碳等氣體，可從第2供給管72供給至上述混合室68。因 此，在前述混合室68内可製作出混合稀釋用流體及添加流 15 sjk 體之處理液。 ^前述第3連接孔67與連接口體73連接。在該連接口體73 夕成有於後端面開口之連接部74，而該連接部74連接用以 2〇 、如壓至預定壓力後之氮氣或氬氣等不活性氣體供給至前 地藏合室68之第3供給管75。 月述連接口體73之前端部設有位於前述混合室68内之 嘴嘴部76，該喷嘴部76之外形尺寸則略小於前述混合室砧 吁内杈尺寸。喷嘴部76之外周面形成有環周溝77，且在其 別嶸開口形成有用以與前述連接部74連通之噴嘴孔78， 另 » / 從該喷嘴孔78可朝前述喷嘴部6〇之一端喷射加壓氣 1308358The nozzle device 3 includes a spray nozzle as shown in Figs. 2A to 2C, and the nozzle body 61 is formed of a synthetic resin containing chemical resistance such as ethylene oxide or a gas-based resin. . When the nozzle body 61 is molded, a plurality of metal wires 62 electrically connected to each other as a conductive member are embedded in the nozzle body 61. One of the metal wires 62 forms a ground portion 63 which is led out of the nozzle body 61, and the ground portion 63 is grounded through the 20-arm body 41. The nozzle body 61 is formed in a columnar shape, and a rectangular portion 64 having a rectangular cross-sectional shape is formed at a middle portion thereof. A first connection hole 65 as a first supply portion is formed in one side surface 64a of the rectangular portion 64, and the other side surface 64b opposite to the side surface 64a on which the first connection hole 65 is formed is opened as the second 12th. 1308358 i, for the second connection hole of π. Further, a third connection hole 67 as a third supply portion is formed in the upper end surface of the nozzle body w. The first to third connection holes 65 to 67 of the month J are still in communication with the mixing chamber formed in the portion of the nozzle body 61 and the moment U64. The mixing chamber is still in communication with the injection portion 569-end, and the other end of the injection portion 69 is open at the front end surface of the nozzle body 61. Further, the injection portion 69 is gradually expanded in diameter from one end communicating with the mixing chamber 68 to the other end of the front end surface of the nozzle body 61 to form a conical shape. The first and second connection holes 65 and 66 are connected to the first and second supply tubes Μ and 72, respectively, as shown by the broken line in FIG. 2B. Therefore, the ith supply tube 71 can be supplied as pure. A dilution fluid such as water is supplied to the mixing chamber. An additive fluid diluted with the dilution fluid, such as a liquid such as ammonia water, hydrochloric acid, hydrogen peroxide water or ozone water, or a gas such as ozone, gas, oxygen, hydrogen or carbon dioxide, can be supplied from the second supply pipe 72 to the mixing chamber. 68. Therefore, a mixing liquid for mixing and a processing liquid for adding a flow of 15 sjk can be produced in the mixing chamber 68. The third connection hole 67 is connected to the connection port 73. On the evening of the connection port body 73, there is a connection portion 74 which is open at the rear end surface, and the connection portion 74 is connected to the front ground for the inert gas such as nitrogen or argon gas which is pressed to a predetermined pressure. The third supply pipe 75 of the chamber 68. The front end portion of the connector body 73 is provided with a mouth portion 76 located in the mixing chamber 68, and the nozzle portion 76 has a shape smaller than that of the aforementioned mixing chamber anvil. The outer peripheral surface of the nozzle portion 76 is formed with a circumferential groove 77, and a nozzle hole 78 for communicating with the aforementioned connecting portion 74 is formed in the other opening, and the nozzle hole 78 can be directed toward one end of the nozzle portion 6 Injection pressurized gas 1308358
士由前述第！供給管71及第2供給管72，分別供給稀釋用 流體及添加流體至位於前述混合室68内之前述喷嘴部？6外 周面之前述環周溝77。因此，稀釋用流體及添加流體沿環 5周溝77流動並混合後，在混合室沾成為已充分混合之處理 液，然後流動至噴射部69。 在混合室68混合後流動至噴射部的之處理液，利用從 嘴孔78嘴射之加卿加壓，因此’處理液在成為 粒子狀後從前料射部69之前端朝絲w噴射。 10 15 20 成力壓形成圓錐狀。因此，即使處理液經加壓 ί加壓氣體㈣絲子狀，«板W切形狀亦會由於 狀而被限定成圓錐狀，且不會擴散。即， 液^實Γ理ΓΓ仙縣保持—定。因此，藉由處理 位確實處理基板W與前述喷射部69前端開口對向之部 若根據前料題in 於旋轉體2!上之基_之噴嘴裝置3卜係:理液至固持 用流體至其噴嘴本體61之第丨供_71、、心供給稀釋 體之第2供給管及用以供給加壓氣體V::給添加流 從第i供給管B供給至上料嘴（、給管乃連接。 稀釋用流體，與從第2供給管72供给<61之混合室68之 加流體前述混合室混合成處理液。〜述此合室68之添 、於前述混合室68製成之處_ 並經由從連接口體73之噴嘴部％ 弟供給管75供給 °之噴嘴孔78喷射出 之加壓 14 1308358 氣體加壓。因此，處理液經過加塵氣體之作用形成粒子狀， 以從一端與前述混合室68連通之喷射部69之另一端朝基板 w上面喷射後，藉處理液處理基板w上面。 即，若根據前述喷嘴裝置之構造’稀釋用流體及添加 5 流體可在喷嘴裝置31之混合室68混合。因此，不需在喷嘴 裝置31上流側設置混合槽’就可如習知般地事先混合供給 稀釋用流體及添加流體，因而，可減低成本且使構造簡單 化0 10 15 20 於刖述混合室68製成之處理液經加壓氣體加壓後從1 射部69喷射。因此，由於處理液隨壓力上升，並成為粒^ 狀而作用在基板W上，故可提升對基板w之處理效果。说 外由於透過力σ壓氣體加壓處理液，與加壓處理液以供銘 至基板W之情況相比，可減少處理液之使用量。 供給至混合室68之稀_缝及添加流體，同時_ 成在突出於混合室_之噴嘴部料周面之環周溝7· 給。’目沿該朝的流錢充分混合後再流動到 ===部69朝基板”射之處理液之稀釋議 合。即，從混合室68可提供稀_ 體及添加賴已充分⑼之料處縣至喷。 在上述混合室68混人 _基板w切之處理;^加壓氣體加壓後從噴射旬 形狀係被限定為_狀。射魏對應於翁部州 之處理液因不會擴散噴射：;從喷射部69相對於細 即，若從噴嘴紫置 _霧氣的產生。 赁射部69朝基板W喷射之處泡By the aforementioned number! The supply pipe 71 and the second supply pipe 72 respectively supply the dilution fluid and the added fluid to the nozzle portion located in the mixing chamber 68. 6 The circumferential groove 77 of the outer peripheral surface. Therefore, the dilution fluid and the addition fluid flow and mix along the circumferential groove 55, and then the treatment liquid is sufficiently mixed in the mixing chamber, and then flows to the injection portion 69. The treatment liquid which has flowed into the injection portion after the mixing chamber 68 is mixed and pressurized by the nozzle which is sprayed from the nozzle hole 78 is sprayed, so that the treatment liquid is sprayed from the front end of the front injection portion 69 toward the yarn w. 10 15 20 The force is pressed to form a cone. Therefore, even if the treatment liquid is pressurized, the pressurized gas (4) is in the form of a filament, the shape of the plate W is limited to a conical shape and does not spread. That is, the liquid ^ Γ ΓΓ ΓΓ xianxian County to maintain - fixed. Therefore, the processing device is sure to process the substrate W and the front end opening of the ejection portion 69 to face the nozzle device 3 according to the previous problem in the rotating body 2!: the liquid to the holding fluid to The second supply pipe of the nozzle body 61, the second supply pipe for supplying the dilution body, and the supply of the pressurized gas V: the supply flow is supplied from the i-th supply pipe B to the upper nozzle (the pipe is connected) The dilution fluid is mixed with the fluid addition chamber of the mixing chamber 68 supplied to the <61 from the second supply pipe 72 to form a treatment liquid. The addition of the combination chamber 68 is made at the mixing chamber 68. The gas is pressurized by the pressure 14 1308358 which is ejected from the nozzle hole 78 of the nozzle portion of the nozzle body 73. The treatment liquid is formed into a particulate shape by the action of the dust gas to be After the other end of the injection portion 69 that communicates with the mixing chamber 68 is sprayed onto the substrate w, the substrate w is processed by the treatment liquid. That is, according to the configuration of the nozzle device, the dilution fluid and the addition of 5 fluid can be in the nozzle device 31. The mixing chamber 68 is mixed. Therefore, it is not required to be in the nozzle The mixing tank is provided on the upstream side of the unit 31, and the dilution fluid and the fluid can be mixed and supplied in advance as in the prior art. Therefore, the structure can be reduced and the structure can be simplified. After being pressurized by the pressurized gas, it is ejected from the first shot portion 69. Therefore, since the treatment liquid rises in pressure and acts as a pellet on the substrate W, the treatment effect on the substrate w can be improved. The sigma pressure gas pressurization treatment liquid can reduce the amount of the treatment liquid used compared with the case where the pressure treatment liquid is supplied to the substrate W. The thin sew and the added fluid supplied to the mixing chamber 68 are simultaneously protruded The circumferential groove 7 of the nozzle portion of the mixing chamber is supplied with a dilution of the treatment liquid which is mixed with the flow of the liquid toward the substrate. From the mixing chamber 68, it is possible to provide a thinner body and a material to which the addition of the material is sufficient (9) to the spray. In the above mixing chamber 68, the mixing of the substrate _ substrate w is cut; Limited to _ shape. Shooting Wei corresponds to the processing liquid of Wengbu State because it does not spread the spray:; Injection unit 69 with respect to the fine i.e., when the fog generating nozzle violet opposite _. Rent-emitting portion 69 toward the substrate W bubble jet place
15 Ϊ308358 液發生擴散’則會產生霧氣’且該霧氣會附著於蓋體！内 面。因此，經由處理液處理基板W後再乾燥處理時，蓋體 1内面之霧氣會飛散，並附著於基板W而造成污染。 然而，如上所述，由於使噴射部69呈圓錐狀’防止處 5 理液擴散，可抑制霧氣之發生’因此在乾燥處理時可防止 霧氣附著而污染基板W。 上述喷嘴裝置31之喷嘴本體61係由合成樹脂製成’以 具有對處理液之耐蝕性。因此’當處理液在噴嘴本體61内 流動時，由於摩擦阻抗會產生靜電。在處理液比阻抗值高 10 的情況下，由於處理液中帶有靜電’在基板W形成之電路 圖案恐怕會因靜電而遭受破壞。 然而，本發明之噴嘴裝置31，在合成樹脂製之喷嘴本 體61埋設有金屬導線62，且其一部露出至外部而成為接地 部63，且該接地部63透過臂體41接地。因此，由於處理液 15 中不帶靜電，故可防止經由處理液處理之基板由於靜電而 損傷。 若根據以上所述之本發明，在喷嘴本體之混合室内藉 由稀釋用流體來稀釋添加流體而製成處理液，則該處理浪 可藉由加壓氣體加壓而從噴射部喷射出。 20 因此，不需設置混合槽，就可以製成混合有添加流艘 及稀釋流體之處理液，並朝基板喷射，故可使構造簡軍化 及減少成本等。 【囷式簡單說明1 第1圖係本發明一實施型態之處理裝置之概略構造戴 _ Λ /Τ _ — ...............---… ------------— .. I Γΐ................. 1308358 面圖。 第2A圖係喷嘴裝置之側視圖。 第2B圖係喷嘴裝置之縱截面圖。 第2C圖係喷嘴裝置之平面圖。 5 【圖式之主要元件代表符號表】 W...基板 15...鎖銷 1…蓋體 16...賦勢彈簣 2…底板 17...解除機構 3...下蓋 18...解除缸體 3a，4a…周壁 19...把手 4...上蓋 21...解除銷 5...通孔 22...固定軸 6...排出管 23...喷嘴頭 7...基座 24...下部喷嘴體 8...安裝孔 29...亂流防止蓋 9...脈衝控制馬達 29a,29b...開口部 9a...固定子 31...喷嘴裝置 9b...旋轉子 41…臂體 11...連結體 42...垂直部 11a...凸緣部 43...水平部 12...旋轉體 43a...安裝部 12a...通孔 47...插通孔 13...保持構件 48…第1驅動源 14...支持銷 49...可動板15 Ϊ 308358 The liquid will diffuse 'and fog will be generated' and the mist will adhere to the cover! inside. Therefore, when the substrate W is processed through the treatment liquid and then dried, the mist on the inner surface of the lid 1 is scattered and adheres to the substrate W to cause contamination. However, as described above, since the ejection portion 69 is formed in a conical shape to prevent the diffusion of the chemical solution, the generation of the mist can be suppressed. Therefore, the mist can be prevented from adhering to the substrate W during the drying process. The nozzle body 61 of the above nozzle device 31 is made of synthetic resin to have corrosion resistance to the treatment liquid. Therefore, when the treatment liquid flows in the nozzle body 61, static electricity is generated due to the frictional resistance. When the treatment liquid is higher than the impedance value by 10, the circuit pattern formed on the substrate W due to static electricity in the treatment liquid may be damaged by static electricity. However, in the nozzle device 31 of the present invention, the metal wire 62 is embedded in the synthetic resin nozzle body 61, and one of the portions is exposed to the outside to form the ground portion 63, and the ground portion 63 is grounded through the arm body 41. Therefore, since the treatment liquid 15 is free from static electricity, it is possible to prevent the substrate treated by the treatment liquid from being damaged by static electricity. According to the invention as described above, in the mixing chamber of the nozzle body, the fluid to be diluted is diluted by the dilution fluid to form a treatment liquid, and the treatment wave can be ejected from the injection portion by pressurization with pressurized gas. 20 Therefore, it is possible to produce a treatment liquid in which a mixed flow vessel and a dilution fluid are mixed, and to spray the substrate toward the substrate without providing a mixing tank, so that the structure can be simplified and the cost can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic configuration of a processing apparatus according to an embodiment of the present invention. _ Λ /Τ _ — ...............---... ----------- .. I Γΐ........... 1308358. Figure 2A is a side view of the nozzle device. Fig. 2B is a longitudinal sectional view of the nozzle device. Figure 2C is a plan view of a nozzle device. 5 [Main component representative symbol table of the drawing] W...substrate 15...lock pin 1...cover body 16...potential magazine 2...base plate 17...release mechanism 3...lower cover 18 ...clearing the cylinders 3a, 4a...the peripheral wall 19...the handle 4...the upper cover 21...the release pin 5...the through hole 22...the fixed shaft 6...the discharge tube 23...the nozzle Head 7...base 24...lower nozzle body 8...mounting hole 29...flow prevention cover 9...pulse control motor 29a, 29b...opening 9a...fixer 31 ...nozzle device 9b...rotor 41...arm body 11...connecting body 42...vertical portion 11a...flange portion 43...horizontal portion 12...rotor 43a... Mounting portion 12a...through hole 47...insertion hole 13...holding member 48...first drive source 14...support pin 49...movable plate
17 1308358 51...固定板 68...混合室 52...第2驅動源 69...喷射部 52a...驅動軸 71...第1供給管 61...喷嘴本體 72...第2供給管 62...金屬導線 73...連接口體 63...接地部 74...連接部 64...矩形部 75...第3供給管 64a，64b...側面 76...噴嘴部 65...第1連接孔 77...環周溝 66…第2連接孔 78...喷嘴孔 67...第3連接孔 1817 1308358 51...fixing plate 68...mixing chamber 52...second drive source 69...injection portion 52a...drive shaft 71...first supply tube 61...nozzle body 72. The second supply pipe 62...the metal wire 73...the connection body 63...the ground portion 74...the connection portion 64...the rectangular portion 75...the third supply pipe 64a,64b.. Side surface 76...nozzle portion 65...first connection hole 77...circumferential groove 66...second connection hole 78...nozzle hole 67...third connection hole 18