KR20030080681A - Apparatus that attach masking tape for Metal CSP - Google Patents
Apparatus that attach masking tape for Metal CSP Download PDFInfo
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- KR20030080681A KR20030080681A KR1020020019435A KR20020019435A KR20030080681A KR 20030080681 A KR20030080681 A KR 20030080681A KR 1020020019435 A KR1020020019435 A KR 1020020019435A KR 20020019435 A KR20020019435 A KR 20020019435A KR 20030080681 A KR20030080681 A KR 20030080681A
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- South Korea
- Prior art keywords
- protective tape
- base plate
- cylinder
- suction
- vacuum block
- Prior art date
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- 230000000873 masking effect Effects 0.000 title 1
- 238000005520 cutting process Methods 0.000 claims abstract description 11
- 239000002184 metal Substances 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims abstract description 6
- 230000001681 protective effect Effects 0.000 claims description 61
- 239000006096 absorbing agent Substances 0.000 claims description 15
- 230000035939 shock Effects 0.000 claims description 15
- 238000003825 pressing Methods 0.000 claims description 7
- 239000000872 buffer Substances 0.000 claims description 2
- 238000001179 sorption measurement Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 5
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31144—Etching the insulating layers by chemical or physical means using masks
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
본 발명은 메탈 CSP용 보호테이프 부착장치에 관한 것으로, 보다 상세하게는 메탈 CSP(Chip Size Package)의 본딩 작업시 리드 프레임(LEAD FRAME)의 리드(LEAD) 변형 및 손상을 방지하는 보호테이프 부착장치에 관한 것이다.The present invention relates to a protective tape attaching device for a metal CSP, and more particularly, to a protective tape attaching device for preventing lead deformation and damage of a lead frame when bonding a metal chip size package (CSP). It is about.
최근 마이크로프로세서나 주문형 반도체(ASIC) 등 비 메모리 칩 사이즈의 소형화(Chip Size Package) 경량화 추세가 주력 반도체 패키지 형태로 자리잡아가고 있다.Recently, the trend of lighter and smaller chip size packages, such as microprocessors and ASICs, is becoming a major semiconductor package.
상기 메탈 CSP 제품은 소형화 추세에 따른 소형제품으로 기존 메탈 제품에 비해 리드 사이즈가 소형이기 때문에 본딩시 발생되는 압력등에 따라 리드의 손상및 변형이 발생하는 경우가 많으며, 이에 따라 생산성 저하 및 불량 발생률이 높기 때문에 본딩 작업 전 리드 프레임 제품공정중에 하부에 리드 보호용 테이프를 부착한다.The metal CSP products are small products according to the miniaturization trend. Since the lead size is smaller than that of the existing metal products, the damage and deformation of the lead are often caused by the pressure generated during bonding. As it is high, the lead protection tape is attached to the lower part during the lead frame production process before bonding.
본 발명은 상기와 같은 종래의 문제점을 해결하기 위하여 안출되는 것으로, 그 목적은 메탈 CSP(Chip Size Package)의 본딩 작업시 리드 프레임(LEAD FRAME)의 리드(LEAD) 변형 및 손상을 방지하는 보호테이프를 자동으로 부착하는 보호테이프 부착장치를 제공함에 있다.The present invention has been made to solve the conventional problems as described above, the object of the protection tape to prevent the lead deformation (LEAD) of the lead frame (LEAD FRAME) during the bonding operation of the metal chip size package (CSP) It is to provide a protective tape attachment device for automatically attaching the.
상기와 같은 목적 달성을 위한 본 발명은 보호테이프 휠에 감긴 보호테이프를 진공블록에서 진공흡착한 후, 진공블록이 리드 프레임의 상면으로 하강하여 보호테이프를 가접착을 한 후, 리드 프레임이 고정된 이송다이가 압착롤러 방향으로 이송하며, 이 때 압착롤러가 하강하여 보호테이프를 압착함으로서 리드 프레임의 상면에 보호테이프를 부착한 후 커팅다이 및 커터에 의해 보호테이프를 절단하도록 구성되었다.The present invention for achieving the above object is vacuum suction of the protective tape wound on the protective tape wheel in the vacuum block, the vacuum block is lowered to the upper surface of the lead frame to temporarily attach the protective tape, the lead frame is fixed The transfer die moves in the direction of the pressing roller, and the pressing roller is lowered to press the protective tape to attach the protective tape to the upper surface of the lead frame, and then cut the protective tape by the cutting die and the cutter.
도 1 은 본 발명의 구성을 나타낸 구성도1 is a block diagram showing the configuration of the present invention
도 2 는 본 발명에 따른 진공블록의 구성을 나타낸 구성도2 is a block diagram showing the configuration of a vacuum block according to the present invention
도 3 은 본 발명을 이용한 보호테이프의 부착 공정을 나타낸 공정도3 is a process chart showing a process of attaching a protective tape using the present invention;
<도면의 주요부분에 대한 부호의 설명><Description of Symbols for Main Parts of Drawings>
(X) : 경사각 (1) : 보호테이프 휠(X): Inclined angle (1): Protective tape wheel
(2) : 완충기 (2a) : 가이드 바(2): shock absorber (2a): guide bar
(2b) : 구동블록 (2c) : 리드스크류(2b): drive block (2c): lead screw
(3) : 진공블록 (3a) : 제 1 실린더(3): vacuum block (3a): first cylinder
(3b) : 흡입경사부 (3c) : 직선부(3b): suction inclination part (3c): straight part
(3d) : 흡착구 (3e) : 연결구(3d): Suction port (3e): Connector
(4) : 커터 (4a) : 제 2 실린더(4): cutter (4a): second cylinder
(5) : 압착롤러 (5a) : 제 3 실린더(5): press roller (5a): third cylinder
(6) : 커팅다이 (6a) : 제 4 실린더(6): cutting die 6a: fourth cylinder
(6b) : 경사부 (6c) : 고정부6b: inclined portion 6c: fixed portion
(6d) : 삽입부 (7) : 이송다이(6d): Insertion portion (7): Transfer die
(8) : 제 1 가이드 롤러 (9) : 제 2 가이드 롤러(8): first guide roller 9: second guide roller
(10) : 제 3 가이드 롤러 (11) : 베이스 플레이트(10): third guide roller 11: base plate
(12) : 테이블 (13) : 리드 프레임12: table 13: lead frame
(14) : 보호테이프(14): protective tape
본 발명의 구성에 대해 첨부도면과 연계하여 설명하면 다음과 같다.Referring to the configuration of the present invention in conjunction with the accompanying drawings as follows.
도 1 은 본 발명의 구성을 나타낸 구성도를, 도 2 는 본 발명에 따른 진공블록의 구성을 나타낸 구성도를 도시한 것으로, 본 발명은 보호테이프(14)가 감긴 보호테이프 휠(1)과, 상기 보호테이프 휠(1)의 상단에 위치하며 베이스 플레이트(11) 설치된 가이드 바(2a)를 따라 이동하여 보호테이프 휠(1)로부터 취출되는 보호테이프(14)의 완충작용을 하는 완충기(2)와, 상기 완충기(2)와 연결되어 완충기(2)를 이동시키며 베이스 플레이트(11)에 고정된 리드스크류(2c)에 설치된 구동블록(2b)과, 상기 완충기(2)를 통해 나온 보호테이프(14)를 안내하도록 베이스 플레이트(11)에 순차적으로 설치된 제 1,2,3 가이드 롤러(8,9,10)와, 상기 제 3 가이드 롤러(10)를 통해 나온 보호테이프(14)를 진공흡착하며 베이스 플레이트(11)에 설치된 제 1 실린더(3a)에 연결된 진공블록(3)과, 상기 진공블록(3)의 후단에 위치하며 베이스 플레이트(11)에 설치된 제 2 실린더(5a)에 연결된 커터(4)와, 상기 커터(4)의 후단에 위치하며 베이스 플레이트(11)에 설치된 제 3 실린더(5a)에 연결된 다수의 압착롤러(5)와, 테이블(12)의 상단에 설치되어 리드 프레임(13)을 이송하는 이송다이(7)와, 상기 진공블록(3)의 전단에 위치하며 베이스 플레이트(11)에 설치된 제 4 실린더(6a)에 의해 작동하는 커팅다이(6)로 구성되었다.1 is a block diagram showing the configuration of the present invention, Figure 2 is a block diagram showing the configuration of the vacuum block according to the present invention, the present invention is a protective tape wheel (1) wound around the protective tape 14 and And a shock absorber (2) which is located at the upper end of the protective tape wheel (1) and moves along the guide bar (2a) provided with the base plate (11) to cushion the protective tape (14) taken out from the protective tape wheel (1). ), A driving block (2b) installed on the lead screw (2c) fixed to the base plate 11 and moving the shock absorber (2) connected to the shock absorber (2), and a protective tape through the shock absorber (2) Vacuum the first, second, third guide rollers (8, 9, 10) sequentially installed on the base plate (11) to guide the (14), and the protective tape (14) through the third guide roller (10). A vacuum block 3 attached to the first cylinder 3a attached to the base plate 11 by suction; A cutter 4 located at the rear end of the ball block 3 and connected to the second cylinder 5a installed on the base plate 11, and a third located at the rear end of the cutter 4 and installed on the base plate 11. A plurality of pressing rollers 5 connected to the cylinder 5a, a transfer die 7 installed at the upper end of the table 12 to transfer the lead frame 13, and positioned at the front end of the vacuum block 3 It consists of a cutting die 6 operated by a fourth cylinder 6a provided on the base plate 11.
상기 완충기(2)는 진공블록(3)의 승하강 시 전진 또는 후진하여 보호테이프(14)의 장력을 적절하게 유지함으로서 보호테이프(14)의 변형을 방지하는 것으로, 진공블록(3)의 하강시에는 구동블록(2b)에 의해 전진하고, 진공블록(3)의 상승시에는 후진하도록 구성되었다.The shock absorber 2 prevents deformation of the protective tape 14 by maintaining the tension of the protective tape 14 by moving forward or backward when the vacuum block 3 moves up and down, thereby lowering the vacuum block 3. At the time of advancement by the drive block 2b, it was comprised so that it might retreat when the vacuum block 3 raises.
상기 제 1,2,3 가이드 롤러(8,9,10)는 완충기(2)를 거친 보호테이프(14)를 진공블록(3)으로 안내함과 동시에 보호테이프(14)가 완만한 곡률을 형성토록 하여보호테이프(14)가 변형되지 않도록 배치되었다.The first, second, third guide rollers 8, 9, and 10 guide the protective tape 14 through the shock absorber 2 to the vacuum block 3, and at the same time, the protective tape 14 forms a gentle curvature. The protective tape 14 was arranged so as not to deform.
상기 진공블록(3)은 보호테이프(14)를 흡착하여 취출함과 동시에 리드 프레임(13)의 표면에 가접착하는 것으로, 하단에 흡입경사부(3b)가 형성되고, 상기 흡입경사부(3b)에 다수의 흡착구(3d)가 형성되며, 상기 각각의 흡착구(3d)는 진공블록(3)의 측면으로부터 형성된 연결구(3e)에 의해 연결되고, 상기 연결구(3e)에 미도시된 흡입라인이 연결된다.The vacuum block 3 adsorbs and extracts the protective tape 14 and is temporarily attached to the surface of the lead frame 13. A suction inclination part 3b is formed at a lower end thereof, and the suction inclination part 3b is provided. A plurality of suction holes (3d) is formed in each of the three suction holes, each suction hole (3d) is connected by a connector (3e) formed from the side of the vacuum block (3), suction shown in the connector (3e) The line is connected.
상기 흡입경사부(3b)의 경사각(X)은 64~66°의 범위에서 형성되어 제 3 가이드 롤러(10)를 거친 보호테이프(14)가 꺽임없이 진공블록(3)에 흡착토록 구성되고, 흡입경사부(3b)의 하부끝단에 직선부(3c)가 형성되며, 직선부(3c)는 0.2~0.8㎜의 길이로 형성되어 보호테이프(14)를 리드 프레임(13)에 가접착하도록 구성되었다.The inclination angle X of the suction inclination portion 3b is formed in a range of 64 to 66 ° so that the protective tape 14 passing through the third guide roller 10 is adsorbed to the vacuum block 3 without bending. A straight portion 3c is formed at the lower end of the suction inclination portion 3b, and the straight portion 3c is formed to have a length of 0.2 to 0.8 mm so that the protective tape 14 is temporarily attached to the lead frame 13. It became.
상기 커터(4)는 제 2 실린더(5a)에 의해 승하강하여 리드 프레임(13)에 부착된 보호테이프(14)를 일정길이로 절단하는 것으로, 커팅다이(6)에 의해 고정된 보호테이프(14)를 절단하도록 구성되었다.The cutter 4 is lowered by the second cylinder 5a to cut the protective tape 14 attached to the lead frame 13 to a predetermined length, and the protective tape 14 fixed by the cutting die 6 is fixed. ) Is configured to cut.
상기 커팅다이(6)는 제 4 실린더(6a)에 의해 전·후진하여 보호테이프(14)를 고정하는 것으로, 전단에 상기 압착롤러(5)와 밀착되는 경사부(6b)가 형성되고, 그 후단에 진공블록(3)의 직선부(3c)와 밀착되는 고정부(6c)가 형성되며, 경사부(6b)와 고정부(6c)가 사이에 커터(4)가 삽입되는 삽입부(6d)가 형성되어 경사부(6b)와 고정부(6c)에 의해 지지된 보호테이프(14)를 커터(4)가 삽입부(6d)에 삽입되면서 절단하도록 구성되었다.The cutting die 6 is moved forward and backward by the fourth cylinder 6a to fix the protective tape 14, and an inclined portion 6b in close contact with the pressing roller 5 is formed at the front end thereof. At the rear end, a fixed part 6c is formed in close contact with the straight portion 3c of the vacuum block 3, and an insertion part 6d into which the cutter 4 is inserted between the inclined part 6b and the fixed part 6c. Was formed to cut the protective tape 14 supported by the inclined portion 6b and the fixed portion 6c while the cutter 4 was inserted into the insertion portion 6d.
상기와 같은 구성을 참조하여 본 발명의 작용을 설명하면 다음과 같다.Referring to the configuration as described above the operation of the present invention.
도 3 은 본 발명을 이용한 보호테이프(14)의 부착 공정을 나타낸 공정도를 도시한 것으로, 보호테이프 휠(1)에 감긴 보호테이프(14)는 완충기(2)와 제 1,2,3 가이드 롤러(8,9,10)를 순차적으로 거치면서 진공블록(3)의 흡입경사부(3b)에 형성된 흡착구(3d) 진공흡착되어 고정되며, 이때 진공블록(3)과 커터(4) 및 압착롤러(5)는 상사점에 위치하고 있고, 완충기(2)는 가이드 바(2a)의 중앙에 위치하며, 이송다이(7)는 리드 프레임(13)이 적재된 상태에서 전진하여 진공블록(3)의 하단에 위치하게 된다.Figure 3 shows a process diagram showing the attachment process of the protective tape 14 using the present invention, the protective tape 14 wound on the protective tape wheel 1 is a buffer 2 and the first, second, third guide roller Suction holes (3d) formed in the suction inclination portion (3b) of the vacuum block (3) while being sequentially passed through (8, 9, 10) is fixed by vacuum suction, wherein the vacuum block (3) and the cutter (4) and compression The roller 5 is located at the top dead center, the shock absorber 2 is located at the center of the guide bar 2a, and the transfer die 7 is advanced in the state where the lead frame 13 is loaded so as to vacuum the block 3. It is located at the bottom of the.
이후 진공블록(3)이 하강하여 보호테이프(14)를 리드 프레임(13)에 가접착한 다음 진공을 해제하고, 완충기(2)는 구동블록(2b)에 의해 전진하여 보호테이프(14)의 장력을 적절하게 유지하여 준다.Thereafter, the vacuum block 3 descends to temporarily attach the protective tape 14 to the lead frame 13, and then release the vacuum, and the shock absorber 2 is advanced by the driving block 2b so that the protective tape 14 Keep the tension properly.
이후 진공블록(3)이 상승하고, 이송다이(7)가 후진함과 동시에 압착롤러(5)가 제 3 실린더(5a)에 의해 하강하여 보호테이프(14)를 리드 프레임(13)에 압착하게 되며, 이때 완충기(2)는 후진하여 보호테이프(14)를 팽팽하게 잡아당겨 주게 된다.Thereafter, the vacuum block 3 is raised, the transfer die 7 is reversed, and the pressing roller 5 is lowered by the third cylinder 5a to compress the protective tape 14 to the lead frame 13. At this time, the shock absorber 2 is retracted to pull the protective tape 14 taut.
이후 리드 프레임(13)의 표면에 보호테이프(14)가 거의 압착될 무렵, 커팅다이(6)가 전진하여 보호테이프(14)를 고정하게 되고, 제 2 실린더(5a)에 연결된 커터(4)가 하강하여 커팅다이(6)의 삽입부(6d)에 삽입되어 보호테이프(14)를 절단하게 되며, 이때 완충기(2)는 초기 위치, 즉 가이드 바(2a)의 중앙에 위치하여 다음 작업을 대기하게 된다.Then, when the protective tape 14 is almost compressed on the surface of the lead frame 13, the cutting die 6 is advanced to fix the protective tape 14, and the cutter 4 connected to the second cylinder 5a. Is lowered and inserted into the inserting portion 6d of the cutting die 6 to cut the protective tape 14. At this time, the shock absorber 2 is positioned at the initial position, that is, at the center of the guide bar 2a, to perform the next operation. I will wait.
이후 커터(4)가 상승하고, 커팅다이(6)가 후진하며, 이송다이(7)가 후진하여 보호테이프(14)가 미부착된 부분에 보호테이프(14)를 부착하게 된다.Then, the cutter 4 rises, the cutting die 6 moves backward, and the transfer die 7 moves backward to attach the protective tape 14 to the portion where the protective tape 14 is not attached.
이와 같이 보호테이프(14)가 완전하게 부착된 리드 프레임(13)은 소정위치에 적재되고, 압착롤러(5)는 상승하게 되며, 이송다이(7)에 또 다른 리드 프레임이 위치하게 된다.In this way, the lead frame 13 to which the protective tape 14 is completely attached is loaded at a predetermined position, the pressing roller 5 is lifted up, and another lead frame is positioned at the transfer die 7.
본 발명은 상술한 특정의 바람직한 실시예에 한정되지 아니하며, 청구범위에서 청구하는 본 발명의 요지를 벗어남이 없이 당해 고안이 속하는 기술분야에서 통상의 지식을 가진 자라면 누구든지 다양한 변형실시가 가능한 것은 물론이고, 그와 같은 변경은 청구범위 기재의 범위 내에 있게 된다.The present invention is not limited to the above-described specific preferred embodiments, and various modifications can be made by any person having ordinary skill in the art without departing from the gist of the present invention claimed in the claims. Of course, such changes will fall within the scope of the claims.
상술한 바와 같이 본 발명은 보호테이프 휠에 감긴 보호테이프를 진공블록으로 취출 시 제 1,2,3 가이드 롤러 및 진공블록의 흡입경사부에 의해 보호테이프가 완만한 곡선을 형성토록 하여 보호테이프의 변형을 방지할 수 있고, 보호테이프의 진공흡착에 따라 이물질 및 틈새의 발생을 제거하여 리드 프레임의 표면에 보호테이프를 견고히 부착함으로서 제조공정 중 발생되는 리드 프레임 리드의 손상을 방지하는 효과가 있는 것이다.As described above, in the present invention, when the protective tape wound on the protective tape wheel is taken out as a vacuum block, the protective tape is formed to have a gentle curve by the first, second and third guide rollers and the suction inclination part of the vacuum block. Deformation can be prevented, and the protective tape is firmly attached to the surface of the lead frame by removing foreign matters and gaps by vacuum adsorption of the protective tape, thereby preventing damage to the lead frame lead generated during the manufacturing process. .
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2002-0019435A KR100431432B1 (en) | 2002-04-10 | 2002-04-10 | Apparatus that attach masking tape for Metal CSP |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2002-0019435A KR100431432B1 (en) | 2002-04-10 | 2002-04-10 | Apparatus that attach masking tape for Metal CSP |
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| KR20030080681A true KR20030080681A (en) | 2003-10-17 |
| KR100431432B1 KR100431432B1 (en) | 2004-05-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| KR10-2002-0019435A KR100431432B1 (en) | 2002-04-10 | 2002-04-10 | Apparatus that attach masking tape for Metal CSP |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101309503B1 (en) * | 2012-01-06 | 2013-09-23 | 주식회사 선일기연 | Adherence apparatus of carrier-tape using carrier-plate for semiconductor |
| KR101869080B1 (en) * | 2018-03-22 | 2018-06-20 | (주)대한콜크 | Self-adhesive type proof sheet for end portion, making method for the same and making apparatus |
| KR102013795B1 (en) * | 2018-04-30 | 2019-08-23 | ㈜토니텍 | UV tape mount unit for semiconductor package |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100240163B1 (en) * | 1992-12-17 | 2000-01-15 | 유무성 | Apparatus taping of lead frame |
| JP3187400B2 (en) * | 1994-10-31 | 2001-07-11 | 日立化成工業株式会社 | Film-shaped organic die bonding material and semiconductor device |
| JP3447518B2 (en) * | 1996-08-09 | 2003-09-16 | リンテック株式会社 | Adhesive sheet sticking apparatus and method |
| KR20010016375A (en) * | 2000-12-06 | 2001-03-05 | 정도화 | cover lay attach device |
-
2002
- 2002-04-10 KR KR10-2002-0019435A patent/KR100431432B1/en not_active IP Right Cessation
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101309503B1 (en) * | 2012-01-06 | 2013-09-23 | 주식회사 선일기연 | Adherence apparatus of carrier-tape using carrier-plate for semiconductor |
| KR101869080B1 (en) * | 2018-03-22 | 2018-06-20 | (주)대한콜크 | Self-adhesive type proof sheet for end portion, making method for the same and making apparatus |
| KR102013795B1 (en) * | 2018-04-30 | 2019-08-23 | ㈜토니텍 | UV tape mount unit for semiconductor package |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100431432B1 (en) | 2004-05-13 |
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