KR20030075521A - 액정표시소자용 진공 합착 장치 - Google Patents
액정표시소자용 진공 합착 장치 Download PDFInfo
- Publication number
- KR20030075521A KR20030075521A KR1020020014787A KR20020014787A KR20030075521A KR 20030075521 A KR20030075521 A KR 20030075521A KR 1020020014787 A KR1020020014787 A KR 1020020014787A KR 20020014787 A KR20020014787 A KR 20020014787A KR 20030075521 A KR20030075521 A KR 20030075521A
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- vacuum
- liquid crystal
- stage
- crystal display
- Prior art date
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
Abstract
Description
Claims (10)
- 기판의 합착 공정이 수행되는 진공 챔버와;상기 진공 챔버 내에 각각 대향되어 구비되고, 반송 장치에 의해 반입된 각 기판을 흡착하여 각 기판간 합착을 수행하는 상부 스테이지 및 하부 스테이지와;상기 진공 챔버 내에 승강 및 회전하게 구비되고, 합착 완료된 기판을 고정하거나 혹은, 상부 스테이지에 고정되는 기판을 받쳐주는 공정 보조 수단:을 포함하여 구성된 액정표시소자용 진공 합착 장치.
- 제 1 항에 있어서,공정 보조 수단은하부 스테이지 혹은, 상부 스테이지의 각 모서리와 인접한 부위에 위치하도록 구비함을 특징으로 하는 액정표시소자용 진공 합착 장치.
- 제 1 항에 있어서,공정 보조 수단은하부 스테이지 혹은, 상부 스테이지의 각 변 중앙 부위와 인접한 부위에 위치하도록 구비함을 특징으로 하는 액정표시소자용 진공 합착 장치.
- 제 1 항에 있어서,공정 보조 수단은각 스테이지의 각 모서리 및 변의 중앙 부위와 인접한 부위에 위치되도록 설치함을 특징으로 하는 액정표시소자용 진공 합착 장치.
- 제 1 항에 있어서,공정 보조 수단은회전 및 승강 가능하게 장착된 회전축과;상기 회전축의 일단에 일체화되며, 각 기판 혹은, 반송 장치의 소정 부위와 접촉하는 받침부와;상기 회전축의 타단에 장착된 구동부:가 포함되어 구성됨을 특징으로 하는 액정표시소자용 진공 합착 장치.
- 제 5 항에 있어서,받침부의 저면인 합착 기판의 상면과 접촉하는 면에는상호간의 접촉시 긁힘을 방지할 수 있는 재질로 형성된 제1접촉부가 더 포함되어 구성됨을 특징으로 하는 액정표시소자용 진공 합착 장치.
- 제 5 항에 있어서,받침부의 상면인 상부 스테이지에 고정되는 기판의 저면을 받쳐주는 면은상호간의 접촉시 긁힘을 방지할 수 있는 재질로 형성된 제2접촉부가 더 포함되어 구성됨을 특징으로 하는 액정표시소자용 진공 합착 장치.
- 제 6 항 또는 제 7 항 중 어느 한 항에 있어서,각 접촉부가 이루는 재질은테프론이나 피크와 같은 재질임을 특징으로 하는 액정표시소자용 진공 합착 장치.
- 제 6 항 또는 제 7 항 중 어느 한 항에 있어서,각 접촉부는테프론이나 피크와 같은 재질로 코팅되어 형성됨을 특징으로 하는 액정표시소자용 진공 합착 장치.
- 제 5 항에 있어서,구동부는회전축을 회전시키는 구동 모터와, 상기 회전축을 승강시키는 승강 실린더가 포함되어 구성됨을 특징으로 하는 액정표시소자용 진공 합착 장치.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020020014787A KR100815909B1 (ko) | 2002-03-19 | 2002-03-19 | 액정표시소자용 진공 합착 장치 |
Applications Claiming Priority (1)
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KR1020020014787A KR100815909B1 (ko) | 2002-03-19 | 2002-03-19 | 액정표시소자용 진공 합착 장치 |
Publications (2)
Publication Number | Publication Date |
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KR20030075521A true KR20030075521A (ko) | 2003-09-26 |
KR100815909B1 KR100815909B1 (ko) | 2008-03-24 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100995635B1 (ko) * | 2003-12-23 | 2010-11-19 | 엘지디스플레이 주식회사 | 액정표시소자 제조용 합착 장치 |
KR101245181B1 (ko) * | 2006-03-13 | 2013-03-19 | 엘아이지에이디피 주식회사 | 기판 합착 장치 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101160245B1 (ko) * | 2008-04-08 | 2012-06-26 | 가부시키가이샤 알박 | 광 조사 장치 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100496277B1 (ko) * | 1998-09-25 | 2005-09-09 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 패널 조립장치 |
JP3828670B2 (ja) * | 1998-11-16 | 2006-10-04 | 松下電器産業株式会社 | 液晶表示素子の製造方法 |
JP3707990B2 (ja) * | 2000-03-30 | 2005-10-19 | 株式会社 日立インダストリイズ | 基板組立装置 |
JP4689797B2 (ja) * | 2000-07-19 | 2011-05-25 | Nec液晶テクノロジー株式会社 | 液晶表示装置の製造装置及びその製造方法 |
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2002
- 2002-03-19 KR KR1020020014787A patent/KR100815909B1/ko active IP Right Grant
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100995635B1 (ko) * | 2003-12-23 | 2010-11-19 | 엘지디스플레이 주식회사 | 액정표시소자 제조용 합착 장치 |
KR101245181B1 (ko) * | 2006-03-13 | 2013-03-19 | 엘아이지에이디피 주식회사 | 기판 합착 장치 |
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KR100815909B1 (ko) | 2008-03-24 |
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