KR20030071492A - Small―sized electronic component - Google Patents

Abstract

The present invention relates to a small electronic component, wherein the small electronic component is disposed on the base (14) formed of insulating glass and coupled to the base through the connection portion 38 to cover the sealing body 16 to hermetically seal the crystal. ) Is a crystal oscillator 10 provided with), the connection part and the cover body are formed of a metal material, and the first and second ground terminals 40 and 42 are integrally formed with the connection part. The side conductor pattern 32 does not short-circuit, but the grounding of the cover body is not possible through the base in the base of insulated glass, but since the grounding terminal is formed integrally with the connecting portion, the grounding terminal It is characterized in that the grounding can be taken.

Description

Small Electronic Component {SMALL―SIZED ELECTRONIC COMPONENT}

BACKGROUND OF THE INVENTION The present invention relates to small electronic components, and in particular, to small electronic components hermetically sealed, such as, for example, crystal oscillators, crystal oscillators, SAW filters (comb filters), piezoelectric sounds or piezoelectric vibrators.

As a conventional small electronic component, for example, a crystal oscillator 1 shown in FIGS. 10A, 10B and 10C is disclosed in Japanese Patent Application No. 2000-344979 (H03H9 / 00). 10A is a plan view of the crystal oscillator 1 without the lid 2 attached thereto, FIG. 10B is a sectional view of the crystal oscillator 1 viewed in the XB-XB direction, and FIG. 10C is a XC-XC view of the crystal oscillator 1. It is sectional view seen from a direction. The crystal oscillator 1 includes a base 4 formed of a conductive material, a terminal insertion hole 3 formed in the base 4, a crystal piece 5 provided on the base 4, and The cover body 2 which is combined with the base 4 to cover the crystal piece 5 and hermetically seals the crystal piece 5 therein, is also inserted into the terminal insertion hole 3 so that the upper end thereof is The terminal 6 electrically connected to the crystal piece 5 and the space between the terminal 6 and the inner peripheral surface of each terminal insertion hole 3 are hermetically sealed, and the terminal 6 and the base 4 are sealed. The insulating part 7 which electrically insulates is provided.

The crystal oscillator 1 is a substrate side conductor pattern 8a, 8b in which two terminals 6 are formed on the substrate 8 in a state where the crystal oscillator 1 is mounted on the substrate 8 as shown in FIGS. 10B and 10C. Is electrically connected). "4a" shown in Fig. 10B is a ground leg. The ground leg 4a is electrically connected to the grounding conductor pattern 8c formed on the substrate 8. "9" is an insulating film. The insulating film 9 prevents short circuit between the base 4 and the substrate-side conductor patterns 8a and 8b.

However, in the conventional crystal oscillator 1 shown in Figs. 10A, 10B, and 10C, the insulating film 9 is made thin in order to reduce the thickness of the crystal oscillator 1, so that the insulating film 9 receives an external force. There is a possibility that cracking occurs and the insulation of the base 4 is broken. Therefore, it is conceivable that the base 4 is made of an insulating material to omit the insulating film 9, thereby increasing the mechanical strength of the crystal oscillator 1.

However, if the base 4 is formed of an insulating material, as shown in Figs. 10A, 10B, and 10C, it is impossible to press the base 4 to form the ground leg portion 4a. Therefore, in order to ground the lid 2, it is conceivable to weld the grounding terminal to the lid 2, but this may lead to poor welding and increase the cost for welding.

In addition, as shown in FIG. 10B, the terminal 6 is formed in a substantially columnar shape, and a blade-shaped portion 6a is formed at the lower end of the terminal 6. And the insulating part 7 is fused to the upper surface of the said blade-shaped part 6a.

Thus, for example, when the substrate 8 is deformed by the force in the bending direction as shown by the dashed-dotted line in FIG. 10B, each terminal 6 in which the bending direction force is coupled with the substrate 8 is shown. The crack is generated in the glass insulating portion 7 and the insulating film 9 by the force. This is because the base 4 is hardly deformed, so that the insulating portion 7 and the insulating film 9 receive the force in the bending direction.

Therefore, the main object of the present invention is to provide a novel small electronic component.

Another object of the present invention is to provide a small electronic component that does not require welding of the grounding terminal and a small electronic component that can prevent damage to the base made of insulating glass even when the substrate on which the small electronic component is mounted is deformed.

1A is a plan view showing a crystal oscillator to which the lid body of the first embodiment of the present invention is not attached;

1B is a front view of the crystal oscillator shown in FIG. 1A,

Fig. 1C is a cross-sectional view of the IC-IC in Fig. 1A,

Figure 2a is a bottom view of the crystal oscillator shown in Figure 1a,

FIG. 2B is a right side view of the crystal oscillator shown in FIG. 1A;

3 is a plan view of a state before bending of the connecting portion installed in the crystal oscillator shown in FIG.

FIG. 4 is a longitudinal sectional view showing a state in which the crystal oscillator shown in FIG. 1A is mounted on a substrate and deformed by a force in a direction in which the substrate is bent;

Fig. 5A is a plan view showing a crystal oscillator to which the lid body of the second embodiment of the present invention is not attached;

FIG. 5B is a partial cross-sectional view of the crystal oscillator shown in FIG. 5A;

Figure 6a is a bottom view of the crystal oscillator shown in Figure 5a,

6B is a right side view of the crystal oscillator shown in FIG. 5A;

7A is a plan view showing a crystal oscillator to which the lid of the third embodiment of the present invention is not attached;

FIG. 7B is a partial cross-sectional view of the crystal oscillator shown in FIG. 7A;

FIG. 7C is a right side view of the crystal oscillator shown in FIG. 7A;

8A is a plan view showing a crystal oscillator to which the lid body of the fourth embodiment of the present invention is not attached;

FIG. 8B is a partial cross-sectional view of the crystal oscillator shown in FIG. 8A;

9A is a bottom view of the crystal oscillator shown in FIG. 8A,

FIG. 9B is a right side view of the crystal oscillator shown in FIG. 5A;

10A is a plan view showing a crystal oscillator without a conventional lid attached;

FIG. 10B is a cross-sectional view taken along line XB-XB in FIG. 10A, and FIG.

10C is a cross-sectional view taken along XC-XC in FIG. 10B.

* Explanation of symbols for the main parts of the drawings

1, 10: crystal oscillator 2, 16: cover

3: Terminal insertion through hole 4, 14: Base

5: revision 6: terminal

7: insulation section 8: substrate

9: insulating film 18: substrate

The present invention is a small electronic component having a cover on which a device is disposed on a base formed of an insulating material and which is coupled to the base through a connecting part to seal the device in an airtight manner, wherein the connecting part and the cover are formed of a metallic material and further grounded. It is a small electronic component in which a terminal is formed integrally with any one of a connecting portion and a lid.

According to the present invention, since the base is formed of an insulating material, the base and the substrate-side conductor patterns 8a and 8b shown in Fig. 10C do not short-circuit. Since the base is formed of an insulating material, the cover body cannot be grounded through the base, but since the grounding terminal is formed integrally with any one of the connecting portion and the cover body, the ground terminal takes the ground of the cover body. Can be. Further, in the first and second inventions, after arranging the element on the base by providing the connecting portion in the base, the lid can be welded to the connecting portion, whereby the element can be hermetically sealed.

Therefore, according to the present invention, since the grounding terminal is integrally formed with any of the connecting portion and the cover body, it is not necessary to weld the grounding terminal to the connecting portion or the like. Therefore, the welding defect of the grounding terminal does not occur and the cost for welding can be reduced. In addition, since the base is formed of an insulating material, it is not necessary to form a conventional insulating film on the base to prevent a short circuit between the base and the substrate-side conductor pattern. Thereby, the small electronic component with high mechanical strength and low cost can be provided.

According to another aspect of the present invention, a device is disposed on a base formed of insulating glass, and a terminal is connected to the device, and a small electronic component provided with a cover body coupled to the base through a connecting portion and hermetically sealing the device. The tip end part is extended to the outer side of a base in the state supported by one.

In this aspect, the small electronic component can be mounted on the substrate by soldering, for example, the terminal of the small electronic component to the substrate-side conductor pattern. As described above, when the board on which the small electronic component is mounted is deformed by the force in the bending direction, the force is transmitted to the terminal coupled with the board. Since the terminal is supported on one side of the base, the terminal is easily deformed by the bending direction force and can absorb the force. Therefore, even when the substrate is deformed, since it is difficult to transmit force to the base, it is possible to prevent damage to the base. In addition, since the base is formed of an insulating material, the base and the substrate-side conductor pattern do not short-circuit.

Therefore, since the base is formed of an insulating material, it is not necessary to form an insulating film on the bottom of the base. Therefore, it is possible to provide a small electronic component having high mechanical strength and low cost. Further, since the terminal is supported by one base, even when the substrate on which the small electronic component is mounted is deformed, the force due to the deformation of the substrate is hardly transmitted to the base. Therefore, even when the base is formed of, for example, insulating glass, damage to the base can be prevented. As a result, the impact resistance performance of the small electronic component can be improved.

The above and other objects, features and advantages of the present invention will become more apparent from the following detailed description of the embodiments which will be made with reference to the drawings.

A first embodiment in which the small electronic component of the present invention is applied to a crystal oscillator will be described with reference to FIGS. 1A to 4. In the crystal oscillator 10 of the first embodiment, the crystal piece 12 is hermetically sealed by the base 14 and the lid 16, and is mounted on the substrate 18 to be used. FIG. 1A is a plan view of the crystal oscillator 10 without the lid 16 attached thereto, FIG. 1B is a front view of the crystal oscillator 10, and FIG. 1C shows the crystal oscillator 10 mounted on the substrate 18. It is sectional drawing seen from IC direction.

As shown in Fig. 1A, the base 14 has a rectangular planar shape (vertical length A1 of the base 14 and the lid 16 is about 3.0 mm, width B1 of about 5.0 mm), It is formed in the cup shape which opens toward the upper side. A side wall 20 is formed along the outer circumferential edge of the base 14. The base 14 is made of glass having an insulating property, for example, ceramic, and its main composition is a mixture of alumina, zirconia, or the like in borosilicate glass. The first and second terminals 24 and 26 are provided on the upper surface of the bottom wall 22 of the base 14.

The first and second terminals 24 and 26 have the same shape and are formed by bending a plate-like body having a planar shape substantially formed in an L shape. Each terminal 24, 26 has one end formed as a straight portion 28, and the other end formed as a bent portion 30. The 1st terminal 24 is shown in the lower side of the left side of FIG. 1A, the linear part 28 is parallel with the width direction of the base 14, The said linear part 28 is the base 14 The upper surface of the bottom wall 22 is fused. And, the bent part 30 penetrates through the side wall 20 of the base 14 and is exposed to the outside of the base 14, and faces downward along the outer surface of the side wall 20 of the base 14, and also in FIG. As shown to 2a, it extends along the bottom face of the base 14. As shown in FIG. The tip portion 30a extending along the bottom surface is an L-shaped member soldered to the substrate-side conductor pattern 32 formed on the substrate 18. One straight portion 30b of the tip portion 30a extends in the depth direction of the base 14, and the other straight portion 30c extends in the widthwise direction of the base 14.

That is, the bent portion 30 of the first terminal 24 has one end supported by the side wall 20 of the base 14, and the tip portion 30a and the intermediate portion 30d exposed to the outside of the base 14. ) Is not fused to the base 14 and is configured to be variable by external force. In addition, the tip portion 30a of the first terminal 24 is accommodated in the recess 34 formed in the bottom surface of the base 14, as shown in FIG. 1C, and the bottom surface of the tip portion 30a is the base. It is arrange | positioned on the same plane as the bottom face of (14). A gap is formed between the tip portion 30a and the inner surface of the recess 34, and as shown in FIG. 4, the tip portion 30a is also formed to be deformable in accordance with the deformation of the substrate 18. As shown in FIG.

The 2nd terminal 26 shown to the upper side of the right side of FIG. 1A is fused to the upper surface of the bottom wall 22 of the base 14 in the state in which the linear part 28 is parallel to the width direction of the base 14. . The bent portion 30 penetrates through the side wall 20 of the base 14 and is exposed to the outside of the base 14, similarly to the bent portion 30 of the first terminal 24, and the side wall of the base 14. It extends downward along the outer surface of 20, and extends along the bottom face of the base 14, as shown in FIG. 2A. The tip portion 30a extending along the bottom surface is an L-shaped member soldered to a substrate-side conductor pattern (not shown) formed on the substrate 18. The bent portion 30 of the second terminal 26 is similar to the bent portion 30 of the first terminal 24, and the proximal end thereof is supported on one side by the side wall 20 of the base 14. The tip portion 30a and the intermediate portion 30d exposed to the outside of the bottom face are configured to be deformable by an external force. In addition, the tip portion 30a of the second terminal 26 is housed in the recessed portion 34 formed in the base 14, and the substrate 18 is the same as the tip portion 30a of the first terminal 24. According to the modification of the tip portion 30a is also formed to be deformable. In addition, as shown in FIG. 1A, the bent part 30 of the 1st terminal 24 and the bent part 30 of the 2nd terminal 26 are arrange | positioned in the diagonal position of the base 14, respectively. This arrangement is made so that it can be mounted even when the direction of the crystal oscillator is reversed when it is placed on the substrate 18 for mounting the crystal oscillator.

And as shown in FIG. 1A, the holding | maintenance part for holding the crystal piece 12 in each end of the same side (left side) as each linear part 28 of the 1st and 2nd terminal 24 and 26 is shown. (36) is bonded with a conductive adhesive. Each holding part 36 is a rectangular plate-like body having a predetermined thickness.

As shown in Figs. 1A, 1B and 1C, the crystal piece 12 is a plate-shaped body having a rectangular planar shape and is disposed in a state parallel to the base 14. And the left edge part 12a of the crystal piece 12 is adhere | attached on the upper surface of the two holding parts 36 with the conductive adhesive agent. Therefore, the left edge part 12a of the crystal piece 12 is electrically connected with the 1st and 2nd each terminal 24 and 26 via each holding part 36. As shown in FIG. Thus, the crystal piece 12 has one support structure in which the left edge part 12a was supported by the two holding parts 36. As shown in FIG.

1A, 1B, and 1C, the connecting portion 38 is provided on the upper surface of the side wall 20 of the base 14. The connecting portion 38 is a rectangular annular body in planar shape, and the upper surface of the side wall 20 of the base 14 is fused to the connecting portion 38. First and second ground terminals 40 and 42 are integrally formed in the connecting portion 38. In this way, the coupling portion 38 is coupled to the base 14 in order to allow the lid 16 to be welded to the coupling portion 38 after the crystal piece 12 is disposed on the base 14. to be. Thereby, the crystal piece 12 can be hermetically sealed by the base 14, the connection part 38, and the lid 16.

The first and second ground terminals 40 and 42 have the same shape as each other, and are almost the same shape as the bent portion 30 of the first terminal 24. As shown in FIG. 1A, the first grounding terminal 40 is formed at its outer edge at the right end of the lower first member parallel to the widthwise direction of the connecting portion 38. The first grounding terminal 40 faces downward from the connecting portion 38 along the outer surface of the side wall 20 (the side wall 20 through which the first terminal 24 penetrates), and also shown in FIG. 2A. As it extends along the bottom face of the base 14. The tip portion 30a extending along the bottom surface is an L-shaped member which is soldered to the substrate-side conductor pattern 44 formed on the substrate 18, and is equivalent to the tip portion 30a of the first terminal 24. Shape.

That is, the first ground terminal 40 has one proximal end supported by the first member of the connecting portion 38, and the distal end portion 30a and the intermediate portion 30d exposed to the outside of the base 14 are external. It consists of a configuration that can be deformed by force. In addition, the tip portion 30a of the first grounding terminal 40 is housed in the recessed portion 34 formed in the base 14 in the same manner as the tip portion 30a of the first terminal 24. As shown in Fig. 4, the substrate 18 is formed to be deformable in accordance with the deformation of the substrate 18.

As shown in FIG. 1A, the second grounding terminal 42 is a left end portion of the second member on the upper side parallel to the width direction of the connecting portion 38, and is formed at an outer edge thereof. The second grounding terminal 42 has the same outer surface as the first grounding terminal 40 from the side wall 20 (the sidewall 20 through which the second terminal 26 penetrates) from the connecting portion 38. Along the bottom and extends along the bottom of the base 14. The tip portion 30a extending along the bottom surface is an L-shaped member soldered to a substrate-side conductor pattern (not shown) formed on the substrate 18. The tip portion 30a of the first terminal 24 is It is an equivalent shape. Accordingly, the second grounding terminal 42 has a proximal end supported by the second member of the connecting portion 38 in the same manner as the first grounding terminal 40 and exposed to the outside of the base 14. 30a and the intermediate part 30d consist of a structure which can be deformed by an external force. In addition, the tip portion 30a of the second ground terminal 42 is housed in the concave portion 34 formed in the base 14 in the same manner as the tip portion 30a of the first terminal 24. As shown in Fig. 4, the substrate 18 is formed to be deformable in accordance with the deformation of the substrate 18. In addition, as shown in Fig. 1A, the first and second grounding terminals 40 and 42 are disposed at positions that are diagonal to the base 14, respectively.

In addition, each tip portion 30a of the second terminal 26, the first grounding terminal 40, and the second grounding terminal 42 is the same as the tip portion 30a of the first terminal 24. The straight portion 30b extends in the depth direction of the base 14, and the other straight portion 30c extends in the width direction of the base 14.

3 is a plan view showing a state before the connecting portion 38 is fused to the base 14, and before the first and second ground terminals 40 and 42 are bent. FIG. 2B illustrates a procedure of bending the first grounding terminal 40 after the connecting portion 38 is fused to the base 14, and after the second terminal 26 is fused to the base 14. The procedure of bending 26) is shown by the dashed-dotted line. In addition, although not shown in the drawing, the first and second terminals 24 and 26 and the connecting portion 38 are attached to the molding die, and the base 14 is filled by filling the molten insulating glass into the molding die. ) Can be fused.

The cover body 16 is a rectangular plate-like body whose planar shape is substantially the same as the outline shape of the base 14. In order to seal the crystal piece 12, the cover body 16 covers the crystal piece 12, and the welded portion formed on the lower surface of the outer circumferential edge of the cover body 16 is formed of the connecting portion 38. Resistance welding (for example, electric welding such as core welding) is performed on the to-be-welded part formed in the upper surface. In addition, the material of the cover body 16 is positive silver (Cu-Ni-Zn alloy), for example, and the material of the 1st and 2nd terminal 24 and 26, the holding part 36, and the connection part 38 is an example. For example, it is a cobalt (Fe-Ni-Co alloy) and all are conductors.

As shown in FIG. 1C, the crystal oscillator 10 may have any one of the first terminal 24, the second terminal 26, and the first and second ground terminals 40 and 42 on the substrate 18. It can be mounted on the board | substrate 18 by soldering to each of the board | substrate side conductor patterns 32 and 44 corresponding to which are printed.

According to the crystal oscillator 10 shown in FIG. 1A, 1B, 1C, etc., since the base 14 is formed from the insulating glass, the base 14 and the board | substrate side conductor pattern 32 shown in FIG. 1C etc. short-circuit. There is no Since the base 14 is formed of insulating glass, the ground of the lid 16 cannot be taken through the base 14, but the first and second ground terminals 40 and 42 are connected to the connection portion 38. Since the first and second ground terminals 40 and 42 are soldered to the substrate-side conductor pattern 44, the lid 16 can be grounded. In addition, since it is not necessary to weld the first and second grounding terminals 40 and 42 to the connecting portion 38, the welding failure of the first and second grounding terminals 40 and 42 does not occur, Can reduce the cost. In addition, since the base 14 is formed of insulating glass, the insulating film 9 shown in FIGS. 10A, 10B, and 10C for preventing a short between the base 14 and the substrate-side conductor pattern 32 is attached to the base 14. There is no need to form. As a result, the problem that cracks occur in the insulating film 9 can be solved, and the crystal oscillator 10 having high mechanical strength and low cost can be provided.

As shown in FIG. 4, when the crystal oscillator 10 is mounted on the substrate 18, the substrate 18 is deformed by the force 46 in the bending direction. And first and second terminals 24 and 26, which engage with 18, and first and second ground terminals 40 and 42, respectively. Since each terminal 24, 26, 40, 42 is supported by one side wall 20 of the base 14, the tip portion 30a and the middle portion 30d are deformed by the force 46 in the bending direction. The force 46 can be absorbed. Therefore, even when the substrate 18 is deformed, damage to the base 14 formed of insulating glass can be prevented. Therefore, the impact resistance of the crystal oscillator 10 may be improved.

In addition, since the first and second terminals 24 and 26 and the first and second ground terminals 40 and 42 have one supporting structure in which the base end is coupled to the side wall 20 of the base 14, each terminal is provided. An intermediate portion 30d along the outer surface of the side wall 20 is formed at 24 and the like.

Since the intermediate portion 30d receives and deforms the force 46 generated by the deformation of the substrate 18, the intermediate portion 30d may be effectively absorbed to prevent damage to the base 14.

Also, as shown in Fig. 2A, since the first and second terminals 24 and 26 and the first and second ground terminals 40 and 42 extend along the bottom surface of the base 14, the crystal oscillator The area required when mounting (10) on the substrate 18 is small, and therefore the mounting density of the crystal oscillator 10 onto the substrate 18 can be increased.

Next, the crystal oscillator 48 of the second embodiment will be described with reference to FIGS. 5A, 5B and 6A, 6B. The difference between the crystal oscillators 10 and 48 of the first embodiment and the second embodiment is that in the first embodiment, as shown in FIG. 1A, one support structure for supporting the crystal piece 12 with the left edge portion 12a. In the second embodiment, as shown in FIG. 5A, the support piece 12 is fixed to both sides 12a and 12b to support the right and left edge portions 12a and 12b. In the first embodiment, the connecting portion 38 is used. The first and second ground terminals 40 and 42 are provided in the second embodiment. In the second embodiment, these ground terminals 40 and 42 are not provided in the connecting portion 50. The shape and arrangement of the second terminals 24, 26 and 54, 56 are different points. Otherwise, detailed description of the parts equivalent to and equivalent to those of the first embodiment is omitted.

The base 52 is made of insulating glass equivalent to the base 14 of the first embodiment, and is formed in a cup shape which is opened upward as shown in Figs. 5A and 5B. Then, the left and right ends 22a on the upper surface of the bottom wall 22 are formed so as to have a height higher than that of the central portion 22b. First and second terminals 54 and 56 are provided at the central portion 22b of the upper surface of the base 52 and each of the left and right end portions 22a. Otherwise, it is equivalent to the base 14 of the first embodiment.

As shown to FIG. 5A, 5B, the 1st terminal 54 is provided in the right part of the base 52, and the 2nd terminal 56 is provided in the left part of the base 52. As shown to FIG. Since these 1st terminal 54 and the 2nd terminal 56 are symmetrical shape, the 1st terminal 54 is demonstrated and description of the 2nd terminal 56 is abbreviate | omitted.

One end of the first terminal 54 is formed as the fixed side portion 58, and the other end thereof is formed as the bent portion 60. The fixed side part 58 consists of the reinforcement part 58a and the holding part 58b, as shown in FIG. 5A. The reinforcement part 58a is a rectangular plate-shaped object of planar shape, and is fused to the center part 22b of the upper surface of the base 52. The reinforcement part 58a is for reinforcing the base 52. The holding part 58b is formed to have a width in the depth direction of the base 52 narrower than the reinforcing part 58a, and is fused to the upper surface of the right end 22a of the base 52. The holding portion 58b is for holding the right edge portion 12b of the crystal piece 12.

The bent part 60 is engaged with the holding part 58b as shown in FIG. 5B, penetrates through the side wall 20 of the base 52, and is exposed to the outside of the base 52, and It extends downward along the outer surface of the side wall 20 and extends along the bottom surface of the base 52. The tip portion 60a extending along the bottom surface is a rectangular plate-shaped member soldered to the substrate-side conductor pattern 32 formed on the substrate 18. The tip portion 60a has a pair of edge portions facing each other parallel to the depth direction of the base 52 and the other pair of edge portions parallel to the horizontal width direction of the base 52.

That is, the bent portion 60 of the first terminal 54 is the same as the bent portion 30 of the first terminal 24 of the first embodiment, and the proximal end (the side of the fixed side portion 58) of the base 52 One side is supported by the side wall 20. Thus, since the tip part 60a and the intermediate part 60b exposed to the outer side of the base 52 are not fused to the base 52, it is the structure which can be deformed by an external force. In addition, the front end portion 60a of the first terminal 54 is the same as the front end portion 30a of the first terminal 24 of the first embodiment as shown in FIGS. 5B and 6A. It is accommodated in the recessed part 34 formed in the inside, and the said tip part 60a can also be changed in accordance with the deformation | transformation of the board | substrate 18, with each tip part 60a soldered to each board | substrate side conductor pattern 32. FIG. It is formed to. FIG. 5B shows the order of bending the first terminal 54 fused to the base 52 by two-dot chain lines.

As shown in Figs. 5A and 5B, the crystal piece 12 is a planar body and is disposed in a state parallel to the base 52. Then, the right and left edges 12a and 12b of the crystal piece 12 are adhered to the upper surfaces of the holding portions 58b of the first and second terminals 54 and 56 with a conductive adhesive. As described above, the crystal piece 12 is composed of both side support structures in which the left and right edge portions 12a and 12b are fixedly supported by the holding portions 58b.

5A and 5B, the connection part 50 is provided in the upper surface of the side wall 20 of the base 52. As shown in FIG. The connection part 50 is a rectangular annular body in planar shape, and the upper surface of the side wall 20 of the base 52 is fused to the connection part 50.

The lid 16 is equivalent to the lid 16 of the first embodiment and is resistance welded to the upper surface of the connecting portion 50. In addition, the material of the cover body 16, the 1st and 2nd terminal 54 and 56, and the connection part 50 is the same as that of 1st Example, and all are conductors.

The crystal oscillator 48 solders the first and second terminals 54 and 56 to the corresponding substrate-side conductor patterns 32 printed on the substrate 18, as shown in FIG. 5B. It can be mounted on (18). However, since the quartz crystal oscillator 48 of the second embodiment shown in Figs. 5A and 5B functions in the same manner as the quartz crystal oscillator 10 of the first embodiment shown in Figs. 1A, 1B and 1C, the detailed description thereof will be omitted.

Next, the crystal oscillator 62 of the third embodiment will be described with reference to FIGS. 7A, 7B, and 7C. The difference between the crystal oscillators 10 and 62 of the first embodiment and the third embodiment is that, in the first embodiment, as shown in Fig. 1A, one support for supporting the crystal piece 12 with the left edge portion 21a is shown. In the third embodiment, as shown in FIG. 7A, the structure is both supporting structures for fixing the crystal piece 12 to the left and right edge portions 12a and 12b. In the second embodiment, the first and second grounding terminals 40 and 42 are provided in the first and second grounding terminals 40 and 42, and the first and second grounding terminals 40 and 42 are not provided in the connecting portion 64. And the shape and arrangement of the second terminals 24, 26 and 70, 72 are different points. Otherwise, detailed description of the parts equivalent to and equivalent to those of the first embodiment is omitted.

As shown in Figs. 7A, 7B, and 7C, the base 66 is formed in a rectangular shape in which the flat shape is long in the horizontal axis direction, and has a cup shape that opens toward the upper side. The base 66 has side walls 20 formed along the outer circumferential edge, and is made of insulating glass equivalent to the base 14 of the first embodiment. The connecting portion 64 is fused to the upper surface of the base 66.

The connecting portion 64 has a shape covering the upper surface of the bottom wall 22 of the base 66, the inner surface and the upper surface of the side wall 20, and each surface corresponding to the base 66 is formed on the lower surface of the connecting portion 64. We are fusion. A blade-shaped portion 64a is formed at the outer circumferential edge of the connecting portion 64. The blade portion 64a is for welding the lower surface of the outer circumferential edge of the lid 16, and the base piece 66 is welded to the blade piece 64 by welding the lid 16 to the blade portion 64a. The airtight seal can be sealed by the connecting portion 64 and the lid 16. And rectangular through-holes 68 are formed one by one in the right part and the left part of the bottom wall of the connection part 64. As shown in FIG. The first terminal 70 is inserted through the right through hole 68, and the second terminal 72 is inserted through the left through hole 68. Since these 1st terminal 70 and the 2nd terminal 72 are symmetrical shape as shown to FIG. 7A, 7B, 7C, it demonstrates the 1st terminal 70, and demonstrates the description of the 2nd terminal 72. FIG. Omit.

In the first terminal 70, one terminal is formed as the fixed side portion 74 and the other end is formed as the bent portion 76. The fixed side portion 74 is composed of a holding portion 74a and a fusion portion 74b as shown in Fig. 7B. The holding part 74a is a rectangular curved member of planar shape, and is for holding the right edge part 12b of the crystal piece 12. The fusion | splicing part 74b is inserted into the through-hole 68 formed in the right side of the said connection part 64 in the non-contact state (state not electrically connected) to the connection part 64, and the base ( It penetrates the bottom wall 22 of 66. The base 66 is fused to the fusion portion 74b, whereby the first terminal 70 is fixed to the base 66.

The bent portion 76 engages with the fusion portion 74b as shown in FIG. 7B and is exposed to the outside of the bottom wall 22 of the base 66, and the middle portion 76a is the bottom wall of the base 66. Along the bottom face of 22) is directed to the right, and the tip portion 76b extends upward along the outer surface of the side wall 20 of the base 66. The intermediate portion 76a is a strip-shaped member soldered to the substrate-side conductor pattern 32 formed on the substrate 18 and extends in the widthwise direction of the base 66.

That is, the bent portion 76 of the first terminal 70 has one end portion (side of the fixed side portion 74) supported by the bottom wall 22 of the base 66 in the same manner as the first terminal 24 of the first embodiment. The tip portion 76b and the intermediate portion 76a exposed to the outside of the base 66 are not fused to the base 66 and are configured to be deformable by an external force. In addition, the intermediate portion 76a and the tip portion 76b of the first terminal 70 are formed on the bottom surface of the base 66 and the outer surface of the side wall 20, as shown in FIGS. 7B and 7C. It is accommodated in the recess 78. Then, in the state where the intermediate portion 76a is soldered to the substrate-side conductor pattern 32, the intermediate portion in accordance with the deformation of the substrate 18 in the same manner as the tip portion 30a of the first terminal 24 of the first embodiment or the like. The 76a and the front end 76b are formed so that change is possible. FIG. 7B shows the order of bending the first and second terminals 70 and 72 fused to the base 66 by two-dot chain lines.

As shown in Figs. 7A, 7B, and 7C, the crystal piece 12 is a rectangular plate-like body in a planar shape, and is disposed in a state parallel to the base 66. Each edge portion on the right and left sides of the crystal piece 12 is bonded to the upper surface of each holding portion 74a of the first and second terminals 70 and 72 with a conductive adhesive. Therefore, the crystal piece 12 is comprised by the both-side support structure by which each left and right edge part was fixedly supported by each holding part 74a.

The lid 16 is equivalent to the lid 16 of the first embodiment, and is resistance-welded to the upper surface of the blade-shaped portion 64a of the connecting portion 64. In addition, the material of the cover body 16, the 1st and 2nd terminal 70 and 72, and the connection part 64 is equivalent to the thing of 1st Embodiment.

The crystal oscillator 62 solders the first terminal 70 and the second terminal 72 to corresponding substrate-side conductor patterns 32 printed on the substrate 18, as shown in FIG. 7B. It can mount on (18). However, since the quartz crystal oscillator 62 of the third embodiment shown in Figs. 7A, 7B and 7C acts in the same manner as the quartz crystal oscillator 10 of the first embodiment shown in Figs. 1A, 1B and 1C, its detailed description will be omitted. .

Next, the quartz crystal oscillator 80 of the fourth embodiment will be described with reference to FIGS. 8A, 8B and 9A, 9B. The difference between the crystal vibrators 62 and 80 of the third embodiment and the fourth embodiment is that the shapes and arrangement of the first terminals 70 and 82 and the second terminals 72 and 84 are different. Other than that, it is equivalent to the third embodiment and detailed description of the equivalent parts is omitted. However, since the 1st terminal 82 and the 2nd terminal 84 are symmetrical shape as shown to FIG. 8A, 8B, and 9A, 9B, the 1st terminal 82 is demonstrated and the 2nd terminal 84 ) Will be omitted.

One end of the first terminal 82 is formed as the fixed side portion 86, and the other end thereof is formed as the two bent portions 88. The fixed side part 86 consists of the holding part 86a and the fusion | melting part 86b as shown in FIG. 8B. The holding part 86a is a substantially rectangular curved member of planar shape, and is for holding the right edge part 12b of the crystal piece 12. The fusion | fusing part 86b is formed by bending a plate-like object in an inverted C shape. The fusion portion 86b is inserted into each of two through holes 68 formed at the right end of the connection portion 90 in a non-adhesive state (not electrically connected) to the connection portion 90. Passing. And each end penetrates the bottom wall 22 of the base 92 in the state which inserted through each through hole 68. As shown in FIG. The base 92 is fused to the fusion portion 86b, whereby the first terminal 82 is fixed to the base 92. In addition, similarly to the fusion | fusing part 86b of the 1st end part, the fusion | fusing part 86b of the 2nd terminal 84 also has the non-contact state with the connection part 90, and each end penetrates the connection part 90. FIG. Therefore, two through holes 68 are also formed in the left side of the connecting portion 90.

Each of the two bent portions 88 engages with corresponding ends of the fusion portion 86b, as shown in FIG. 8B, is exposed to the outside of the bottom wall 22 of the base 92, and each intermediate portion ( 88a faces sidewalls 20 in opposite directions along the bottom surface of bottom wall 22 of base 92, and each tip portion 88b is upwardly along the outer surface of sidewall 20 of base 92. It is extending. Each of these intermediate portions 88a is a plate member soldered to each of the substrate-side conductor patterns 32 formed on the substrate 18 and extends in the widthwise direction of the base 92.

That is, each bent portion 88 of the first terminal 82 has one base end (side of the fixed side portion 86) supported by the base 92 similarly to the first terminal 24 of the first embodiment. The tip portion 88b and the intermediate portion 88a exposed to the outside of the base 92 are not fused to the base 92 and have a configuration that can be changed by an external force. In addition, the middle portion 88a and the tip portion 88b of the first terminal 82 are formed on the bottom surface of the base 92 and the outer surface of the side wall 20, as shown in FIGS. 8B and 9A. It is accommodated in the recess 78. Each intermediate portion 88a is soldered to each of the substrate-side conductor patterns 32, in the same manner as the tip portion 30a of the first terminal 24 of the first embodiment, depending on the deformation of the substrate 18. The portion 88a and the tip portion 88b are also formed to be deformable.

The crystal oscillator 80 is formed by soldering the first terminal 82 and the second terminal 84 to corresponding respective substrate side conductor patterns 32 printed on the substrate 18 as shown in FIG. 8B. It can be mounted on (18). However, since the quartz crystal oscillator 80 of the fourth embodiment shown in FIGS. 8A, 8B and 9A, 9B operates in the same manner as the quartz crystal oscillator 10 of the first embodiment shown in FIGS. Omit.

However, in the first embodiment, the first and second ground terminals 40 and 42 are previously formed integrally with the connecting portion 38, but instead of the first and second ground terminals 40 and 42, the first and second ground terminals 40 and 42 are previously formed. You may form integrally with the cover body 16.

In the first to fourth embodiments, the present invention is applied to a crystal vibrator provided with the crystal piece 12 as an element. However, the above-mentioned invention is applied to other crystal vibrators, SAW filters (comb filters), piezoelectric sounds, It can be applied to piezoelectric vibrators and the like. In short, the present invention can be applied to small electronic components.

While the invention has been shown and described in detail, it is obvious that it has been used as a mere illustration and example and should not be construed as limiting, the spirit and scope of the invention being limited only by the words of the appended claims.

According to the present invention, even when a small electronic component requiring no welding of the grounding terminal and a board on which the small electronic component is mounted are deformed, damage to the base made of insulating glass can be prevented, thereby providing a high impact resistance and inexpensive small electronic component. .

Claims (6)

In a small electronic component having an element disposed on a base formed of an insulating material, and provided with a cover for sealing the element in combination with the base through a connecting portion, The small electronic component, wherein the connecting portion and the lid are formed of a metal material, and a ground terminal is integrally formed with any one of the connecting portion and the lid. The method of claim 1, The base is formed of glass, The ground terminal is a small electronic component, characterized in that one end is extended along the bottom surface of the base in a state that one end is supported by one of the connecting portion and the cover body. In a small electronic component provided with a cover body for arranging an element on a base formed of an insulating material, connecting a terminal to the element, and engaging the base through a connecting portion to seal the element. The terminal is a small electronic component, characterized in that the front end portion is extended to the outside of the base in one state supported by the base. The method of claim 3, wherein And said terminal extends along the bottom surface of said base. The method according to claim 3 or 4, The terminal is a small electronic component, characterized in that supported by one side of the base. The method according to any one of claims 3 to 5, The base is a small electronic component, characterized in that formed of insulating glass.