CN1441549A - Small electronic part - Google Patents

Small electronic part Download PDF

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Publication number
CN1441549A
CN1441549A CN03104884A CN03104884A CN1441549A CN 1441549 A CN1441549 A CN 1441549A CN 03104884 A CN03104884 A CN 03104884A CN 03104884 A CN03104884 A CN 03104884A CN 1441549 A CN1441549 A CN 1441549A
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CN
China
Prior art keywords
pedestal
terminal
connecting portion
substrate
lid
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN03104884A
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Chinese (zh)
Inventor
大藤刚理
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Fujimaru Kogyo KK
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Fujimaru Kogyo KK
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Application filed by Fujimaru Kogyo KK filed Critical Fujimaru Kogyo KK
Publication of CN1441549A publication Critical patent/CN1441549A/en
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    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04GSCAFFOLDING; FORMS; SHUTTERING; BUILDING IMPLEMENTS OR AIDS, OR THEIR USE; HANDLING BUILDING MATERIALS ON THE SITE; REPAIRING, BREAKING-UP OR OTHER WORK ON EXISTING BUILDINGS
    • E04G3/00Scaffolds essentially supported by building constructions, e.g. adjustable in height
    • E04G3/28Mobile scaffolds; Scaffolds with mobile platforms
    • E04G3/30Mobile scaffolds; Scaffolds with mobile platforms suspended by flexible supporting elements, e.g. cables
    • E04G3/305Mobile scaffolds; Scaffolds with mobile platforms suspended by flexible supporting elements, e.g. cables specially adapted for tanks, silos or similar vessels
    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04GSCAFFOLDING; FORMS; SHUTTERING; BUILDING IMPLEMENTS OR AIDS, OR THEIR USE; HANDLING BUILDING MATERIALS ON THE SITE; REPAIRING, BREAKING-UP OR OTHER WORK ON EXISTING BUILDINGS
    • E04G23/00Working measures on existing buildings
    • E04G23/02Repairing, e.g. filling cracks; Restoring; Altering; Enlarging
    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04GSCAFFOLDING; FORMS; SHUTTERING; BUILDING IMPLEMENTS OR AIDS, OR THEIR USE; HANDLING BUILDING MATERIALS ON THE SITE; REPAIRING, BREAKING-UP OR OTHER WORK ON EXISTING BUILDINGS
    • E04G3/00Scaffolds essentially supported by building constructions, e.g. adjustable in height
    • E04G3/28Mobile scaffolds; Scaffolds with mobile platforms
    • E04G2003/283Mobile scaffolds; Scaffolds with mobile platforms mobile horizontally
    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04GSCAFFOLDING; FORMS; SHUTTERING; BUILDING IMPLEMENTS OR AIDS, OR THEIR USE; HANDLING BUILDING MATERIALS ON THE SITE; REPAIRING, BREAKING-UP OR OTHER WORK ON EXISTING BUILDINGS
    • E04G3/00Scaffolds essentially supported by building constructions, e.g. adjustable in height
    • E04G3/28Mobile scaffolds; Scaffolds with mobile platforms
    • E04G2003/286Mobile scaffolds; Scaffolds with mobile platforms mobile vertically

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  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Mechanical Engineering (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Oscillators With Electromechanical Resonators (AREA)

Abstract

The present invention provides a small-sized electronic component, which is a crystal vibrator 10 wherein a crystal chip 12 is placed on a base 14 made of insulation glass, coupled to the base via a connection part 38, and cover 16 for air-tightly sealing the crystal chip. The connection part and the cover are made of a metallic material and first and second earth terminals 40, 42 are integrally formed with the connection part. Since the base is made of the insulation glass, no short-circuit takes place between the base and a substrate side conductor pattern 32. However, it is impossible to take earthing of the cover via the base made of the insulation glass, since the earth terminals are integrally formed with the connection part, the cove is grounded by using the earth terminals.

Description

Small-sized electronic part
Technical field
The present invention relates to small-sized electronic part, particularly such as small-sized electronic part quartzy vibrating elements, crystal oscillator, comb filter (SAW mode filter), piezo-electric type tuning fork, piezoelectric vibration device etc., that its internal implementation air seal formula is provided with.
Background technology
As this small-sized electronic part in the technology formerly, for example disclose quartzy vibrating elements 1 shown in Figure 10 (A)~Figure 10 (C), No. 344979/2000 (H03H9/00) application for a patent for invention of Japan.Figure 10 (A) is the schematic plan of this quartzy vibrating elements 1 of expression when lid 2 is not installed; Figure 10 (B) is the schematic cross sectional view of expression when direction XB-XB observes quartzy vibrating elements 1; Figure 10 (C) expression schematic cross sectional view when direction XC-XC observes quartzy vibrating elements 1.This quartzy vibrating elements 1 has the pedestal of being made by electric conducting material 4, the terminal that is formed on pedestal 4 places inserts through hole 3,3, be arranged on the quartz plate 5 on the pedestal 4, and can combine with pedestal 4 according to the mode that lid is covering quartz plate 5, with the lid 2 of quartz plate 5 air seals in place, inside usefulness, be inserted in terminal insertion through hole 3 but also have to run through, 3 places, the terminal 6 that its upper end and quartz plate 5 are being electrically connected, 6, and to the gap enforcement air seal formula encapsulation between the interior lateral circle surface of each terminal 6 and terminal insertion through hole 3, simultaneously to terminal 6,6 and 4 of pedestals implement the insulation division 7 that electric insulation is used, 7 etc.
This quartzy vibrating elements 1 is shown in Figure 10 (B) and Figure 10 (C), and under the state that is installed on the substrate 8, two terminals 6,6 and being formed between substrate-side conductor fig 8a, 8b on the substrate 8 are electrically connected.Reference number 4a shown in Figure 10 (B), expression be earthy foot.This earthy 4a of foot and the earthy conductor fig 8c that is formed on the substrate 8 are electrically connected.What reference number 9 was represented is dielectric film.This dielectric film 9 is used to prevent short circuit occurs between pedestal 4 and substrate-side conductor fig 8a, the 8b.
Yet, quartzy vibrating elements 1 in this technology formerly shown in Figure 10 (A)~Figure 10 (C) in order to reduce the thickness of quartzy vibrating elements 1, need make dielectric film 9 quite thin, so dielectric film 9 is easy to generate fracture under external force, thereby may destroy the insulating properties of pedestal 4.Therefore, can expect adopting insulating material to make pedestal 4, omit dielectric film 9, improve the scheme of the mechanical strength of quartzy vibrating elements 1 thus.
Yet, when adopting insulating material to make pedestal 4, can shown in Figure 10 (A)~Figure 10 (C), can not form the earthy 4a of foot by the mode that pedestal 4 is implemented punch process.Therefore, be connected with earth point, need form earthy terminal, but when adopting this form of the composition, the problem of failure welding may occur, and the cost of implementing to weld is also than higher in lid 2 places welding in order to make lid 2.
Shown in Figure 10 (B), terminal 6 is cylindrical substantially, also is formed with flange part 6a in the lower end of this terminal 6.And, welding insulation division 7 at the upper side place of this flange part 6a.
Therefore, shown in two pecked lines among Figure 10 (B), when substrate 8 when under the power effect of warpage direction, producing distortion, this active force along the warpage direction will be passed to each terminal 6 place that combines with substrate 8, so insulation division 7 and the dielectric film 9 made by glass may produce fracture under the effect of this power.Because pedestal 4 is difficult to produce distortion, so will be applied on insulation division 7 and the dielectric film 9 along the active force of warpage direction.
Summary of the invention
The present invention is exactly the invention that addresses the above problem usefulness, and main purpose of the present invention just provides a kind of novel small-sized electronic part.
Another object of the present invention provides a kind of small-sized electronic part that does not need earthy terminal is implemented welding, even and a kind ofly produce the occasion that distortion is arranged for the substrate that small-sized electronic part is installed, also can prevent from the pedestal of being made by insulating glass is caused the small-sized electronic part of damage.
In order to realize the foregoing invention purpose, a kind of small-sized electronic part provided by the invention, be a kind of with arrangements of components on the pedestal that forms by insulating material, and be provided with by connecting portion and combine, thereby element is implemented the small-sized electronic part of the lid of air seal formula encapsulation with pedestal; And connecting portion wherein and lid made by metal material, and one in earthy terminal and connecting portion and the lid forms as one.
If employing the present invention because pedestal made by insulating material, so pedestal not can and substrate-side conductor fig 8a, 8b shown in Figure 10 (C) between produce short circuit.Because pedestal is made by insulating material, thus lid can not be grounded by this pedestal, yet since earthy terminal be with connecting portion and lid in one form as one, so lid can be grounded by this earthy terminal.And, in first and second preferred forms of the present invention,, can again lid be welded on the connecting portion with after arrangements of components is on pedestal thus by connecting portion being arranged on the pedestal place, realize air seal formula setting thus to element.
Therefore if adopt the present invention and since earthy terminal be with connecting portion and lid in one be pre-formed to one, locate so need that no longer earthy terminal is welded on connecting portion etc.Therefore, the problem of earthy terminal failure welding can not occur, and can reduce and implement the needed cost of welding.And, because pedestal made by insulating material, thus no longer need to be provided with use in the technology formerly, prevent from the dielectric film that short circuit is used to occur between pedestal and the substrate-side conductor fig.Therefore, the present invention can provide the high and small-sized electronic part with low cost of a kind of mechanical strength.
Another kind of small-sized electronic part provided by the invention, be a kind of with arrangements of components on the pedestal that forms by insulating glass, on element, be connected with terminal, and be provided with and combine with pedestal by connecting portion, element is implemented the small-sized electronic part of the lid of air seal formula encapsulation; And terminal wherein makes leading section extend to the lateral surface place of pedestal under the state of by the pedestal cantilever support.
If adopt this small-sized electronic part provided by the invention, can by with the terminal on the small-sized electronic part and substrate-side conductor fig by as scolding tin etc. mode be connected, thus small-sized electronic part is installed on the substrate.When the substrate that small-sized electronic part is installed in this manner, be subjected to when the active force of warpage direction produces distortion, this active force will be passed to the terminal place that combines with substrate.Since terminal be cantilever support at the pedestal place, so easily this along producing distortion under the power effect of warpage direction, this active force is implemented to absorb.Even therefore produce the occasion that distortion is arranged for substrate, this active force also is difficult to be passed to the pedestal place, thereby can prevent from pedestal is caused damage.And, because pedestal made by insulating material, thus pedestal not can and the substrate-side conductor fig between produce short circuit.
Because pedestal is made by insulating material, so no longer need form dielectric film at the place, bottom surface of pedestal.Therefore, the present invention can provide a kind of mechanical strength high and small-sized electronic part with low cost.In addition, owing to terminal by the pedestal cantilever support, so even produce the occasion that distortion is arranged for the substrate that small-sized electronic part is installed, the active force that is produced by base plate deformation also is difficult to be passed to the pedestal place.Therefore, even, also can prevent from pedestal is caused damage for the occasion that adopts such as making pedestals such as insulating glasses.Its result can improve the impact resistance of small-sized electronic part.
By the detailed description of embodiment being carried out below with reference to accompanying drawing, can be expressly understood above-mentioned purpose of the present invention more, and other goals of the invention, feature and advantage.
Description of drawings
The schematic plan that Fig. 1 (A) uses as quartzy vibrating elements first embodiment of the invention, when lid is not installed for expression; The schematic elevational view that Fig. 1 (B) uses for the quartzy vibrating elements of expression shown in Fig. 1 (A); Schematic cross sectional view when Fig. 1 (C) cuts open for the line IC-IC of expression in Fig. 1 (A).
The schematic, bottom view that Fig. 2 (A) uses for the quartzy vibrating elements of expression shown in Fig. 1 (A); The schematic right hand view that Fig. 2 (B) uses for the quartzy vibrating elements of expression shown in Fig. 1 (A).
Fig. 3 is in the schematic plan that state is used before the warpage for expression is arranged on connecting portion on the quartzy vibrating elements shown in Fig. 1 (A).
When Fig. 4 will the quartzy vibrating elements shown in Fig. 1 (A) be installed on the substrate for expression, the schematic longitudinal sectional that the state of this substrate when producing distortion under the power effect of warpage direction used.
The schematic plan that Fig. 5 (A) uses as quartzy vibrating elements second embodiment of the invention, when lid is not installed for expression; The schematic fragmentary cross-sectional view that Fig. 5 (B) uses for the quartzy vibrating elements of expression shown in Fig. 5 (A).
The schematic, bottom view that Fig. 6 (A) uses for the quartzy vibrating elements of expression shown in Fig. 5 (A); The schematic right hand view that Fig. 6 (B) uses for the quartzy vibrating elements of expression shown in Fig. 5 (A).
The schematic plan that Fig. 7 (A) uses as quartzy vibrating elements third embodiment of the invention, when lid is not installed for expression; The schematic fragmentary cross-sectional view that Fig. 7 (B) uses for the quartzy vibrating elements of expression shown in Fig. 7 (A); The schematic right hand view that Fig. 7 (C) uses for the quartzy vibrating elements of expression shown in Fig. 7 (A).
The schematic plan that Fig. 8 (A) uses as quartzy vibrating elements fourth embodiment of the invention, when lid is not installed for expression; The schematic fragmentary cross-sectional view that Fig. 8 (B) uses for the quartzy vibrating elements of expression shown in Fig. 8 (A).
The schematic, bottom view that Fig. 9 (A) uses for the quartzy vibrating elements of expression shown in Fig. 8 (A); The schematic right hand view that Fig. 9 (B) uses for the quartzy vibrating elements of expression shown in Fig. 8 (A).
The schematic plan that Figure 10 (A) uses as quartzy vibrating elements technical examples, when lid is not installed formerly for expression; Schematic cross sectional view when Figure 10 (B) cuts open for the line XB-XB of expression in Figure 10 (A); Schematic cross sectional view when the line XC-XC of Figure 10 (C) expression in Figure 10 (B) cuts open.
Embodiment
To Fig. 4, first embodiment when small-sized electronic part of the present invention is applied as quartzy vibrating elements describes below with reference to Fig. 1 (A)~Fig. 1 (C).As the quartzy vibrating elements 10 of first embodiment, by pedestal 14 and lid 16 quartz plate 12 air seal formulas are encapsulated in inner place, and can be installed in use on the substrate 18.The schematic plan of quartzy vibrating elements 10 usefulness when Fig. 1 (A) does not install lid 16 for expression; Fig. 1 (B) is the schematic elevational view of quartzy vibrating elements 10 usefulness of expression; Fig. 1 (C) for expression along direction IC-IC, the schematic cross sectional view when implementing to observe to being installed in quartzy vibrating elements 10 on the substrate 18.
Shown in Fig. 1 (A), the flat shape of pedestal 14 is rectangle (the longitudinal length A1 of pedestal 14 and lid 16 is approximately 3.0 millimeters (mm), and lateral length B1 is approximately 5.0 millimeters (min)), and forms the cup-like shape towards last side opening.Outer circumferential edge along this pedestal 14 is formed with sidewall 20.Pedestal 14 by have insulating properties, such as adding the manufacturings such as glass of pottery are arranged, its main component is for being mixed with aluminium oxide or zirconia etc. in pyrex.And the upper side place at the diapire 22 of pedestal 14 also is provided with first and second terminals 24,26.
First and second terminals 24,26, its shape is mutually the same, and flat shape is substantially the board-like material warpage formation of L font.An end on these two terminals 24,26 is made of linearity portion 28, and another end is made of joggling part 30.Shown in the lower-left side among Fig. 1 (A), the direction that is provided with of the linearity portion 28 on the first terminal 24 parallels with the transverse width direction of pedestal 14, and this linearity portion 28 is welded on the upper side place of the diapire 22 of pedestal 14.Joggling part 30 runs through by the sidewall on the pedestal 14 20 and exposes lateral surface place at pedestal 14, so along the lateral surface of pedestal 14 upper side walls 20 further towards lower side to extension, and shown in Fig. 2 (A), extend along the place, bottom surface of pedestal 14.The leading section 30a that extends along this place, bottom surface is for being welded on parts that use, that be the L font on the substrate-side conductor fig 32 that is formed on the substrate 18.A line part 30b on this leading section 30a extends towards the depth direction of pedestal 14, and another line part 30c extends along the transverse width direction of pedestal 14.
In other words be exactly, joggling part 30 on this first terminal 24, its base end part by 20 cantilever support of the sidewall on the pedestal 14, the leading section 30a and the pars intermedia 30d that expose to the open air at pedestal 14 lateral surface places are not welded on the pedestal 14, can produce the form of the composition of distortion under external force thereby be.And shown in Fig. 1 (C), also being formed with recess 34 at the place, bottom surface of pedestal 14, the leading section 30a on this first terminal 24 receives and is contained within this recess 34, and the downside of leading section 30a and the bottom surface on the pedestal 14 are disposed at grade.And, between the medial surface of leading section 30a and recess 34, be formed with the gap, and as shown in Figure 4, leading section 30a also can produce distortion along with the distortion of substrate 18.
Be illustrated in the linearity portion 28 in second terminal 26 at place, upper right side among Fig. 1 (A), with state that the transverse width direction of pedestal 14 parallels under, be welded on the upper side place of the diapire 22 of pedestal 14.Joggling part 30 on its joggling part 30 and the first terminal 24 in the same manner, run through by the sidewall on the pedestal 14 20 and expose outside at pedestal 14, and then along the lateral surface of pedestal 14 upper side walls 20 towards lower side to extension, and shown in Fig. 2 (A), extend along the place, bottom surface of pedestal 14.The leading section 30a that extends along this place, bottom surface is welded on parts on the substrate-side conductor fig (not shown) that is formed on the substrate 18, that be the L font.Joggling part 30 on this second terminal 26 and the joggling part 30 on the first terminal 24 are in the same manner, its base end part by 20 cantilever support of the sidewall on the pedestal 14, and forms the leading section 30a and the pars intermedia 30d that expose to the open air at pedestal 14 lateral surface places and can produce the form of the composition of distortion under external force.And leading section 30a on second terminal 26 receives and is contained within the recess 34 that is formed at pedestal 14 places, with leading section 30a on the first terminal 24 in the same manner, along with the distortion of substrate 18, leading section 30a also can produce distortion.Shown in Fig. 1 (A), the joggling part 30 on the joggling part 30 on the first terminal 24 and second terminal 26 is configured in the diagonal position place on the pedestal 14 respectively.Adopt the reason of this configuration mode to be, when being configured in it on substrate 18, even counter-rotating also can be implemented to install before and after the direction of quartzy vibrating elements for quartzy vibrating elements is implemented to install.
Shown in Fig. 1 (A), the maintaining part 36 that quartz plate 12 is implemented to keep usefulness is set is by conductive adhesive, implementing bonding the connection with the end of same side (such as left side) in each linearity portion 28,28 on first and second terminals 24,26.This maintaining part 36 is for having the rectangular plate shape material of predetermined thickness.
Shown in Fig. 1 (A), quartz plate 12 is that the board-like material of rectangle constitutes by flat shape, and implements configuration according to the mode that parallels with pedestal 14.The 12a of left side edge portion on the quartz plate 12 is by conductive adhesive, the bonding upper side place that is connected two maintaining parts 36.Therefore, the 12a of left side edge portion on the quartz plate 12 is by these two maintaining parts 36, and 24,26 enforcements of first and second terminals are electrically connected.Adopt this form of the composition, quartz plate 12 is the cantilever support form that the 12a of left side edge portion is being supported by two maintaining parts 36.
Shown in Fig. 1 (A)~Fig. 1 (C), the sidewall 20 upper side places at pedestal 14 also are provided with connecting portion 38.Connecting portion 38 is the rectangular ring bodies of its flat shape, and the upper side of the sidewall 20 on the pedestal 14 is welded on this connecting portion 38 places.The first and second earthy terminals 40,42 are integrally formed in this connecting portion 38 places.Adopt this form of the composition, be in the reason that connecting portion 38 is combined in pedestal 14 places, be configured in quartz plate 12 on the pedestal 14 after, again lid 16 is welded on connecting portion 38 places.If adopt this form of the composition, can implement the encapsulation of air seal formula by pedestal 14, connecting portion 38 and 16 pairs of quartz plates of lid 12.
The first and second earthy terminals 40,42 are mutually the same shape, and are substantially identical shape with joggling part 30 on the first terminal 24.The first earthy terminal 40, shown in Fig. 1 (A), the right-hand end of downside first parts that parallel as the transverse width direction along connecting portion 38 is formed on its outer ledge place.And the first earthy terminal 40 is risen by connecting portion 38 places, along the lateral surface of sidewall 20 (the first terminal 24 runs through the sidewall 20 that passes through) towards lower side to extension, and shown in Fig. 2 (A), extend along the place, bottom surface of pedestal 14.Along the leading section 30a at place, this bottom surface, for being welded on parts on the substrate-side conductor fig 44 that is formed on the substrate 18, that be the L font, and identical with the formation shape of leading section 30a on the first terminal 24.
In other words be exactly that this first earthy terminal 40 formed its base end part by the first parts cantilever support on the connecting portion 38, and the leading section 30a and the pars intermedia 30d that expose to the open air at pedestal 14 lateral surface places produces the form of the composition of distortion under external force.And leading section 30a on the first earthy terminal 40 and the leading section 30a on the first terminal 24 receive and to be contained within the recess 34 that is positioned on the pedestal 14 in the same manner, and as shown in Figure 4, also are to produce the form of the composition of distortion along with the distortion of substrate 18.
The second earthy terminal 42 can be shown in Fig. 1 (A), and the left end as upside second parts that parallel with the transverse width direction of connecting portion 38 is formed on its outer ledge place.And, the second earthy terminal 42 and the first earthy terminal 40 in the same manner, by connecting portion 38 places rise lateral surface along sidewall 20 (second terminal 26 runs through the sidewall 20 that passes through) towards lower side to extension, and extend along the place, bottom surface of pedestal 14.Along the leading section 30a at place, this bottom surface, for being welded on parts on the substrate-side conductor fig (not shown) that is formed on the substrate 18, that be the L font, identical with the formation shape of leading section 30a on the first terminal 24.Therefore, this second earthy terminal 42 and the first earthy terminal 40 are in the same manner, its base end part by the second parts cantilever support on the connecting portion 38, and forms the leading section 30a and the pars intermedia 30d that expose to the open air at pedestal 14 lateral surface places and can produce the form of the composition of distortion under external force.In addition, leading section 30a on this second earthy terminal 42 and the leading section 30a on the first terminal 24 receive and to be contained within the recess 34 that is positioned on the pedestal 14 in the same manner, and as shown in Figure 4, are to produce the form of the composition of distortion along with the distortion of substrate 18.And, shown in Fig. 1 (A), the first and second earthy terminals 40,42 can be configured in the diagonal position place on the pedestal 14 respectively.
Leading section 30a on second terminal, 26, the first earthy terminal 40 and the second earthy terminal 42, respectively with the first terminal 24 on leading section 30a in the same manner, an one line part 30b extends towards the depth direction of pedestal 14, and another line part 30c extends along the transverse width direction of pedestal 14.
Fig. 3 is the state before representing to be welded on connecting portion 38 on the pedestal 14, and the first and second earthy terminals 40,42 are implemented the schematic plan that warpage moulding state is before used.In Fig. 2 (B), use two pecked lines, show be welded on connecting portion 38 on the pedestal 14 after, the first earthy terminal 40 is implemented the order that warpage adds man-hour, and after being welded on second terminal 26 on the pedestal 14, second terminal 26 is implemented the order that warpage adds man-hour.Though it is not shown, yet first and second terminals 24,26 and connecting portion 38 all can be under the states that it is arranged in the mould, be filled to mode in this mould by the insulating glass that will be molten condition, with their adhere on pedestal 14.
Lid 16 is the rectangular plate shape parts identical substantially with the contour shape of pedestal 14 for its flat shape, for quartz plate 12 is implemented sealing, covering under the state of quartz plate 12 at lid 16 lids, to portion that is fused that is formed on the peripheral edge downside place, the outside on the lid 16 and the portion that is fused that is formed on the upper side place of connecting portion 38, implement impedance welding (such as electric welding of enforcement such as seam welding etc.).In addition, the material of making lid 16 for example is pack fong (a Cu-Ni-Zn alloy), and the material of making first and second terminals 24,26, maintaining part 36 and connecting portion 38 for example is kovar alloy (Fe-Ni-Co alloy), and these materials are conductor.
Quartzy vibrating elements 10 can be shown in Fig. 1 (C), some by with in the first terminal 24, second terminal 26 and the first and second earthy terminals 40,42, be welded on printing and be formed on mode on the corresponding substrate side conductor figure 32,34 on the substrate 18 etc., be installed on the substrate 18.
Quartzy vibrating elements 10 shown in Fig. 1 (A)~Fig. 1 (C) forms pedestal 14 by insulating glass, thus pedestal 14 not can and the substrate-side conductor fig 32 shown in Fig. 1 (C) etc. between produce short circuit.Because pedestal 14 usefulness insulating glasses form, so can not make lid 16 ground connection by pedestal 14, yet because the first and second earthy terminals the 40, the 42nd are integrally formed with connecting portion 38, so can make lid 16 ground connection by the mode that the first and second earthy terminals 40,42 are welded on the substrate-side conductor fig 44.Because do not need the first and second earthy terminals 40,42 are welded on the connecting portion 38, thus the problem of first and second earthy terminal 40,42 failure weldings can not appear, and can cut down and implement the needed cost of welding.Because pedestal 14 is made by insulating glass, thus no longer need on pedestal 14, form shown in Figure 10 (A)~Figure 10 (C), prevent the dielectric film 9 used in pedestal 14 and 32 formation of substrate-side conductor fig short circuit.Adopt this form of the composition, can provide a kind of can the elimination and the cracking problem occur, and have than higher mechanical strength and quartzy vibrating elements 10 with low cost at dielectric film 9 places.
In addition, as shown in Figure 4, if under the state that quartzy vibrating elements 10 is installed on the substrate 18, this substrate 18 is being out of shape along producing under active force 46 effects of warpage direction, 46 of this active forces are passed to first and second terminals, 24,26 places that combine with substrate 18, and the first and second earthy terminals, 40,42 places.Because each terminal the 24,26,40, the 42nd, sidewall 20 places of cantilever support on pedestal 14 so leading section 30a and pars intermedia 30d can implement to absorb to this active force 46 this along producing distortion under active force 46 effects of warpage direction.Therefore, even substrate 18 produces the occasion of distortion, can prevent that also damage from appearring in the pedestal 14 that is formed by insulating glass.Therefore, the present invention can improve the impact resistance of this quartzy vibrating elements 10.
Because first and second terminals, 24, the 26 and first and second earthy terminals 40,42, what adopt is base end part to be combined in the cantilever support form of the composition at sidewall 20 places of pedestal 14, so be formed with along the pars intermedia 30d of the lateral surface of sidewall 20 in each terminal 24.Because this pars intermedia 30d can accept by the active force 46 of the distortion generation of substrate 18 and produce distortion, so can implement absorption to this active force effectively, prevents from thus pedestal 14 to be caused damage.
And shown in Fig. 2 (A), first and second terminals, 24, the 26 and first and second earthy terminals the 40, the 42nd, extend the bottom surface on pedestal 14, so can reduce quartzy vibrating elements 10 is installed in needed area on the substrate 18, thereby increases the packing density when being installed in quartzy vibrating elements 10 on the substrate 18.
Below with reference to Fig. 5 (A), Fig. 5 (B) and Fig. 6 (A), Fig. 6 (B) describes the quartzy vibrating elements 48 as second embodiment of the invention.The difference that quartzy vibrating elements 10 among first embodiment and the quartzy vibrating elements among second embodiment are 48 is, among first embodiment shown in Fig. 1 (A), quartz plate 12 is the cantilever support form of the composition that is being supported by the 12a of left side edge portion, in a second embodiment shown in Fig. 5 (A), quartz plate 12 is by left side and the 12a of right side edge portion, 12b implements the supported on both sides form of the composition of fixed support, and be in first embodiment with the first and second earthy terminals 40,42 are arranged on connecting portion 38 places, this earthy terminal 40 is not set in a second embodiment at connecting portion 50 places, 42, and make first and second terminals 24,26 and first and second terminals 54,56 shape and configuration mode differ from one another.In addition, all with first embodiment in identical, omitted detailed description here to these same sections.
Pedestal 52 is made by the insulating glass identical with pedestal 14 among first embodiment, and as Fig. 5 (A), shown in Fig. 5 (B), forms the cup-like shape of side opening.Be positioned at the left and right sides stage portion 22a at the upper side place of diapire 22, form according to the mode higher than the height of central portion 22b.Central portion 22b and stage portion 22a place, the left and right sides at the upper side place that is positioned at this pedestal 52 are being provided with first and second terminals 54,56.In addition, all identical with the form of the composition of pedestal 14 among first embodiment.
As Fig. 5 (A), shown in Fig. 5 (B), the first terminal 54 is arranged on the right side of pedestal 52, and second terminal 56 is arranged on the left side of pedestal 52.These two the first terminals 54 and second terminal 56 are symmetrical shape, so only the first terminal 54 is described here, have omitted the respective description to second terminal 56.
Fixation side portion 58 is done to become in an end on the first terminal 54, and joggling part 60 is made to become in another end.Fixedly sidepiece 58 is made of 58a of enhancing portion and maintaining part 58b shown in Fig. 5 (A).The 58a of enhancing portion is the rectangular plate-shaped member of flat shape, and is welded on the upper side central portion 22b place of pedestal 52.This enhancing 58a of portion implements to strengthen to the intensity of pedestal 52.The width of pedestal 52 depth directions of maintaining part 58b forms narrowlyer than the width of the 58a of enhancing portion, and is welded on the upper side place of the right side stage portion 22a of pedestal 52.This maintaining part 58b is used for the 12b of right side edge portion of quartz plate 12 is implemented to keep.
Joggling part 60 is shown in Fig. 5 (B), 58b combines with maintaining part, run through the sidewall 20 by pedestal 52 and expose in the outside of pedestal 52, so along the lateral surface of the sidewall 20 of pedestal 52 towards lower side to extension, further extend along the bottom surface of pedestal 52.The leading section 60a that extends along this bottom surface is welded on plate-shaped member on the substrate-side conductor fig 32 that is formed on the substrate 18, rectangular shaped.This leading section 60a goes up a pair of edge part respect to one another and parallels with the depth direction of pedestal 52, and another parallels with the transverse width direction of pedestal 52 edge part.
In other words be exactly, joggling part 60 on this first terminal 54 and the joggling part 30 on the first terminal 24 among first embodiment in the same manner, its base end part (fixedly sidepiece 58 sides) by 20 cantilever support of the sidewall on the pedestal 52.Adopt this form of the composition, the leading section 60a and the central portion 60b that expose to the open air in pedestal 52 outsides are not welded on pedestal 52 places, can produce the form of the composition of distortion under external force so be.In addition, leading section 60a on this first terminal 54 is shown in Fig. 5 (B) and Fig. 6 (A), with as the leading section 30a on the first terminal 24 of first embodiment in the same manner, receipts are contained within the recess 34 at the place, bottom surface that is formed on the pedestal 52, under each leading section 60a was welded on state on the substrate-side conductor fig 32, leading section 60a also can produce distortion along with the distortion of substrate 18.Fig. 5 (B) is with two pecked lines, shows the processing sequence of the first terminal 54 that is welded on pedestal 52 places being implemented warpage processing.
As Fig. 5 (A), shown in Fig. 5 (B), quartz plate 12 is the board-like material of rectangle for its flat shape, and implements configuration according to the mode that parallels with pedestal 52.In addition, the left side of quartz plate 12 and the 12a of right side edge portion, 12b are bonded in the upper side place of the maintaining part 58b of first and second terminals 54,56 by conductive adhesive.Adopt this form of the composition, quartz plate 12 is the left side and the supported on both sides form of the composition by each maintaining part 58b fixed support respectively of the 12a of right side edge portion, 12b.
As Fig. 5 (A), shown in Fig. 5 (B), the upper side place of the sidewall 20 on pedestal 52 is provided with connecting portion 50.Connecting portion 50 is the rectangular endless member of flat shape, and the upper side of the sidewall 20 on the pedestal 52 is welded on this connecting portion 50 places.
Lid 16 among the lid 16 and first embodiment is similar, and the impedance welding is at the upper side place of connecting portion 50.And identical among the material of making lid 16, first and second terminals 54,56 and connecting portion 50 and first embodiment is conductor.
Quartzy vibrating elements 48 can be installed on the substrate 18 by the first terminal 54 and second terminal 56 being welded on the mode of printing on the corresponding substrate side conductor figure 32 that is formed on the substrate 18 etc. as Fig. 5 (B) shown in.But, as Fig. 5 (A), shown in Fig. 5 (B), as the quartzy vibrating elements 48 of second embodiment, have with shown in Fig. 1 (A)~Fig. 1 (C), as the identical effect of the quartzy vibrating elements 10 of first embodiment, so omitted detailed description here to them.
Below with reference to Fig. 7 (A)~Fig. 7 (C), the quartzy vibrating elements 62 as third embodiment of the invention is described.The difference that quartzy vibrating elements 10 among first embodiment and the quartzy vibrating elements among the 3rd embodiment are 62 is, among first embodiment shown in Fig. 1 (A), quartz plate 12 is the cantilever support form of the composition that is being supported by the 12a of left side edge portion, among the 3rd embodiment shown in Fig. 7 (A), quartz plate 12 is by left side and the 12a of right side edge portion, 12b implements the supported on both sides form of the composition of fixed support, and be in first embodiment with the first and second earthy terminals 40,42 are arranged on connecting portion 38 places, in the 3rd embodiment, this earthy terminal 40 is not set at connecting portion 64 places, 42, and make first and second terminals 24,26 and first and second terminals 70,72 shape and configuration mode differ from one another.In addition, all with first embodiment in identical, omitted detailed description here to these same sections.
Pedestal 66 is shown in Fig. 7 (A)~Fig. 7 (C), and being flat shape is along the long rectangular shape of transverse width direction, and forms the cup-like shape towards last side opening.This pedestal 66 also is being formed with sidewall 20 along its outer circumferential edge place, and by with the identical insulating glass material of pedestal 14 among first embodiment.Adhere has connecting portion 64 at the upper side place of pedestal 66.
Connecting portion 64 is can be to the upper side of the diapire 22 of pedestal 66, and the medial surface of sidewall 20 and upper side implement the formation shape that lid covers, and corresponding each face is welded on the downside place of this connecting portion 64 in the pedestal 66.The peripheral edge place is formed with flange part 64a in the outside of connecting portion 64.Flange part 64a is used for the downside at the peripheral edge place, the outside of welded cover 16, by lid 16 being welded on the mode at flange part 64a place, implements the encapsulation of air seal formula by pedestal 66, connecting portion 64 and 16 pairs of quartz plates of lid 12.And diapire right side on connecting portion 64 and left side are located, and are formed with the through hole 68 of a rectangular shaped respectively.The first terminal 70 runs through by through hole 68 places that are positioned at the right side, and second terminal 72 runs through by being positioned at through hole 68 places in left side.These two the first terminals 70 and second terminal 72 are the left-right symmetric shape shown in Fig. 7 (A)~Fig. 7 (C), so only the first terminal 70 is described here, omitted the detailed description to second terminal 72.
An end on the first terminal 70 forms fixedly sidepiece 74, and another end forms joggling part 76.Fixedly sidepiece 74 is made of maintaining part 74a and the 74b of adhere portion shown in Fig. 7 (B).Maintaining part 74a is the rectangular warpage parts of flat shape, and is used for the 12b of right side edge portion on the quartz plate 12 is implemented to keep.The 74b of adhere portion can not with connecting portion 64 contacted states under (not forming under the state that is electrically connected), run through by being formed on the through hole 68 at place, right side on the connecting portion 64, run through in this state by the diapire on the pedestal 66 22.Pedestal 66 fusions are connected adhere portion 74b place, thereby the first terminal 70 is fixed on the pedestal 66.
Joggling part 76 is shown in Fig. 7 (B), combine with the 74b of adhere portion, and expose the outside of the diapire 22 on pedestal 66, intermediate portion 76a extends towards right direction along the bottom surface of the diapire 22 of pedestal 66, and then leading section 76b extends towards last side direction along the lateral surface of pedestal 66 upper side walls 20.This pars intermedia 76a is welded on the strip-shaped parts that forms substrate-side conductor fig 32 places on the substrate 18, and extends along the transverse width direction of pedestal 66.
In other words be exactly, joggling part 76 on the first terminal 70 and the first terminal 24 among first embodiment are in the same manner, its base end part (fixedly sidepiece 74 sides) by diapire 22 cantilever support of pedestal 66, the leading section 76b and the pars intermedia 76a that expose to the open air at pedestal 66 lateral surface places do not have adhere on pedestal 66, can produce the form of the composition of distortion under external force thereby be.And pars intermedia 76a on this first terminal 70 and leading section 76b receive within the recess 78 at the lateral surface place be contained in the bottom surface that is formed at pedestal 66 and sidewall 20 shown in Fig. 7 (B) and Fig. 7 (C).Under the state that pars intermedia 76a is welded on the substrate-side conductor fig 32, with the leading section 30a of the first terminal 24 among first embodiment etc. in the same manner, pars intermedia 76a and leading section 76b also are can produce the form of the composition of distortion along with the distortion of substrate 18.In Fig. 7 (B),, show first and second terminals 70,72 that fusion is connected on the pedestal 66 and implement the order that warpage adds man-hour by two pecked lines.
Quartz plate 12 is that the board-like material of rectangle constitutes by flat shape, and disposes according to the mode that parallels with pedestal 66 shown in Fig. 7 (A)~Fig. 7 (C).Right side on the quartz plate 12 and left side edge portion are by conductive adhesive, the bonding upper side place that is connected each maintaining part 74a of first and second terminals 70,72.Therefore, quartz plate 12 is the left side and the supported on both sides form of the composition by each maintaining part 74a fixed support respectively of right side edge portion.
Lid 16 is identical with lid 16 among first embodiment, and the impedance welding is at the upper side place of the flange part 64a of connecting portion 64.And, the material of lid 16, first and second terminals 70,72 and connecting portion 64, identical with among first embodiment.
Quartzy vibrating elements 62 can be installed on the substrate 18 by welding with the corresponding substrate-side conductor fig 32,32 that the first terminal 70 and 72 printings of second terminal are formed on the substrate 18 as Fig. 7 (B) shown in.But, shown in Fig. 7 (A)~Fig. 7 (C), as the quartzy vibrating elements 62 of the 3rd embodiment, have with shown in Fig. 1 (A)~Fig. 1 (C), as the identical effect of the quartzy vibrating elements 10 of first embodiment, so omit detailed description to them.
Below with reference to Fig. 8 (A), Fig. 8 (B) and Fig. 9 (A), Fig. 9 (B) describes the quartzy vibrating elements 80 as fourth embodiment of the invention.The difference that quartzy vibrating elements 62 among the 3rd embodiment and the quartzy vibrating elements among the 4th embodiment are 80 is that the shape and the configuration mode of the first terminal 70,82 and second terminal 72,84 differ from one another.In addition, all with the 3rd embodiment in identical, so omit detailed description to these same sections.But the first terminal 82 and second terminal 84 are as Fig. 8 (A), and Fig. 8 (B) and Fig. 9 (A) shown in Fig. 9 (B), are the left-right symmetric shape, so only the first terminal 82 is described, omit the detailed description to second terminal 84.
An end of the first terminal 82 forms fixedly sidepiece 86, and another end forms two joggling parts 88.Fixedly sidepiece 86 is made of maintaining part 86a and the 86b of adhere portion shown in Fig. 8 (B).Maintaining part 86a is the rectangular substantially warpage parts of flat shape, and is used for the 12b of right side edge portion on the quartz plate 12 is implemented to keep.The 86b of adhere portion is the plate-shaped member that warpage is made into the コ font.This adhere 86b of portion not with connecting portion 90 contacted states under (not forming under the state that is electrically connected), make each end run through two through hole 68 places by the right side place that is formed on connecting portion 90.In addition, the diapire 22 by pedestal 92 is run through in each end under the state that runs through by through hole 68 places.Pedestal 92 fusions are connected adhere portion 86b place, thereby the first terminal 82 is fixed on the pedestal 92.86b of adhere portion on second terminal 84 and the 86b of adhere portion on the first end in the same manner, not with connecting portion 90 contacted states under, each end is run through by connecting portion 90.Therefore, also be formed with two through holes 68 at the place, left side of connecting portion 90.
Two joggling parts 88 are shown in Fig. 8 (B), be combined in corresponding each place, end of the 86b of adhere portion, and expose outside to the open air at the diapire 22 of pedestal 92, and each pars intermedia 88a extends towards the sidewall 20 that is positioned at the rightabout place along the bottom surface of the diapire 22 of pedestal 92, and then leading section 88b extends towards last side direction along the lateral surface of pedestal 92 upper side walls 20.These each pars intermedia 88a are the plate-shaped member that is welded on substrate-side conductor fig 32 places that are formed on the substrate 18, and extend along the transverse width direction of pedestal 92.
In other words be exactly, each joggling part 88 on the first terminal 82 and the first terminal 24 among first embodiment are in the same manner, its base end part (fixedly sidepiece 86 sides) by pedestal 92 cantilever support, the leading section 88b and the pars intermedia 88a that expose to the open air at pedestal 92 lateral surface places do not have adhere on pedestal 92, can produce the form of the composition of distortion under external force thereby be.And pars intermedia 88a on this first terminal 88 and leading section 88b receive within the recess 78 at the lateral surface place be contained in the bottom surface that is formed at pedestal 92 and sidewall 20 shown in Fig. 8 (B) and Fig. 9 (A).Under the state that each pars intermedia 88a is welded on each substrate-side conductor fig 32, with leading section 30a on the first terminal 24 among first embodiment in the same manner, this pars intermedia 88a and leading section 88b also are can produce the form of the composition of distortion along with the distortion of substrate 18.
Quartzy vibrating elements 80 can be installed on the substrate 18 by welding with the corresponding substrate-side conductor fig 32,32 that the first terminal 82 and 84 printings of second terminal are formed on the substrate 18 as Fig. 8 (B) shown in.But, as Fig. 8 (A), Fig. 8 (B) and Fig. 9 (A), shown in Fig. 9 (B), as the quartzy vibrating elements 80 of the 4th embodiment, have with shown in Fig. 1 (A)~Fig. 1 (C), as the identical effect of the quartzy vibrating elements 10 of first embodiment, so omit detailed description to them.
But in first embodiment, the first and second earthy terminals the 40, the 42nd form as one with connecting portion 38 in advance, yet can also adopt the form of the composition that the first and second earthy terminals 40,42 are formed as one with lid 16 in advance.
And, in first embodiment to the, four embodiment, be that to be applied as the occasion that is provided with the quartzy vibrating elements of quartz plate 12 as element with the present invention be that example describes, however the present invention can also be applied as in addition, such as crystal oscillator, comb filter (SAW mode filter), piezo-electric type tuning fork, piezoelectric vibration device etc.In other words be exactly that the present invention goes for this class small-sized electronic part.
The present invention is elaborated with reference to the accompanying drawings, yet these explanations only are schematic and illustrative, do not have limiting meaning.

Claims (6)

1. small-sized electronic part, wherein with arrangements of components on the pedestal that forms by insulating material, and be provided with by connecting portion and combine with described pedestal, described element is implemented the lid of air seal formula encapsulation, it is characterized in that:
Described connecting portion and described lid are made by metal material, and then make one in earthy terminal and described connecting portion and the described lid to form as one.
2. small-sized electronic part as claimed in claim 1, it is characterized in that described pedestal made by glass material, extend along the bottom surface of described pedestal under the state of by a cantilever support in described connecting portion and the described lid end of described earthy terminal.
3. small-sized electronic part, wherein with arrangements of components on the pedestal that forms by insulating material, on described element, be connected with terminal, and be provided with by connecting portion and combine with described pedestal, described element is implemented the lid that the air seal formula encapsulates, it is characterized in that:
Described terminal makes leading section extend along the lateral surface place of described pedestal under the state of by described pedestal cantilever support.
4. small-sized electronic part as claimed in claim 3 is characterized in that described terminal extends along the bottom surface of described pedestal.
5. as claim 3 or 4 described small-sized electronic parts, it is characterized in that described terminal implementing cantilever support by the side of described pedestal.
6. as each described small-sized electronic part in the claim 3~5, it is characterized in that described pedestal is by the insulating glass material.
CN03104884A 2002-02-27 2003-02-21 Small electronic part Pending CN1441549A (en)

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JP2002051167A JP2003258588A (en) 2002-02-27 2002-02-27 Small-sized electronic component
JP051167/2002 2002-02-27

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101237223B (en) * 2007-01-30 2012-06-20 日本电波工业株式会社 Tuning-fork type piezoelectric unit
CN101273256B (en) * 2005-09-26 2013-11-13 精工爱普生株式会社 Tuning bi-fork piezoelectric oscillation element and pressure sensor
CN103401523B (en) * 2007-12-06 2016-06-01 株式会社村田制作所 Piezo-vibration

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3996904B2 (en) * 2004-01-27 2007-10-24 松下電器産業株式会社 Surface mount base for electronic devices
JP4630110B2 (en) * 2005-04-05 2011-02-09 パナソニック株式会社 Manufacturing method of electronic parts

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101273256B (en) * 2005-09-26 2013-11-13 精工爱普生株式会社 Tuning bi-fork piezoelectric oscillation element and pressure sensor
CN101237223B (en) * 2007-01-30 2012-06-20 日本电波工业株式会社 Tuning-fork type piezoelectric unit
CN103401523B (en) * 2007-12-06 2016-06-01 株式会社村田制作所 Piezo-vibration

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