KR20030047719A - 의사 동축 전송 라인이 교차하는 장치 - Google Patents

의사 동축 전송 라인이 교차하는 장치 Download PDF

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Publication number
KR20030047719A
KR20030047719A KR1020020065797A KR20020065797A KR20030047719A KR 20030047719 A KR20030047719 A KR 20030047719A KR 1020020065797 A KR1020020065797 A KR 1020020065797A KR 20020065797 A KR20020065797 A KR 20020065797A KR 20030047719 A KR20030047719 A KR 20030047719A
Authority
KR
South Korea
Prior art keywords
coaxial transmission
pseudo coaxial
transmission line
transmission lines
ground
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020020065797A
Other languages
English (en)
Korean (ko)
Inventor
도브루이스알
카세이존에프
블룸안토니알
Original Assignee
애질런트 테크놀로지스, 인크.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 애질런트 테크놀로지스, 인크. filed Critical 애질런트 테크놀로지스, 인크.
Publication of KR20030047719A publication Critical patent/KR20030047719A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/085—Triplate lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/06—Coaxial lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/088—Stacked transmission lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0221—Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809—Coaxial layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4685—Manufacturing of cross-over conductors

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Waveguides (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Semiconductor Integrated Circuits (AREA)
KR1020020065797A 2001-10-29 2002-10-28 의사 동축 전송 라인이 교차하는 장치 Withdrawn KR20030047719A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/020,486 2001-10-29
US10/020,486 US6573597B2 (en) 2001-10-29 2001-10-29 Cross-over for quasi-coaxial transmission lines fabricated on a substrate

Publications (1)

Publication Number Publication Date
KR20030047719A true KR20030047719A (ko) 2003-06-18

Family

ID=21798872

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020020065797A Withdrawn KR20030047719A (ko) 2001-10-29 2002-10-28 의사 동축 전송 라인이 교차하는 장치

Country Status (4)

Country Link
US (1) US6573597B2 (enExample)
JP (1) JP2003198214A (enExample)
KR (1) KR20030047719A (enExample)
DE (1) DE10241346A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8946873B2 (en) * 2007-08-28 2015-02-03 Micron Technology, Inc. Redistribution structures for microfeature workpieces
US8247883B2 (en) * 2008-12-04 2012-08-21 Palo Alto Research Center Incorporated Printing shielded connections and circuits

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04267586A (ja) 1991-02-22 1992-09-24 Nec Corp 同軸配線パターンおよびその形成方法
US5262353A (en) * 1992-02-03 1993-11-16 Motorola, Inc. Process for forming a structure which electrically shields conductors
US5510758A (en) * 1993-04-07 1996-04-23 Matsushita Electric Industrial Co., Ltd. Multilayer microstrip wiring board with a semiconductor device mounted thereon via bumps
JP3219067B2 (ja) * 1999-01-08 2001-10-15 日本電気株式会社 集積回路
US6388198B1 (en) * 1999-03-09 2002-05-14 International Business Machines Corporation Coaxial wiring within SOI semiconductor, PCB to system for high speed operation and signal quality
US6373740B1 (en) * 1999-07-30 2002-04-16 Micron Technology, Inc. Transmission lines for CMOS integrated circuits

Also Published As

Publication number Publication date
DE10241346A1 (de) 2003-05-15
US20030080415A1 (en) 2003-05-01
US6573597B2 (en) 2003-06-03
JP2003198214A (ja) 2003-07-11

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Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20021028

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid