KR20030027733A - 회전 캐리어에 대한 환상의 리셉터클 - Google Patents
회전 캐리어에 대한 환상의 리셉터클 Download PDFInfo
- Publication number
- KR20030027733A KR20030027733A KR1020020058270A KR20020058270A KR20030027733A KR 20030027733 A KR20030027733 A KR 20030027733A KR 1020020058270 A KR1020020058270 A KR 1020020058270A KR 20020058270 A KR20020058270 A KR 20020058270A KR 20030027733 A KR20030027733 A KR 20030027733A
- Authority
- KR
- South Korea
- Prior art keywords
- suction
- receptacle
- chamber
- pressure distribution
- carrier
- Prior art date
Links
- 239000007921 spray Substances 0.000 claims description 2
- 239000007788 liquid Substances 0.000 abstract description 11
- 239000004065 semiconductor Substances 0.000 abstract description 9
- 125000006850 spacer group Chemical group 0.000 abstract description 6
- 238000005530 etching Methods 0.000 abstract description 2
- 238000011282 treatment Methods 0.000 description 9
- 235000012431 wafers Nutrition 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 239000007789 gas Substances 0.000 description 4
- 239000002253 acid Substances 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3063—Electrolytic etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Weting (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Centrifugal Separators (AREA)
- Rotary Switch, Piano Key Switch, And Lever Switch (AREA)
- Jet Pumps And Other Pumps (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Apparatus For Radiation Diagnosis (AREA)
- Auxiliary Devices For And Details Of Packaging Control (AREA)
- Iron Core Of Rotating Electric Machines (AREA)
- Manipulator (AREA)
- Respiratory Apparatuses And Protective Means (AREA)
Abstract
Description
Claims (10)
- 디스크 형상의 물체를 수용하기 위한 캐리어를 회전시키는 환상의 리셉터클에 있어서,- 리셉터클은 물체를 위한 캐리어의 지지표면 방사형 연장부에서 최소한 하나의 환상의 채널(26,26')을 갖고,- 최소한 하나의 환상의 채널(26,26')과 인접하여, 최소한 하나의 흡입장치는 내부벽(12)에서 시작하여 리셉터클에서 작동하고,- 흡입장치는 내부벽(12)에 위치한 흡입 오프닝(16) 및 흡입 오프닝(16)의 흡입단부와 방사형으로 인접한 환상의 흡입챔버(18,18',18")를 포함하고,- 압력분배챔버(30)는 흡입라인(38)을 흡입챔버(18,18',18")에 연결시키는 것을 특징으로 하는 리셉터클.
- 제 1 항에 있어서, 흡입 오프닝(16)은 환상의 채널(26,26') 위에서 작동하는 것을 특징으로 하는 리셉터클.
- 제 1 항에 있어서, 흡입 오프닝(16)은 리셉터클의 내부벽(12)을 따라 가능한 균일하게 분포된 여러개의 흡입노즐로 구성되는 것을 특징으로 하는 리셉터클.
- 제 1 항에 있어서, 흡입 오프닝(16)은 링표면(14,14',14")에 위치하는 것을특징으로 하는 리셉터클.
- 제 1 항에 있어서, 흡입챔버(18,18',18")는 분리된 오프닝(20,20',20")을 통해 압력분배챔버(30)로 연결되는 것을 특징으로 하는 리셉터클.
- 제 1 항에 있어서, 리셉터클에서 서로 상단에서 작동하는 다중 환상의 채널(26,26') 및 그에 할당된 흡입장치를 갖는데, 최소한 두 개의 흡입장치는 동일한 압력분배챔버(30)에 연결되는 것을 특징으로 하는 리셉터클.
- 제 1 항에 있어서, 최소한 하나의 흡입장치의 흡입챔버(18')는 리셉터클의 내부벽(12)에서부터 시작하여 캐러이의 지지표면에 대해서 아래쪽으로 경사지는 것을 특징으로 하는 리셉터클.
- 제 1 항에 있어서, 디스크 형태의 물체 위에 있는 스프레이 장치로 되돌아오는 환상의 채널(26,26')에 연결된 출구라인(34,36)을 갖는 것을 특징으로 하는 리셉터클.
- 제 8 항에 있어서, 다중 환상의 채널(26,26')은 접합된 출구라인에 연결되는 것을 특징으로 하는 리셉터클.
- 제 1 항에 있어서, 압력분배챔버(30)는 비교적 폭이 작지만 리셉터클의 전체높이에 대해서 연장되는 것을 특징으로 하는 리셉터클.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ATA1518/2001 | 2001-09-26 | ||
AT0151801A AT413162B (de) | 2001-09-26 | 2001-09-26 | Ringförmige aufnahmevorrichtung für einen rotierenden träger zur aufnahme eines scheibenförmigen gegenstandes wie eines halbleiterwafers |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20030027733A true KR20030027733A (ko) | 2003-04-07 |
KR100721222B1 KR100721222B1 (ko) | 2007-05-22 |
Family
ID=3688305
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020020058270A KR100721222B1 (ko) | 2001-09-26 | 2002-09-26 | 회전 캐리어에 대한 환상의 리셉터클 |
Country Status (9)
Country | Link |
---|---|
US (1) | US7052577B2 (ko) |
EP (1) | EP1298708B1 (ko) |
JP (1) | JP4234375B2 (ko) |
KR (1) | KR100721222B1 (ko) |
CN (1) | CN1305124C (ko) |
AT (2) | AT413162B (ko) |
DE (1) | DE50211641D1 (ko) |
SG (1) | SG105562A1 (ko) |
TW (1) | TW578252B (ko) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040238008A1 (en) * | 2003-03-12 | 2004-12-02 | Savas Stephen E. | Systems and methods for cleaning semiconductor substrates using a reduced volume of liquid |
JP2009064795A (ja) * | 2005-12-27 | 2009-03-26 | Tokyo Electron Ltd | 基板処理装置および基板処理方法 |
TWI359456B (en) * | 2006-12-15 | 2012-03-01 | Lam Res Ag | Device and method for wet treating plate-like arti |
US9484229B2 (en) | 2011-11-14 | 2016-11-01 | Lam Research Ag | Device and method for processing wafer-shaped articles |
US8974632B2 (en) * | 2011-11-30 | 2015-03-10 | Lam Research Ag | Device and method for treating wafer-shaped articles |
RU2642907C2 (ru) * | 2012-10-05 | 2018-01-29 | Конинклейке Филипс Н.В. | Поворотное устройство позиционирования |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AT389959B (de) * | 1987-11-09 | 1990-02-26 | Sez Semiconduct Equip Zubehoer | Vorrichtung zum aetzen von scheibenfoermigen gegenstaenden, insbesondere von siliziumscheiben |
JPH02130922A (ja) * | 1988-11-11 | 1990-05-18 | Toshiba Corp | 半導体基板エッチング装置 |
JPH0444714A (ja) * | 1990-06-12 | 1992-02-14 | Masanobu Iguchi | お茶の入れ方および用具 |
JPH05102028A (ja) * | 1991-10-09 | 1993-04-23 | Nec Corp | フオトレジスト膜現像カツプ |
US5273588A (en) * | 1992-06-15 | 1993-12-28 | Materials Research Corporation | Semiconductor wafer processing CVD reactor apparatus comprising contoured electrode gas directing means |
JPH0766272A (ja) * | 1993-08-31 | 1995-03-10 | Toshiba Corp | ウェーハ保管、運搬ボックス |
US5705223A (en) * | 1994-07-26 | 1998-01-06 | International Business Machine Corp. | Method and apparatus for coating a semiconductor wafer |
JP3641115B2 (ja) * | 1997-10-08 | 2005-04-20 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JPH11238715A (ja) * | 1998-02-20 | 1999-08-31 | Sumitomo Heavy Ind Ltd | 表面洗浄方法及び装置 |
DE19807460A1 (de) * | 1998-02-21 | 1999-04-15 | Sez Semiconduct Equip Zubehoer | Ringförmige Aufnahme für einen rotierenden Träger |
US6040011A (en) * | 1998-06-24 | 2000-03-21 | Applied Materials, Inc. | Substrate support member with a purge gas channel and pumping system |
TW504776B (en) * | 1999-09-09 | 2002-10-01 | Mimasu Semiconductor Ind Co | Wafer rotary holding apparatus and wafer surface treatment apparatus with waste liquid recovery mechanism |
-
2001
- 2001-09-26 AT AT0151801A patent/AT413162B/de not_active IP Right Cessation
-
2002
- 2002-08-13 AT AT02018034T patent/ATE385611T1/de active
- 2002-08-13 DE DE50211641T patent/DE50211641D1/de not_active Expired - Lifetime
- 2002-08-13 EP EP02018034A patent/EP1298708B1/de not_active Expired - Lifetime
- 2002-08-23 JP JP2002244214A patent/JP4234375B2/ja not_active Expired - Fee Related
- 2002-09-05 US US10/235,316 patent/US7052577B2/en not_active Expired - Lifetime
- 2002-09-11 TW TW091120736A patent/TW578252B/zh not_active IP Right Cessation
- 2002-09-25 SG SG200205821A patent/SG105562A1/en unknown
- 2002-09-26 CN CNB021434425A patent/CN1305124C/zh not_active Expired - Fee Related
- 2002-09-26 KR KR1020020058270A patent/KR100721222B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR100721222B1 (ko) | 2007-05-22 |
AT413162B (de) | 2005-11-15 |
US7052577B2 (en) | 2006-05-30 |
DE50211641D1 (de) | 2008-03-20 |
TW578252B (en) | 2004-03-01 |
EP1298708A3 (de) | 2005-12-07 |
JP4234375B2 (ja) | 2009-03-04 |
SG105562A1 (en) | 2004-08-27 |
CN1305124C (zh) | 2007-03-14 |
CN1409385A (zh) | 2003-04-09 |
US20030056898A1 (en) | 2003-03-27 |
EP1298708B1 (de) | 2008-02-06 |
ATE385611T1 (de) | 2008-02-15 |
EP1298708A2 (de) | 2003-04-02 |
JP2003115475A (ja) | 2003-04-18 |
ATA15182001A (de) | 2005-04-15 |
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