KR20030010312A - Method for preparing multilayer package substrate using the rivet - Google Patents

Abstract

PURPOSE: A method for manufacturing a multiple layer package is provided to precisely set locations of substrates, miniature equipment, and simplify a process using a rivet. CONSTITUTION: A CCL substrate and a substrate are prepared. A dry film is laminated at the CCL substrate as a start material. Copper are laminated on both surfaces of the CCL substrate. A circuit is formed at the substrate through an exposure, developing, and etching. The CCL substrate and the substrate are laminated using adhesives. In order to prepare the CCL substrate and the substrate, rivet holes are drilled and formed at up and down, and left and right of the CCL substrate. The laminated substrates are fixed using a rivet(8). When rivet holes more than two are formed on one surface of each substrate, the rivet holes are located away from each other by an interval of 100-150 mm.

Description

Method for preparing a multilayer package substrate using rivets {Method for preparing multilayer package substrate using the rivet}

The present invention relates to a method for manufacturing a multi-layer package substrate using rivets, and more particularly, to use a rivet to form a rivet hole in the manufacture of the substrate to fix a plurality of substrates with rivets. It relates to a method for producing a high-layer package substrate.

Due to the continuous development of the electronic industry, the electronic component industry, which is attributable to it, is also developed. Accordingly, a denser substrate is required because the electronic component has a very dense cohesion. Thus, the package board of a multilayer printed circuit plays a part in miniaturization and high performance of an electronic component.

In the multilayer printed circuit board, a conductor circuit is formed on a plurality of substrates constituting the substrate in advance, and the substrates are bonded to each other to cope with mounting of highly integrated electronic components. Such multilayer printed circuit boards have various forms and are manufactured by various methods.

5 schematically illustrates the manufacturing principle of a conventional four layer multilayer package substrate. As shown in FIG. 5, in general, in order to form a multilayer substrate having a four-layer structure, a dry film is laminated on a CCL having copper laminated on both surfaces of an epoxy resin, and an inner layer circuit is formed through exposure, development, and etching. Prepreg and copper foil are attached to both sides to attach them at high temperature and high pressure. At this time, the inner layer core may be blackened in advance to increase the adhesive strength during the adhesion. Also, after bonding, the prepreg is obtained to the required size through mechanical processing (trimming) to eliminate the flow out of the required area.

However, as high-performance electronic components are required, four or more high-layer boards are required. For example, Japanese Patent Laid-Open No. 5-183272 describes the main parts and conductors for mounting electronic parts. A multilayer board is prepared by joining a lowermost substrate having a pattern formed thereon, an adhesive layer, and an upper layer substrate having an opening therein, through-holes are formed in the multilayer board, and then a sheet-like mask capable of covering the openings is thermally compressed on the uppermost layer. A method of manufacturing a substrate for mounting a multilayer electronic component is described by performing copper plating on the entire surface of the substrate, followed by etching the upper and lower plates to form a conductive pattern on the upper and lower plates, and then removing the mask. In addition, Japanese Patent Application Laid-open No. Hei 10-116933 discloses a multilayer printed wiring board for IC mounting in which a heat sink can be strongly fixed to a laminate by soldering, and the IC is strongly fixed to a heat sink using a resin adhesive. . In addition, Japanese Patent Application Laid-Open No. 10-116932 discloses warpage by heating the laminate at 200 ° C. for 1 hour, and then heating the laminate at 150 to 180 ° C. for 4 to 5 minutes in a reflow furnace, and using a thermosetting adhesive. After curing, the heat sink is fixed on the conductor circuit, and finally, it is heated at 240 to 250 ° C. for 5 to 10 seconds, and the solder is melted to connect the chip capacitor and the conductor circuit. Since the warpage phenomenon has been generated in advance, a method of manufacturing a multi-layer printed circuit board for mounting an IC which can suppress the warpage phenomenon even when heated at a high temperature of 240 ° C. or higher is described. In Japanese Patent Laid-Open No. 7-22756, when manufacturing a printed circuit board, a thin plate-opening recess is formed in a portion of the outermost substrate that becomes the outermost layer in advance facing the electronic component mounting portion. Is formed by a projection having a thickness thinner than that of the outermost layer substrate. The lower substrate has a mount and an opening. The outermost substrate is laminated on the plurality of substrates, through-holes are formed, and through-hole metal plating is performed. Also described is a method of manufacturing a multilayer printed circuit board in which a conductor circuit is formed on the surface of an outermost layer substrate by etching and the protrusion is removed to form an opening.

As can be seen from the prior art, pins are commonly used to precisely stack a plurality of substrates. FIG. 6 is a cross-sectional side view of a multilayer package in which a plurality of substrates are fixed and stacked using pins according to a conventional method, and each of the substrates is precisely positioned when the prepared substrates are stacked at a time using a prepreg having a low flow rate. You will use pins to match them. However, when the pin is used, the fixing and dismantling is performed by using about 4 pinholes on the substrate. In the case of fixing, a huge fixing device is used and another dismantling device is used for dismantling. Become.

Accordingly, an object of the present invention is to solve the above-mentioned problems and to manufacture the high-performance high-layer package substrate, and to precisely position each of the substrates manufactured, while minimizing the equipment and simplifying the process. It is to provide a method of manufacturing a substrate.

In order to achieve the above object, a method of manufacturing a multilayer package substrate of the present invention includes a substrate having a circuit formed through exposure, development and etching after laminating a dry film using a CCL substrate having copper laminated on both surfaces as a starting material. In the method of manufacturing a multi-layer package substrate in which each of the prepared substrates is prepared and laminated by using an adhesive, each of the substrates is formed by drilling a rivet hole in each of the top, bottom, left and right sides of the CCL substrate, which is a material when preparing the substrate. And, it is characterized in that the substrate to be laminated by using a rivet.

1 is a side cross-sectional view showing a riveting method according to the present invention,

Figure 2 is a side cross-sectional view showing a multi-layer package substrate fixed with rivets according to the present invention,

Figure 3 is a plan view showing a position for drilling a rivet hole in the substrate for fixing the rivet according to the present invention,

4A and 4B are schematic diagrams schematically showing manufacturing steps of respective substrates according to an embodiment of the present invention.

5 is a configuration diagram showing a manufacturing step of a conventional multi-layer package substrate of a four-layer structure,

6 is a side cross-sectional view of a multilayer packager in which a plurality of substrates are fixed and stacked by using a pin according to a conventional method.

<Brief Description of Drawings>

1, 2, 3, 4, 5, 6: Substrate 7, 11: Prepreg

8: rivet 9: rivet hole

10: heat sink 12: chip

13: metal wire 14: fixing pin

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.

1 is a side cross-sectional view illustrating a method of stacking substrates by rivets according to the present invention, wherein each substrate prepared as shown is stacked at one time using a prepreg. At this time, a rivet can be attached to the rivet hole which is drilled and formed at the time of manufacture of a board | substrate, and can position a board | substrate precisely by attaching a rivet.

One example of the manufacturing steps of each substrate for use by the method according to the invention is shown in FIGS. 4A and 4B. FIG. 4A is a diagram illustrating a step of manufacturing the substrate of the first layer, the second layer, and the sixth layer from the upper layer in FIG. 2, and FIG. 4B is the third layer, the fourth layer, and the third layer from the upper layer in FIG. 2. 5 shows a step of manufacturing a five-layer substrate.

The substrates manufactured by the method of FIG. 4A are prepared as substrates without circuits to protect the internal cavity of the substrate and to protect the conductor circuits printed on the upper and lower layer substrates. As shown in FIG. 4A, a CCL substrate having copper laminated on both surfaces is used as a starting material, and copper is etched from the front surface, and then an internal cavity is formed to an appropriate size using a router.

As the substrate usable in the present invention, glass epoxy resin, glass bis merimide triazine resin, glass polyimide resin, polyethylene terephthalate, polyphenylsulfone, polyimide and the like can be used, and in particular, glass epoxy resin is preferred. It is not limited to this. As shown in FIG. 4B, a conventional surface treatment including exposure, development, and etching is performed on a CCL substrate laminated with copper on both sides to form a conductor printed circuit at upper and lower ends of each layer. Thereafter, routers are used to form internal cavities to a suitable size and to blacken the surface to facilitate lamination. As the method of forming a conductor circuit, a conventional method such as a tenting method, a soldering peeling method, a fluoride method, or the like, or a transfer method in which the conductor circuit is formed by electrolytic copper plating or the like beforehand and transferred by an adhesive such as prepreg is used. It may be, but is not limited to such. The internal cavity size of the substrates produced by the method is the largest in the first layer and the smallest in the sixth layer. The method of manufacturing the substrate has been specifically described for the purpose of illustration, but is not limited thereto.

Figure 2 shows a form in which the rivet according to the present invention is installed on the substrates produced by the method described above. In order to obtain the final product as in FIG. 2, hole processing is performed before laminating the dry film in the manufacturing step of the substrate as in FIGS. 4A and 4B. Such hole processing is as shown in FIG.

Figure 3 is a plan view showing a position for drilling a rivet hole for fixing the rivet according to the present invention, which is formed by drilling a rivet hole in each of the top, bottom, left and right of the CCL substrate, each of the top, bottom, left and right or the The above hole processing is possible, and most preferably, two holes are drilled into a total of eight holes. In addition, when two or more rivet holes are placed on one surface of each substrate, it is preferable to be drilled at intervals of 100 to 150 mm.

Therefore, since the hole processing is formed at the time of manufacture of the substrate, the layers can be formed to be precisely aligned with each other comprehensively in the state where the circuits are already formed. It also eliminates the need to produce the desired size by mechanically processing the contour after lamination as in the conventional method.

In addition, while the conventional pin method should be fixed by using a huge fixing device using about 4 pinholes on the board and dismantled using a separate dismantling device, the rivet can be used as it is without dismantling after use. . In addition, the rivet can be freely manufactured to a desired size according to the substrate thickness, preferably can be produced in a thickness of 1/3 to 1/4 of the substrate thickness, for example, if the 1.5mm produced 0.3 ~ 0.4mm Can be used.

As described above, the method for manufacturing a multilayer package substrate by the method according to the present invention not only obtains excellent position alignment even when laminated with a small amount of prepreg, but also position alignment of a plurality of substrates is absolutely Excellent and also the miniaturization of the riveting device can simplify the equipment and simplify the implementation process.

All simple modifications and variations of the present invention fall within the scope of the present invention, and the specific scope of the present invention will be apparent from the appended claims.

Claims (3)

Multi-layers in which CCL substrates on which copper is laminated on both sides are used as starting materials, and dry films are laminated, and substrates each having a circuit formed through exposure, development and etching are prepared, and the respective substrates are laminated using an adhesive. In the manufacturing method of the package substrate, When preparing the respective substrates, rivet holes are formed in each of the upper, lower, left, and right sides of the CCL substrate, which is a material, and the laminated substrates are fixed by rivets. Way. The method of claim 1, wherein two rivet holes are drilled on the upper, lower, left, and right sides of the CCL substrate. The method of manufacturing a multi-layer package substrate using rivet according to claim 1, wherein the rivet holes are drilled at intervals of 100 to 150 mm when two or more rivet holes are placed on one surface of each substrate.