KR20030003893A - 솔더볼 범핑 장치 - Google Patents
솔더볼 범핑 장치 Download PDFInfo
- Publication number
- KR20030003893A KR20030003893A KR1020010039745A KR20010039745A KR20030003893A KR 20030003893 A KR20030003893 A KR 20030003893A KR 1020010039745 A KR1020010039745 A KR 1020010039745A KR 20010039745 A KR20010039745 A KR 20010039745A KR 20030003893 A KR20030003893 A KR 20030003893A
- Authority
- KR
- South Korea
- Prior art keywords
- solder ball
- hole
- block
- printed circuit
- circuit board
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 98
- 238000001179 sorption measurement Methods 0.000 claims description 37
- 238000000034 method Methods 0.000 claims description 21
- 238000007789 sealing Methods 0.000 claims description 6
- 230000002950 deficient Effects 0.000 abstract description 7
- 238000010521 absorption reaction Methods 0.000 abstract 2
- 239000004065 semiconductor Substances 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000004907 flux Effects 0.000 description 2
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (5)
- 다수개의 제1통공이 형성되며 상기 통공에 진공흡착 호스가 연결된 상부 블록;상기 상부 블록의 제1통공과 동일 위치에 형성된 제2통공을 구비하며 배면에 상기 제2통공에서 인출된 가이드 유로가 설치된 중간 블록;상기 상부 블록과 결합되면서 중간 블록을 진공밀폐시키며 상기 가이드 유로의 단부에 연결되는 제3통공을 구비한 하부 블록;상기 하부 블록의 배면에 부착설치되며 각 제3통공과 일대일 대응하는 다수의 솔더볼 흡착 유닛을 구비한 솔더볼 흡착 스트립을 포함하는 것을 특징으로 하는 솔더볼 범핑 장치
- 제 1 항에 있어서,상기 가이드 유로는 중간 블록을 일부 깍아내어 요(凹)부 형태로 이루어진 것을 특징으로 하는 솔더볼 범핑 장치
- 제 1 항에 있어서,상기 진공흡착 호스는 각각 개별제어가 가능하도록 형성된 것을 특징으로 하는 솔더볼 범핑 장치
- 제 1 항에 있어서,상기 중간 블록은 상부 블록과 일체로 형성된 것을 특징으로 하는 솔더볼 범핑 장치
- 제 1 항에 있어서,상기 솔더볼 흡착 유닛은 솔더볼이 범핑될 인쇄회로기판의 솔더볼 패드와 동일한 위치에 홀이 형성된 것을 특징으로 하는 솔더볼 범핑 장치.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020010039745A KR100720409B1 (ko) | 2001-07-04 | 2001-07-04 | 솔더볼 범핑 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020010039745A KR100720409B1 (ko) | 2001-07-04 | 2001-07-04 | 솔더볼 범핑 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20030003893A true KR20030003893A (ko) | 2003-01-14 |
KR100720409B1 KR100720409B1 (ko) | 2007-05-22 |
Family
ID=27713349
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020010039745A KR100720409B1 (ko) | 2001-07-04 | 2001-07-04 | 솔더볼 범핑 장치 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100720409B1 (ko) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100482810B1 (ko) * | 2001-12-28 | 2005-04-14 | 동부아남반도체 주식회사 | 솔더볼 공급장치 |
KR100618308B1 (ko) * | 2005-01-27 | 2006-09-13 | 한미반도체 주식회사 | 솔더볼 흡착장치 및 흡착방법 |
KR100735517B1 (ko) * | 2007-04-02 | 2007-07-04 | 주식회사 고려반도체시스템 | 개선된 솔더볼 파지 기능을 갖는 솔더볼 어태치 장치 및 그제어 방법 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3360435B2 (ja) * | 1994-10-14 | 2002-12-24 | 株式会社日立製作所 | 電子回路装置の製造方法 |
KR100216799B1 (ko) * | 1996-10-24 | 1999-09-01 | 김규현 | 솔더볼 범핑 장비의 솔더볼 안착장치 |
JP3526738B2 (ja) * | 1998-02-05 | 2004-05-17 | 千住金属工業株式会社 | 球状はんだの搭載装置および搭載方法 |
KR200245731Y1 (ko) * | 1998-11-06 | 2001-12-17 | 마이클 디. 오브라이언 | 반도체패키지의회로기판구조 |
-
2001
- 2001-07-04 KR KR1020010039745A patent/KR100720409B1/ko active IP Right Grant
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100482810B1 (ko) * | 2001-12-28 | 2005-04-14 | 동부아남반도체 주식회사 | 솔더볼 공급장치 |
KR100618308B1 (ko) * | 2005-01-27 | 2006-09-13 | 한미반도체 주식회사 | 솔더볼 흡착장치 및 흡착방법 |
KR100735517B1 (ko) * | 2007-04-02 | 2007-07-04 | 주식회사 고려반도체시스템 | 개선된 솔더볼 파지 기능을 갖는 솔더볼 어태치 장치 및 그제어 방법 |
Also Published As
Publication number | Publication date |
---|---|
KR100720409B1 (ko) | 2007-05-22 |
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