KR20030001773A - Method for designing and manufacturing about electronic parts and production jig - Google Patents

Abstract

PURPOSE: A method for designing and manufacturing electronic components and a production jig is provided to enhance productivity and reduce a manufacturing cost by improving a production process and a manufacturing method to reduce an error rate. CONSTITUTION: A guide hole formation process is performed to form a plurality of guide holes(102,103). A heat-sink path, and an air and gas exhaust path formation process are performed to form a heat-sink path(205) and an air and gas exhaust path. A heat-sink hole is formed on a heat-sink plate and reinforcement plate(201) if a drawing of the heat-sink plate and reinforcement plate(201) is designed to reduce bubbles in a hot press process. A corrosion and sanding surface is processed by performing a corrosion and sanding work. A gas exhaust hole(202) is formed if a projected part is generated on the heat-sink plate and reinforcement plate(201).

Description

Electronic part and production jig design and manufacturing method {Method for designing and manufacturing about electronic parts and production jig}

The present invention relates to a jig, a production process and a manufacturing method for the design, production, and quality improvement of a part of mechanical and electronic products, and in particular, the development and invention of the auxiliary jig during the design and production of heating plates and reinforcement plates. It is a new design that improves the defect rate and workability of parts by improving the method and improves the performance of the product by reducing the cost and productivity of the product. It is about a method.

Current circuit boards made of conventional current circuit boards (PCB, F.PCB, metal PCB), etc., or any material, and are made of a compound such as metal, epoxy (plastics) and glass, and serve as heat sinks, reinforcement plates, or heat sinks, and function of reinforcing plates. When assembling various parts such as chip part, resistance, condenser, etc. on the current circuit board, the part that is not in contact due to the surface state of the heat sink, reinforcement plate, and the base material or the current Unetched on the circuit board (the work to corrode the remaining parts, leaving only the part formed with copper wire to form a circuit) or marking part (indicates the position of assembling the parts or later holds parts assembly parts such as chips as protrusions) ) Plane underneath to join the current circuit board to the heat sink or reinforcement plate while protruding above the corroded part. Place the reinforcement plate, put graft paper (paper) on it, put the vinyl film (PEP) on it, place the product on the heat sink or reinforcement plate to be bonded on it, and put the vinyl film (PEP) on the product. Set up multiple layers by placing the compo (subsidiary materials for close contact between the circuit part and the corrosion part), placing graft paper (paper feeder) on it, and then placing the hot press stiffener plate again. As the conventional technology has been progressed by applying the work to keep the product in close contact with the product at normal or normal temperature according to the product,

First, regardless of the material of the heat sink or reinforcing plate by using a private flat plate, the adhesive strength is reduced, the required adhesion did not come out.

Second, it uses the compo (subsidiary materials used for close contact between the circuit part and the corrosion part) but it is a protruding circuit because the entire area is pressurized under the condition that the product is placed on the plate and the plate press reinforcement plate is placed. When the frame is formed or when the frame is formed on the product as a printing or attachment such as marking, the air (air) or the generated gas in that range cannot be escaped because the upper projecting part is pressured first. This results in less product production.

Third, small bubbles (remaining air or gas) occur in the process of bonding the flat-panel wool which functions as a heat sink or reinforcing plate and the current circuit board, and air or gas in the marking of the current circuit protrusion or the assembly of parts is released. It remains unbonded due to the presence of unbonded parts. As a result, there are severely inadequate parts in the parts assembly parts (circuit concentrated), chip, and other parts assembly parts markings, resulting in high defect rate and product performance when assembling chips and other parts. The deterioration in function and of course the durability of the finished product.

Fourth, the pressure and temperature to which the part of the current circuit board welded to the heat sink or reinforcement plate is transferred when the thickness of the heat sink or reinforcement plate is 1.5Ø by performing the adhesive work by hot press in the same way as the general current circuit board manufacturing method. The remaining current circuit boards that are not welded to the heat sink and the reinforcement plate cannot maintain the same press pressure and temperature in the space as much as 1.5Ø + current circuit board. As a result, the parts that are not bonded to the heat sink or the reinforcement plate (the part that exists in the space) are curled up and down, and severe curls are generated at the exposed parts of the current circuits or other parts assembled at the ends. By being generated, this also causes the defective products of the product to increase.

Fifth, in providing a heat dissipation function by bonding the heat sink to the electronic circuit board, it became a factor to reduce the heat dissipation effect by using a private flat plate.

The present invention has been made to solve the problems described above, by inducing the discharge of air (air) or generated gas in the bubble phenomenon or the protrusion of the entire bonding site to maintain a high adhesion and maximize the heat dissipation effect of the circuit board The purpose is to provide a jig design and manufacturing process method necessary for the design and production of electronic parts that can improve curling and creasing of open circuit parts.

Figures 1a to 1c is a configuration diagram illustrating the front and rear views of the finished product of the FPC circuit board produced with the design and manufacturing process of the heat sink or reinforcement plate, the plane holding jig plate of the present invention in detail.

2a to 2c is a gas hole (hole) and air (air) of the heat sink reinforcement plate of the present invention through the heat sink from the rear of the heat generating assembly to increase the overall heat dissipation effect by the gas discharge generated during the manufacturing process Design diagram for enlargement of holes and maximum heat dissipation area and heat dissipation.

3 is a flat retaining jig plate according to the present invention is made of the same material and the input hole of the heat sink and reinforcement plate and the welded FPC, PCB electronic circuit board is in close contact with the plane holding jig plate in a flat state, generated in the space state This is a block diagram that improves the adhesion of the circuit board to curling and curling of the circuit ground.

Figures 4a and 4b is a flat holding jig plate developed by the present invention by setting the FPC, PCB electronic circuit board welded to the heat sink or reinforcement plate on the flat holding jig plate, the adhesion of the product and the flatness, the curl of the terminal part Schematic setting diagram to prevent phenomena.

FIG. 5 is a view illustrating a process in which a FPC and a PCB circuit board are in a space state and hot-pressed (adherent work) by arranging in a state of being in contact with a heat sink or reinforcing plate between a press auxiliary plate and an auxiliary agent as a conventional hot press process as a conventional technology. .

Figure 6 is a FPC, a PCB circuit board in contact with the heat sink or reinforcement plate invented in the present invention by inserting into the hole (hole) of the plane holding jig plate and the heat sink or reinforcement plate formed in the plate FPC, Example process diagram for performing a hot press (press) after setting the PCB circuit board to be in close contact with the plane.

* Description of the symbols for the main parts of the drawings *

101: FPC, PCB circuit board 102: heat dissipation, gusset plate guide hole

103: FPC, PCB guide hole 104: FPC, PCB corrosion

105: FPC, PCB current circuit 106: open ground circuit

107: marking line for parts assembly 108: chip die part

109: chip marking line 110: the part to dry up and down the FPC

111: wire bonding connection circuit with chip (CIP)

201: heat sink, reinforcement plate 202: air exhaust hole

203: Heat dissipation furnace on the back of the part

205: heat dissipation 206: bending portion

207: corrosion, sanding back (corrosion, sanding adhesive surface)

301: flat retaining plate 302: heat sink, reinforcing plate insertion hole

401: product contact state 402: flat jig surface

501: hot press auxiliary plate 502: cushion paper

503: COMFORMER (PVC) 504: TPX (polyester)

505: COVERLAY (polyimide film)

The present invention for achieving the above object, in the design of the electronic components and production jig and manufacturing method thereof, FPC, PCB electronic circuit board and heat sink, reinforcing plate, etc. of the various parts of various machines, electronic products are bonded and closely Design technology to solve the close contact part by air bubble (air or air is a value in the joining part) due to air (air) or gas generated from materials during manufacturing process. The manufacturing process and manufacturing method are included.

In addition, the present invention, by using the surface of the heat sink (reinforcement plate) according to the material of the uneven mold, the production of the press mold and corrosion, using the diamond or silica grains and air, etc. to increase the uneven height and surface area according to the material and design of the product It is characterized in that it comprises a heat sink (reinforcement plate) design and manufacturing method for the expansion of the heat dissipation area, the expansion of the adhesive area and the discharge of air (air) or generated gas.

In addition, the present invention, in the state in which the heat sink (reinforcement plate) and the FPC, PCB circuit board is in contact with the heat sink (reinforcement plate) of the same material and thickness of the hot press workable standard can be inserted into the flat portion of the jig By contacting FPC and PCB circuit board (the part that is not bonded with the heat dissipation board), the thermal conductivity and cold conductivity of the entire part of the product (parts) are kept to be the same as the flat maintenance jig, It is characterized by including the design of the production jig and its manufacturing method for preventing the phenomenon of curling up and down and the phenomenon of curling (crumpling) occurs.

In order to improve the above-described prior art, the method of corrosion of the surface irregularities forming mold or the chemical corrosion method according to the characteristics of the material in the heat sink or reinforcement plate of the private plane, steel stone, silica, sand, etc. By selecting the appropriate standard according to the material and hardness or the circuit layout design of the current circuit board, the surface irregularities are formed by the air pressure of the compressor, so that the circuit arrangement interval of the current circuit board is wide or the heat sink or reinforcement board and the current circuit board are first. It can be selected when there is no marking protruding at the assembly position of the chip, the resistor, the condenser, or the like at the bonded portion.

Although the present invention can form a concave-convex surface on the private plane to improve and prevent a small bubble phenomenon, it can induce adhesion and heat dissipation effect by expanding the surface area, but the circuit of the current circuit board is dense or the projecting height of the circuit Higher projections are formed by marking with high printing or by attaching a tape or attaching a tape to the assembly of parts such as chips, resistors, condensers, etc., and reinforcing hot presses located above and below the product during hot press work. Since the plate or reinforcing material is first contacted with the upper surface of the protrusion, air (air) or gas generated therein cannot be discharged to the outside.

For this reason, chips can be formed by forming holes in current circuit boards, or forming appropriate holes in heat sinks or reinforcement plates, and forming exhaust paths connected to the holes on the rear side of the grooves to induce air (air) or gas discharge to solve the non-adherent areas. When assembling parts such as resistors, resistors and condensers, air (air) or gas forms bubbles during SMD work that connects the circuit grounding part of the current circuit board and the circuit stopping part of the part with aluminum wire, gold wire, or other wire. It is not possible to maintain the assembly work height of chips and other parts, or to solve the defects caused by the cushioning phenomenon (bounced when the machine grounds the wire during SMD) and at the same time, it is a function of the heat sink. By increasing the surface area and acting as an alternating current passage of cold / hot air, at the same time to increase the heat dissipation effect.

In order to adhere the current circuit board to the heat sink and the reinforcement plate, the invention of the flat material holding jig plate of the same material and thickness of the heat sink and the reinforcement plate used in the product in the hot press work is applied to the heat holding plate of the product Produces the same hole as the standard of the reinforcement plate by mold or wire cutting and maintains the top view. Inserts the heat sink or reinforcement plate into the hole of the flat jig plate while the current circuit board is welded to the heat sink or reinforcement plate. By keeping the entire surface of the current circuit board in close contact with the surface of the plane holding jig plate, the same thermal conductivity and pressure are applied so that the current circuit board (FPC) curls up and down and the curl of the open copper ground circuit part is wrinkled. To improve the efficiency of the heat sink or reinforcement plate and the current circuit board (FPC). The current edition of the circuit board end of a novel design and manufacturing processes that prevent kkeokyineun phenomenon.

The above objects, features and advantages will become more apparent from the following detailed description taken in conjunction with the accompanying drawings. Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The present invention to achieve the above object is to improve the product adhesion degree necessary for the development and production of electronic component parts for the electronic component design and production of the product, and the FPC, PCB circuit board contact area and other planes and parts (air) air In order to remove the generated gas and to secure the heat dissipation area and heat dissipation hole of the heat sink, circuit design drawings (data) of electronic components (FPC, PCB circuit board) are prepared in the design of the product jig plate and the manufacturing process thereof. When the raw materials and subsidiary materials are determined by using the drawings, and the required molds and drawings are prepared, the parts of each part are manufactured by the work process, and the FPC and PCB circuit boards are completed, and the heat sink or reinforcement board is completed. The close contact work by hot press work is completed and then the necessary parts are assembled. At this time, the specific configuration of the present invention that has not been solved in the prior art and production manufacturing process as an embodiment for each part to the finished product of Figure 1a to 1c,

Figures 2a to 2c shows the work of the guide holes 102 and 103 as a press mold operation or other processing method depending on the material of the product manufactured by the mold or wire cutting, etc. in the manufacture of the heat sink or reinforcement plate Next, the heat dissipation path 205 and the air (air) and gas discharge path 204 are formed, and the working drawings of the heat dissipation plate and the reinforcing plate 201 are bubbled during the hot press operation by the circuit diagram 101 of the FPC and PCB circuit boards. In the case of a circuit design with less phenomena, the heat dissipation hole 203 on the rear part of the heat sink and the reinforcing plate 201 works to corrode the adhesive surface, sanding (surface area and adhesion strength improvement, and surface irregularities to prevent fine bubbles). To form a corroded and sanded surface 207 and to form the protrusions 105 and 109 on the heat sink and the reinforcement plate 201 such as the FPC and the PCB circuit 105. Air) and the generated gas discharge hole (202) Forming the ding surface 207,

3 is a planar holding jig flat plate 301 which is selected as a material having the same material and thickness as the heat sink or reinforcing plate 201 to maintain the same thermal conductivity and cooling rate to maintain the same shrinkage phenomenon for each part of the product. The insertion hole 302 of the heat sink or reinforcement plate 201 is made, and the semi-finished product 401 in the temporary contact state is inserted into the insertion hole 302 so that the heat sink or reinforcement plate 201 is brought into close contact with the plane holding jig plane plate 301. (301) 302, FPC, PCB circuit board 101 to maintain the thermal conductivity and the cooling rate after the hot press the same by parts of the product by closely contacting the plane of the plane holding jig flat plate 301, not the space state As a part of the circuit work process embodiment that is open and connected with the parts 110 and the crumpled or curled up and down of the FPC, PCB circuit board 101 by maintaining the same shrinkage phenomenon for each part of the product,

4A and 4B show an embodiment 401 in which a heat sink or reinforcing plate 201 is in contact with an FPC and a PCB circuit board 101 by a developed design and process to hot-press a flat holding jig plate 301. In order to insert the heat sink or reinforcement plate 201 into the plane holding jig plate 301 (302), the FPC and PCB circuit boards are brought into close contact with the plane of the plane holding jig plate 301 so as to maintain the flatness. Examples of working processes up to 206)

5 is a flowchart of a hot press operation for bonding (adhering) a product of the prior art, in which a heat sink (reinforcement plate) 201 is welded to an FPC and a PCB circuit board 101 is welded to a state 401 (TPX). 504 and the COVERLAY (polyimide film) 505 is an example in which the space is formed during the hot press operation of the product in the state 401 welded,

6 is a schematic diagram of an embodiment as a developed design and work process of FIGS. 2A, 2B, 2C, 3, 4A and 4B as an embodiment set before a hot press operation to produce a finished product of the representative view; .

The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and various substitutions, modifications, and changes are possible in the art without departing from the technical spirit of the present invention. It will be apparent to those of ordinary knowledge.

According to the present invention as described above, the air (air) or the gas on the joint site is completely discharged, and the adhesion surface is enlarged to improve the adhesion, and at the same time, the air (air) is generated on the lower part of the component where heat dissipation area and heat are generated Create a gas hole (life preserver) to increase the heat dissipation effect, and improve the assembly of parts (wire bonding and SMD) by improving the curling of the electronic circuit board and curling of the open ground circuit by using a flat holding jig plate. By smoothly reducing parts performance and defective rate, cost is reduced and the performance and durability of finished products are improved.

Claims (6)

In the design of electronic components and production jig and manufacturing method thereof, FPC, PCB electronic circuit board, heat sink, reinforcement board, etc. are parts of various parts of machinery and electronics that are bonded and closely contact each other due to air (air) or gas generated from materials during the manufacturing process. Design technology, manufacturing process, and manufacturing method for solving the close contact caused by the bubble phenomenon (a phenomenon in which air or air is valuable at the joint). The surface of the heat sink (reinforcement plate) can be increased by increasing the height and surface area according to the material and design of the product by using uneven mold, press mold and corrosion, diamond or silica grains and air. Heat sink (reinforcement plate) design and manufacturing method to enlarge the adhesive area and discharge air (air) or generated gas. The method of claim 2, As the current circuit is concentrated on the heat sink (reinforcement plate), FPC, PCB circuit board adhesive part (adhesive part), the projecting circuit is designed in a sealed form, or the marking line is formed by printing or tape on the parts assembly, so the height of protrusion is increased. Technology that makes upper and lower through holes at the point where air (air) gas does not affect the circuit of the part that cannot be leaked to one part during hot press work and designs the exhaust path at the back of the heat sink (reinforcement plate) And preparation method. The method of claim 2 or 3, Maximize the heat dissipation effect by expanding the uneven surface to the part where the air (air) gas discharge path is not needed, and expanding the heat dissipation area, making holes (holes) at the back of the parts that generate heat during use, and securing the flow path of cold / hot air Design and its manufacturing method. In the state where the heat sink (reinforcement plate) and the FPC and PCB circuit boards are in contact with each other, make a hole that can be inserted into a hot press workable material of the same material and thickness as the heat sink (reinforcement plate), and the FPC, PCB circuit board (heat sink) By holding the (reinforcement plate) and the non-adhesive part closely together, keeping the thermal conductivity and cold conductivity in the entire part of the product (part) the same as the flat maintenance jig, and bringing it into close contact with the circuit board or open ground circuit part. Design of a production jig and a method of manufacturing the same to prevent the occurrence of wrinkles. The method according to any one of claims 2, 3 or 5, The heat sink (reinforcement plate), FPC, PCB by completely removing the air (air) or the gas generated during the manufacturing process as a result of any one of claims 2, 3 or 5. Design, production process, and manufacturing method for solving the problem of not being grounded by bubble phenomenon when assembling parts to the part to be bonded (close) by close contact with circuit board.