KR200266543Y1 - A table moving device of TCP(Tape Carrier Package) bonding - Google Patents

Abstract

The present invention is a facility for crimping TN / STN CELL and TAB (Tape Automated Bonding) bonding materials, using a camera to see and align the marks on the monitor, and then thermally compressing them by a heater and automatically moving the stage. The present invention relates to a table moving device of a TCP (Tape Carrier Package) bonding machine capable of confirming a crimping state. The table moving device that can rotate automatically by accommodating the screw fixed to the drive motor enables safer operation, so the assembly structure is simple with the production of a large quantity of products, which enables efficient maintenance and repair of parts. There is a characteristic.

Description

A table moving device of TCP (Tape Carrier Package) bonding}

The present invention is a facility for crimping TN / STN CELL and TAB (Tape Automated Bonding) bonding materials, using a camera to see and align the marks on the monitor, and then thermally compressing them by a heater and automatically moving the stage. The present invention relates to a table moving device of a TCP bonding machine capable of confirming a crimping state, and more specifically, to a stage motor connected to a bonding head unit on a main body, which is fixed to a driving motor at a lower side of a plate so as to move left and right. The present invention relates to a table moving device capable of automatically rotating by receiving a screw.

In general, surface mount technology (SMT) is becoming more popular in the mounting of individual components due to the miniaturization, vitality, and high functionality of electronic devices, and components such as power meters are large and cannot support their own weight with lead. Except for this, most parts are surface mounted.

The surface mounting component includes a tape carrier package (TCP), which consists of a chip, which is a semiconductor device, and a coating portion coated with the chip on a corresponding surface of the chip.

In addition, the conventional TCP bonding machine for this purpose operates the plate by operating the cylinder, and fixes the head part on the upper side of the front panel. Therefore, if the mechanical fine adjustment and the bonding position and the input data value are not skilled, It causes a fatal defect, there was a problem that the productivity is reduced due to the long working time when replacing.

The present invention has been devised to solve the above problems, and by configuring the table moving device of the TCP bonding machine, which is safer and simpler to operate, to see and align the marks on the monitor, it is then thermally compressed by the heater and automatically It is an object of the present invention to provide a table moving device of a TCP bonding machine that can check a crimp state by moving a stage.

In order to achieve the above object, a table moving device capable of automatically rotating by receiving a screw fixed to a driving motor at a lower side of a plate to move a stage unit connected to a bonding head unit on a main body to the left and right to achieve the above object will be.

1 is a front view of the bonding machine attached to the main portion of the subject innovation

Figure 2 is a side view of the bonding machine attached to the main portion of the subject innovation

3 is a front view of the bonding head unit constructed by one embodiment of the present invention;

4 is a plan view of a bonding head unit constructed by one embodiment of the present invention;

5 is a front view of a stage unit constructed by one embodiment of the present invention

6 is a plan view of a stage unit constructed by one embodiment of the present invention

7 is a side view of a stage unit constructed by one embodiment of the present invention

8 is a front view of a camera unit constructed by one embodiment of the present invention

9 is a plan view of a camera unit constructed by one embodiment of the present invention

Explanation of symbols on the main parts of the drawings

10. Shaft Plate 11. Stopper Plate

12. Guide shaft 13. Head plate

14. Screw stopper 15. Heater

16. Base clamp 17. Air cylinder

18. Heater Bar 19. X, Y Stage Plate

20. Side cover 22. Drive motor

23. TAB guide plate 24. Light sensor

25. Stage plate 27. LM guide

28. Ball screw 29. Camera bracket

30. Camera 31. Z-axis camera control

32. X-axis camera control unit 33. Bonding head unit

34. Stage unit 35. Camera unit

36. Light sensor

The present invention consists of a bonding head unit in which the assembled head descends and a mark displayed on the monitor, and a stage unit moving automatically after thermal compression and a camera unit confirming the compression state.

Hereinafter, the configuration of the present invention with reference to the accompanying drawings in detail as follows.

1 is a front view of the bonding machine attached to the main portion of the present invention, Figure 2 is a side view of the bonding machine attached to the main portion of the present invention, Figure 3 is a front view of the bonding head unit configured by an embodiment of the present invention 4 is a plan view of a bonding head unit constructed by one embodiment of the present invention, FIG. 5 is a front view of a stage unit constructed by one embodiment of the present invention, and FIG. 6 is configured by one embodiment of the present invention. 7 is a plan view of a stage unit, FIG. 7 is a side view of a stage unit constructed by one embodiment of the present invention, FIG. 8 is a front view of a camera unit constructed by one embodiment of the present invention, and FIG. 9 is an embodiment of the present invention. It is a top view of the camera unit comprised by the example.

First, as shown in FIGS. 1 and 2, the bonding head unit 33 and the stage unit 34 are configured to be connected to each other to operate, and the camera unit 35 is disposed below the stage unit 34. Attached is configured to check the state of thermal compression.

At this time, the heater 15 and the heater bar 18 assembled to the bonding head unit 33 are preferably assembled to the head plate 13 and the guide plate 14, and the head plate 13 is It is fixed to the air cylinder 17 is configured to ride up and down the guide shaft 12.

On the other hand, the temperature generated by the heater 15 is applied differentially depending on the working conditions, the temperature range is 170 ℃ to 220 ℃ is appropriate, the time is suitable for 10 to 20 seconds.

Accordingly, the heater 15 assembled to the bonding head unit 33 descends to the surface of the plate 25 assembled to the stage unit 34 configured as shown in FIG. 5 while descending by the operation of the air cylinder 17. .

In addition, assembling the ball screw 28 connected to the driving motor 22 in the lower stage plate 25, the ball screw 28 is operated by the rotation of the driving motor 22, the stage plate 25 is a guide ( 27) It is configured to move left and right by riding.

In addition, as shown in FIG. 1, the camera unit 35 is assembled to a lower portion of the stage plate 25 and mounted on the optical sensor 36 in a compressed state of a CELL and a tape automated bonding (TAB) bonding material. It is assembled so that you can check it on the monitor.

In the above situation, the camera 30 is fixed to the camera bracket 29 and configured to adjust the focus of the camera by the Z-axis camera adjuster 31 and the X-axis camera adjuster 32.

Therefore, as the heater 15 fixed to the head plate 13 is lowered by the action of the air cylinder 17, the TAB bonding material is thermally compressed on the LCD mounted on the stage plate 25, and the thermo-compression material is pressed against the camera 30. You can check the crimping status through the monitor.

Referring to the operation and effects of the present invention made in the above configuration in detail as follows.

First, the "auto mode" switch (not shown) of the touch panel (not shown) is raised to the ON position.

The equipment is then ready for work. At this time, the stage plate 25 is moved to the home position by the rotation of the ball screw 28 connected to the drive motor 22, and at the same time each cylinder (not shown) also reaches the home position.

The operator then moves the "start" switch (not shown) of the touch panel (not shown) to the ON position.

Next, the operator places the LCD on the stage plate 25.

At this time, by pressing the "CELL" switch of the control box (not shown) the LCD (CELL) is adsorbed by the vacuum device (not shown) of the stage 25 so as not to be moved.

Next, the CELL and TAB bonding materials are aligned on the monitor by manual positioning, and the control box (not shown) is switched on and the stage plate 25 moves on the Y axis for bonding. .

In the above situation, since the stage plate 25 is assembled with the ball screw 28, there is no problem in moving, and in the movement, the guide plate 27 can move very precisely and accurately.

When the movement of the stage plate 25 is completed, the head plate 13 is lowered by the operation of the air cylinder 17.

At this time, the head plate 13 is connected to the guide shaft 12 and the screw stopper 14 can be safely operated.

As the head plate 13 descends as described above, a high temperature is generated in the heater 15.

Therefore, when the TAB bonding material caught on the heater bar 18 is bonded to the CELL surface, the head plate 13 is raised by the operation of the air cylinder 17 to be returned to its original position.

And the stage plate 25 can repeat the above-mentioned work process, returning to the original position by riding the guide 27 by the rotation of the ball screw 28.

The present invention described above is possible to those skilled in the art to which the present invention belongs to various modifications and changes can be made within the scope without departing from the technical spirit of the present invention in the foregoing embodiments and the accompanying drawings. It is not limited.

According to the table moving device of the bonding machine according to the embodiment of the present invention described above, by the action of the ball screw fixed to the drive motor on the lower side of the plate to move the stage unit connected to the bonding head unit to the left and right Because it can work more safely, it is simple to assemble together with the production of a large quantity of products, which is characterized by efficient maintenance and repair of parts.

Claims (1)

In the table moving device of the TCP bonder, The bonding head unit and the stage unit are configured to be connected to each other to operate, but the ball screw connected to the drive motor to move the left and right through the guide to accommodate the ball screw connected to the drive plate to move the stage plate formed on the stage unit Table moving device of the TCP bonder, characterized in that configured to