KR200208211Y1 - Liquefied Gas Line Heating Equipment for Etching Equipment - Google Patents

Liquefied Gas Line Heating Equipment for Etching Equipment Download PDF

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Publication number
KR200208211Y1
KR200208211Y1 KR2019950047443U KR19950047443U KR200208211Y1 KR 200208211 Y1 KR200208211 Y1 KR 200208211Y1 KR 2019950047443 U KR2019950047443 U KR 2019950047443U KR 19950047443 U KR19950047443 U KR 19950047443U KR 200208211 Y1 KR200208211 Y1 KR 200208211Y1
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South Korea
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gas line
conductor
process gas
outer circumferential
circumferential surface
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KR2019950047443U
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Korean (ko)
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KR970046700U (en
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안세일
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김영환
현대반도체 주식회사
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Priority to KR2019950047443U priority Critical patent/KR200208211Y1/en
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Abstract

본 고안은 웨이퍼의 표면에 증착된 필름을 에칭하는 에칭장비의 액화가스라인 히팅장치에 관한 것으로써, 좀더 구체적으로는 공정가스가 액화되기 쉬운 BCl₃를 챔버의 내부로 공급시 공정가스가 액화되지 않도록 한 것이다.The present invention relates to a liquefied gas line heating apparatus of an etching apparatus for etching a film deposited on the surface of a wafer. More specifically, the process gas is not liquefied when BCl₃ is easily supplied into the chamber. It is.

이를 위해, 공정가스가 통과되는 가스라인(1)의 외주면에 피복된 절연물(4)과, 상기 절연물의 외주면에 감싸여지게 위치되어 콘트롤러(3)에 의해 발열하는 도체(5)와, 상기 도체의 외주면에 피복되어 도체를 보호하는 절연피복(6)으로 구성된 것이다.To this end, an insulator 4 coated on the outer circumferential surface of the gas line 1 through which the process gas passes, a conductor 5 positioned to be wrapped around the outer circumferential surface of the insulator, and generated by the controller 3, and the conductor It is composed of an insulating coating (6) to cover the outer peripheral surface of the conductor.

Description

에칭장비의 액화가스라인 히팅장치Liquefied Gas Line Heating System for Etching Equipment

제 1 도는 종래의 장치를 나타낸 사시도1 is a perspective view showing a conventional device

제 2 도는 본 고안의 장치를 나타낸 사시도2 is a perspective view showing the device of the present invention

* 도면의 주요부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings

1 : 가스라인 3 : 콘트롤러 4 : 절연물 5 : 도체Reference Signs List 1 gas line 3 controller 4 insulator 5 conductor

6 : 절연피복6: insulation coating

본 고안은 웨이퍼의 표면에 증착된 필름을 에칭하는 에칭장비의 액화가스라인 히팅장치에 관한 것으로써, 좀더 구체적으로는 공정가스가 액화되기 쉬운 BCl₃를 챔버의 내부로 공급시 공정가스가 액화되지 않도록 한 것이다.The present invention relates to a liquefied gas line heating apparatus of an etching apparatus for etching a film deposited on the surface of a wafer. More specifically, the process gas is not liquefied when BCl₃ is easily supplied into the chamber. It is.

일반적으로 에칭장비에서 공정가스가 상온에서 액화되기 쉬은 BCl₃와 같은 공정가스를 사용할 경우에는 유량조절 콘트롤러(MFC)를 통과한 공정가스가 액화되니 않도록 가스라인을 히팅시켜 공정가스의 온도를 약 40 ~ 50℃로 유지시켜 주고 있다.In general, in case of using process gas such as BCl₃ where process gas is easily liquefied at room temperature in the etching equipment, heat the gas line to prevent the process gas passed through the flow control controller (MFC). It is kept at 50 degreeC.

첨부도면 제 1 도는 종래의 장치를 나타낸 사시도로써, 가스라인(1)의 외주면에 전선(2)을 감아 장비에 설치된 콘트롤러(3)를 조작하여 가스라인(1)을 히팅하도록 되어 있다.FIG. 1 is a perspective view of a conventional apparatus, in which a wire 3 is wound around an outer circumferential surface of the gas line 1 to operate a controller 3 installed in the equipment to heat the gas line 1.

따라서 공정가스가 보관된 공정가스 캐비넷으로 부터 에칭장비까지 가스라인(1)을 연결한 후 가스라인의 외주면에 전선(2)을 감은 다음 상기 전선을 공정가스 캐비넷의 콘트롤러(3)에 연결한다.Therefore, after connecting the gas line (1) from the process gas cabinet containing the process gas to the etching equipment, wound the wire (2) on the outer peripheral surface of the gas line and then connect the wire to the controller (3) of the process gas cabinet.

이러한 상태에서 챔버(도시는 생략함)의 내부에 에칭을 실시할 웨이퍼를 로딩시킨 다음 콘트롤러(3)에서 전선(2)에 전원을 인가하면 상기 전선이 발열하여 가스라인(1)을 통과하는 공정가스를 간접적으로 히팅하게 되므로 공정가스가 챔버의 내부로 공급되는 과정에서 액화되지 않게 된다.In such a state, a wafer to be etched is loaded into a chamber (not shown), and then power is applied to the wires 2 by the controller 3, and the wires generate heat to pass through the gas line 1. Since the gas is indirectly heated, the process gas is not liquefied while being supplied into the chamber.

그러나 이러한 종래의 장치는 가스라인(1)의 외주면에 전선(2)을 감아 전선의 발열에 따른 간접열을 공급되는 공정가스에 전달하도록 되어 있으므로 공정가스에 전달되는 열전도 분포가 불뷴일하게 되어 국부적인 액화현상이 일어나게 된다.However, such a conventional device is wound around the wire 2 on the outer circumferential surface of the gas line 1 so as to transmit indirect heat according to the heat generated by the wire to the supplied process gas, so that the heat conduction distribution delivered to the process gas becomes uneven. Liquefaction occurs.

만약, 공정가스가 액화된 상태로 챔버내에 유입되면 플라즈마(Plasma)를 형성하지 못하고 이물질로 작용하게 되므로 웨이퍼의 품질이 저하되었음은 물론 장비의 가동중에 에러가 자주 발생되는 문제점이 있었다.If the process gas is introduced into the chamber in a liquefied state, plasma does not form and acts as a foreign material, so that the quality of the wafer is deteriorated and an error occurs frequently during the operation of the equipment.

또한, 가스라인(1)의 외주면에 감겨진 전선(2)이 풀어지게 되므로 보행중에 작업자가 전선에 걸려 넘어지게 되는 안전사고가 발생될 염려도 있었다.In addition, since the electric wire 2 wound around the outer circumferential surface of the gas line 1 is released, there is a fear that a safety accident may occur when a worker trips over the electric wire while walking.

본 고안은 종래의 이와 같은 문제점을 해결하기 위해 안출한 것으로써, 그 구조를 개선하여 공정가스를 균일하게 히팅함과 동시에 가스라인을 단일관으로 형성할 수 있도록 하는데 그 목적이 있다.The present invention has been made to solve such a problem in the prior art, and its purpose is to improve the structure to uniformly heat the process gas and to form a gas line in a single tube.

상기 목적을 달성사기 위한 본 고안의 형태에 따르면, 공정가스가 통과되는 가스라인의 외주면에 피복된 절연물과, 상기 절연물의 외주면에 감싸여지게 위치되어 콘트롤러에 의해 발열하는 도체와, 상기 도체의 외주면에 피복되어 도체를 보호하는 절연피복으로 구성됨을 특징으로 하는 에칭장비의 액화가스라인 히팅장치가 제공된다.According to an aspect of the present invention for achieving the above object, an insulator coated on the outer circumferential surface of the gas line through which the process gas passes, a conductor positioned to be wrapped around the outer circumferential surface of the insulator, and generated by a controller, and an outer circumferential surface of the conductor Provided is a liquefied gas line heating apparatus of an etching apparatus, characterized in that the coating is covered with an insulating coating to protect the conductor.

이하, 본 고안을 일 실시예로 도시한 첨부된 도면 제 2 도를 참고로 하여 더욱 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings of FIG. 2 as an embodiment.

첨부도면 제 2 도는 본 고안의 장치를 나타낸 사시도로써, 본 고안은 공정가스가 통과되는 가스라인(1)의 외주면에 절연물(4)이 피복되어 있고 상기 절연물의 외주면에는 콘트롤러(3)에 의해 발열하는 도체(5)가 감싸여지게 위치되어 있으며 상기 도체의 외주면에는 도체를 보호하는 절연피복(6)이 피복되어 있다.FIG. 2 is a perspective view showing the device of the present invention, in which the insulator 4 is coated on the outer circumferential surface of the gas line 1 through which the process gas passes, and the outer circumferential surface of the insulator generates heat by the controller 3. The conductor 5 is positioned to be wrapped, and the outer peripheral surface of the conductor is covered with an insulating coating 6 to protect the conductor.

이때 가스라인(1)은 스테인레스관으로 하고 절연물(4)은 10MΩ이상으로 하며, 도체(5)는 1Ω이하로 하고 절연피복(6)은 1KV/Cm이상으로 한다.At this time, the gas line 1 is made of stainless steel pipe, the insulator 4 is 10MΩ or more, the conductor 5 is 1Ω or less, and the insulation coating 6 is 1KV / Cm or more.

이와 같이 구성된 본 고안의 작용, 효과를 설명하면 다음과 같다.Referring to the operation, effects of the present invention configured as described above are as follows.

먼저, 단일관으로 형성된 본 고안의 가스라인을 공정가스가 보관된 공정가스 캐비넷으로 부터 에칭장비까지 연결한 후 도체(5)에 연결된 전선(7)을 공정가스 캐비넷의 콘트롤러(3)에 연결한다.First, the gas line of the present invention formed of a single pipe is connected to the etching equipment from the process gas cabinet in which the process gas is stored, and then the wire 7 connected to the conductor 5 is connected to the controller 3 of the process gas cabinet. .

이러한 상태에서 챔버(도시는 생략함)의 내부에 에칭을 실시할 웨이퍼를 로딩시킨 다음 콘트롤러(3)에서 전선(7)을 통해 도체(5)에 전원을 인가하면 상기 도체가 발열하여 가스라인(1)을 통과하는 공정가스를 균일하게 간접적으로 히팅하게 되므로 공정가스가 챔버의 내부로 공급되는 과정에서 액화되지 않게 되는 것이다.In such a state, a wafer to be etched is loaded into a chamber (not shown), and when the controller 3 applies power to the conductor 5 through the electric wire 7, the conductor generates heat to generate a gas line ( Since the process gas passing through 1) is uniformly and indirectly heated, the process gas is not liquefied while being supplied into the chamber.

이상에서와 같이 본 고안은 공정가스를 공급하는 가스라인이 단일관으로 형성되어 있어 그 구조가 간단해지게 됨은 물론 챔버측으로 공급되는 공정가스를 균일하게 히팅하여 액화되는 것을 미연에 방지하게 되므로 웨이퍼의 품질을 향상시케게 되는 효과를 얻게 된다.As described above, the present invention is a gas line for supplying the process gas is formed of a single tube, so that the structure is simple, as well as to uniformly heat the process gas supplied to the chamber side to prevent liquefaction in advance. The effect is to improve the quality.

Claims (1)

공정가스가 통과되는 가스라인의 외주면에 피복된 절연물과, 상기 절연물의 외주면에 감싸여지게 위치되어 콘트롤러에 의해 발열하는 도체와, 상기 도체의 외주면에 피복되어 도체를 보호하는 절연피복으로 구성됨을 특징으로 하는 에칭장비의 액화가스라인 히팅장치.It consists of an insulator coated on the outer circumferential surface of the gas line through which the process gas passes, a conductor positioned to be wrapped on the outer circumferential surface of the insulator and generating heat by the controller, and an insulation coating which is coated on the outer circumferential surface of the conductor to protect the conductor. Liquefied gas line heating device for etching equipment.
KR2019950047443U 1995-12-26 1995-12-26 Liquefied Gas Line Heating Equipment for Etching Equipment KR200208211Y1 (en)

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Application Number Priority Date Filing Date Title
KR2019950047443U KR200208211Y1 (en) 1995-12-26 1995-12-26 Liquefied Gas Line Heating Equipment for Etching Equipment

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KR2019950047443U KR200208211Y1 (en) 1995-12-26 1995-12-26 Liquefied Gas Line Heating Equipment for Etching Equipment

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KR970046700U KR970046700U (en) 1997-07-31
KR200208211Y1 true KR200208211Y1 (en) 2001-11-30

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100674476B1 (en) * 2005-04-28 2007-01-30 (주)티티에스 Block heater for gas line

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100674476B1 (en) * 2005-04-28 2007-01-30 (주)티티에스 Block heater for gas line

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KR970046700U (en) 1997-07-31

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