KR20020094614A - Pick up tool for semiconductor device - Google Patents

Abstract

PURPOSE: An apparatus for picking up a semiconductor device is provided to maintain constantly a pitch value between pickup headers by controlling automatically relative pitch values between the plural pickup headers. CONSTITUTION: A horizontal guide portion(12) is fixed to a front portion of a frame(11). A plurality of pickup headers(30) are coupled with the horizontal guide portion(12). A guide block(31) is installed at the pickup header(30). A support block(32) is combined with a flat plate portion(33). A cylinder(34) is installed in a passing hole of the flat plate portion(33). An elevation shaft(35) is combined with the cylinder(34). A support portion(37) is installed at a front face of the support block(23). A nozzle is installed on a back side of the support portion(37). A spring(38) is installed on an outer circumference of the elevation shaft(35). A plurality of upper pulleys(14a) are installed at a left side and a right side of the frame(11). An upper belt(13a) is connected between the upper pulleys(14a). A plurality of lower pulleys(14b) are installed at a lower side of the upper pulleys(14a). A lower belt(13b) is installed between the lower pulleys(14b). The upper and the lower pulleys(14a,14b) are operated by a driving motor(15). A plurality of pickup headers(30) are connected to a plurality of belts(13a,13b). A belt clamp(39) is fixed by the upper and the lower belts(13a,13b). The pickup headers(30a,30b) are coupled with the upper belt(13a). The pickup belt(30c) is coupled with the lower belt(13b). A vertical guide portion(21) is installed at a back side of the frame(11).

Description

Pick up device for semiconductor device

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pickup device, and more particularly, to a pickup device of a semiconductor device having an improved structure to adjust relative pitch values of a plurality of pickup headers.

Typically, semiconductor devices, such as surface mount devices and handlers, pick up electronic components and mount them on a circuit board or mount them on a burn in board to inspect electrical properties. Device. Such a device makes horizontal, vertical and rotational movements possible by using a pickup device that picks up an electronic component so that it can be mounted in a desired position.

In recent years, the pickup apparatus includes a plurality of pickup headers, and the pickup headers perform linear reciprocating motion along the horizontal and vertical guides, thereby mounting the electronic components on the substrate or the socket, or inspecting the electrical characteristics after mounting. At this time, the pitch between the electronic components adsorbed by the nozzle of each pickup header should maintain the same pitch as the pitch between the component mounting portions formed on the substrate or socket to be mounted. To this end, each pickup header adjusts the pitch in the horizontal and vertical directions.

By the way, the conventional pickup apparatus has the following problems.

First, the pickup header provided in the pickup device is fixed while maintaining a constant pitch. Accordingly, when the pitch between each pickup header changes, it is necessary to set the relative position of each header and adjust the pitch values between the respective pickup headers individually using the fastening means at that position, which takes a lot of adjustment time.

Second, since each pickup header is driven independently, it is not easy to adjust it when there is a change in pitch value.

Second, since a drive source for driving each pickup header is provided to drive each of them, the structure of the pickup device becomes complicated and it is difficult to maintain a high precision of the pitch value.

SUMMARY OF THE INVENTION The present invention is directed to a pickup device of a semiconductor device which is capable of automatically adjusting the pitch between a plurality of pickup headers and changing the pitch value while maintaining the same pitch between each pickup header. The purpose is to provide.

1 is a front view showing a pickup device according to a first embodiment of the present invention,

2 is a plan view of FIG.

3 is a side view of a portion of FIG. 1;

4 is a perspective view of FIG.

5 is a front view showing a pickup device according to a second embodiment of the present invention;

6 is a front view showing a pickup device according to a third embodiment of the present invention.

<Brief description of symbols for main parts of the drawings>

10.Horizontal movement means 11 ... Frame

12.Horizontal guide section 13 ... Belt

14 horizontal pulley

20 Vertical movement means 21 Vertical guide

22 Vertical pulleys 30 Pickup header

31.Guide block 32 ... Support block

34 cylinder 36 nozzle

38 ... spring 39 ... belt clamp

In order to achieve the above object, a pickup device of a semiconductor device according to an aspect of the present invention,

frame;

A plurality of pickup headers provided on the frame; And

The pickup header is coupled to maintain the same pitch value between each pickup header, horizontal movement means installed to move in the opposite direction to each other; characterized in that it comprises a.

In addition, the horizontal movement means,

Drive source;

At least one pulley connected to the drive source and installed in the frame so as to be rotatable by the driving force supplied therefrom; and

And a belt connected to synchronize the pulley and installed so that the pickup header is moved in a direction opposite to each other.

In addition, the pulley is characterized in that it comprises a drive pulley coupled to the power take-out shaft drawn from the drive source, and a driven pulley coupled to the drive pulley having a rotation ratio of an integer multiple.

Further, the driving pulley is installed so that the lower pulley is synchronized, the lower belt is connected between the lower pulley,

The driven pulley is provided with an upper belt on a coaxial line, and an upper belt is connected between the upper pulleys,

The upper and lower belts are characterized in that the pickup header is installed to move in the opposite direction to adjust the pitch.

Hereinafter, a pickup device of a semiconductor device according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 is a front view illustrating a pickup apparatus according to a first embodiment of the present invention, FIG. 2 is a plan view of FIG. 1, and FIG. 3 is a side view showing an excerpt of FIG. 1.

1 to 3, the pickup apparatus includes horizontal movement means 10 installed on the frame 11, vertical movement means 20 for lifting and lowering the frame 11, and the horizontal and vertical movements. And a plurality of pickup headers 30 which are linearly reciprocated by the movement means 10, 20.

The horizontal movement means 10 includes a horizontal guide portion 12 installed in the front portion of the frame 11, at least one belt 13 for moving the pickup header 30 in the horizontal direction, and the belt A plurality of horizontal motion pulleys 14 synchronized by 13 and a drive source for supplying power to the horizontal motion pulley 14, for example, a drive motor 15 are provided.

In addition, the vertical movement means 20 is coupled to the vertical guide portion 21 installed in the rear portion of the frame 11 and the vertical guide portion 21 to elevate the frame 11 in the vertical direction. At least one vertical movement pulley 22 and a driving motor 23 for supplying power to the vertical movement pulley 22 are provided.

More specifically, as shown in FIG.

A horizontal guide portion 12, for example a horizontal guide rail, is fixed to the front end of the frame 11 along the longitudinal direction of the frame 11. A plurality of pickup headers 30 are coupled to the horizontal guide part 12 so as to be horizontally movable along the horizontal guide part 12.

The pickup header 30 is provided with a guide block 31 to be slidable along the horizontal guide portion 12. The support block 32 is screwed to the guide block 31. A flat plate portion 33 is coupled to the front portion of the support block 32 in a vertical direction with respect to the frame 11, and a cylinder 34 is installed through a through hole formed in the flat plate portion 33. The lifting shaft 35 is coupled to the cylinder 34. In addition, a nozzle 36 (see FIG. 3) is provided on a rear surface of the support part 37 provided on the front surface of the support block 23, so as to adsorb electronic components. At this time, the spring 38, which is an elastic biasing means, is provided on the outer circumferential surface of the lifting shaft 35 so that a predetermined pressing force is applied when the nozzle 36 sucks the electronic component.

At least one horizontal movement pulley 14 is installed on the frame 11 above the horizontal guide part 12. The pulley 14 is divided into an upper pulley 14a and a lower pulley 14b so that the plurality of pickup headers 30 can move in opposite directions while maintaining a constant pitch.

That is, the frame 11 is provided with a plurality of upper pulleys 14a on the left and right sides of the frame 11, and the upper belt 13a for synchronizing them is connected between the upper pulleys 14a. The lower pulley 14b is provided below the upper pulley 14a. A lower belt 13b is also provided between the lower pulleys 14b. At this time, the horizontal movement means is not limited to the coupling of the belt 13 and the pulley 14, it will be possible to replace the other movement means such as the combination of the wire and the roller.

Here, the upper and lower pulleys 14a and 14b are rotatable by the driving of one drive motor 15 and are installed to have rotation ratios of mutually integer multiples.

That is, the drive motor 15 is installed at the rear of the frame 11, the drive pulley (not shown) is coupled to the power take-off shaft drawn from it. The driving pulley is connected to the driven pulley 14c provided on the rear surface of the frame 11 by a belt. The driven pulley 14c may transmit the driving force of the driving motor 15 to the upper belt 13a through the upper pulley 14a connected coaxially.

In addition, a lower pulley 14b synchronized with the driving pulley is installed on the coaxial line drawn out from the driving motor 15, and the driving force can be transmitted to the lower belt 13b through the lower pulley 14b. Do.

At this time, the driving pulley and the driven pulley 14c are coupled to each other to have a rotation ratio of an integral multiple, so that the upper and lower belts 13a and 13b connected to the upper and lower pulleys 14a and 14b have a moving distance of an integral multiple. It is possible to proceed with. In addition, the pulleys 14 enable both forward and reverse rotation in accordance with the installation direction, or one pulley, for example, the upper pulley 14a rotates forward, and another pulley, the lower pulley 14b. Can be reversed and vice versa.

In this case, the pickup header 30 is coupled to the belt 13. A belt clamp 39 is provided on the upper belt 13a and the lower belt 13b from the upper end of the support block 32 toward the frame 11. The belt clamp 39 is fixed to the upper and lower belts 13a and 13b by bolt coupling.

As such, the pickup header 30 has a guide block 31 installed at a lower end thereof so as to be linearly reciprocated to the horizontal guide 12, and a belt clamp 39 provided at the upper end of the upper and lower belts 13a. It is fixed to 13b. In addition, the pickup header 30 is composed of a plurality, some pickup header 30a (30b) is coupled to the upper belt 13a, the other pickup header 30c is coupled to the lower belt (13b).

On the other hand, one pickup header 300 of the pickup header 30 is fixed to the frame (11). The pickup header 300 serves as a reference for maintaining the same pitch value between the pickup headers when the other pickup headers 30a to 30c linearly reciprocate horizontally by horizontal movement means.

In addition, the rear surface of the frame 11 is provided with a vertical guide portion 21, the vertical guide portion 21 is coupled to the power take-off shaft of the drive motor 23 (see Fig. 3) for supplying a driving force As the plurality of vertical movement pulleys 22 rotate by the belt 23, the lifting movement is possible. Accordingly, the frame 11 can be moved in the vertical direction as a whole.

Referring to the operation of the pickup device having a structure as described above is as follows.

By driving of the drive motor 15, the upper horizontal motion pulley 14a and the lower horizontal motion pulley 14b coupled to the power take-off shaft drawn therefrom rotate, and the upper and lower pulleys 14a ( The upper and lower belts 13a and 13b connected between 14b) are movable in the horizontal direction as indicated by the arrows. At this time, the upper and lower pulleys 14a and 14b are connected with a rotation ratio of an integer multiple, and may be rotatable in the same direction or may be rotated in opposite directions depending on the direction in which they are installed.

When the upper and lower pulleys 14a and 14b rotate, the plurality of pickup headers 30 coupled by the belt clamp 37 fixed thereto move along the rotational direction of the belt 13. Accordingly, the pickup header 30 proceeds in a predetermined direction.

At this time, the first pickup header 30a is coupled to the upper belt 13a on the upper belt 13a, and the second pickup header 30b is provided on the lower belt which is changed in direction by the pulley 14a. The lower belt 13b is provided with a third pickup header 30c on the upper belt in the direction in which the lower pulley 14b rotates. In addition, the frame 11 is provided with a pickup header 300 fixed between the movable pickup headers 30a to 30c.

When the upper and lower pulleys 14a and 14b rotate in the same direction, the first pickup header 30a and the third pickup header 30c may move in the same direction. The second pickup header 30b may move in a direction opposite to the first and third pickup headers 30a and 30c.

That is, based on the fixed pickup header 300, the first and third pickup headers 30a and 30c and the second pickup header 30b move closer together or simultaneously move away from each other. It is possible. Accordingly, the pickup headers 30 may be moved in opposite directions while maintaining a constant pitch value between the pickup headers 30 and, if there is a change in the pitch value, the pickup headers 30 may be separated and moved independently. It may be possible to automatically adjust the pitch value by appropriately adjusting the belt 13 and pulley 14 without the need for setting. In addition, since the pickup headers 30 are movable by one driving motor 15, the pickup headers 30 may be accurately adjusted.

On the other hand, in order to adjust the position in the vertical direction of the pickup header 30, 300, the frame 11 itself coupled with the vertical guide portion 21 by the drive of the drive motor 23 is lifted. Accordingly, the position in the vertical direction of the pickup headers 30 and 300 is set. In addition, it will be said that the positioning of the pickup headers 30 and 300 in the vertical direction is also possible by the lifting movement of the lifting shaft 35.

As such, when a pitch value is set between the pickup headers 30 and 300, the nozzle 36 is moved by the lifting shaft 35 coupled to the cylinder 34 or the lifting movement of the frame 11 itself. Electronic components are adsorbed, and it is possible to mount them on a printed circuit board or insert them into a socket or the like.

5 shows a pickup device according to a second embodiment of the present invention.

Referring to the figure, unlike the first embodiment, the pick-up device is provided with a pulley and a belt.

On the frame 11, a drive pulley 51 rotatable by a drive motor and a driven pulley 52 synchronized with the drive pulley 51 by a belt 53 are provided. The timing belt 53 is provided with a plurality of pickup headers 54. Since the coupling relationship of the pickup header 54 to the belt 53 has been described above in detail in the first embodiment, a description thereof will be omitted. On the other hand, the pickup header 54 is coupled to the lower end is slidable along the horizontal guide portion 55.

The pickup header 54 includes a first pickup header 54a coupled to an upper portion of the belt 53, a second pickup header 54b coupled to a lower portion which is redirected by a driven pulley 52, and And a third pickup header 54c fixed in position between the first and second pickup headers 54a and 54b.

In the pickup device having such a structure, when the driving pulley 51 is rotated by the driving force of the driving motor, the driven pulley 52 synchronized by the belt 53 is also rotatable. Accordingly, the pickup header 54 coupled to the belt 53 is moved in the horizontal direction, whereby the pitch value such as widening or narrowing the interval between the headers can be adjusted.

That is, the first pickup header 54a moves from the right side of the frame 11 to the left side and the second pickup header 54b moves from the left side of the frame 11 to the right side in accordance with the advancing direction of the belt 53. Move in a direction adjacent to the third pickup header 54c. In contrast, the first and second pickup headers 54a and 54b may move in a direction away from the third pickup header 54c. This is arbitrarily adjustable according to the pitch of the substrate or the socket on which the electronic component adsorbed by the pickup header 54 is mounted.

6 shows a pickup device according to a third embodiment of the present invention.

Referring to the drawings, the pick-up apparatus includes an upper pulley 61 and a lower pulley 62 rotatable therewith.

In this case, unlike in the first embodiment, the horizontally movable first and second pickup headers 64a and 64b are movable in opposite directions to the upper belt 63a connected to the upper pulley 61. It is coupled to the upper and lower parts so as to. In addition, the lower pulley 62 is also provided with a lower belt 63b connected thereto so that the third and fourth pickup headers 64c and 64d are movable in opposite directions. In addition, the lower end of the frame 11 is provided with a horizontal guide portion 65 for guiding the pickup header 64 in the horizontal direction. On the other hand, a drive pulley coupled to a power take-off shaft drawn from one drive motor and a driven pulley positioned coaxially with the upper pulley 61 are connected by a belt, and the lower pulley 62 is coaxially driven with the drive pulley. And, the pulleys are combined with each other having a rotation ratio of an integer multiple, so that the upper and lower belts (63a, 63b) proceeds with a corresponding movement distance. Accordingly, the pitch value between the pickup header 64 can be arbitrarily adjusted.

As such, in the present embodiment, a plurality of pulleys 61 and 62 are rotatable by one driving motor (not shown), and the upper and lower belts 63a connecting the pulleys 61 and 62, respectively. The first to fourth pickup headers 64a to 64d, which are coupled to the circumference 63b, may maintain the same pitch value, and may be adjusted when there is a change in the value.

In addition, when a plurality of pulleys and belts are installed in the frame 11, at least one drive motor for rotating the plurality of pulleys is installed at the same time, and as shown in the configuration of the above-described embodiment for each pulley and belt group. It may be possible to narrow or widen the pitch by moving the respective pickup headers in opposite directions at the same time by receiving the driving force of one driving motor.

As described above, the pickup device of the semiconductor device according to the present invention can obtain the following effects.

First, by using a single drive motor to rotate at least one or more pulleys, and by installing a plurality of pickup headers on the belt connected between the pulleys to move in the horizontal direction opposite to each other, the pitch value between each pickup header It is easy to adjust, maximizing throughput.

Secondly, a plurality of pickup headers can be moved by one drive motor to adjust the pitch value of each other, thereby greatly reducing the volume or weight of the apparatus.

Third, it is possible to move while automatically adjusting the pitch of the pickup header by the driving force of the drive motor, so that the pitch value can be maintained accurately.

Although the present invention has been described with reference to one embodiment shown in the drawings, this is merely exemplary, and those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

Claims (7)

frame; A plurality of pickup headers provided on the frame; And And horizontal movement means coupled to the pickup headers to maintain the same pitch value between the respective pickup headers and to move in the opposite directions. The method of claim 1, The horizontal movement means, Drive source; At least one pulley connected to the drive source and installed in the frame so as to be rotatable by the driving force supplied therefrom; and And a belt connected to synchronize the pulleys and installed to move the pickup headers in opposite directions to each other. The method of claim 2, And said pulley comprises a drive pulley coupled to a power take-off shaft drawn from said drive source, and a driven pulley coupled to said drive pulley with a rotation ratio of an integral multiple. The method of claim 3, The driving pulley is installed so that the lower pulley is synchronized, the lower belt is connected between the lower pulley, The driven pulley is provided with an upper belt on a coaxial line, and an upper belt is connected between the upper pulleys, The pickup device of the semiconductor device, characterized in that the pickup header is installed on the upper and lower belts to adjust the pitch by moving in the opposite direction. The method according to claim 2 or 4, And a pickup header fixed to the frame is provided between the pickup headers. The method of claim 2, The frame pickup device of the semiconductor device, characterized in that the pickup header is slidably coupled to the horizontal guide portion for guiding linear reciprocating movement. The method of claim 2, And said pulley is rotatable by one drive source.