KR20020060917A - Apparatus for control cooling of computer components and method thereof - Google Patents

Abstract

PURPOSE: An apparatus for controlling refrigeration of a computer component and a method for the same are provided to prevent an electronic component and a main board from being deteriorated by humidity created when the electronic component is cooled. CONSTITUTION: A cooling component(120) includes a heat emission panel for emitting the heat created on the electronic component and a heat emission member for emitting the heat, transferred from the cooling component(120) through the heat emission panel, to outside. A sensor(151) detects temperature of the electronic component. A detection part(153) operates in response to the temperature detected by the sensor(151) and outputs a signal. A display part(155) operates in response to an output signal from the detection part(153) and displays the detected temperature. A cooling control part(170) receives signals from the detection part(153) and a detection part(163), and thereby recognizes temperature of the sensor(151) and a sensor(161), and then outputs a cooling control signal. A drive part(175) operates the cooling component(120). An alert sound generation part(180) generates an alert sound in response to an output signal from the detection part(163).

Description

Cooling control device of computer parts and its method {APPARATUS FOR CONTROL COOLING OF COMPUTER COMPONENTS AND METHOD THEREOF}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a system for cooling heat generated in an electronic component, and in particular, a semiconductor cooling device is used to cool heat generated in an electronic component such as a central processing unit (hereinafter referred to as a CPU chip) of a computer and a graphics chip. The present invention relates to a cooling control device for a computer component and a method for preventing a phenomenon in which moisture is generated in an electronic component due to a sudden temperature difference between the electronic component and the outside, thereby deteriorating the component.

In general, a CPU chip or a graphic chip, which is an electronic component of a computer, generates heat inside the chip due to high-speed data processing during operation, and prevents it because the chip may malfunction if the chip is overheated above a certain temperature. In order to do so, a chip chiller is required.

As a result, the chip cooler adopts a heat sink made of a metal having good thermal conductivity or an air-cooled cooler combined with a heat sink and a cooling fan to dissipate the chip. The degree of cooling of the CPU chip is determined by the difference between the amount of heat generated from the heat sink and the heat dissipated into the air from the heat sink.In order to increase the degree of cooling of the heat sink, the surface area of the CPU chip can be increased. There is a limitation that cannot be done, and the cooling effect is inevitably reduced if the heat generation amount is also increased as the performance of the CPU chip is improved.

In order to compensate for this, a cooling fan is used in combination with the purpose of increasing the amount of heat dissipated into the air, which also improves the cooling effect somewhat, while not only increasing the volume of the cooling device but also causing vibration and noise. there was.

Conventionally, in order to compensate for this, the heat generated from the CPU chip is continuously maintained using a thermoelectric cooling element to which the Peltier effect is applied, such as the "cooling device of the CPU chip using the thermoelectric cooler" of Utility Model Application No. 1999-19354 of FIG. It moves in one direction and adjusts the cooling degree according to the heating state so that the CPU chip can always maintain a constant temperature cooling state.

As shown in FIG. 1, a cooling device for a CPU chip using a thermoelectric cooler includes a thermoelectric cooler 4 and a thermoelectric cooler 4, which are in close contact with the heat conduction plate 2 and the heat sink 3 and serve as a kind of heat pump. Heat generated from the CPU chip 1 and the heat sink 3, which accumulates heat conducted from the heat sink and causes the accumulated heat to dissipate into the air due to convection, and generates a predetermined space when combined with the heat conduction plate 2 The heat conduction plate 2 and the heat dissipation plate 3 serve to conduct heat to the endothermic ceramic plate of the thermoelectric cooling element 4 in contact with each other, as well as having a groove into which the bimetal switch 6 is inserted. Insulation packing (5) and CPU chip (1) to separate the overheat conduction plate (2) and to prevent the heat accumulated in the heat sink from being reversed back to the heat conduction plate, together with a closed space generated when the heat conduction plate and the heat sink are combined. Input power of the thermoelectric cooling element (4) By adjusting, the CPU chip 1 is comprised including the bimetal switch 6 which always maintains cooling state of appropriate temperature.

This prior art uses the thermoelectric cooling element 4 and the bimetal switch 6 to cool the CPU chip, but it is important to set the operating temperature of the cooling element only with the bimetal switch 6 without setting the reference temperature of the surrounding environment. If the temperature of the cooling element is too low compared to the temperature of the surrounding environment, water is generated in the CPU chip due to the difference between the ambient temperature, which is not suitable as a cooling device. Therefore, a sensing circuit for detecting the temperature and the ambient temperature of the CPU chip is necessary.

Therefore, the conventional thermoelectric cooling element is excellent in cooling performance when operating the thermoelectric cooling element is one side is cooled and the other side to release the heat, the cooled portion can be cooled down to below zero temperature and the surface to be cooled Due to the temperature difference between the heat-generating surfaces, the cooling surface may be moistened or frozen, causing the CPU chip to malfunction or be damaged. There was considerable difficulty.

Accordingly, an object of the present invention is to use a semiconductor cooling device to cool the heat generated by electronic components such as a central processing unit (hereinafter referred to as a CPU chip) and a graphics chip of a computer due to the rapid temperature difference between the electronic component and the inside of the computer. The present invention provides a cooling control device for a computer part and a method thereof, which can prevent moisture from being generated in an electronic part to deteriorate the electronic part and the main board.

In addition, another object of the present invention is to detect the CPU chip and the internal temperature of the computer and display the detected temperature with a plurality of light emitting diodes, and to maintain the cooling temperature of the electronic components within the predetermined temperature range with the internal temperature of the computer at all times. Disclosed are a cooling control device for a computer component and a method of controlling the operation of the cooling device.

In addition, another object of the present invention is to detect the CPU chip and the internal temperature of the computer, respectively, when the detected temperature is above a certain temperature to generate an alarm sound to ensure the safety of the cooling device, a plurality of heat dissipation member and fan It is to provide a cooling control device and a method for a computer component that can further improve the cooling efficiency.

1 shows a cooling apparatus for a computer electronic component according to the prior art,

2 is an assembled perspective view showing a cooling device for computer electronic components according to the present invention;

3 is an exploded perspective view of FIG. 2;

4 is a circuit block diagram showing a cooling control circuit according to the present invention;

5 is a circuit diagram illustrating a detailed circuit of FIG. 4 according to an exemplary embodiment of the present invention.

* Explanation of symbols for the main parts of the drawings

10: electronic component (CPU chip) 100: cooling device

110: first heat sink 120: cooling element

130: second heat dissipation member 150: circuit board

151: First sensor 153: First detector (amplifier)

155: first display unit (light emitting diode) 161: second sensor

163: second detection unit (amplifier) 165: second display unit (light emitting diode)

170: cooling control unit 175: driving unit

180: alarm sound generating unit 190: fan member

Technical means of the present invention for achieving the above object, the cooling device for cooling an electronic component of a computer comprising: first detecting means for sensing the temperature of the computer electronic component, and outputs a signal corresponding to the detected temperature; Second detection means for sensing the internal temperature of the computer and outputting a signal corresponding to the detected temperature; A first heat dissipation member mounted on an upper end of a package of the computer electronic component to release heat generated from the computer electronic component; A cooling element mounted on an upper end of the first heat dissipation member to operate according to a predetermined power supply to cool the first heat dissipation member; A second heat dissipation member installed at an upper end of the first heat dissipation member and a cooling element to discharge and air-cool the heat transferred from the cooling element to the outside; The temperature values detected by the first and second detection means are compared with each other, and then the power supplied to the cooling device is controlled according to the result, and the cooling temperature of the computer electronic component is always constant from the internal temperature of the computer. Cooling control means for controlling to maintain the; And a driving part which opens and closes according to a control signal of the cooling control means and supplies power to the cooling element.

In addition, the technical method of the present invention for achieving the above object, the step of sensing the temperature of the electronic component and outputs a signal corresponding thereto; Sensing a computer internal temperature and outputting a corresponding signal; Lighting up and displaying the light emitting diodes corresponding to the detected electronic component and the computer internal temperature, respectively; Determining whether the internal temperature of the electronic component and the computer is detected by the electronic component and the internal temperature of the electronic component and the computer is greater than a predetermined temperature, thereby cooling the electronic component by driving a cooling element; Determining whether the electronic component and the internal temperature of the computer have been received, and if the temperature of the electronic component is less than a predetermined temperature, turning off the cooling element to stop cooling; Determining whether the electronic component and the computer internal temperature detected by the above are received and, when the computer internal temperature is above a predetermined temperature, generating an alarm sound; And determining that the electronic component and the computer internal temperature are detected, and as a result, when the temperature difference between the electronic component and the computer is less than a predetermined temperature, turning off the cooling element to stop the cooling.

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.

FIG. 2 is an assembled perspective view illustrating an electronic component cooling apparatus of a computer applied to the present invention, and includes a first heat sink 110, a cooling element 120, a second heat sink member 130, a fixing clip 135, and a circuit board 150. ) And a fan 190.

The first heat sink 110 is formed of a plurality of metal pads, such as a copper plate and an aluminum plate seated on the top of the package of computer electronic components such as the CPU chip 10 to release heat generated from the computer electronic components, the second The heat dissipation member 130 is installed on the top of the first heat dissipation plate 110 and the cooling element 120 and is configured to discharge heat transferred from the cooling element 120 through a plurality of heat dissipation fins 131 vertically arranged. Although not shown in the drawing, the cooling device 120 is installed between the first heat sink 110 and the second heat sink 130 to receive power to cool the first heat sink 110.

In addition, the second heat dissipation member 130 further includes a fan 191 for air-cooling the heat dissipation fin on one side of the heat dissipation fin 131 and a fan guard 195 for protecting the fan 191 from the outside. On one side of the second heat dissipation member 130, a circuit board 150 on which cooling circuit components (control chip, transistor, capacitor, resistor, diode, LED, coil, buzzer, sensor, etc.) are mounted is attached. It is.

The fixing clip 135 is coupled to the second heat dissipation member 130 to support the cooling device to be fixed on the electronic component, and to detect a temperature of the computer electronic component on one side of the first heat dissipation plate 110. The first sensor 151 is further provided.

The cooling device is disassembled as shown in FIG. 3.

That is, the cooling element 120 is seated on the upper end of the first heat sink 110, the first heat sink 110 is coupled to the lower end of the second heat dissipation member 130 by a screw, the circuit board 150 is a screw It is coupled to one side of the second heat dissipation member 130, the fan 191 and the fan guard 195 is coupled to the opening surface of the heat dissipation fin of the second heat dissipation member 130 by a screw, the fixed clip The 135 is coupled to the lower end of the second heat dissipation member 130 to fix and support the cooling device on the chip.

The cooling device 120 is a semiconductor cooling device applying the Peltier effect. When the current flows from the N-type semiconductor material to the P-type semiconductor material, the surface bonded to the N-type and P-type semiconductor material decreases in temperature by endothermic action. , Unbonded surfaces exothermic.

One to several hundred thermocouples made of such N-type and P-type semiconductor elements are formed in a matrix, and the thermocouples are sandwiched between ceramic plates that electrically support the structure while electrically blocking the radiator and the cooling object. The heat generated from the CPU chip 10, which has a fabricated structure and requires cooling, is transferred to a heat sink in contact with the heat absorbing and heat dissipating ceramic plate through the heat conducting plate in close contact with the heat absorbing ceramic plate of the cooling device 120. It acts to continuously move.

That is, when the cooling element 120 is operated, one side is cooled, and the other side generates heat, and the amount of heat generated varies depending on the degree of cooling, but it depends on how well the heat is generated. Efficiency is determined.

Therefore, in the process of cooling the first heat sink 110, the opposite side of the cooling element 120 generates a lot of heat, so that the second heat dissipation member 130 is required, and the heat dissipation performance of the second heat dissipation member 130 is required. This should allow the first heat sink 110 to cool well.

To this end, a cooling fan 190 is attached to the second heat dissipation member 130 to increase thermal cooling efficiency, and foreign matters are prevented from entering the cooling fan 191 using the fan guard 195.

In addition, the circuit board 150 attached to the side surface of the second heat dissipation member 130 is a dense complex electronic circuit in a narrow space, and is attached to the second heat dissipation member 130 in order not to be affected by the surrounding environment. have.

4 is a block diagram showing a cooling control apparatus according to an embodiment of the present invention, the cooling element 120, the first sensor 151, the first detection unit 153, the first display unit 155, the second sensor 161, a second detector 163, a second display unit 165, a cooling controller 170, a driver 175, an alarm sound generator 180, and the like.

The cooling device 120 is mounted on the upper end of the package of the computer electronic component such as the CPU chip 10 to the first heat sink 110 and the upper end of the first heat sink to receive and release heat generated from the computer electronic component. It is installed between the second heat dissipation member 130 for dissipating heat transferred from the cooling element 120 to the outside through a plurality of heat dissipation fins 131 arranged in a vertical line is supplied with power in accordance with a predetermined control signal 1 is configured to cool the heat sink 110.

In addition, the first sensor 151 is installed on one side of the first heat sink 110 in order to detect the temperature of the computer electronic component, the first detection unit 153 according to the temperature detected by the first sensor 151. A plurality of light emitting diodes, each of which includes a buffer and a plurality of amplifiers, the first display unit 155 is operated according to the output signal of the first detection unit 153 to visually display the detected temperature. Consists of

The second sensor 161 is installed at one side of the second heat dissipation member 130 to detect the temperature inside the computer, and the second detection unit 163 operates according to the temperature detected by the second sensor 161. A buffer for outputting a signal corresponding thereto and a plurality of amplifiers, and the second display unit 165 is composed of a plurality of light emitting diodes that are operated according to the output signal of the second detector 163 to visually display the sensing temperature. have.

In addition, the cooling controller 170 receives the signals output from the first detector 153 and the second detector 163 to determine the detected temperatures of the first sensor 151 and the second sensor 161 and then corresponds to the corresponding signals. It is configured to output a cooling control signal, the driving unit 175 is operated according to the specific output signal of the first detector 153 and the signal output from the cooling control unit 170 to supply power to the cooling element 120 to operate. It is composed of a plurality of switching elements, the alarm sound generating unit 180 is composed of a switching device and a buzzer for receiving the power supply according to a specific output signal of the second detector 163 to generate an alarm sound.

That is, referring to the cooling apparatus of FIGS. 3 and 4, there is a first heat sink 110 that contacts the package of the CPU chip 10 and absorbs heat, and the semiconductor cooling device 120 is disposed on an upper end of the first heat sink 110. ) To cool the first heat dissipation plate 110, and a second heat dissipation member 130 to cool the heat generated from the cooling element 120 at the upper end of the cooling element 120.

The first heat sink 110 is a place where the heat generated from the CPU chip 10 and the cooling state cooled by the cooling element 120 exist at the same time. The first sensor 151 is installed to generate heat and cooling generated from the CPU chip. The temperature of the device 120 may be sensed to be cooled, and there is a second sensor 161 mounted on the circuit board 150 to sense an ambient temperature, that is, a computer internal temperature, and the second sensor 161 detects the temperature. One temperature is set to a reference temperature at which the control unit can operate the cooling element 120, and the reference temperature is divided into seven steps as follows.

That is, the second detection unit 163 has the ability to detect each of the minimum 20, 25, 30, 35, 40, 45, 50 ℃ by each can detect the internal temperature of the computer by temperature.

In addition, the first sensor 151 is attached to the first heat sink 110 to sense the temperature generated by the CPU chip 10 and sends a signal to the cooling control unit 170 to determine the degree of cooling of the cooling element 120. As a signal, the temperature detection capability of the first detection unit 153 is divided into seven stages set to approximately 5 ° C. lower than the detection capability of the second sensor 161. This is for cooling the temperature of the CPU chip 10 to about 5 ° C. lower than the internal temperature of the computer, and the first detection unit 153 has a minimum of 15, 20, 25, 30, 35, 40, and 45 ° C. It is set to detect.

The heat generated from the CPU chip 10 is cooled by the cooling element 120 where the heat generated from the CPU chip 10 and the cooling state to cool the cooling element 120 exist together in the first heat sink 110. If more than the cooling state, the temperature of the first heat sink 110 will rise. On the contrary, if the cooling state that the cooling element 120 cools is stronger than the heat generated by the CPU chip 10, the temperature of the first heat sink 110 will be lowered.

Therefore, the cooling control unit 170 will always try to maintain a constant temperature of the first heat sink 110, and will automatically control this operation.

Here, if the cooling element 120 unconditionally cools the CPU chip 10, the degree of cooling is overcooled than the heat generated by the CPU chip 10, and thus the temperature of the first heat sink 110 will continue to decrease. Moisture is generated on the CPU chip 10 and the circuit board 150 due to the temperature difference with the surroundings, and the peripheral motherboard including the CPU chip 10 will be fatally damaged.

Therefore, in order to cool the heat generated by the CPU chip 10 using the cooling element 120, a control means for controlling the cooling is necessary.

FIG. 5 is a detailed circuit diagram of FIG. 4 according to an embodiment of the present invention, which will be described with reference to FIGS. 3 and 4.

The first sensor 151 (S1) is a thermistor sensor having a characteristic of a negative temperature coefficient connected between a power supply voltage and a ground voltage. The first sensor 151 (S1) is installed on one side of the first heat sink 110 and the resistance value decreases as the temperature increases. The temperature of the CPU chip 10, that is, the temperature of the first heat sink 110 is configured to be sensed.

In addition, the first detector 153 receives the output voltage of the first sensor 151 through the non-inverting terminal (+) and outputs a follower amplifier B1 and an output of the follower amplifier B1. The first and second series resistors R1 provided with the inverting terminal (-), installed in parallel between the power supply voltage and the ground voltage, and whose resistance is changed according to the sensed temperature of the first sensor 151 to determine whether or not to conduct. The first operational amplifier Op1 receives the partial voltage of R2) as a non-inverting terminal and outputs a signal corresponding thereto, and the output voltage of the follower amplifier B1 is provided to the inverting terminal (-). And the partial voltages of the third and fourth series resistors R3 and R4, which are installed in parallel between the power supply voltage and the ground voltage and whose conduction is determined according to the sensed temperature of the first sensor 151, to the non-inverting terminal (+). A second operational amplifier Op2 provided to output a detection signal corresponding thereto and an output voltage of the follower amplifier B1; The non-inverting terminal is provided with an inverting terminal, is installed in parallel between the power supply voltage and the ground voltage, and the divided voltages for the fifth and sixth series resistors R5 and R6 are determined to be conductive according to the sensed temperature of the first sensor 151. The third operational amplifier Op3 and the output signal of the follower amplifier B1 are provided as inverting terminals and are installed in parallel between the power supply voltage and the ground voltage. A fourth operational amplifier Op4 that receives the partial voltages of the seventh and eighth series resistors R7 and R8 that are connected according to the sensed temperature of 151 as a non-inverting terminal, and outputs a corresponding detection signal; The ninth and tenth series resistors are provided with the output voltage of the follower amplifier B1 as an inverting terminal, are installed in parallel between the power supply voltage and the ground voltage, and are connected to each other according to the sensing temperature of the first sensor 151. Non-inverting terminal with partial pressure for (R9, R10) The fifth operational amplifier Op5 and the output signal of the follower amplifier B1 are provided as inverting terminals and are installed in parallel between the power supply voltage and the ground voltage and are provided in parallel with the first sensor. A sixth operational amplifier Op6 that receives the divided voltages of the eleventh and twelfth series resistors R11 and R12, whose conduction is determined according to the sensed temperature of 151, and outputs a detection signal corresponding thereto; And a thirteenth and fourteenth series resistors provided with an output terminal of the follower amplifier B1 as an inverting terminal and installed in parallel between a power supply voltage and a ground voltage and determining whether conduction is conducted according to a sensed temperature of the first sensor 151. And a seventh operational amplifier Op7 that receives the partial pressures of R13 and R14 as the non-inverting terminal and outputs a detection signal corresponding thereto.

The first to fourteenth resistors R1 to R14 are set to different resistance values, so that the conduction of current is determined according to the sensing temperature of the first sensor 151, and that each of the operational amplifiers Op1 to Op7 is The signal input to the non-inverting terminal is also determined, and the voltage input to the inverting terminal based on the non-inverting terminals of the operational amplifiers Op1 to Op7 is 'high or low' to be output to the cooling controller 170 according to the magnitude. The level of the signal is determined.

In addition, the first display unit 155 is light emitting diodes L1 to L7 connected between the output terminals of the first to seventh operational amplifiers Op1 to Op7 and the ground voltage, respectively, and outputs of the respective operational amplifiers Op1 to Op7. It is configured to be turned on or off by receiving power according to a signal, so that the sensing temperature of the first sensor 151 can be visually checked.

On the other hand, the second sensor 161 is a thermistor sensor having a characteristic of the negative temperature coefficient connected between the power supply voltage and the ground voltage is installed on the circuit board 150, the ambient temperature of the second heat radiation member 130, that is, inside the computer It is made to sense the temperature.

In addition, the second detector 163 inverts the output voltage of the follower amplifier B2 and the follower amplifier B2 for receiving and outputting the output voltage of the second sensor 161 as a non-inverting terminal. It is provided as a terminal and installed in parallel between the power supply voltage and the ground voltage, and the divided voltages of the 21st and 22nd series resistors R21 and R22, which are determined to be conductive according to the sensing temperature of the second sensor 161, are used as non-inverting terminals. The eleventh operational amplifier Op11 receives the output signal corresponding thereto and the output voltage of the follower amplifier B2 is provided as an inverting terminal and is installed in parallel between the power supply voltage and the ground voltage, and the second sensor 161 is provided. A twelfth operational amplifier Op12 that receives the divided voltages of the twenty-third and twenty-fourth series resistors R23 and R24 which are determined to be conductive according to the sensed temperature of the N-C, and outputs a corresponding detection signal; The output voltage of the follower amplifier B2 is reset to an inverting terminal. And a partial voltage between the 25th and 26th series resistors R25 and R26, which are installed in parallel between the power supply voltage and the ground voltage and whose conduction is determined according to the sensed temperature of the second sensor 161, is provided as a non-inverting terminal. A thirteenth operational amplifier Op13 that outputs a corresponding detection signal and an output voltage of the follower amplifier B2 are provided as an inverting terminal and are installed in parallel between a power supply voltage and a ground voltage to sense the second sensor 161. A fourteenth operational amplifier Op14 that receives a partial pressure of the twenty-seventh and twenty-eighth series resistors R27 and R28 whose conduction is determined according to temperature, and outputs a detection signal corresponding thereto; The 29th and 30th series resistors R29 and R30 provided with an output terminal of the amplifier B2 as an inverting terminal and installed in parallel between the power supply voltage and the ground voltage and whose conduction is determined according to the sensing temperature of the second sensor 161. The partial pressure on the Receiving a fifteenth operational amplifier Op15 and a corresponding output signal of the follower amplifier B2 as an inverting terminal, and are installed in parallel between the power supply voltage and the ground voltage, and the second sensor 161 is provided. A sixteenth operational amplifier Op16 that receives the divided voltages of the thirty-first and thirty-second series resistors R31 and R32 that are connected according to the sensed temperature of the non-inverting terminal, and outputs a corresponding detection signal; Thirty-third and thirty-fourth series resistors R33 provided with an output terminal of the follower amplifier B2 as an inverting terminal, installed in parallel between a power supply voltage and a ground voltage, and having conduction according to a sensing temperature of the second sensor 161. , The seventeenth operational amplifier Op17 receives the partial pressure of R34) as a non-inverting terminal and outputs a detection signal corresponding thereto.

The twenty-first to thirty-fourth resistors (R21 to R34) are set to different resistance values, and the conduction of the current is determined according to the sensed temperature of the second sensor 161, and each of the operational amplifiers Op11 to Op17 The signal input to the non-inverting terminal is also determined, and the voltage input to the inverting terminal based on the non-inverting terminals of the operational amplifiers Op11 to Op17 is 'high or low' to be output to the cooling controller 170 according to the magnitude. The level of the signal is determined.

Also, the second display unit 165 is light emitting diodes L1 to L7 connected between the output terminals of the eleventh to seventeenth operational amplifiers Op11 to Op17 and the ground voltage, respectively, and outputs of the operational amplifiers Op11 to Op17. It is configured to turn on or off depending on the signal, so that the sensing temperature of the second sensor 161 can be visually confirmed.

The alarm sound generator 180 has a buzzer 185 and a third switching device Q3 connected in series between a power supply voltage and a ground voltage, so that the switching device Q1 is connected to the output signal of the seventeenth operational amplifier Op17. In response to the alarm sound.

In the driving unit 175, a current path is connected between the power supply voltage and the ground voltage, and a current path is connected between the power supply voltage and the ground voltage, and the first switching element Q1 responding to the output signal of the first operational amplifier Op1. The second switching device Q2 connected to the output signal of the cooling control unit 170 is connected, and the relay switch Ry is turned on (terminal A) according to the turn-on of the second switching device Q2. It is configured to supply a predetermined power to the cooling element 120. That is, when the second switching device Q2 is turned on according to the control signal of the cooling control unit 170 and the power is supplied to the relay Ry, the relay switch is closed (A terminal) to supply power to the cooling device 120. Will be supplied. If the output signal of the first operational amplifier Op1 is in the 'low' signal state (when the temperature of the CPU chip is lower than or equal to the set temperature), the voltage applied to the base terminal of the second switching element Q2 is the first switching element ( Since the second switching device Q2 is turned off since the current path of Q1 is pulled down to the ground voltage, cooling is stopped because power is not supplied to the cooling device 120.

The cooling control unit 170 receives the signals output from the first to seventh operational amplifiers Op1 to Op7 and the eleventh to seventeenth operational amplifiers Op11 to Op17 and receives the first sensor 151 and the second sensor. After determining the temperature of 161, the second switching device Q2 is controlled according to the result of the comparison to control and determine whether the cooling device 120 is cooled.

Reference numeral 190 denotes a fan member, which is supplied with a power supply voltage through the fourth switching element Q4 according to the selection of the external switch SW to drive the fan at a high speed or a low speed. 130) increase the cooling efficiency.

Looking at the operation of the present invention configured as described above are as follows.

The first sensor 151 senses the temperature of the chip, the follower B1 connected to the first sensor 151 has a resistance value changed according to the temperature of the first sensor 151, and the follower according to the temperature. The voltage input to the non-inverting terminal of the amplifier B1 changes. Therefore, a constant voltage is always set to the inverting terminal of the follower amplifier B1. When the resistance value of the first sensor 151 changes with temperature based on the set voltage, the non-inverting of the follower amplifier B1 is performed. The input voltage of the terminal is changed, and the follower amplifier B1 is amplified based on the voltage input to the inverting terminal.

The amplified voltages are simultaneously input to the inverting terminals of the first to seventh operational amplifiers Op1 to Op7, and the non-inverting terminals of the first to seventh operational amplifiers Op1 to Op7 are respectively different reference voltages. The first to fourteenth resistors R1 to 14 of different resistance values are installed to distinguish the set voltages of the voltage into seven, and the first to seventh operational amplifiers (A) as the output voltage of the first sensor 151 changes. Op1 to Op7 are differently operated process is transferred to the cooling control unit 170 as it is.

Seven detection temperatures of the first detection unit 153 with respect to the voltage of the first sensor 151 are set to 15, 20, 25, 30, 35, 40, 45 ° C., and with respect to the voltage of the second sensor 161. Seven detection temperatures of the second detection unit 163 are set to 20, 25, 30, 35, 40, 45, 50 ° C. That is, the sensor voltage detection circuits of the first detection unit 153 and the second detection unit 163 have the same circuit configuration having a symmetrical structure, and are designed with different setting ranges for detecting only temperature.

The light emitting diodes L1 to L7 and L11 to L17 of the first display unit 155 and the second display unit 165 display the temperatures detected by the first detector 153 and the second detector 163, respectively. In this case, the color is set to 7 preset colors according to the detected temperature. However, the color of the light emitting diodes L1 to L7 is divided into four colors due to the limited color of light emitting diodes currently available, and the four colors indicate the sensing temperature of the first or second sensors 151 and 161. To display.

For example, in the first display unit 155, green LED1 is 15 ° C, LED2 is 20 ° C, yellow LED3 is 25 ° C, LED4 is 30 ° C, red LED5 is 35 ° C, LED6 is 40 ° C and dark red LED7 is 45 ° C. ℃ 2, the second display unit 165, green LED1 20 ℃, LED2 25 ℃, yellow LED3 30 ℃, LED4 35 ℃, red LED5 40 ℃, LED6 45 ℃, dark red LED7 To be expressed as 50 ° C.

This is shown in the table below.

First expression 2nd expression LED color LED Temperature LED color LED Temperature [℃] green LED1 15-20 green LED11 20-25 LED2 20-25 LED12 25-30 yellow LED3 25-30 yellow LED13 30 to 35 LED4 30 to 35 LED14 35-40 Red LED5 35-40 Red LED15 40 to 45 LED6 40 to 45 LED16 45-50 Dark red LED7 45 or more Dark red LED17 50 or more

Therefore, when the respective light emitting diodes L1 to L7 and L11 to L17 are turned on, the corresponding temperature is shown. When the dark red color is turned on at the second display unit 165, the internal temperature of the computer exceeds 50 ° C. Since the third switching element Q3 of the alarm sound generator 180 is switched by receiving the output signal of the seventeenth operational amplifier Op17, the buzzer B is supplied with power to generate an alarm sound to generate a computer user. Instruct them to take action.

Therefore, the cooling controller 170 determines the temperature difference between the chip and the computer according to the signals output from the operational amplifiers Op1 to Op7 and Op11 to Op17 of the first and second detectors 153 and 163. The operation of the cooling element 120 is determined by controlling the opening and closing of the second switching element Q2 of the driving unit 175 so that the temperature of the CPU chip 10 cannot be lowered to about 5 ° C. or lower based on the internal temperature of the computer. In addition, the second switching device Q2 of the driving unit 175 is turned off so that the power applied to the cooling device 120 is cut off so as not to rise above the computer internal temperature.

The output signal levels of the operational amplifiers Op1 to Op7 and Op11 to Op17 according to the detection temperature are summarized in Tables 2 and 3 below.

First detector Sensing Temperature [℃] Output signal of each operational amplifier Op1 Op2 Op3 Op4 Op5 Op6 Op7 15 or less low low low low low low low 15-20 Hi low low low low low low 20-25 Hi Hi low low low low low 25-30 Hi Hi Hi low low low low 30 to 35 Hi Hi Hi Hi low low low 35-40 Hi Hi Hi Hi Hi low low 40 to 45 Hi Hi Hi Hi Hi Hi low 40 to 45 Hi Hi Hi Hi Hi Hi low 45 or more Hi Hi Hi Hi Hi Hi Hi

Second detector Sensing Temperature [℃] Output signal of each operational amplifier Op11 Op12 Op13 Op14 Op15 Op16 Op17 20 or less low low low low low low low 20-25 Hi low low low low low low 25-30 Hi Hi low low low low low 30 to 35 Hi Hi Hi low low low low 35-40 Hi Hi Hi Hi low low low 40 to 45 Hi Hi Hi Hi Hi low low 45-50 Hi Hi Hi Hi Hi Hi low 50 or more Hi Hi Hi Hi Hi Hi Hi

For example, referring to Tables 2 and 3, when the internal temperature of the computer is about 30 ° C. due to the signal detected by the second detection unit 163, the cooling control unit 170 turns the second switching element Q2. It is turned off to prevent the temperature of the CPU chip 10 from lowering to 25 ° C or lower, and further suppressed to be 30 ° C or higher so that the CPU chip 10 is always maintained at about 25 ° C to 30 ° C.

When the temperature of the CPU chip 10 is 15 ° C. or less, the first to seventeenth operational amplifiers Op1 to Op17 all output a 'low' signal, and the output signal of the first operational amplifier Op1 is the driver 175. Is applied to the input terminal of the first switching element Q1 to conduct the switch Q1 so that the input terminal of the second switching element Q2 pulls down to the ground voltage through the current path of the first switching element Q1. Therefore, the switch Q2 is turned off so that the relay switch Ry is turned off (B terminal) to stop the cooling operation of the cooling element.

As described above, in the cooling apparatus of the present invention, the first detection unit 153 and the second detection unit 163 are symmetrical circuits, and the detection capability thereof is slightly different, but is detected by the first sensor 151 and the second sensor 161. It operates to distinguish the signal according to the temperature.

Since the output signal of the first sensor 151 is set to about 5 ° C. lower than the output signal of the second sensor 161, the temperature of the CPU chip 10 is cooled to about 5 ° C. lower than the computer internal temperature. maintain.

The combination of the signals detected by the first detector 153 and the second detector 163 is sent to the cooling controller 170. In the cooling controller 170, the signal of the first sensor 151 and the second sensor ( The temperature of the CPU chip 10, ie, the first, is automatically received in order to analyze the signal of the first sensor 151 based on the signal of the second sensor 161 by receiving the signal of the 161. The temperature of the heat sink 110 is controlled to be kept constant.

Therefore, the CPU chip 10 can be stably maintained at a constant temperature while being strongly cooled, and thus can perform normal and stable high speed data processing capability.

Although specific embodiments of the present invention have been described and illustrated above, the present invention may be variously modified by those skilled in the art, such as by applying the semiconductor cooling element and its control device to not only a CPU chip of a computer but also other electronic parts or equipment requiring cooling. It is obvious that it can be implemented. Such modified embodiments should not be individually understood from the technical spirit or the prospect of the present invention, and such modified embodiments should fall within the appended claims of the present invention.

Therefore, in the present invention, the temperature of the semiconductor cooling element is detected so as to detect the CPU chip and the internal temperature of the computer, and display the detected temperature with a plurality of light emitting diodes, and to keep the cooling temperature of the electronic component within the predetermined temperature range at all times. By controlling the operation, when cooling the heat generated from the electronic component, the temperature difference between the electronic component and the computer can prevent moisture from being generated in the electronic component and deteriorate the electronic component and the circuit board. When the internal temperature of the computer is detected and the detected temperature is above a certain temperature, an alarm sound is generated to ensure the safety of the cooling device, and a plurality of heat dissipation members and fans are provided to further improve cooling efficiency. Keep your computer's internal temperature properly even in the summer and under adverse conditions. By cooling a safe and powerful, the temperature of the CPU of the computer chip, the computer can operate safely without what the problem occurs because the temperature of the CPU chip can ensure the reliability of the product.

Claims (9)

In a device for cooling electronic components of a computer: First detection means for sensing a temperature of the computer electronic component and outputting a signal corresponding to the sensed temperature; Second detection means for sensing the internal temperature of the computer and outputting a signal corresponding to the detected temperature; A first heat dissipation member mounted on an upper end of a package of the computer electronic component to release heat generated from the computer electronic component; A cooling element mounted on an upper end of the first heat dissipation member to operate according to a predetermined power supply to cool the first heat dissipation member; A second heat dissipation member installed at an upper end of the first heat dissipation member and a cooling element to discharge and air-cool the heat transferred from the cooling element to the outside; The temperature values detected by the first and second detection means are compared with each other, and then the power supplied to the cooling device is controlled according to the result, and the cooling temperature of the computer electronic component is always constant from the internal temperature of the computer. Cooling control means for controlling to maintain the; And And a driving unit which opens and closes according to a control signal of the cooling control means and supplies power to the cooling element. The method according to claim 1, The first detection means, A first sensor installed at the first heat dissipation member and sensing a temperature of a computer electronic component; A follower amplifier configured to receive and output an output signal corresponding to the temperature sensed by the first sensor as a non-inverting terminal; And receiving an output signal of the follower amplifier and a sensing signal applied through a common terminal of a plurality of series resistors connected in parallel between a power supply voltage and a ground voltage to the inverting terminal and the non-inverting terminal, respectively, according to the sensing temperature of the first sensor. Cooling control device for a computer component comprising a plurality of operational amplifiers for outputting signals of different levels. The method according to claim 1, The first detection means, A first sensor installed at the first heat dissipation member and sensing a temperature of a computer electronic component; A follower amplifier configured to receive and output an output signal corresponding to the temperature sensed by the first sensor as a non-inverting terminal; And receiving an output signal of the follower amplifier and a sensing signal applied through a common terminal of a plurality of series resistors connected in parallel between a power supply voltage and a ground voltage to the inverting terminal and the non-inverting terminal, respectively, according to the sensing temperature of the first sensor. Cooling control device for a computer component comprising a plurality of operational amplifiers for outputting signals of different levels. The method according to claim 2 or 3, The first sensor and the second sensor, Cooling control device for a computer component, characterized in that the thermistor sensor is connected between the power supply voltage and the ground voltage, each having a characteristic of the negative temperature coefficient. The method according to claim 1, The driving unit includes: a first switching device connected to a current path between a power supply voltage and a ground voltage and responsive to an output signal of a specific operational amplifier of the first detection unit; A second switching element connected between a power supply voltage and a ground voltage and responsive to an output signal of the cooling control means; And a relay switch switched according to the turn-on of the second switching element to supply power to the cooling element. The method according to claim 1, And a display unit for visually displaying a temperature detected by lighting in accordance with each output signal of the first and second detection means. The method according to claim 1, Cooling control device for a computer component characterized in that it further comprises an alarm sound generating means for generating an alarm sound when the detected temperature of the second detection means is a predetermined temperature or more corresponding to the specific output signal. The second heat dissipation member, A plurality of heat dissipation fins for dissipating heat transferred from the cooling element; And a fan configured to air-cool the plurality of heat sink fins. Sensing a temperature of the computer electronic component and outputting a signal corresponding thereto; Sensing a computer internal temperature and outputting a corresponding signal; Lighting up and displaying the light emitting diodes corresponding to the detected electronic component and the computer internal temperature, respectively; Determining whether the internal temperature of the electronic component and the computer is detected by the electronic component and the internal temperature of the electronic component and the computer is greater than a predetermined temperature, thereby cooling the electronic component by driving a cooling element; Determining whether the electronic component and the internal temperature of the computer have been received, and if the temperature of the electronic component is less than a predetermined temperature, turning off the cooling element to stop cooling; Determining whether the electronic component and the computer internal temperature detected by the above are received and, when the computer internal temperature is above a predetermined temperature, generating an alarm sound; And And determining that the electronic component and the computer internal temperature are detected, and when the difference between the electronic component and the computer is less than a predetermined temperature, turning off the cooling element to stop the cooling. .