KR100728691B1 - Electronic Circuit For Controlling Refrigeration Of Computer Processor Unit - Google Patents

Abstract

The present invention provides an electronic cooling control device for cooling an electronic component of a computer by installing a cold sink at an upper end of the CIP oil and installing an electronic cooling element at an upper end of the cold sink, wherein the heat sink temperature of the electronic component is installed at the cold sink. A temperature sensor for outputting a signal corresponding thereto; A reference temperature setting unit that presets a specific temperature to be controlled to a voltage through a plurality of resistors installed in parallel with the temperature sensor; A comparator for comparing the output signal of the sensing amplifier and the output signal of the reference temperature setting unit with each other as a non-inverting terminal and an inverting terminal; A sensor monitoring unit configured to receive an output signal of the temperature sensor and a predetermined reference voltage as a non-inverting terminal and an inverting terminal, respectively, to monitor whether the temperature detecting sensor is short-circuited or malfunctioning at a sudden low temperature; A logic calculator configured to receive and output a signal output from the comparator and the sensor monitor; Switching means which are opened and closed according to the output signal of the logic operation unit and electrically insulated from the output terminal; A cooling element driving unit which opens and closes according to the output signal of the switching means and supplies a predetermined power to the electronic cooling element; And a PWM control oscillator for generating a predetermined duty pulse and outputting it to the switch means by arbitrarily adjusting the amplitude and duty cycle of the basic oscillation frequency when the electronic cooling element is powered off. It provides CPI's electronic cooling control circuit which can improve the speed very fast.

Description

CPIU's Electronic Circuit For Controlling Refrigeration Of Computer Processor Unit

1 is a block diagram showing a CPI cooling device and a control circuit thereof according to the prior art,

2 is a circuit diagram showing a cooling control unit of the CAPI cooling device according to the prior art,

3 is a block diagram of a CAPI electron cooling device according to the present invention;

4 is a circuit diagram illustrating a cooling control unit according to an embodiment of the present invention.

* Explanation of symbols for the main parts of the drawings

10: electronic component (CPU chip) 20: cold sink

30: electronic cooling element 40: heat sink

50: fan motor 100: cooling control unit

110: temperature sensor 112: sensing amplifier

114: reference temperature setting unit 116: comparison unit

118: sensor monitoring unit 120: logic operation unit

122: switching means 124: cooling element drive unit

126: constant voltage regulator 130: PWM control oscillator

The present invention relates to an electronic cooling device that cools heat generated in a CPU used in a general computer and an industrial controller. The electronic cooling module and the cooling plate are bonded to each other to transfer the heat generated by the CPU to the cold sink, and the cold sink. When the heat is transferred to the cold sink, the cold sink is transferred to the electronic cooling element, and the heat absorbed by the electronic cooling element is transferred to the heat sink again to release heat to the outside by the rotating fan motor, and when the power of the electronic cooling element is off. By supplying the predetermined power by the predetermined duty pulse oscillated by the oscillator for PWM control and preventing the back electromotive force from being transferred to the CPU, the CPU can be kept at a predetermined optimal temperature (about 25 degrees Celsius) and energy can be saved. The electronic cooling control circuit of the CPU.

In general, a CPU chip or a graphic chip, which is an electronic component of a computer, generates heat inside the chip due to high-speed data processing during operation, and prevents it because the chip may malfunction if the chip is overheated above a certain temperature. In order to do so, a chip chiller is required.

For this reason, the chip cooling device employs a heat sink made of a metal having good thermal conductivity, or an air-cooled cooling device in which the heat sink and the cold sink are combined to dissipate the chip.

The heat sink has heat accumulation and heat dissipation functions. The degree of cooling of the CPU chip is determined by the difference between the heat generated from the CPU chip and the heat dissipated into the air from the heat sink. In order to increase the surface area, it is possible to increase the surface area. However, there is a limitation in that the surface area of the heat sink can not be increased indefinitely in the computer, and the cooling effect is inevitably reduced if the heat generation amount is also increased as the performance of the CPU chip is improved. none.

In order to compensate for this, a fan motor is used in combination with the purpose of increasing the amount of heat dissipated into the air, which also improves the cooling effect somewhat, while not only increases the volume of the cooling device but also generates vibration and noise. there was.

Conventionally, in order to compensate for this, the thermoelectric cooling device using the Peltier effect and the CPU temperature sensor, as in the patent application 1999-30392, "CPI oil cooling apparatus and method", are used to quickly cool the heat generated from the CPU chip. An apparatus for enabling a chip to operate more smoothly has been proposed, and the present invention further includes a oscillating portion for PWM control in the "CPI oil cooling control circuit" of Patent Application No. 2001-53702. The present invention provides a more stable thermoelectric cooling element. To provide a control circuit that can operate and save energy.

Accordingly, an object of the present invention is to cool the heat generated from electronic components such as a central processing unit (hereinafter referred to as a CPU chip) and a graphics chip of a computer using an electronic cooling element, a temperature sensor, and an oscillator to a predetermined temperature. It is a device to detect the malfunction of the temperature sensor and operate the power output stage more stably, and control the cooling of the CIF oil which can block the back EMF from being transferred to the CPU when the electronic cooling element is turned off by using the oscillator. To provide a circuit.

Technical means of the present invention for achieving the above object, the present invention is installed in the upper end of the cold sink, and the electronic cooling control device for cooling the electronic components of the computer by installing an electronic cooling element on the upper end of the cold sink. A temperature sensing sensor installed at the cold sink and outputting a signal corresponding to the heating temperature of the electronic component; A reference temperature setting unit that presets a specific temperature to be controlled to a voltage through a plurality of resistors installed in parallel with the temperature sensor; A comparator for comparing the output signal of the sensing amplifier and the output signal of the reference temperature setting unit with each other as a non-inverting terminal and an inverting terminal; A sensor monitoring unit configured to receive an output signal of the temperature sensor and a predetermined reference voltage as a non-inverting terminal and an inverting terminal, respectively, to monitor whether the temperature detecting sensor is short-circuited or malfunctioning at a sudden low temperature; A logic calculator configured to receive and output a signal output from the comparator and the sensor monitor; Switching means which are opened and closed according to the output signal of the logic operation unit and electrically insulated from the output terminal; A cooling element driving unit which opens and closes according to the output signal of the switching means and supplies a predetermined power to the electronic cooling element; And a PWM control oscillator for generating a predetermined duty pulse to output the switching means by adjusting an amplitude and a duty cycle of a basic oscillation frequency when the electronic cooling device is powered off.

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.

Fig. 1 is a block diagram showing a CPI cooling device and a control circuit thereof according to the prior art, and Fig. 2 is a circuit diagram showing a cooling control unit of the CCF cooling device according to the prior art, and includes a CPU 10, a cold sink 20, and an electronic circuit. It consists of the cooling element 30, the heat sink 40, the fan motor 50 and the cooling control unit 100, and the heat generated from the CPU to the electronic cooling element and the cold sink to heat the heat generated by the CPU When the heat is transferred to the sink, the heat transferred to the cold sink is transferred to the electronic cooling element, and the heat absorbed by the electronic cooling element is transferred to the heat sink again, and the heat transferred by the rotation of the fan motor is released to the outside. In this way, the thermal energy generated by the CPU and the existing thermal energy are summed up, and the temperature of the CPU is rapidly increased. If the temperature is higher than the set temperature, the process is switched to the cooling mode and the cooling is performed. By repeating to maintain the optimum temperature of the CPU, Figure 3 is a block diagram of the CIF electronic cooling apparatus according to the present invention, Figure 4 is a circuit diagram showing a cooling control unit according to an embodiment of the present invention has the same configuration as the prior art However, the present invention further includes an oscillation unit for PWM (Pulse Width Modulation) control in the cooling control unit to arbitrarily adjust the amplitude and duty cycle of the basic oscillation frequency supplied by the oscillation unit for the PWM control when the electronic cooling element is turned off. Automatic supply of a predetermined duty pulse to transfer back EMF (i.e. heat generated from the heat sink) to the CPU By more precisely controlling the temperature, the CPU speed can be increased according to the stable ambient conditions at the optimum temperature (approximately 25 degrees Celsius), and the energy consumption can be reduced by more than 50%, greatly reducing the power consumption. That is, 100% of power is supplied when the power is on and cooling mode, and 10-50% of power is supplied to the electronic cooling element when the power is cut off by a preset duty pulse when the power is off. It relates to an apparatus and a control circuit thereof.

The operation configuration of FIGS. 3 and 4 will be described in detail with reference to FIGS. 1 and 2 as follows.

First, FIG. 3 is a block diagram of a CPI electronic cooling apparatus according to the present invention, which includes a CPU 10, a cold sink 20, an electronic cooling element 30, a heat sink 40, a fan motor 50, and a cooling control unit ( 100), and the same components as in the prior art FIGS. 1 and 2 are denoted by the same reference numerals.

The cold sink 20 is composed of a copper pad and a metal pad such as an aluminum plate seated on the top of the package of the CPU, such as the CPU chip 10 to release heat generated from computer electronic components, the electronic cooling element 30 is It is in close contact with the upper end of the cold sink 20 is configured to cool the cold sink 20 to a set temperature by receiving power under the control of the cooling control unit 100, the heat sink 40 is the electronic cooling element 30 It is installed on the top of the) and is configured to release the heat transferred from the electronic cooling device 30 through a plurality of heat dissipation fins 45 installed in a row in a row, the fan motor 50 is installed on one side of the heat sink 40 It is configured to air-cool the heat radiating fins 45 which are operated according to a predetermined power supply and warmed to a predetermined temperature.

And, the cooling control unit 100 is composed of a plurality of electronic components are arranged on a circuit board mounted on one side of the heat sink 40, the temperature sensing sensor 31 of one side of the cold sink 20 It is made to control the operation of the electronic cooling device 30 according to the sensing temperature.

The electronic cooling device 30 is a semiconductor electronic cooling module using the Peltier effect, and when the current flows from the N-type semiconductor material to the P-type semiconductor material, the surface bonded to the N-type and P-type semiconductor material is endothermic. Down, the unbonded side exothermic.

One to several hundred thermocouples made of such N-type and P-type semiconductor elements are formed in a matrix, and the thermocouples are sandwiched between ceramic plates that electrically support the structure while electrically blocking the radiator and the cooling object. The heat generated from the CPU chip 10, which has a fabricated structure and requires cooling, is heated by a heat sink in contact with the heat absorbing and heat dissipating ceramic plate through the heat conducting plate in close contact with the heat absorbing ceramic plate of the electronic cooling device 30. It keeps moving.

That is, when the electronic cooling element 30 is operated, one side is cooled, and the other side generates heat, and the amount of heat generated varies depending on the degree of cooling, but depending on how well the heat is generated. The efficiency of is determined.

Therefore, in the process of cooling the cold sink 20, since the heat is generated on the opposite side of the electronic cooling device 30, the heat sink 40 is required, and the heat sink 40 should have good heat dissipation performance. (20) can be cooled well.

To this end, the fan motor 50 is attached to the heat sink 40 to circulate air in the air by the rotation of the fan motor, thereby dissipating heat, thereby improving thermal cooling efficiency.

In addition, the cooling control unit 100 according to the present invention, as shown, the temperature sensor 110, the sensing amplifier 112, the reference temperature setting unit 114, the comparison unit 116, the sensor monitoring unit 118 , A logic operation unit 120, a switching unit 122, a cooling element driving unit 124, a constant voltage control unit 126, and a PWM control oscillation unit 130.

The temperature sensor 110 is installed inside the cold sink 20 to output a signal corresponding to the heating temperature of the electronic component, and the sensing amplifier 112 is output through the temperature sensor 110. It is configured to amplify the received signal and the reference signal to the non-inverting terminal (+) and the inverting terminal (-), respectively, and the reference temperature setting unit 114 is a resistor (R5, R6), the comparator 116 is configured to receive and compare the output signal of the sensing amplifier 112 and the output signal of the reference temperature setting unit 114, respectively, and then output a corresponding signal. The monitoring unit 118 is composed of an amplifier for outputting a signal corresponding to the output signal of the temperature sensor 110 and a predetermined reference voltage, respectively, and then compare the output signal when the temperature sensor is short-circuit or malfunctioning at a sudden low temperature.The.

In addition, the logic operation unit 120 is composed of an oragate for receiving the signals output from the comparator 116 and the sensor monitoring unit 118, respectively, and logically combines them and outputs the corresponding signals. Is composed of a photocoupler such as a photodiode (PD) and a phototransistor (PT) which are operated according to the output signal of the logic operation unit 120 and the output signal of the PWM control oscillator to electrically insulate the output terminal, and the cooling element driver 124. ) Is composed of transistors TR1 and TR2 to be opened and closed according to the switching of the photocoupler to supply predetermined power to the electronic cooling element 30, and the constant voltage controller 126 is a voltage and a reference voltage supplied from the sensing amplifier. Compared to the preset voltage according to the use temperature from the table, if it is higher than the reference voltage, the voltage input from the comparator or the DC 12V voltage applied from the outside After converting the power supply to various circuits and electronic cooling elements, the oscillator 130 for PWM control oscillates when the power is turned off, and arbitrarily adjusts the amplitude and duty cycle of the fundamental frequency supplied (approximately, 10-50%). It automatically supplies duty pulse of and inputs to photocoupler.

In addition, the electron cooling element 30 is a positive electrode (+), (-) of the semiconductor electronic cooling module (TEM / ThermoElectric Module) applying the Peltier Effect (+ 12VDC) when the power is supplied (+ 12VDC) electrons (+ As it moves from) to (-), the positive electrode (+) absorbs heat and generates heat to the negative electrode (-).

4 is a circuit diagram illustrating a cooling control unit according to an embodiment of the present invention with reference to FIG. 3.

The temperature sensor 110 is installed between the power supply voltage VCC and the ground voltage GND, and outputs a signal corresponding to the cold sink 20, that is, the heating temperature of the CPU 10. Detector type Platinum Temperature (Platinum Temperature) device, the sensing amplifier 112 is a signal output through the temperature sensor 110 and a plurality of resistors (R4, ZD1) connected in series between the power supply voltage and the ground voltage Comprising an operational amplifier (Op1) for receiving and amplifying the signal applied to the non-inverting terminal (+) and inverting terminal (-), respectively, and the reference temperature setting unit 114 is a plurality of between the power supply voltage and ground voltage After connecting the resistors (R5, R6) in series, it is configured to preset a specific temperature to be controlled by a voltage through a plurality of resistors (R5, R6), the comparator 116 is amplified by the sensing amplifier 112 The reference voltage set through the output signal and the reference temperature setting unit 114 Each non-inverting terminal (+) and an inverting terminal (-) and then compares each received input to the comparator is composed of (Comp) and outputting a signal corresponding thereto.

In addition, the sensor monitoring unit 118 is a signal input to the temperature sensor 110 and the voltage (Va) supplied through the constant voltage adjusting unit 126 to the non-inverting terminal (+) and inverting terminal (-), respectively. Comprising an amplifier (Op2) provided and outputs a corresponding signal, it is configured to monitor the circuit of the temperature sensor 110 is short-circuit or malfunctioning at a low temperature, the logic operation unit 120 is a comparison unit 116 And a logic gate after receiving a signal output from the sensor monitoring unit 118 and logically combining the signal and outputting the high signal when at least one of the two input signals is 'high'. 122 is opened or closed according to the output signal of the logic operation unit 120 when the power is on, or opened and closed according to the output signal of the PWM control oscillator 130 when the power is off and the photodiode for electrically insulated from the output terminal ( PD) and phototransistor (PT) It is composed of a photo coupler, the cooling device driver 124 is switched in accordance with the conduction of the phototransistor (PT) of the switching means 122 to supply a predetermined power to the electronic cooling device (30) through the output terminal ( TR1) and FET-type transistor (TR2), the PWM control oscillator 130 is installed between the power supply (VCC) and ground (GND), when the cold mode is stopped and the power is turned off when the power is turned off The oscillator is configured to supply a predetermined DC voltage to the electronic cooling element by outputting it to the coupler.

In addition, the sensor monitoring unit 118 normally outputs a 'high' signal when the temperature sensor 110 is not malfunctioning or under-cooled, and a forward diode (D1) is installed at the non-inverting input terminal (+) to provide a current. To prevent the reverse flow of the power supply and the variable resistance (VR1) between the power supply voltage and the temperature sensor 110 is configured to adjust the CPU 10 to the appropriate temperature according to the surrounding environment by arbitrarily adjusting the cooling temperature. It is desirable to.

Looking at the schematic operation of the electronic cooling control device of the present invention configured as described above are as follows.

The temperature sensor 110 installed on one side of the cold sink 20 in close contact with the CPU 10 has a large resistance as the temperature rises, and a voltage corresponding to the exothermic temperature of the cold sink 20 is increased by an amplifier ( Output to the non-inverting terminal (+) of Op1).

The amplifier Op1 is amplified according to the input voltage and the output voltage is supplied to the non-inverting terminal (+) of the comparator Comp.

In the comparator Comp, the voltage supplied from the amplifier Op1 and the reference voltage applied from the reference voltage setting unit are respectively supplied to the non-inverting terminal (+) and the inverting terminal (-), and then the input voltage is higher than the reference voltage. If it is high, the 'high' signal is output to the oragate G1.

The oA gate G1 receives the output signal of the comparator 116 and the output signal of the sensor monitor 118 and performs a logical operation, respectively, and when at least one of the two signals is 'high', that is, the temperature sensor ( When the heating temperature detected through 110 is higher than the preset reference temperature or there is no abnormality in the temperature detection sensor 110, a 'high' signal is output.

Subsequently, the photodiode PD of the photocoupler 122 emits light according to the output signal of the OR gate G1 to turn on the phototransistor PT and to cool according to the turn-on of the phototransistor PT. The transistor M1 of the device driver 124 is turned on to supply a predetermined DC voltage to the electronic cooling device 30.

In this case, the operation of the electronic cooling device 30 may be visually confirmed by the light emitting diode PD1 provided between the power supply voltage VCC and the transistor M1. In addition, by setting the reference temperature set in the reference temperature setting unit 114 to 25 ℃ to maintain the CPU 10 approximately 25 ℃, the temperature detection sensor 110 and the constant voltage control unit 126 and The power supplied to the amplifiers Op1, Op2, comparator and Oagate G1 is kept constant so that the power supply can be stably operated regardless of the change of the external power voltage. In 124, it is preferable to use the transistor TR and the FET transistor TR2 to quickly switch.

Therefore, when the temperature is lower than the set temperature, the power supply is automatically turned off, and the electronic cooling element feeds back the high temperature thermal energy emitted from the aluminum heat sink due to the heat conduction effect and heats the CPU again. The thermal energy generated by the CPU and the existing thermal energy are summed up, and the temperature of the CPU rises rapidly. When the temperature rises above the set temperature, the CPU enters the cooling mode and cools.

At this time, when the power is turned off, the amplitude and duty cycle of the basic oscillation frequency oscillated by the oscillator for PWM control are arbitrarily adjusted to automatically supply a predetermined duty pulse (about 10-50%), thereby providing a photo of the photocoupler 122. The photodiode PT is turned on by emitting light of the diode PD, and the transistor M1 of the cooling device driver 124 is turned on according to the turn-on of the phototransistor PT to cool the electron cooling device. 30) to supply a constant DC voltage.

Therefore, the CPU chip is supplied with 100% of the power to the electronic cooling element in the cooling mode when the power is on, and the predetermined power (about 10-50%) is supplied to the electronic cooling element by a predetermined duty pulse when the power is turned off. 10 can be more powerfully cooled and maintained at a constant temperature, thereby performing normal and stable high-speed data processing capability and saving energy.

Although specific embodiments of the present invention have been described and illustrated above, not only the CPU chip of a computer but also other electronic components or equipment requiring cooling, such as notebooks, industrial device semiconductors, manufacturing equipment applications, laser coolers, mold coolers, kimchi refrigerators, and optical communication fields. And it is apparent that the present invention, such as using the electronic cooling element and its control device by applying to a medical device may be variously modified and implemented by those skilled in the art. Such modified embodiments should not be individually understood from the technical spirit or the prospect of the present invention, and such modified embodiments should fall within the appended claims of the present invention.

         Accordingly, in the present invention, an electronic cooling element, a temperature sensor, and an oscillator are used to cool a heat generated from electronic components such as a computer's central processing unit and a graphic chip to a predetermined temperature (about 25 degrees Celsius). By installing a means for monitoring the temperature sensor, it detects malfunction of sensor and overcooling state of electronic parts to operate CPU cooling more stably, and insulates cooling temperature control side and cooling element driving side through photo coupler. Accordingly, the electronic cooling element driving side can be operated stably.

        In addition, there is no thermoelectric conversion of the electronic cooling device (that is, switching from the cooling mode to the heating mode rapidly) to maintain the life of the electronic cooling device, and the cooling efficiency is reduced by more than 50% in terms of energy and thermal management protection. It can be increased by more than 50% compared to the existing method, and it can reduce power consumption even more. It is very stable in controlling thermoelectric elements, and it can improve the speed of CPU very quickly even when using computer for a long time. It has no electronic effect and has less noise and vibration.

Claims (3)

      In the electronic cooling control device to install a cold sink on the top of the C, and to cool the electronic components of the computer by installing an electronic cooling element on the top of the cold sink, A temperature sensing sensor installed in the cold sink and outputting a signal corresponding to the heating temperature of the electronic component; A sensing amplification unit configured to amplify the signal and the reference signal output through the temperature sensing sensor as non-inverting terminals and inverting terminals, respectively; A reference temperature setting unit that presets a specific temperature to be controlled to a voltage through a plurality of resistors installed in parallel with the temperature sensor; A comparator for comparing the output signal of the sensing amplifier and the output signal of the reference temperature setting unit with each other as a non-inverting terminal and an inverting terminal; A sensor monitoring unit configured to receive an output signal of the temperature sensor and a predetermined reference voltage as a non-inverting terminal and an inverting terminal, respectively, to monitor whether the temperature detecting sensor is short-circuited or malfunctioning at a sudden low temperature; A logic calculator configured to receive and output a signal output from the comparator and the sensor monitor; Switching means which are opened and closed according to the output signal of the logic operation unit and electrically insulated from the output terminal; Cooling element driving unit for opening and closing according to the output signal of the switching means for supplying a predetermined power to the electronic cooling element; Consisting of the cold sink is installed on the upper end of the C, and the computer is installed by installing the electronic cooling element on the upper end of the cold sink An electronic cooling control device for cooling an electronic component of And a PWM control oscillator for generating a predetermined duty pulse to output the switching means by adjusting an amplitude and a duty cycle of a basic oscillation frequency when the electronic cooling element is powered off. delete The method according to claim 1, The PWM control oscillator, CIFIL's electronic cooling control circuit is characterized by supplying 10% to 50% power to the electronic cooling element when the power of the electronic cooling element is turned off by a preset duty pulse.

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