KR100418382B1 - Circuit for controlling refrigeration of computer processor unit - Google Patents

Abstract

The present invention provides a cooling control device for cooling an electronic component of a computer by installing a cold sink at an upper end of a CPU and installing an electronic cooling element at an upper end of the cold sink. A temperature sensor for outputting a signal corresponding to the heating temperature, a reference temperature setting unit for presetting a specific temperature to be controlled to a voltage through a plurality of resistors installed in parallel with the temperature sensor, and the sensing amplifier unit A comparator which receives and compares the output signal and the output signal of the reference temperature setting unit with the non-inverting terminal and the inverting terminal, respectively, and receives the output signal of the temperature sensor and a predetermined reference voltage as the non-inverting terminal and the inverting terminal, respectively. A sensor monitoring unit for monitoring a short circuit or malfunctioning at a sudden low temperature, and opening / closing according to an output signal of the comparing unit and the sensor monitoring unit And a switching means electrically insulated from the output stage, and a cooling element driver which opens and closes according to the output signal of the switching means and supplies a predetermined power to the electronic cooling element, thereby detecting a malfunction of the temperature sensing sensor and Provides CPI's cooling control circuit for more stable operation.

Description

CFICUIT FOR CONTROLLING REFRIGERATION OF COMPUTER PROCESSOR UNIT}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a control device for cooling heat generated in computer electronic components. In particular, the present invention relates to a central processing unit (hereinafter referred to as a CPU chip) of a computer and an electronic component such as a graphic chip using an electronic cooling element and a temperature sensor. It relates to a cooling control circuit of the CAPI oil to cool the heat to the predetermined temperature range.

In general, a CPU chip or a graphic chip, which is an electronic component of a computer, generates heat inside the chip due to high-speed data processing during operation, and prevents it because the chip may malfunction if the chip is overheated above a certain temperature. In order to do so, a chip chiller is required.

For this reason, the chip cooling device employs a heat sink made of a metal having good thermal conductivity or an air-cooled cooling device in which a heat sink and a cooling fan are combined to heat the chip.

The heat sink has heat accumulation and heat dissipation functions. The degree of cooling of the CPU chip is determined by the difference between the heat generated from the CPU chip and the heat dissipated into the air from the heat sink. Although it is possible to increase the surface area of the computer, the surface area of the heat sink is infinitely large, and considering the trend that the heat generation also increases as the performance of the CPU chip increases, the cooling effect is inevitably reduced.

In order to compensate for this, a combination of cooling fans is used for the purpose of increasing the amount of heat dissipated into the air, which also improves the cooling effect somewhat, while increasing the volume of the cooling device and generating vibration and noise. there was.

Conventionally, in order to compensate for this, the thermoelectric cooling device using the Peltier effect and the CPU temperature sensor, as in the patent application 1999-30392, "CPI oil cooling apparatus and method", are used to quickly cool the heat generated from the CPU chip. An apparatus for enabling a chip to operate more smoothly has been proposed, and the present invention provides a control circuit capable of more stably operating a thermoelectric cooling element in a CPU oil cooling device using a CPU temperature sensor and a thermoelectric cooling element. To provide.

Accordingly, an object of the present invention is to provide an apparatus for cooling a heat generated from electronic components such as a central processing unit (hereinafter referred to as a CPU chip) of a computer and a graphics chip using an electronic cooling element and a temperature sensor. The present invention provides a cooling control circuit of a CAPI oil that can detect a malfunction of a temperature sensing sensor and operate the power output stage more stably.

1 is a block diagram showing a CPI cooling device and a control circuit thereof according to the present invention,

2 is a circuit diagram showing a cooling control unit according to an embodiment of the present invention.

* Explanation of symbols for the main parts of the drawings

10: electronic component (CPU chip) 20: cold sink

30: electronic cooling element 40: heat sink

50: fan motor 100: cooling control unit

110: temperature sensor 112: sensing amplifier

114: reference temperature setting unit 116: comparison unit

118: sensor monitoring unit 120: logic operation unit

122: switching means 124: cooling element drive unit

126: constant voltage regulator

The technical means of the present invention for achieving the above object, in the cooling control device for cooling the electronic components of the computer by installing a cold sink on top of the CPI, an electronic cooling element on the top of the cold sink: A temperature sensor installed in the sink and outputting a signal corresponding to the heating temperature of the electronic component; A sensing amplification unit configured to amplify the signal and the reference signal output through the temperature sensing sensor as non-inverting terminals and inverting terminals, respectively; A reference temperature setting unit that presets a specific temperature to be controlled to a voltage through a plurality of resistors installed in parallel with the temperature sensor; A comparator for comparing the output signal of the sensing amplifier and the output signal of the reference temperature setting unit with each other as a non-inverting terminal and an inverting terminal; A sensor monitoring unit configured to receive an output signal of the temperature sensor and a predetermined reference voltage as a non-inverting terminal and an inverting terminal, respectively, to monitor whether the temperature detecting sensor is short-circuited or malfunctioning at a sudden low temperature; A logic calculator configured to receive and output a signal output from the comparator and the sensor monitor; Switching means which are opened and closed according to the output signal of the logic operation unit and electrically insulated from the output terminal; And a cooling element driving unit which opens and closes according to the output signal of the switching means and supplies a predetermined power to the electronic cooling element.

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.

1 is a block diagram showing a CPI cooling device and a control circuit thereof according to the present invention, including a CPU 10, a cold sink 20, an electronic cooling element 30, a heat sink 40, a fan motor 50, It consists of a cooling control unit (100).

The cold sink 20 is composed of a copper pad and a metal pad such as an aluminum plate seated on the top of the CAPI oil package such as the CPU chip 10 to release heat generated from computer electronic components, the electronic cooling element 30 It is in close contact with the upper end of the cold sink 20 is supplied with power under the control of the overcooling control unit 100 is configured to cool the cold sink 20 to a set temperature, the heat sink 40 is an electronic cooling element ( It is installed on the top of the 30 and is configured to discharge the heat transferred from the electronic cooling device 30 through a plurality of heat dissipation fins 45 installed in a row in a vertical line, the fan motor 50 is on one side of the heat sink 40 Installed and operated according to a predetermined power supply is configured to cool the heat radiating fins 45 heated to a predetermined temperature.

And, the cooling control unit 100 is composed of a plurality of electronic components are arranged on a circuit board mounted on one side of the heat sink 40, the temperature sensing sensor 31 of one side of the cold sink 20 It is made to control the operation of the electronic cooling device 30 according to the sensing temperature.

The electronic cooling device 30 is a semiconductor electronic cooling module using the Peltier effect, and when the current flows from the N-type semiconductor material to the P-type semiconductor material, the surface bonded to the N-type and P-type semiconductor material is endothermic. Down, the unbonded side exothermic.

One to several hundred thermocouples made of such N-type and P-type semiconductor elements are formed in a matrix, and the thermocouples are sandwiched between ceramic plates that electrically support the structure while electrically blocking the radiator and the cooling object. The heat generated from the CPU chip 10, which has a fabricated structure and requires cooling, is heated by a heat sink in contact with the heat absorbing and heat dissipating ceramic plate through the heat conducting plate in close contact with the heat absorbing ceramic plate of the electronic cooling device 30. It keeps moving.

That is, when the electronic cooling element 30 is operated, one side is cooled, and the other side generates heat, and the amount of heat generated varies depending on the degree of cooling, but depending on how well the heat is generated. The efficiency of is determined.

Therefore, in the process of cooling the cold sink 20, since the heat is generated on the opposite side of the electronic cooling device 30, the heat sink 40 is required, and the heat sink 40 should have good heat dissipation performance. (20) can be cooled well.

To this end, the cooling fan 50 is attached to the heat sink 40 to increase the thermal cooling efficiency.

In addition, the cooling control unit 100 according to the present invention, as shown, the temperature sensor 110, the sensing amplifier 112, the reference temperature setting unit 114, the comparison unit 116, the sensor monitoring unit 118 , A logic operation unit 120, a switching unit 122, a cooling element driving unit 124, and a constant voltage control unit 126.

The temperature sensor 110 is installed on one side of the cold sink 20 is configured to output a signal corresponding to the heat generated temperature of the electronic component, the sensing amplifier 112 is a temperature sensor 110 The signal and the reference signal outputted through the non-inverting terminal (+) and the inverting terminal (-) are respectively provided and amplified, and the reference temperature setting unit 114 is a resistance to preset a specific temperature to control voltage ( R5 and R6, and the comparing unit 116 is configured to receive the output signal of the sensing amplifier 112 and the output signal of the reference temperature setting unit 114, respectively, and then output a corresponding signal. The sensor monitoring unit 118 receives and compares the output signal of the temperature sensor 110 and a predetermined reference voltage, respectively, and then outputs a corresponding signal when the temperature sensor is shorted or malfunctions at a sudden low temperature. Done with There.

In addition, the logic operation unit 120 is provided with an oragate for receiving the signals output from the comparator 116 and the sensor monitoring unit 118, respectively, and logically combining the signals and outputting the corresponding signals. Is composed of photocouplers such as photodiodes (PD) and phototransistors (PT) which are operated according to the output signal of the logic operation unit 120 and electrically insulate from the output terminals, and the cooling element driving unit 124 is used for switching the photocouplers. Therefore, the opening and closing is performed to supply a predetermined power to the electronic cooling device 30, and the constant voltage adjusting unit 126 is configured to convert a DC 12V voltage applied from the outside into a predetermined constant voltage and then supply it to various circuit parts.

2 is a circuit diagram illustrating a cooling control unit according to an embodiment of the present invention, which will be described with reference to FIG. 1.

The temperature sensor 110 is installed between the power supply voltage VCC and the ground voltage GND, and outputs a signal corresponding to the cold sink 20, that is, the heating temperature of the CPU 10. Detector type Platinum Temperature (Platinum Temperature) device, the sensing amplifier 112 is a signal output through the temperature sensor 110 and a plurality of resistors (R4, ZD1) connected in series between the power supply voltage and the ground voltage Comprising an operational amplifier (Op1) for receiving and amplifying the signal applied to the non-inverting terminal (+) and inverting terminal (-), respectively, and the reference temperature setting unit 114 is a plurality of between the power supply voltage and ground voltage After the resistors R5 and R6 are connected in series, a predetermined temperature to be controlled is set to a voltage through a plurality of resistors R5 and R6 in advance, and the comparator 116 is amplified by the sensing amplifier 112. The reference voltage set through the output signal and the reference temperature setting unit 114 It consists of a comparator (Comp) that receives and compares each non-inverting terminal (+) and inverting terminal (-) and outputs the corresponding signal.

In addition, the sensor monitoring unit 118 is a signal input to the temperature sensor 110 and the voltage (Va) supplied through the constant voltage adjusting unit 126 to the non-inverting terminal (+) and inverting terminal (-), respectively. Comprising an amplifier (Op2) provided and outputs a corresponding signal, it is configured to monitor the circuit of the temperature sensor 110 is short-circuit or malfunctioning at a low temperature, the logic operation unit 120 is a comparison unit 116 And a logic gate after receiving a signal output from the sensor monitoring unit 118 and logically combining the signal and outputting the high signal when at least one of the two input signals is 'high'. Reference numeral 122 is opened and closed in accordance with the output signal of the logic operation unit 120 and is composed of a photocoupler consisting of a photodiode (PD) and a phototransistor (PT) for electrically insulated from the output terminal, the cooling element driver 124 is Phototransistor of the switching means 122 It is composed of a FET transistor M1 which is switched in accordance with the conduction of the rotor PT and supplies a constant power supply to the electronic cooling element 30 through the output terminal.

In addition, the sensor monitoring unit 118 normally outputs a 'high' signal when the temperature sensor 110 is not malfunctioning or under-cooled, and a forward diode (D1) is installed at the non-inverting input terminal (+) to provide a current. To prevent the reverse flow of the power supply and the variable resistance (VR1) between the power supply voltage and the temperature sensor 110 is configured to adjust the CPU 10 to the appropriate temperature according to the surrounding environment by arbitrarily adjusting the cooling temperature. It is desirable to.

Looking at a schematic operation of the cooling control device of the present invention configured as described above are as follows.

The temperature sensor 110 installed on one side of the cold sink 20 in close contact with the CPU 10 has a large resistance as the temperature rises, and a voltage corresponding to the exothermic temperature of the cold sink 20 is increased by an amplifier ( Output to the non-inverting terminal (+) of Op1).

The amplifier Op1 is amplified according to the input voltage and the output voltage is supplied to the non-inverting terminal (+) of the comparator Comp.

In the comparator Comp, the voltage supplied from the amplifier Op1 and the reference voltage applied from the reference voltage setting unit are respectively supplied to the non-inverting terminal (+) and the inverting terminal (-), and then the input voltage is higher than the reference voltage. If it is high, the 'high' signal is output to the oragate G1.

The oA gate G1 receives the output signal of the comparator 116 and the output signal of the sensor monitor 118 and performs a logical operation, respectively, and when at least one of the two signals is 'high', that is, the temperature sensor ( When the heating temperature detected through 110 is higher than the preset reference temperature or there is no abnormality in the temperature detection sensor 110, a 'high' signal is output.

Subsequently, the photodiode PD of the photocoupler 122 emits light according to the output signal of the OR gate G1 to turn on the phototransistor PT and to cool according to the turn-on of the phototransistor PT. The transistor M1 of the device driver 124 is turned on to supply a predetermined DC voltage to the electronic cooling device 30.

In this case, the operation of the electronic cooling device 30 may be visually confirmed by the light emitting diode PD1 provided between the power supply voltage VCC and the transistor M1.

In addition, the reference temperature set in the reference temperature setting unit 114 is set to 25 ℃ to maintain the CPU 10 approximately 25 ℃, the temperature sensor 110 and through the constant voltage control unit 126 The power supplied to the amplifiers Op1, Op2, comparator and Oagate G1 is kept constant so that the power supply can be stably operated regardless of the change of the external power voltage. In 124, it is preferable to use a FET transistor M1 to quickly switch.

Therefore, the CPU chip 10 can be stably maintained at a constant temperature while being strongly cooled, and can perform normal and stable high speed data processing capability.

Although specific embodiments of the present invention have been described and illustrated above, the present invention may be variously modified by those skilled in the art, such as by using an electronic cooling element and its control device not only for a CPU chip of a computer but also for other electronic parts or equipment requiring cooling. It is obvious that it can be implemented. Such modified embodiments should not be individually understood from the technical spirit or the prospect of the present invention, and such modified embodiments should fall within the appended claims of the present invention.

Therefore, in the present invention, by using the electronic cooling element and the temperature sensor, a means for monitoring the temperature sensor in a device for cooling the heat generated from electronic components such as the computer's central processing unit and the graphics chip to a predetermined temperature CPU cooling can be operated more stably by detecting sensor malfunction and supercooling state of electronic parts. In addition, the cooling element driving side is maximally stable by insulating the cooling temperature control side and the cooling element driving side through a photocoupler. By applying a constant voltage to the various circuits always through the constant voltage adjusting unit 126, there is an advantage that the circuit can be operated stably regardless of the fluctuation of the external power supply voltage during power control.

Claims (4)

In a cooling control device for cooling the electronic components of the computer by installing a cold sink on the top of the CIF oil, an electronic cooling element on the top of the cold sink: A temperature sensing sensor installed in the cold sink and outputting a signal corresponding to the heating temperature of the electronic component; A sensing amplification unit configured to amplify the signal and the reference signal output through the temperature sensing sensor as non-inverting terminals and inverting terminals, respectively; A reference temperature setting unit that presets a specific temperature to be controlled to a voltage through a plurality of resistors installed in parallel with the temperature sensor; A comparator for comparing the output signal of the sensing amplifier and the output signal of the reference temperature setting unit with each other as a non-inverting terminal and an inverting terminal; A sensor monitoring unit configured to receive an output signal of the temperature sensor and a predetermined reference voltage as a non-inverting terminal and an inverting terminal, respectively, to monitor whether the temperature detecting sensor is short-circuited or malfunctioning at a sudden low temperature; A logic calculator configured to receive and output a signal output from the comparator and the sensor monitor; Switching means which are opened and closed according to the output signal of the logic operation unit and electrically insulated from the output terminal; And And a cooling element driving unit which opens and closes according to the output signal of the switching means and supplies a predetermined power to the electronic cooling element. The method according to claim 1, The cooling control device, And a constant voltage control unit for converting a DC voltage input from the outside into a constant voltage and supplying a constant constant voltage to various circuit units. The method according to claim 1, The temperature sensor, CPI oil cooling control circuit, characterized in that the RTD-type platinum temperature element is proportional to the temperature and the resistance value. The method according to claim 1, Said switching means is CCF cooling control circuit, characterized in that consisting of a photocoupler.