US20110225982A1 - Cpu cooling circuit having thermoelectric element - Google Patents
Cpu cooling circuit having thermoelectric element Download PDFInfo
- Publication number
- US20110225982A1 US20110225982A1 US12/820,044 US82004410A US2011225982A1 US 20110225982 A1 US20110225982 A1 US 20110225982A1 US 82004410 A US82004410 A US 82004410A US 2011225982 A1 US2011225982 A1 US 2011225982A1
- Authority
- US
- United States
- Prior art keywords
- cooling circuit
- type semiconductor
- semiconductor units
- cpu
- cpu cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 25
- 239000004065 semiconductor Substances 0.000 claims abstract description 35
- 239000000758 substrate Substances 0.000 claims abstract description 21
- 238000005070 sampling Methods 0.000 claims description 5
- 230000007423 decrease Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000003570 air Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/38—Cooling arrangements using the Peltier effect
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present disclosure relates to a central processing unit (CPU) cooling circuit, and more particularly, to CPU cooling circuit having thermoelectric element.
- CPU central processing unit
- an electronic element of an electronic device such as a central processing unit (CPU) of a computer
- CPU central processing unit
- a large amount of heat is often produced.
- the heat must be quickly removed from the CPU to prevent unstable operation or damage to the CPU.
- a heat sink made of aluminum or copper is attached to an outer surface of the CPU to absorb the heat from the CPU.
- the heat absorbed by the heat sink is then dissipated to the ambient air via a fan attached on the heat sink.
- dissipating heat to air is slow and inefficient.
- the fan will keep operating at a high-speed of rotation, which wastes electric power and shortens the life of the fan.
- FIG. 1 is a diagram of a CPU cooling circuit having a thermoelectric element according to one embodiment of the present disclosure.
- FIG. 2 is a side view of the thermoelectric element of the CPU cooling circuit in FIG. 1 .
- the CPU cooling circuit 100 includes a current source circuit 20 and a thermoelectric element 10 driven by the circuit 20 .
- the circuit 20 controls a current output to the thermoelectric element 10 to cool a CPU (not shown) to which the thermoelectric element 10 is attached.
- the thermoelectric element 10 includes a first thermoelectric substrate 11 a coupled to the CPU and an opposite second thermoelectric substrate 11 b , a plurality of p-type semiconductor units 101 a , and a plurality of n-type semiconductor units 101 b .
- the thermoelectric element 10 further includes a first electrically conductive pattern 102 a and a second electrically conductive pattern 102 b formed at internal surfaces of the first and the second substrates 11 a and 11 b , respectively.
- Each of the n-type and the p-type semiconductor units 101 a and 101 b is sandwiched between the first and the second patterns 102 a and 102 b .
- the first and the second patterns 102 a and 102 b are connected to opposite ends of the semiconductor units 101 a and 101 b , respectively.
- the semiconductor units 101 a and 101 b are alternately arranged to be electrically connected in series via the first and the second patterns 102 a and 102 b .
- each adjacent pair of the semiconductor units 101 a and 101 b is electrically connected in parallel via the first and the second patterns 102 a and 102 b.
- thermoelectric element 10 further includes a positive power supply input 110 and an opposite negative power supply input 112 formed on the internal surface of the first substrate 11 a for receiving a driving current from the current source circuit 20 .
- thermoelectric element 10 When current flows through the semiconductor units 101 a and 101 b , pn junctions of the semiconductor units 101 a and 101 b attached to the first substrate 11 a have current flowing from the n-type semiconductor units 101 a to the p-type semiconductor units 101 b and form a cooler portion, whereas, other pn junctions of the semiconductor units 101 a and 101 b attached to the second substrate 11 b have current flowing from the p-type semiconductor units 101 b to the n-type semiconductor units 101 a and form a heater portion. Therefore, heat can be conducted from the first substrate 11 a to the opposite second substrate 11 b via the semiconductor units 101 a and 101 b . A heat conductive efficiency of the thermoelectric element 10 is in direct proportion to the current flowing therethrough.
- the circuit 20 includes a voltage comparator 21 , a thermal resistor R 1 , a current division resistor R 2 , a plurality of current sampling resistors R 3 , and a plurality of switches Q.
- the voltage comparator 21 is an LM358DRG4 chip produced by Texas Instruments, Incorporated.
- the voltage comparator 21 includes a first input I 1 , a second input I 2 , a third input I 3 , a fourth input I 4 , a first output O 1 , and a second output O 2 .
- the thermal resistor R 1 has a negative temperature index and its resistance decreases with an increase its temperature.
- the thermal resistor R 1 connects in parallel with the current division resistor R 2 between the first input I 1 and an external power supply VCC.
- the thermal resistor R 1 is positioned adjacent to the first substrate 11 a of the thermoelectric element 10 to sense a temperature of the thermoelectric element 10 .
- the plurality of switches Q includes five n-channel metal-oxide-semiconductor (NMOS) transistors.
- Each NMOS transistor Q includes a source electrode S, a drain electrode D, and a gate electrode S controlling an electrical conductivity between the source electrode S and the drain electrode D.
- the gate electrode G of each NMOS transistor Q connects to the first and the second outputs O 1 and O 2 of the voltage comparator 21 .
- the drain electrode D of each NMOS transistor Q connects to the external power source VCC.
- the source electrode S of each NMOS transistor Q connects to the positive power supply input 110 of the thermoelectric element 10 .
- each NMOS transistor Q also connects to the second input I 2 of the voltage comparator 21 via a resistor (not labeled).
- the NMOS transistors Q can be replaced by some other kind of switch such as p-channel metal-oxide-semiconductor (PMOS) transistors, npn type bipolar transistors, or pnp type bipolar transistors.
- PMOS metal-oxide-semiconductor
- the resistors R 3 include five current sampling resistors R 3 connected in parallel between the fourth input I 4 of the voltage comparator 21 and ground.
- the fourth input I 4 of the voltage comparator 21 also connects to the negative power supply input 112 of the thermoelectric element 10 .
- thermoelectric element 10 In operation, when a CPU attached to the first substrate 11 a of the thermoelectric element 10 normally works it can make the temperature of the thermoelectric element 10 increase, the resistance of the thermal resistor R 1 correspondingly decreases according to the increased temperature of the thermoelectric element 10 . Thus, a current flowing through the thermal resistor R 1 is increased to improve an output power of the current source circuit 20 to drive the thermoelectric element 10 for cooling the CPU.
- the voltage comparator 21 also increases a driving voltage to gate electrode G of each NMOS transistor Q to increase a current flowing through the thermoelectric element 10 .
- the fourth input I 4 is used to detect the current flowing through the thermoelectric element 10 and compares the current flowing through the thermoelectric element 10 with a reference voltage Vref of the third input I 3 .
- the voltage comparator 21 control the first output I 1 to turn off the switches Q for protecting the circuit 20 and send an alarm signal to an external device, such as a speaker, to warn of the over-current condition of the CPU cooling circuit 100 .
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Semiconductor Integrated Circuits (AREA)
Abstract
Description
- 1. Technical Field
- The present disclosure relates to a central processing unit (CPU) cooling circuit, and more particularly, to CPU cooling circuit having thermoelectric element.
- 2. Description of Related Art
- During operation of an electronic element of an electronic device, such as a central processing unit (CPU) of a computer, a large amount of heat is often produced. The heat must be quickly removed from the CPU to prevent unstable operation or damage to the CPU. Typically, a heat sink made of aluminum or copper is attached to an outer surface of the CPU to absorb the heat from the CPU. The heat absorbed by the heat sink is then dissipated to the ambient air via a fan attached on the heat sink. However, dissipating heat to air is slow and inefficient. In addition, when the temperature of the CPU is high, the fan will keep operating at a high-speed of rotation, which wastes electric power and shortens the life of the fan.
- Therefore, a new system is desired to overcome the above-described shortcomings.
- The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of at least one embodiment. In the drawings, like reference numerals designate corresponding parts throughout the various views.
-
FIG. 1 is a diagram of a CPU cooling circuit having a thermoelectric element according to one embodiment of the present disclosure. -
FIG. 2 is a side view of the thermoelectric element of the CPU cooling circuit inFIG. 1 . - Reference will now be made to the drawings to describe various disclosed embodiments of the present disclosure in detail, wherein like numerals refer to like elements throughout.
- Referring to
FIGS. 1 to 2 , aCPU cooling circuit 100 according to one embodiment of the present disclosure is shown. TheCPU cooling circuit 100 includes acurrent source circuit 20 and athermoelectric element 10 driven by thecircuit 20. Thecircuit 20 controls a current output to thethermoelectric element 10 to cool a CPU (not shown) to which thethermoelectric element 10 is attached. - As shown in
FIG. 2 , thethermoelectric element 10 includes a firstthermoelectric substrate 11 a coupled to the CPU and an opposite secondthermoelectric substrate 11 b, a plurality of p-type semiconductor units 101 a, and a plurality of n-type semiconductor units 101 b. Thethermoelectric element 10 further includes a first electricallyconductive pattern 102 a and a second electricallyconductive pattern 102 b formed at internal surfaces of the first and thesecond substrates type semiconductor units second patterns second patterns semiconductor units semiconductor units second patterns semiconductor units second patterns - The
thermoelectric element 10 further includes a positivepower supply input 110 and an opposite negativepower supply input 112 formed on the internal surface of thefirst substrate 11 a for receiving a driving current from thecurrent source circuit 20. - When current flows through the
semiconductor units semiconductor units first substrate 11 a have current flowing from the n-type semiconductor units 101 a to the p-type semiconductor units 101 b and form a cooler portion, whereas, other pn junctions of thesemiconductor units second substrate 11 b have current flowing from the p-type semiconductor units 101 b to the n-type semiconductor units 101 a and form a heater portion. Therefore, heat can be conducted from thefirst substrate 11 a to the oppositesecond substrate 11 b via thesemiconductor units thermoelectric element 10 is in direct proportion to the current flowing therethrough. - The
circuit 20 includes avoltage comparator 21, a thermal resistor R1, a current division resistor R2, a plurality of current sampling resistors R3, and a plurality of switches Q. - In this embodiment, the
voltage comparator 21 is an LM358DRG4 chip produced by Texas Instruments, Incorporated. Thevoltage comparator 21 includes a first input I1, a second input I2, a third input I3, a fourth input I4, a first output O1, and a second output O2. - The thermal resistor R1 has a negative temperature index and its resistance decreases with an increase its temperature. In this embodiment, the thermal resistor R1 connects in parallel with the current division resistor R2 between the first input I1 and an external power supply VCC. In one embodiment, the thermal resistor R1 is positioned adjacent to the
first substrate 11 a of thethermoelectric element 10 to sense a temperature of thethermoelectric element 10. - In this embodiment, as shown in
FIG. 1 , the plurality of switches Q includes five n-channel metal-oxide-semiconductor (NMOS) transistors. Each NMOS transistor Q includes a source electrode S, a drain electrode D, and a gate electrode S controlling an electrical conductivity between the source electrode S and the drain electrode D. The gate electrode G of each NMOS transistor Q connects to the first and the second outputs O1 and O2 of thevoltage comparator 21. The drain electrode D of each NMOS transistor Q connects to the external power source VCC. The source electrode S of each NMOS transistor Q connects to the positivepower supply input 110 of thethermoelectric element 10. The source electrode S of each NMOS transistor Q also connects to the second input I2 of thevoltage comparator 21 via a resistor (not labeled). In alternative embodiments, the NMOS transistors Q can be replaced by some other kind of switch such as p-channel metal-oxide-semiconductor (PMOS) transistors, npn type bipolar transistors, or pnp type bipolar transistors. - In this embodiment, as shown in
FIG. 1 , the resistors R3 include five current sampling resistors R3 connected in parallel between the fourth input I4 of thevoltage comparator 21 and ground. The fourth input I4 of thevoltage comparator 21 also connects to the negativepower supply input 112 of thethermoelectric element 10. - In operation, when a CPU attached to the
first substrate 11 a of thethermoelectric element 10 normally works it can make the temperature of thethermoelectric element 10 increase, the resistance of the thermal resistor R1 correspondingly decreases according to the increased temperature of thethermoelectric element 10. Thus, a current flowing through the thermal resistor R1 is increased to improve an output power of thecurrent source circuit 20 to drive thethermoelectric element 10 for cooling the CPU. Thevoltage comparator 21 also increases a driving voltage to gate electrode G of each NMOS transistor Q to increase a current flowing through thethermoelectric element 10. - The fourth input I4 is used to detect the current flowing through the
thermoelectric element 10 and compares the current flowing through thethermoelectric element 10 with a reference voltage Vref of the third input I3. In one embodiment, when the current flowing through thethermoelectric element 10 is over 20 amperes, thevoltage comparator 21 control the first output I1 to turn off the switches Q for protecting thecircuit 20 and send an alarm signal to an external device, such as a speaker, to warn of the over-current condition of theCPU cooling circuit 100. - It is to be understood, however, that even though numerous characteristics and advantages of certain inventive embodiments have been set out in the foregoing description, together with details of the structures and functions of the embodiments, the disclosure is illustrative only; and that changes may be made in detail, especially in matters of arrangement of parts within the principles of present invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims (15)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010124886.2A CN102193604B (en) | 2010-03-16 | 2010-03-16 | Heat-radiation circuit of CPU (Central Processing Unit) |
CN201010124886.2 | 2010-03-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20110225982A1 true US20110225982A1 (en) | 2011-09-22 |
Family
ID=44601791
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/820,044 Abandoned US20110225982A1 (en) | 2010-03-16 | 2010-06-21 | Cpu cooling circuit having thermoelectric element |
Country Status (2)
Country | Link |
---|---|
US (1) | US20110225982A1 (en) |
CN (1) | CN102193604B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103412186A (en) * | 2013-08-27 | 2013-11-27 | 国家电网公司 | Ring main unit current collecting device |
US10208894B1 (en) * | 2014-01-24 | 2019-02-19 | Wavefront Research, Inc. | Compact dual detector Dewar |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110828397B (en) * | 2019-10-28 | 2023-01-10 | 科华数据股份有限公司 | Chip heat dissipation auxiliary circuit and data processing chip |
CN113496968A (en) * | 2021-07-07 | 2021-10-12 | 南昌黑鲨科技有限公司 | Heat dissipation assembly for heat dissipation of chip and preparation process method |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5515682A (en) * | 1994-04-19 | 1996-05-14 | Fujitsu Limited | Peltier control circuit and a peltier device structure |
US5724818A (en) * | 1995-07-27 | 1998-03-10 | Aisin Seiki Kabushiki Kaisha | Thermoelectric cooling module and method for manufacturing the same |
US6226994B1 (en) * | 1997-07-02 | 2001-05-08 | Sel Application Co., Ltd. | Thermoelectric element and thermoelectric cooling or heating device provided with the same |
US20050103036A1 (en) * | 2002-04-10 | 2005-05-19 | Daikin Industries , Ltd. | Compressor unit and refrigerator using the unit |
US6981381B1 (en) * | 2003-12-16 | 2006-01-03 | Lattice Semiconductor Corp. | Linear thermoelectric device driver |
US7043543B2 (en) * | 1996-07-23 | 2006-05-09 | Server Technology, Inc. | Vertical-mount electrical power distribution plugstrip |
US20060245133A1 (en) * | 2005-04-27 | 2006-11-02 | National Instruments Corporation | Protection and voltage monitoring circuit |
US7609496B2 (en) * | 2005-08-08 | 2009-10-27 | Mitsubishi Denki Kabushiki Kaisha | Non-feedback type load current controller |
US20090293500A1 (en) * | 2005-06-24 | 2009-12-03 | Lei Chen | Device for Controlling a Thermo-Electric System |
US8222511B2 (en) * | 2006-08-03 | 2012-07-17 | Gentherm | Thermoelectric device |
Family Cites Families (3)
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CN2638119Y (en) * | 2003-06-18 | 2004-09-01 | 吴琪君 | Constant temperature source chip |
CN100502191C (en) * | 2007-04-12 | 2009-06-17 | 无锡博创微电子有限公司 | MOS type over-temperature protection circuit |
CN101727116A (en) * | 2008-10-21 | 2010-06-09 | 杜波 | Constant temperature chip capable of setting temperature |
-
2010
- 2010-03-16 CN CN201010124886.2A patent/CN102193604B/en not_active Expired - Fee Related
- 2010-06-21 US US12/820,044 patent/US20110225982A1/en not_active Abandoned
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5515682A (en) * | 1994-04-19 | 1996-05-14 | Fujitsu Limited | Peltier control circuit and a peltier device structure |
US5724818A (en) * | 1995-07-27 | 1998-03-10 | Aisin Seiki Kabushiki Kaisha | Thermoelectric cooling module and method for manufacturing the same |
US7043543B2 (en) * | 1996-07-23 | 2006-05-09 | Server Technology, Inc. | Vertical-mount electrical power distribution plugstrip |
US6226994B1 (en) * | 1997-07-02 | 2001-05-08 | Sel Application Co., Ltd. | Thermoelectric element and thermoelectric cooling or heating device provided with the same |
US20050103036A1 (en) * | 2002-04-10 | 2005-05-19 | Daikin Industries , Ltd. | Compressor unit and refrigerator using the unit |
US6981381B1 (en) * | 2003-12-16 | 2006-01-03 | Lattice Semiconductor Corp. | Linear thermoelectric device driver |
US20060245133A1 (en) * | 2005-04-27 | 2006-11-02 | National Instruments Corporation | Protection and voltage monitoring circuit |
US20090293500A1 (en) * | 2005-06-24 | 2009-12-03 | Lei Chen | Device for Controlling a Thermo-Electric System |
US7609496B2 (en) * | 2005-08-08 | 2009-10-27 | Mitsubishi Denki Kabushiki Kaisha | Non-feedback type load current controller |
US8222511B2 (en) * | 2006-08-03 | 2012-07-17 | Gentherm | Thermoelectric device |
Non-Patent Citations (1)
Title |
---|
Storr, Wayne, PNP Transistors, February 27, 2009, Electronics-Tutorials, http://www.electronics-tutorials.ws/transistor/tran_3.html * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103412186A (en) * | 2013-08-27 | 2013-11-27 | 国家电网公司 | Ring main unit current collecting device |
US10208894B1 (en) * | 2014-01-24 | 2019-02-19 | Wavefront Research, Inc. | Compact dual detector Dewar |
Also Published As
Publication number | Publication date |
---|---|
CN102193604A (en) | 2011-09-21 |
CN102193604B (en) | 2014-03-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:ZHOU, HAI-QING;TONG, SONG-LIN;REEL/FRAME:024569/0691 Effective date: 20100301 Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:ZHOU, HAI-QING;TONG, SONG-LIN;REEL/FRAME:024569/0691 Effective date: 20100301 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |