CN219202194U - Resistor temperature control device and current detection device - Google Patents
Resistor temperature control device and current detection device Download PDFInfo
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- CN219202194U CN219202194U CN202223044740.4U CN202223044740U CN219202194U CN 219202194 U CN219202194 U CN 219202194U CN 202223044740 U CN202223044740 U CN 202223044740U CN 219202194 U CN219202194 U CN 219202194U
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Abstract
The present application relates to a resistance temperature control device and a current detection device. The resistance temperature control device includes: the temperature detection circuit can detect the temperature of the resistor, wherein the temperature detection circuit outputs a cooling signal when the detected temperature is larger than a first preset threshold value, outputs a heating signal when the detected temperature is smaller than a second preset threshold value, and further comprises a temperature control circuit, the temperature control circuit is connected with the temperature detection circuit, the temperature control circuit comprises a semiconductor refrigerating device arranged on the resistor, when the temperature detection circuit outputs the heating signal, one end of the semiconductor refrigerating device, which is in contact with the resistor, heats, and when the temperature detection circuit outputs the cooling signal, one end of the semiconductor refrigerating device, which is in contact with the resistor, refrigerates. By adopting the device, the temperature of the resistor can be kept in a stable temperature range, the temperature range can be set to be any temperature, and the temperature control is more flexible.
Description
Technical Field
The present disclosure relates to the field of resistor temperature control technologies, and in particular, to a resistor temperature control device and a current detection device.
Background
Since the impedance of the resistor changes along with the temperature change of the resistor, the temperature of the resistor is usually required to be controlled in a high-precision current measurement scene, so that the influence of the temperature change of the resistor on the precision of current measurement is avoided.
At present, a heater can be added on the resistor to control the temperature of the resistor, but the control mode is single and is not suitable for complex working environments, especially working environments with large environmental temperature changes.
Disclosure of Invention
In view of the above, it is necessary to provide a resistance temperature control device and a current detection device that are more flexible in temperature control.
In a first aspect, the present application provides a resistance temperature control device comprising:
a resistor;
a temperature detection circuit for detecting the temperature of the resistor, outputting a cooling signal when the detected temperature is greater than a first preset threshold value, and outputting a heating signal when the detected temperature is less than a second preset threshold value;
the temperature control circuit is connected with the temperature detection circuit and comprises a semiconductor refrigeration device, the semiconductor refrigeration device is arranged on the resistor, when the temperature detection circuit outputs a heating signal, one end, which is in contact with the resistor, of the semiconductor refrigeration device heats, and when the temperature detection circuit outputs a cooling signal, one end, which is in contact with the resistor, of the semiconductor refrigeration device refrigerates.
In one embodiment, the temperature control circuit further comprises: the power supply is connected with the semiconductor refrigerating device, and outputs direct current in a first direction to the semiconductor refrigerating device when the temperature detection circuit outputs a heating signal so as to heat one end of the semiconductor refrigerating device, which is in contact with the resistor, and outputs direct current in a second direction to the semiconductor refrigerating device when the temperature detection circuit outputs a cooling signal so as to refrigerate one end of the semiconductor refrigerating device, which is in contact with the resistor.
In one embodiment, the semiconductor refrigeration device includes a plurality of refrigeration semiconductors connected in series with one another.
In one embodiment, one of the two adjacent refrigeration semiconductors is a P-type refrigeration semiconductor, and the other is an N-type refrigeration semiconductor.
In one embodiment, the cooling semiconductor is made of bismuth telluride material.
In one embodiment, the semiconductor refrigeration device is provided with a heat sink, and the semiconductor refrigeration device exchanges heat through the heat sink.
In one embodiment, a first thermally conductive layer is disposed between the semiconductor refrigeration device and the heat sink.
In one embodiment, a second thermally conductive layer is disposed between the semiconductor refrigeration device and the resistor.
In one embodiment, the temperature detection circuit includes a temperature detection device.
In a second aspect, the present application further provides a current detection device, including: a resistance temperature control device as claimed in any one of the first aspects above and a current detection circuit operable to detect a current of a resistor in the resistance temperature control device.
The resistor temperature control device and the current detection device comprise a resistor, and a temperature detection circuit capable of detecting the temperature of the resistor, wherein the temperature detection circuit outputs a cooling signal when the detected temperature is larger than a first preset threshold value, outputs a heating signal when the detected temperature is smaller than a second preset threshold value, and further comprises a temperature control circuit, the temperature control circuit is connected with the temperature detection circuit, the temperature control circuit comprises a semiconductor refrigeration device arranged on the resistor, when the temperature detection circuit outputs the heating signal, one end of the semiconductor refrigeration device, which is in contact with the resistor, heats, and when the temperature detection circuit outputs the cooling signal, one end of the semiconductor refrigeration device, which is in contact with the resistor, refrigerates. According to the semiconductor refrigerating device, the semiconductor refrigerating device is arranged on the resistor, when the temperature detection circuit detects that the temperature of the resistor is greater than the first preset threshold value, the semiconductor refrigerating device refrigerates, the temperature of the resistor is reduced, when the temperature detection circuit detects that the temperature of the resistor is less than the second preset threshold value, the semiconductor refrigerating device heats, the temperature of the resistor is increased, in this way, the temperature of the resistor can be kept in a stable temperature range, the temperature range can be set to be any temperature, and the temperature control is more flexible.
Drawings
In order to more clearly illustrate the technical solutions of embodiments or conventional techniques of the present application, the drawings required for the descriptions of the embodiments or conventional techniques will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person of ordinary skill in the art.
FIG. 1 is a schematic diagram of a resistance temperature control device according to an embodiment;
FIG. 2 is a schematic diagram of a resistance temperature control device according to another embodiment;
fig. 3 is an assembly schematic diagram of a resistor and a semiconductor refrigeration device of a resistor temperature control device according to another embodiment.
Reference numerals illustrate:
101. a resistor; 102. A temperature detection circuit; 103. a temperature control circuit;
1031. a semiconductor refrigeration device; 201. a power supply; 301. A P-type refrigeration semiconductor;
302. an N-type refrigerating semiconductor; 303. A heat sink; 304. A first heat conductive layer;
305. and a second heat conducting layer.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application will be further described in detail with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the present application.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
Spatially relative terms, such as "under", "below", "beneath", "under", "above", "over" and the like, may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use and operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements or features described as "under" or "beneath" other elements would then be oriented "on" the other elements or features. Thus, the exemplary terms "below" and "under" may include both an upper and a lower orientation. Furthermore, the device may also include an additional orientation (e.g., rotated 90 degrees or other orientations) and the spatial descriptors used herein interpreted accordingly.
As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," and/or the like, specify the presence of stated features, integers, steps, operations, elements, components, or groups thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or groups thereof.
In the description of the present specification, reference to the terms "some embodiments," "other embodiments," "desired embodiments," and the like, means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, schematic descriptions of the above terms do not necessarily refer to the same embodiment or example.
Since the impedance of the resistor changes along with the temperature change of the resistor, the temperature of the resistor is usually required to be controlled in a high-precision current measurement scene, so that the influence of the temperature change of the resistor on the precision of current measurement is avoided. At present, a heater can be added on the resistor to control the temperature of the resistor, but the control mode is single and is not suitable for complex working environments, especially working environments with large environmental temperature changes.
In view of this, this application is through setting up semiconductor refrigeration device on the resistance, and semiconductor refrigeration device refrigerates when temperature detection circuit detects that resistance temperature is greater than first default threshold value, makes resistance temperature reduce, and when temperature detection circuit detects that resistance temperature is less than second default threshold value, semiconductor refrigeration device heats, makes resistance temperature rise, through this kind of mode, can make the temperature of resistance keep in a stable temperature range, and temperature range can set to arbitrary temperature, and temperature control is more nimble.
In an embodiment of the present application, as shown in fig. 1, there is provided a resistance temperature control apparatus 100 including a resistor 101; the temperature detection circuit 102 for detecting the temperature of the resistor outputs a cooling signal when the detected temperature is greater than a first preset threshold value, and outputs a heating signal when the detected temperature is less than a second preset threshold value.
The resistor 101 is a resistor that needs to be temperature-controlled, and the resistor can operate in a preset temperature range by temperature-controlling the resistor. Resistor 101 may be used to measure the current magnitude by measuring the voltage drop across resistor 101. The temperature detection circuit 102 is configured to detect a temperature of the resistor 101, output a cooling signal when the detected temperature is greater than a first preset threshold, and output a heating signal when the detected temperature is less than a second preset threshold. Wherein the temperature lowering signal is used for lowering the temperature of the resistor 101, and the heating signal is used for raising the temperature of the resistor 101. The first preset threshold and the second preset threshold may be equal, or may not be equal even though the resistor 101 operates at a fixed temperature value, and the second preset threshold is smaller than the first preset threshold, even though the resistor 101 operates at a temperature range, for example, the first temperature threshold is 40 degrees, and the second temperature threshold is 36 degrees, the temperature detection circuit 102 outputs a cooling signal when the temperature of the resistor 101 is greater than 40 degrees, and outputs a heating signal when the temperature of the resistor 101 is less than 36 degrees, so that the resistor 101 operates between 36 degrees and 40 degrees.
And a temperature control circuit 103, the temperature control circuit 103 being connected to the temperature detection circuit 102, the temperature control circuit 103 including a semiconductor refrigeration device 1031, the semiconductor refrigeration device 1031 being provided on the resistor 101, the semiconductor refrigeration device 1031 being configured to heat one end of the resistor 101 that is in contact with the semiconductor refrigeration device 1031 when the temperature detection circuit 102 outputs a heating signal, and the semiconductor refrigeration device 1031 being configured to cool one end of the resistor 101 that is in contact with the semiconductor refrigeration device 1031 when the temperature detection circuit 102 outputs a cooling signal.
The temperature control circuit 103 is connected to the temperature detection circuit 102, and is capable of receiving a heating signal or a cooling signal output by the temperature detection circuit 102, when the semiconductor refrigeration device 1031 is powered on by direct current, a temperature difference is generated between both ends, when the temperature control circuit 103 receives the heating signal, one end of the semiconductor refrigeration device 1031, which contacts the resistor 101, heats up, and increases the temperature of the resistor 101, and when the temperature control circuit 103 receives the cooling signal, one end of the semiconductor refrigeration device 1031, which contacts the resistor 101, cools down, and decreases the temperature of the resistor 101.
In the above embodiment, the resistor temperature control device includes a resistor, and a temperature detection circuit capable of detecting a temperature of the resistor, wherein the temperature detection circuit outputs a cooling signal when the detected temperature is greater than a first preset threshold value, outputs a heating signal when the detected temperature is less than a second preset threshold value, and further includes a temperature control circuit connected to the temperature detection circuit, the temperature control circuit includes a semiconductor refrigeration device disposed on the resistor, and when the temperature detection circuit outputs the heating signal, one end of the semiconductor refrigeration device in contact with the resistor heats, and when the temperature detection circuit outputs the cooling signal, one end of the semiconductor refrigeration device in contact with the resistor cools. According to the semiconductor refrigerating device, the semiconductor refrigerating device is arranged on the resistor, when the temperature detection circuit detects that the temperature of the resistor is greater than the first preset threshold value, the semiconductor refrigerating device refrigerates, the temperature of the resistor is reduced, when the temperature detection circuit detects that the temperature of the resistor is less than the second preset threshold value, the semiconductor refrigerating device heats, the temperature of the resistor is increased, in this way, the temperature of the resistor can be kept in a stable temperature range, the temperature range can be set to be any temperature, and the temperature control is more flexible.
In the embodiment of the present application, as shown in fig. 2, the temperature control circuit further includes a power supply 201, where the power supply 201 is connected to the semiconductor refrigeration device 1031, and when the temperature detection circuit 102 outputs a heating signal, the power supply 201 outputs a direct current in a first direction to the semiconductor refrigeration device 1031, so that one end of the semiconductor refrigeration device 1031 in contact with the resistor 101 heats, and when the temperature detection circuit 102 outputs a cooling signal, the power supply 201 outputs a direct current in a second direction to the semiconductor refrigeration device, so that one end of the semiconductor refrigeration device in contact with the resistor refrigerates.
Optionally, the power supply 201 is configured to provide direct current to the semiconductor refrigeration device 1031, where the first direction and the second direction are opposite directions, when the semiconductor refrigeration device 1031 is powered on with the direct current, a temperature difference is generated at two ends, the direction of the direct current is switched, and the temperature difference direction at two ends is also changed, that is, when the semiconductor refrigeration device 1031 passes through the direct current in the first direction, one end of the semiconductor refrigeration device 1031, which contacts the resistor 101, is a hot end, so that the temperature of the resistor 101 can be heated, and when the semiconductor refrigeration device 1031 passes through the direct current in the second opposite direction, one end of the semiconductor refrigeration device 1031, which contacts the resistor 101, is a cold end, so that the temperature of the resistor 101 can be cooled.
Alternatively, if the low temperature characteristic of the resistor 101 is good, that is, the resistance change rate of the resistor is small when the resistance temperature is low, that is, the first preset threshold of the resistor 101 may be set to a lower temperature, for example, 10 degrees, at this time, the end of the semiconductor refrigeration device 1031, which contacts the resistor 101, is always the cold end, so as to perform refrigeration, so that the temperature of the resistor 101 is kept at 10 degrees, and the resistor 101 operates at a lower temperature, so that the stability of the resistor 101 is better.
Alternatively, if the resistor 101 needs to be operated at a higher temperature, the second preset threshold of the resistor 101 may be set at a higher temperature, for example, 60 degrees, where the end of the semiconductor refrigeration device 1031 in contact with the resistor 101 is always the hot end, so as to perform heating, so that the temperature of the resistor 101 is kept at 60 degrees.
In the embodiment, the temperature of the resistor can be controlled to rise or fall through the semiconductor refrigerating device, and the resistor can work at different temperatures in the mode, so that the environment adaptability is high.
In the embodiment of the present application, as shown in fig. 3, the semiconductor cooling device 1031 includes a plurality of cooling semiconductors connected in series with each other.
With continued reference to fig. 3, one of the two adjacent refrigeration semiconductors is a P-type refrigeration semiconductor 301, and the other is an N-type refrigeration semiconductor 302.
The P-type refrigeration semiconductor 301 and the N-type refrigeration semiconductor 302 are connected together by electrodes, when current flows, heat generated by the current can be transferred from one side of the semiconductor refrigeration device to the other side, and a cold end and a hot end are generated on the semiconductor refrigeration device.
Alternatively, the refrigeration semiconductor is made of bismuth telluride material.
In one embodiment, referring to fig. 3, a heat sink 303 is disposed on the semiconductor refrigerator 1031, and the semiconductor refrigerator 1031 exchanges heat with the heat sink 303.
Alternatively, one end of the semiconductor refrigeration device 1031 is in contact with the resistor 101, and the other end may be provided with the heat sink 303. The heat sink can radiate heat to the easily-generated electronic component, and is generally made of aluminum alloy, brass or bronze into a sheet shape. The heat from the semiconductor refrigeration device 1031 is conducted to the heat sink 303 and then dissipated to the ambient air via the heat sink 303. Since the maximum temperature difference that can be generated at both ends of the semiconductor refrigeration device is limited, when one end of the semiconductor refrigeration device 1031, which is in contact with the heat sink 303, is a hot end, the heat sink can accelerate heat dissipation and reduce the temperature of the hot end, thereby enabling the cold end to maintain a low temperature. When the end of the semiconductor refrigeration device 1031 contacting the heat sink 303 is the cold end, the heat sink 303 minimizes the decrease in the temperature of the cold end, thereby enabling the hot end to maintain a high temperature.
In the above embodiments, the heat exchange efficiency of the semiconductor refrigeration device with the ambient air can be increased by adding the heat sink.
In the embodiment of the present application, please continue to refer to fig. 3, the first heat conductive layer 304 is disposed between the semiconductor refrigeration device 1031 and the heat sink 303.
The first heat conducting layer 304 may perform an insulating and heat conducting medium function, reduce the thermal resistance of the interface between the semiconductor refrigeration device 1031 and the heat sink 303, better conduct the heat emitted by the semiconductor refrigeration device 1031 to the heat sink 303, and improve the heat dissipation efficiency of the semiconductor refrigeration device 1031. The first heat conductive layer 304 may be a heat conductive insulating sheet.
Alternatively, the first heat conductive layer 304 may use a heat conductive paste or a heat conductive glue.
Optionally, a second heat conductive layer 305 is disposed between the semiconductor refrigeration device 1031 and the resistor 101.
For the same reason as described above, the interface thermal resistance between the semiconductor refrigeration device 1031 and the resistor 101 is reduced, and the second heat conduction layer 305 is provided between the semiconductor refrigeration device 1031 and the resistor 101, so that when the semiconductor refrigeration device 1031 is at the hot end, the heat on the semiconductor refrigeration device 1031 is better conducted to the resistor 101, and the temperature of the resistor 101 is increased. When the semiconductor cooling device 1031 is at the cold end, the heat of the resistor 101 is better conducted to the semiconductor cooling device 1031, so that the temperature of the resistor 101 is reduced. The second heat conductive layer 305 may be a heat conductive insulating sheet, and optionally, a heat conductive paste or a heat conductive paste may be used for the second heat conductive layer 305.
In the above embodiment, the heat exchange efficiency between the semiconductor refrigeration device and the heat sink and the resistor is improved by the first heat conduction layer and the second heat conduction layer.
In an embodiment of the present application, the temperature detection circuit 102 includes a temperature detection device.
The temperature detecting device is used for detecting the temperature of the resistor, and can be a thermistor, wherein the thermistor is a sensor resistor, and the resistance value of the sensor resistor changes along with the change of the temperature. Optionally, the thermistor is disposed in a preset range of the resistor 101, and when the temperature of the resistor 101 changes, the resistance of the thermistor changes, and through other circuit designs, a heating signal or a cooling signal can be output according to the resistance change of the thermistor, that is, the temperature change of the resistor 101.
In one embodiment, the present application further provides a current detection device, including a resistance temperature control device as described in any one of the above embodiments, and a current detection circuit operable to detect a current of a resistance in the resistance temperature control device.
The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples only represent a few embodiments of the present application, which are described in more detail and are not to be construed as limiting the scope of the present application. It should be noted that it would be apparent to those skilled in the art that various modifications and improvements could be made without departing from the spirit of the present application, which would be within the scope of the present application. Accordingly, the scope of protection of the present application shall be subject to the appended claims.
Claims (10)
1. A resistance temperature control device, the device comprising:
a resistor;
a temperature detection circuit for detecting the temperature of the resistor, outputting a cooling signal when the detected temperature is greater than a first preset threshold value, and outputting a heating signal when the detected temperature is less than a second preset threshold value;
the temperature control circuit is connected with the temperature detection circuit, the temperature control circuit comprises a semiconductor refrigeration device, the semiconductor refrigeration device is arranged on the resistor, when the temperature detection circuit outputs the heating signal, one end, in contact with the resistor, of the semiconductor refrigeration device heats, and when the temperature detection circuit outputs the cooling signal, one end, in contact with the resistor, of the semiconductor refrigeration device refrigerates.
2. The resistance temperature control device according to claim 1, wherein the temperature control circuit further comprises:
and when the temperature detection circuit outputs the cooling signal, the power supply outputs direct current in a second direction to the semiconductor refrigeration device so as to cool one end of the semiconductor refrigeration device, which is in contact with the resistor.
3. A resistance temperature control apparatus according to claim 1 or 2, wherein the semiconductor refrigeration device includes a plurality of refrigeration semiconductors connected in series with each other.
4. A resistance temperature control device according to claim 3, wherein one of the adjacent two cooling semiconductors is a P-type cooling semiconductor and the other is an N-type cooling semiconductor.
5. A resistance temperature control device according to claim 3, wherein the cooling semiconductor is made of bismuth telluride material.
6. The resistance temperature control apparatus according to claim 1 or 2, wherein a fin is provided on the semiconductor refrigeration device, and the semiconductor refrigeration device exchanges heat through the fin.
7. The resistance temperature control apparatus according to claim 6, wherein a first heat conductive layer is provided between the semiconductor refrigeration device and the heat sink.
8. A resistance temperature control apparatus according to claim 1 or 2, wherein a second heat conductive layer is provided between the semiconductor refrigeration device and the resistor.
9. A resistance temperature control apparatus according to claim 1 or 2, wherein the temperature detection circuit comprises a temperature detection device.
10. A current detection device, comprising: a resistance temperature control device according to any one of claims 1 to 9 and a current detection circuit operable to detect a current of a resistor in the resistance temperature control device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223044740.4U CN219202194U (en) | 2022-11-16 | 2022-11-16 | Resistor temperature control device and current detection device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223044740.4U CN219202194U (en) | 2022-11-16 | 2022-11-16 | Resistor temperature control device and current detection device |
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| Publication Number | Publication Date |
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| CN219202194U true CN219202194U (en) | 2023-06-16 |
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| CN202223044740.4U Active CN219202194U (en) | 2022-11-16 | 2022-11-16 | Resistor temperature control device and current detection device |
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- 2022-11-16 CN CN202223044740.4U patent/CN219202194U/en active Active
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