CN112254826A - Thermal infrared imager temperature control system for restraining detector temperature drift - Google Patents
Thermal infrared imager temperature control system for restraining detector temperature drift Download PDFInfo
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- 230000000452 restraining effect Effects 0.000 title description 2
- 239000004065 semiconductor Substances 0.000 claims abstract description 28
- 238000005057 refrigeration Methods 0.000 claims abstract description 17
- 230000005679 Peltier effect Effects 0.000 claims abstract description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 10
- 239000004020 conductor Substances 0.000 claims description 8
- 239000000523 sample Substances 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000004519 grease Substances 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 230000002829 reductive effect Effects 0.000 claims description 2
- 238000004861 thermometry Methods 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 6
- 230000002401 inhibitory effect Effects 0.000 abstract description 4
- 230000007547 defect Effects 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 description 9
- 238000009529 body temperature measurement Methods 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 230000002441 reversible effect Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000036760 body temperature Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
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- 230000003287 optical effect Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/20—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
- G01J5/22—Electrical features thereof
- G01J5/24—Use of specially adapted circuits, e.g. bridge circuits
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/0022—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiation of moving bodies
- G01J5/0025—Living bodies
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/06—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
- G01J5/068—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity by controlling parameters other than temperature
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Abstract
The invention relates to the field of uncooled thermal infrared imager temperature control, in particular to a thermal infrared imager temperature control system for inhibiting detector temperature drift, which is used for solving the defects that the traditional temperature control measures are low in working efficiency and poor in temperature control precision and cannot meet the application requirement of the uncooled thermal infrared imager on high temperature drift when the uncooled thermal infrared imager is used for measuring the temperature of a human body. The method comprises the following steps: a semiconductor refrigeration fin having a first heat exchange surface and a second heat exchange surface; a heat sink in contact with the first heat exchange surface; a detector in contact with the second heat exchange surface; the controller is used for providing voltage for the semiconductor refrigerating sheet so as to enable the detector and the heat sink to exchange heat according to the Peltier effect; and the polarity of the voltage can be changed according to the relationship between the current environment temperature value and the preset temperature value. The invention is suitable for the human body thermometer.
Description
Technical Field
The invention relates to the field of uncooled thermal infrared imager temperature control, in particular to a thermal infrared imager temperature control system for inhibiting detector temperature drift.
Background
When the uncooled thermal infrared imager is used for measuring the temperature of a human body, the thermal infrared imager is required to have higher temperature measurement precision. For a detector in an uncooled thermal infrared imager, a relatively serious temperature drift phenomenon can be generated along with the increase of the ambient temperature and the absorption of infrared radiation, so that the response characteristic of the infrared detector can be influenced, and the temperature measurement precision is influenced to a certain extent. In practical application, the output signal of the non-refrigeration detector is greatly influenced because the temperature of the non-refrigeration detector changes during working. Resulting in detector output values that are not only related to the target radiation but also to the operating temperature of the detector. The effect of the temperature drift of the detector on the detector output is also an energy. Therefore, it is considered that the detector temperature drift is superimposed on the radiation response of the detector to the target, so that the temperature drift suppression of the detector is necessary. In the past, the temperature-tracing measures are usually implemented by adopting a fan for cooling or a high-power heating resistor, but the fan and the heating resistor not only have low working efficiency, but also have poor temperature control accuracy. The application requirement of the uncooled thermal infrared imager for high temperature drift requirement when used for measuring the temperature of the human body cannot be met.
Disclosure of Invention
The invention aims to solve the defects that the traditional temperature control measures are low in working efficiency and poor in temperature control precision and cannot meet the application requirement of an uncooled thermal infrared imager on high temperature drift when the uncooled thermal infrared imager is used for measuring the temperature of a human body.
According to a first aspect of the present invention, there is provided a thermal infrared imager temperature control system for suppressing detector temperature drift, comprising: a semiconductor refrigeration fin having a first heat exchange surface and a second heat exchange surface; a heat sink in contact with the first heat exchange surface; a detector in contact with the second heat exchange surface; the controller is used for providing voltage for the semiconductor refrigerating sheet so as to enable the detector and the heat sink to exchange heat according to the Peltier effect; and the polarity of the voltage can be changed according to the relationship between the current environment temperature value and the preset temperature value.
Preferably, the system further comprises a temperature sensor disposed within the probe for feeding back the sensed temperature to the controller.
Preferably, the controller is capable of changing the preset temperature value according to a received external instruction.
Preferably, the heat sink is a copper base.
Preferably, both the first and second heat exchange surfaces are coated with a thermally conductive material.
Preferably, the heat conducting material is heat conducting silica gel or heat conducting silicone grease.
Preferably, the thermal infrared imager temperature control system is used in an environment of-20 ℃ to +30 ℃.
Preferably, the uncooled thermal infrared imager temperature control system is detachably arranged between the detector of the thermal infrared imager and the heat sink.
Preferably, in an initial state, the voltage provided by the controller for the semiconductor chilling plate can raise the temperature of the detector; when the temperature value fed back by the detector through the temperature sensor is larger than a preset value, the polarity of the voltage provided by the controller for the semiconductor refrigerating sheet is reversed, so that the temperature of the detector is reduced; when the temperature of the probe is less than another preset value, the voltage polarity is reversed again, again raising the temperature of the probe.
Preferably, the thermal infrared imager is used for human body temperature measurement.
The invention has the beneficial effects that:
1. the power consumption is low: the same power supply can be used as the detector, and when the voltage is DC 12V, the maximum power consumption is only 36W;
2. the working environment has strong temperature adaptability: when the ambient working environment temperature is-20 ℃ to +30 ℃, the temperature rise of the detector can be kept at +30 ℃, and if the device disclosed by the invention is not used, the temperature rise of a general non-refrigeration infrared detector can reach more than +40 ℃;
3. the temperature control precision is high: through the accurate temperature control of the controller, the temperature error of the test point at each position of the detector can be smaller than +/-0.5 ℃;
4. the infrared detector can be detachably connected with a thermal imager, so that a general infrared detector also has the function of inhibiting temperature drift.
Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
FIG. 1 is a schematic diagram of one embodiment of the present invention;
FIG. 2 is a schematic diagram of the Peltier effect;
fig. 3 is a schematic circuit structure diagram according to an embodiment of the present invention.
Detailed Description
Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.
The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.
Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.
In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
The invention provides a thermal infrared imager temperature control system for inhibiting detector temperature drift, as shown in fig. 1, comprising: a semiconductor refrigeration fin having a first heat exchange surface and a second heat exchange surface; a heat sink in contact with the first heat exchange surface; a detector in contact with the second heat exchange surface; the controller is used for providing voltage for the semiconductor refrigerating sheet so as to enable the detector and the heat sink to exchange heat according to the Peltier effect; and the polarity of the voltage can be changed according to the relationship between the current environment temperature value and the preset temperature value.
The peltier effect means that when current passes through a loop formed by different conductors, in addition to irreversible joule heat, heat absorption and heat release phenomena occur at joints of the different conductors respectively along with the difference of current directions. The principle is shown in fig. 2. That is, by applying a suitable dc voltage across the semiconductor cooler, heat flows from one end of the element to the other. At this time, the temperature of one end of the refrigerator is lowered while the temperature of the other end is simultaneously raised. However, as long as the direction of the current is changed, the direction of the heat flow can be changed to transport heat to the other end. Therefore, two functions of cooling and heating can be simultaneously realized on one thermoelectric refrigerator. In the invention, the Peltier effect is realized by the semiconductor refrigerating sheet, namely, forward or reverse voltage is applied to two ends of the semiconductor refrigerating sheet to ensure that two surfaces of the refrigerating sheet carry out heat exchange in different directions. In the uncooled infrared detector, due to the lack of a low-temperature refrigerating device, when the thermal imager works for a long time, temperature drift can occur due to the temperature rise of the detector, and when the environmental temperature obviously changes, for example, in an area with large temperature difference between day and night, or when the detector is alternately used indoors and outdoors, the temperature drift can also occur. Based on the design idea, the Peltier effect is selected to solve the problem of temperature drift so as to keep the size of the thermal infrared imager small and avoid adding too many refrigerating devices.
As can be seen in fig. 1, two faces of the semiconductor chilling plate contact the detector and the heat sink, respectively, which in the embodiment shown in fig. 1 is a heat dissipation base. Meanwhile, the positions of the semiconductor refrigerating sheet close to the two surfaces are respectively connected with the two electrodes of the power supply, and the controller can control the direction of heat exchange by controlling the polarity of the power supply. Because the temperature of the heat sink is closer to the room temperature, the temperature rise of the detector and the room temperature within a certain range can be kept by controlling the electrifying polarity of the power supply. In specific implementation, the heat dissipation base can be made of a purple copper material. The red copper base can be contacted with an object with a preset temperature, so that the detector is easier to dissipate heat. For example, a copper base in contact with an object below room temperature may allow a detector with higher ambient temperature requirements to more easily operate at the appropriate temperature. In order to make the heat exchange sufficient and uniform, the first heat exchange surface and the second heat exchange surface may be coated with a heat conductive material. The heat conducting material can be heat conducting silica gel or heat conducting silicone grease.
The invention may also include a temperature sensor disposed within the probe for feeding back the sensed temperature to the controller. The temperature sensor can be selected from NTC sensor.
The controller of the present invention is also capable of changing the preset temperature value according to the received external instruction. The controller can be connected with an upper computer, and the upper computer sets parameters to realize the control.
FIG. 3 shows a schematic circuit diagram of an embodiment of the present invention, wherein the controller has 3 input terminals and an output terminal, and the first input terminal is used for connecting a 12V DC power supply and is the working voltage of the circuit board; the second input end receives temperature feedback from the temperature sensor; the third input end is connected with the upper computer, and can receive parameters set by the upper computer as preset temperature values. The output end outputs voltage according to the preset temperature set by the upper computer and the temperature feedback of the sensor, and the polarity of the output voltage can be changed according to the size relation between the actually detected temperature and the set value. The third input end is connected with the computer through an RS232 interface only when parameters need to be set, and the connection is not needed during normal work. Because the functions to be realized by the controller are simple and can be realized without complex logic, the price and the volume of the required circuit component are low, and the controller can be arranged in the original thermal infrared imager without increasing the volume of the thermal infrared imager.
The working process of the invention is as follows:
1) the heating and refrigerating assembly feeds the temperature of the infrared uncooled detector back to the control panel through the NTC in real time.
2) The temperature control system of the control panel can make judgment according to the current set temperature and the actual temperature and judge whether heating or refrigeration is needed. One surface of the semiconductor refrigeration piece is a hot surface, and the other surface is a cold surface. When the temperature value of the working environment of the detector is less than the temperature control set temperature, the heating surface is provided with a temperature sensor NTC for feeding back a temperature signal to the control board in real time;
3) the semiconductor refrigerating plate is connected with a forward 12v voltage to start heating and temperature control.
4) When the temperature value of the working environment fed back by the detector is greater than the temperature control setting temperature, the temperature control plate outputs reverse 12V voltage,
5) the cold and hot surfaces of the semiconductor refrigerating sheet start to exchange, the original heating surface is the cooling surface, and the temperature sensor NTC at the position feeds back temperature signals to the control board in real time.
The working principle and the beneficial effects of the present invention are illustrated by an embodiment.
< example >
The numerical values presented in this example are only one of the cases and do not limit the scope of the present invention. The structure of this embodiment is shown in fig. 1 and fig. 3, and is a dual-band human body thermometer, which is used for measuring human body temperature at room temperature, and the measurement radius is about 30 meters. The initial value of the room temperature is 25 ℃, the controller is preset by the upper computer to change the voltage polarity until the temperature is less than 35 ℃ when the temperature detected by the sensor exceeds 55 ℃; when the temperature detected by the sensor is less than-20 ℃, the voltage polarity is changed until the temperature is more than 0 ℃. When the detected temperature is other values, no voltage may be supplied or the voltage may be set to a specified polarity and value. The core optical component of the temperature measuring equipment is an infrared detector, and the temperature of the detector gradually rises along with the increase of the working time. The temperature measuring equipment also has a red copper base, and the temperature cannot be changed because the detector transfers heat to the red copper base, which is equivalent to a heat sink. The semiconductor refrigerating chip is arranged between the detector and the red copper base, and can make the detector release heat or absorb heat to the red copper base along with different voltages supplied to the semiconductor refrigerating chip. When the detector is arranged, only the semiconductor refrigerating sheet is required to be in contact with the shell of the detector and the red copper base respectively, other special requirements on the detector are not required, and heat transfer is carried out only through shell contact. And the controller only needs a 12V direct current power supply, can share the same power supply with the detector, and does not need to increase other power supply modules.
The thermal infrared imager is of a non-refrigeration type, a special refrigeration mechanism is not arranged inside the thermal infrared imager, and temperature control and measurement are carried out through a detachable semiconductor refrigeration piece and a controller. The thermal infrared imager has small integral volume and can be applied to common civil scenes. For example, thermal imagers can be placed at entrances of schools and airports, so that the thermal imager of the embodiment has a smaller volume and does not occupy too much space compared with a refrigeration thermal imager. A significant progress of the embodiment is that the semiconductor refrigeration piece and the controller are detachable, so that the semiconductor refrigeration piece and the controller can be applied to a common temperature measuring instrument. Furthermore, since the natural cooling speed of the detector is slow, the detector cannot reach the optimal working temperature after continuously working at a certain temperature in airports and schools with huge pedestrian flow, and finally the temperature measurement effect is poor. The thermal imager of the embodiment can accelerate the heat dissipation process through the Peltier effect, so that the detector can be kept at a proper working temperature for a long time.
Human body temperature measurement is a field with higher measurement precision, for example, in an epidemic situation period, 37.2 ℃ is usually used as a heating early warning line, if the temperature of a detector drifts, a thermal imager can give false early warning when a detected person does not heat, and the problem of quarantine burden in a public place is increased; similarly, temperature drift can cause the situation that people actually generate heat but miss detection, and is not beneficial to the implementation of epidemic prevention work. Therefore, in the human body thermometer, the invention can achieve outstanding effect.
On the other hand, in cold weather, the present embodiment can also be used for rapid warm-up to bring the detector to a suitable operating temperature. For example, in outdoor cold weather, the heat sink is enabled to reach a certain constant temperature through the constant temperature control device, and then the semiconductor refrigeration piece is used for uniformly conducting heat for the detector, so that the detector works at a proper environment temperature. Because the detector cannot be directly heated, the method of the embodiment can quickly and uniformly enable the detector to reach the working temperature, and is a new idea.
Therefore, the embodiment provides a new temperature control idea for the prior art. In the prior art, although there is a scheme of combining a detector and a refrigerating sheet, the peltier effect is not utilized, and an additional refrigerating device is utilized to cooperate with the refrigerating sheet for heat dissipation. The temperature can be flexibly controlled by using the scheme of the embodiment, the high cost and the large volume of refrigeration equipment are not needed, and the temperature can be controlled only by a detachable circuit and a semiconductor wafer.
Although some specific embodiments of the present invention have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustrative purposes only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.
Claims (10)
1. An uncooled thermal infrared imager temperature control system for suppressing detector temperature drift, comprising:
a semiconductor refrigeration fin having a first heat exchange surface and a second heat exchange surface;
a heat sink in contact with the first heat exchange surface;
a detector in contact with the second heat exchange surface;
the controller is used for providing voltage for the semiconductor refrigerating sheet so as to enable the detector and the heat sink to exchange heat according to the Peltier effect; and the polarity of the voltage can be changed according to the relationship between the current environment temperature value and the preset temperature value.
2. The uncooled thermal infrared imager temperature control system for suppressing temperature drift as claimed in claim 1, further comprising a temperature sensor disposed in the detector for feeding back the detected temperature to the controller.
3. The uncooled thermal infrared imager temperature control system for suppressing temperature drift as claimed in claim 1, wherein the controller is capable of changing the preset temperature value according to a received external command.
4. The uncooled thermal infrared imager temperature control system for suppressing temperature drift of claim 1, wherein the heat sink is a red copper base.
5. The uncooled thermal infrared imager temperature control system for suppressing temperature drift of claim 1, wherein the first heat exchange surface and the second heat exchange surface are each coated with a thermally conductive material.
6. The uncooled thermal infrared imager temperature control system for suppressing temperature drift as claimed in claim 5, wherein the heat conducting material is heat conducting silica gel or heat conducting silicone grease.
7. The uncooled thermal infrared imager temperature control system for suppressing temperature drift as claimed in claim 2, wherein the thermal infrared imager temperature control system is used in an environment of-20 ℃ to +30 ℃.
8. The uncooled thermal infrared imager temperature control system for suppressing temperature drift as claimed in claim 7, wherein the uncooled thermal infrared imager temperature control system is detachably disposed between the detector of the thermal infrared imager and the heat sink.
9. The uncooled thermal infrared imager temperature control system for suppressing temperature drift as claimed in claim 2,
in an initial state, the voltage provided by the controller for the semiconductor refrigerating sheet can increase the temperature of the detector; when the temperature value fed back by the detector through the temperature sensor is larger than a preset value, the polarity of the voltage provided by the controller for the semiconductor refrigerating sheet is reversed, so that the temperature of the detector is reduced; when the temperature of the probe is less than another preset value, the voltage polarity is reversed again, again raising the temperature of the probe.
10. The uncooled thermal infrared imager temperature control system for suppressing temperature drift as claimed in claim 8, wherein the thermal infrared imager is used for human body thermometry.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113701891A (en) * | 2021-08-25 | 2021-11-26 | 西安中科立德红外科技有限公司 | Temperature drift suppression model construction method, image processing method, device and equipment |
| CN113865719A (en) * | 2021-09-30 | 2021-12-31 | 黄新伦 | Medical infrared forehead temperature instrument suitable for multi-environment temperature and working method |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101813951A (en) * | 2009-12-07 | 2010-08-25 | 中国科学院西安光学精密机械研究所 | Temperature-controllable focal plane detector mechanism |
| CN102721243A (en) * | 2011-03-31 | 2012-10-10 | 中国科学院西安光学精密机械研究所 | Multi-TEC temperature adjustment control system based on single chip microcomputer |
| CN202677222U (en) * | 2012-05-30 | 2013-01-16 | 中国科学院西安光学精密机械研究所 | Precise thermal control mechanism of focal plane detector |
| CN204705413U (en) * | 2015-06-29 | 2015-10-14 | 湖北三江航天万峰科技发展有限公司 | A kind of infreared imaging device of miniaturization |
| CN108170179A (en) * | 2017-12-13 | 2018-06-15 | 苏州长风航空电子有限公司 | A kind of temprature control method based on non-refrigeration type infrared imaging component |
| CN111351581A (en) * | 2020-03-17 | 2020-06-30 | 南京理工大学 | Temperature-controlled infrared thermal imager and temperature control method thereof |
| CN111403504A (en) * | 2020-03-23 | 2020-07-10 | 中国科学院长春光学精密机械与物理研究所 | Large-target-surface detector array type multi-stage semiconductor refrigeration method |
-
2020
- 2020-09-02 CN CN202010907580.8A patent/CN112254826A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101813951A (en) * | 2009-12-07 | 2010-08-25 | 中国科学院西安光学精密机械研究所 | Temperature-controllable focal plane detector mechanism |
| CN102721243A (en) * | 2011-03-31 | 2012-10-10 | 中国科学院西安光学精密机械研究所 | Multi-TEC temperature adjustment control system based on single chip microcomputer |
| CN202677222U (en) * | 2012-05-30 | 2013-01-16 | 中国科学院西安光学精密机械研究所 | Precise thermal control mechanism of focal plane detector |
| CN204705413U (en) * | 2015-06-29 | 2015-10-14 | 湖北三江航天万峰科技发展有限公司 | A kind of infreared imaging device of miniaturization |
| CN108170179A (en) * | 2017-12-13 | 2018-06-15 | 苏州长风航空电子有限公司 | A kind of temprature control method based on non-refrigeration type infrared imaging component |
| CN111351581A (en) * | 2020-03-17 | 2020-06-30 | 南京理工大学 | Temperature-controlled infrared thermal imager and temperature control method thereof |
| CN111403504A (en) * | 2020-03-23 | 2020-07-10 | 中国科学院长春光学精密机械与物理研究所 | Large-target-surface detector array type multi-stage semiconductor refrigeration method |
Non-Patent Citations (1)
| Title |
|---|
| 刘银春: "《大学物理实验学》", 31 August 2006 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113701891A (en) * | 2021-08-25 | 2021-11-26 | 西安中科立德红外科技有限公司 | Temperature drift suppression model construction method, image processing method, device and equipment |
| CN113701891B (en) * | 2021-08-25 | 2023-02-24 | 西安中科立德红外科技有限公司 | Temperature drift suppression model construction method, image processing method, device and equipment |
| CN113865719A (en) * | 2021-09-30 | 2021-12-31 | 黄新伦 | Medical infrared forehead temperature instrument suitable for multi-environment temperature and working method |
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Application publication date: 20210122 |
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