WO2015123142A1 - Kiosk apparatus with temperature control system - Google Patents

Kiosk apparatus with temperature control system Download PDF

Info

Publication number
WO2015123142A1
WO2015123142A1 PCT/US2015/015025 US2015015025W WO2015123142A1 WO 2015123142 A1 WO2015123142 A1 WO 2015123142A1 US 2015015025 W US2015015025 W US 2015015025W WO 2015123142 A1 WO2015123142 A1 WO 2015123142A1
Authority
WO
WIPO (PCT)
Prior art keywords
temperature
thermoelectric module
kiosk
thermal controller
humidity
Prior art date
Application number
PCT/US2015/015025
Other languages
French (fr)
Inventor
Michael A. Campagna
Steve SAGERIAN
Original Assignee
Peerless Industries, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Peerless Industries, Inc. filed Critical Peerless Industries, Inc.
Publication of WO2015123142A1 publication Critical patent/WO2015123142A1/en

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00Machines, plants or systems, using electric or magnetic effects
    • F25B21/02Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F25B21/04Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect reversible
    • GPHYSICS
    • G07CHECKING-DEVICES
    • G07FCOIN-FREED OR LIKE APPARATUS
    • G07F9/00Details other than those peculiar to special kinds or types of apparatus
    • G07F9/10Casings or parts thereof, e.g. with means for heating or cooling
    • G07F9/105Heating or cooling means, for temperature and humidity control, for the conditioning of articles and their storage
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20954Modifications to facilitate cooling, ventilating, or heating for display panels
    • H05K7/20963Heat transfer by conduction from internal heat source to heat radiating structure
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/021Control thereof
    • F25B2321/0211Control thereof of fans
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/025Removal of heat
    • F25B2321/0251Removal of heat by a gas

Definitions

  • the present invention relates generally to structures for enclosing electronic devices. More particularly, the present invention relates to outdoor enclosures, such as outdoor kiosks, for heating and/or cooling electronic devices and/or the interior of the outdoor enclosure.
  • outdoor enclosures have become enormously popular in both commercial and residential sectors, such as outdoor kiosks, vending machines, gas station pumps, etc.
  • outdoor enclosures have risen in popularity due to lessening costs of electronic components, increased durability of electronic components, and increased desire of consumers for accessibility to the products provided by the outdoor enclosures.
  • Some electronic devices that have decreased in cost and/or increased in durability include flat panel displays, computing components, etc.
  • Such electronic components might be located outdoors in various residential and commercial settings for entertainment, marketing, informational, and/or sales purposes, potentially exposing the electronic components to damaging rain, snow, debris, temperature fluctuations, humidity fluctuations, and other outdoor conditions. As with outdoor
  • liquids and other potential contaminants may be near or come into contact with the electronic components, potentially damaging or degrading the performance of the electronic components. It is desirable to protect the electronic components from exposure to
  • the temperature within the enclosure may vary depending on the environment. For example, in an outdoor environment with cold temperatures, the interior temperature within the enclosure may be similarly cold, which may affect the operation of the electronic components (e.g., dimming the screen of a display device, freezing a liquid crystal display, freezing interior water vapor on electronic components or electrical connections thereof, etc.). Similarly, in an outdoor environment with hot temperatures, the interior temperature within the enclosure may be similarly hot, which may affect the operation of the electronic components (e.g., overheating electronics components within the enclosure, such as a display device, microprocessor, memory device, video card, storage device, etc.).
  • Figure 1 is a schematic block diagram illustrating components of an outdoor enclosure
  • Figure 2 is a partial cross sectional view of an implementation of an assembly showing a thermoelectric module coupled to an outer casing of the outdoor enclosure;
  • FIG. 3 is a partial cross sectional view of another implementation of an assembly showing a thermoelectric module partially embedded in the outer casing of the outdoor enclosure;
  • Figure 4 is a partial cross sectional view of still another implementation of an assembly for a thermoelectric module having a portion extending through an opening of the outer casing of the outdoor enclosure;
  • FIG. 5 is a flow diagram of an example process for controlling the thermoelectric module based on temperature
  • Figure 6 is a flow diagram of another example process for controlling the
  • thermoelectric module based on temperature and humidity.
  • FIG. 1 depicts a block diagram illustrating components of an outdoor enclosure 100 one or more enclosure devices 115.
  • the outdoor enclosure 100 may include a variety of outdoor enclosures, such as outdoor kiosks, vending machines, gas station pumps, etc.
  • the outdoor enclosure 100 is a protective enclosure configured to enclose one or more enclosure devices 115, such as a display device (e.g., a LCD, LED or plasma display device), data processors, memory devices, video components (e.g., video cards), audio components (e.g., speakers, audio cards, etc.), storage devices (e.g., hard disk drives, solid-state drives, etc.), and/or other electronic components, within an interior of the outdoor enclosure 100.
  • a display device e.g., a LCD, LED or plasma display device
  • data processors e.g., memory devices
  • video components e.g., video cards
  • audio components e.g., speakers, audio cards, etc.
  • storage devices e.g., hard disk drives, solid-state drives
  • structures such as outdoor kiosks may also include other items housed within the interior thereof, such as products for purchase or rental.
  • the outdoor enclosure 100 is constructed so that the enclosure devices 115 may be located in an outdoor environment or in other environments where the enclosure devices 115 require or may benefit from protection from ambient conditions. Accordingly, the outdoor enclosure 100 is constructed to resist and substantially prevent ingress of various liquids that may be encountered in the location, including precipitation when the outdoor enclosure 100 may be directly or indirectly exposed to precipitation. In various embodiments, the outdoor enclosure 100 is constructed to prevent ingress of rain, snow, and/or splashing liquid. In a particular embodiment, the outdoor enclosure 100 is constructed to prevent ingress of liquid at a submersed depth of up to five feet of water, which may correspond to a modified rating of the IP68 standard (the contents of which are incorporated herein by reference).
  • the outdoor enclosure 100 includes a casing 105 (e.g., the kiosk body ) that houses the enclosure devices 115 within the outdoor enclosure 100.
  • the casing 105 may be a multi-piece assembly, such as a front portion and a rear portion that may be coupled together to enclose the enclosure devices 115 therebetween.
  • the rear portion and front portion may be joined together in a manner that prevents ingress of liquids into the outdoor enclosure 100.
  • a plurality of connecting elements may join the multi-piece assembly for the casing 105. The use of removable connecting elements allows for installation of and access to the enclosure devices 115 within in the outdoor enclosure 100.
  • one or more gaskets may be disposed between one or more of the pieces of a multi-piece casing 105 to provide appropriate sealing of the outdoor enclosure 100.
  • a portion or all of the casing 105 may also serve as a heat sink, dissipating heat generated from within the outdoor enclosure 100 to the environment outside the enclosure. As such, at least a portion of the casing 105 may comprise a material having a relatively high thermal conductivity.
  • the casing 105 comprises die cast aluminum.
  • the casing 105 may include a heat sink portion that comprises a plurality of fins, such as fins 190 of Figures 2-4, disposed on the outer surface to enhance convective transfer of heat generated from within the outdoor enclosure 100 to the environment.
  • a heat sink portion that comprises a plurality of fins, such as fins 190 of Figures 2-4, disposed on the outer surface to enhance convective transfer of heat generated from within the outdoor enclosure 100 to the environment.
  • thermoelectric module 170 may be coupled (e.g., via connecting elements such as bolts, screws, latches, clamps, clips, etc., via adhesives, or otherwise) or positioned relative to the casing 105 such that thermal conduction occurs between a second portion of the thermoelectric module 170 and the casing 105.
  • the thermal energy either heating or cooling, may be conducted through the casing 105 to the plurality of fins for convection to the surrounding environment, as will be discussed in greater detail below.
  • thermal control devices may be disposed within or at least partially within the outdoor enclosure 100, to assist in maintaining the internal temperature of the outdoor enclosure 100.
  • Thermal control may be accomplished by including devices intended to add and/or remove heat from the outdoor enclosure 100 depending on ambient conditions and/or the operating conduction or conditions of the enclosure devices 115.
  • the various thermal control devices may work independently or in concert to assist in modulating the temperature inside the outdoor enclosure 100 within the operating temperature range(s) and/or storage temperature range(s) of the enclosure devices 115 under various ambient conditions.
  • the outdoor enclosure 100 is capable of maintaining the internal temperature inside the enclosure within the operating range of an ambient temperature range of between about -20 °C and about 60 °C.
  • the thermal control devices within the outdoor enclosure 100 may comprise passive and/or active devices.
  • the outdoor enclosure 100 may further include a power source 110 within the outdoor enclosure 100 to provide direct or indirect power to one or more components within the outdoor enclosure 100.
  • the power source 110 may be mounted within the outdoor enclosure 100 and may be electrically coupled to an external power source, for example, directly or indirectly to a conventional power grid or other source.
  • an EMI filter may be included between the external power source and the internal power source 110.
  • the power source 110 may be a battery, a solar panel, etc.
  • the outdoor enclosure 100 further includes a thermal controller 120.
  • the thermal controller 120 is electrically coupled to the power source 110 to receive power.
  • the thermal controller 120 is also electrically coupled to a temperature sensor 130, a humidity sensor 140, an H-Bridge 150, and one or more fans 160.
  • the thermal controller 120 may be configured to control the heating or cooling of the first portion of the thermoelectric module 170.
  • the thermal controller 120 may receive an output from the temperature sensor 130, such as a value indicative of an internal temperature of the outdoor enclosure 100, and/or an output from the humidity sensor 140, such as a value indicative of an internal humidity of the outdoor enclosure 100, and control the operation of the one or more fans 160 and one or more thermoelectric modules 170.
  • the heating and/or cooling system may include a thermoelectric module 170, and more particularly a Peltier thermoelectric module.
  • a Peltier thermoelectric module is be a TEC 1-12705 Thermoelectric Peltier Cooler available from Hebei I.T. (Shanghai) Co., Ltd. of Shanghai, China.
  • the Peltier thermoelectric module 170 of the present example is a silicon device having a first portion 172 and a second portion 174.
  • the first portion 172 may be positioned within an interior of the casing 105 of the outdoor enclosure 100 and the second portion 174 may be coupled to a portion of the casing 105 of the outdoor enclosure 100 and directly or indirectly exposed to the external environment.
  • thermoelectric module 170 When an electric current is applied to the thermoelectric module 170 in a first direction, the first portion 172 is cooled and the second portion 174 is heated. When the electric current is applied to the module 170 in a second direction, substantially opposite the first direction, the first portion 172 is heated and the second portion 174 is cooled.
  • the internal temperature of the outdoor enclosure 100 and/or one or more of the enclosure devices 115 may be actively regulated, by heating or cooling the first portion 172, using the thermoelectric module 170.
  • a plurality of thermoelectric modules 170 may be provided to form a thermoelectric module array.
  • the first portion 172 of the thermoelectric module or modules 170 may be aligned with one or more of the enclosure devices 115 and/or the power source 110 that is thermally sensitive or otherwise may benefit from thermal management.
  • the first portion 172 may be positioned within the outdoor enclosure 100 such that the first portion 172 is substantially aligned with a location of an enclosure device 115 and/or the power source 110 of the outdoor enclosure 100.
  • the thermoelectric module or modules 170 and the first portion 172 may be arbitrarily positioned within the outdoor enclosure 100.
  • the second portion 174 of each thermoelectric module or modules 170 may be coupled to the casing 105 for heat transfer to a heat sink portion of the casing 105.
  • the thermoelectric module 170 and the casing 105 may be coupled together (e.g., via connecting elements such as bolts, screws, latches, clamps, clips, etc. via adhesives, or otherwise) and may include a thermally conductive grease or adhesive interposed between the second portion 174 and the heat sink portion, as will be discussed in further detail in reference to Figure 2.
  • the second portion 174 is conductively coupled to the heat sink portion of the casing 105.
  • thermoelectric module 170 may be integrated or embedded in the casing 105 (e.g., a recess may be formed in the casing 105 for the thermoelectric module 170 to be at least partially embedded, as will be discussed in further detail in reference to Figure 3).
  • the casing 105 may include an opening for the second portion 174 to be exposed to the external environment, as will be discussed in further detail in reference to Figure 4.
  • the second portion 174 of the thermoelectric module 170 may be associated with another portion of the outdoor enclosure 100.
  • a plurality or an array of thermoelectric modules 170 may be positioned within the outdoor enclosure 100. The Peltier thermoelectric module 170 and control thereof will be described in greater detail below.
  • the temperature sensor 130 is electrically coupled to the thermal controller 120 and the power source 110 (either directly or indirectly) and is configured to output a signal indicative of a temperature detected by the temperature sensor 130.
  • the temperature sensor 130 may include a thermistor, a thermocouple, a resistance temperature detector, or any other temperature sensor.
  • the signal output from the temperature sensor 130 may be a voltage value that corresponds to a detected temperature.
  • the thermal controller 120 may receive and use the voltage value representative of the temperature as an input for controlling the one or more fans 160 and/or the thermoelectric module or modules 170, as will be described in greater detail below.
  • the temperature sensor 130 is positioned within the outdoor enclosure 100 to measure the internal temperature of the outdoor enclosure 100.
  • the temperature sensor 130 may be positioned near the thermoelectric module 170.
  • the temperature sensor 130 may be positioned adjacent to a thermoelectric module 170.
  • the temperature sensor 130 may be positioned remote from the thermoelectric module 170, such as at an opposite corner of the outdoor enclosure 100 relative to the thermoelectric module 170.
  • the temperature sensor 130 may be arbitrarily positioned within the outdoor enclosure 100.
  • a plurality of temperature sensors 130 may be provided within the outdoor enclosure 100. Each temperature sensor 130 may be associated with a corresponding enclosure device 115 and/or a set of enclosure devices 115.
  • the humidity sensor 140 is also electrically coupled to the thermal controller 120 and the power source 110 (either directly or indirectly) and is configured to output a signal indicative of a humidity detected by the humidity sensor 140.
  • the humidity sensor 140 may include a hygrometer, a humistor, or any other humidity sensor.
  • the signal output from the humidity sensor 140 may be a voltage value that corresponds to a detected humidity, such as a relative humidity.
  • the thermal controller 120 may receive and use the voltage value representative of the humidity as an input for controlling the one or more fans 160 and/or the thermoelectric module or modules 170, as will be described in greater detail below.
  • the humidity sensor 140 is positioned within the outdoor enclosure 100 to measure the internal humidity of the outdoor enclosure 100.
  • the humidity sensor 140 may be positioned near the temperature sensor 130 and/or the thermoelectric module 170.
  • the humidity sensor 140 may be positioned adjacent to the temperature sensor 130 such that the humidity and temperature measurements are taken at substantially the same spatial position.
  • the humidity sensor 140 may be positioned remote from the temperature sensor 130.
  • the humidity sensor 140 may be arbitrarily positioned within the outdoor enclosure 100.
  • a plurality of temperature sensors 130 may be provided within the outdoor enclosure 100. Each temperature sensor 130 may be associated with a corresponding enclosure device 115 and/or a set of enclosure devices 115.
  • the humidity sensor 140 may be omitted.
  • the thermal controller 120 is further electrically coupled to the H-Bridge 150.
  • the H- Bridge 150 is also electrically coupled to one or more thermoelectric modules 170 and the power source 110.
  • the thermal controller 120 is configured to control the direction of current supplied from the power source 110 to the one or more thermoelectric modules 170 via the H- Bridge 150.
  • the thermal controller 120 may control the current flow to the one or more thermoelectric modules 170 by using one half of the H-Bridge 150. That is, the thermal controller 120 may, using the H-Bridge 150, control whether current flows in a first direction or a second direction through the thermoelectric modules 170.
  • thermoelectric module 170 when an electric current is applied to the one or more thermoelectric modules 170 in the first direction, the first portion 172 of each thermoelectric module 170 is cooled and the second portion 174 of each thermoelectric module 170 is heated.
  • the electric current is applied to the one or more thermoelectric modules 170 in the second direction, opposite the first direction, the first portion 172 of each thermoelectric module 170 is heated and the second portion 174 of each thermoelectric module 170 is cooled.
  • the second portion 174 may be conductive ly coupled to or otherwise associated with the casing 105 for heat transfer to the external atmosphere of the outdoor enclosure 100. Accordingly, it may be appreciated that the internal temperature of the outdoor enclosure 100, portions thereof, and/or one or more of the enclosure devices 115 may be actively regulated by the thermal controller 120 using the H- Bridge 150 and one or more thermoelectric modules 170.
  • the thermal controller 120 may control the current flowing through the one or more thermoelectric modules 170 using pulse width modulation (PWM).
  • PWM pulse width modulation
  • the thermal controller 120 may control the duty cycle of the pulse width modulation to vary the heating or cooling provided by the one or more thermoelectric modules 170.
  • the duty cycle of the pulse width modulation reaches 100%, then the maximum current is applied and the maximum heating or cooling is provided by the one or more thermoelectric modules 170.
  • One or more fans 160 may be electrically coupled the thermal controller 120 and the power source 110 (either directly or indirectly).
  • the thermal controller 120 may be configured to control the one or more fans 160.
  • the one or more fans 160 may be positioned to circulate air within the outdoor enclosure 100.
  • the one or more fans 160 may be positioned relative to the one or more thermoelectric modules 170 to increase the convective heat transfer from the first portion 172 (e.g., adjacent to, above, etc.) to the interior air of the outdoor enclosure 100 to assist the heating or cooling provided by the first portion 172 of the one or more thermoelectric modules 170.
  • the power source 110 may be a significant heat generator that may raise the internal temperature within the outdoor enclosure 100 when in operation.
  • a Peltier thermoelectric module 170 may be located between the power source 110 and the casing 105 such that the thermoelectric module 170 may actively cool the power source 110 and/or the interior of the outdoor enclosure 100.
  • the thermoelectric module 170 may be conductively coupled to the casing 105 such that thermal energy may be conducted to a heat sink portion of the casing 105. In some instances, such as when the outdoor enclosure 100 is within a cold environment, the thermoelectric module 170 may heat the power source 110 and/or the interior of the outdoor enclosure 100.
  • the outdoor enclosure 100 may include one or more thermoelectric modules 170 (more particularly, Peltier thermoelectric modules) associated with the casing 105.
  • the module 170 may be physically coupled to a heat sink portion having fins 190 of the casing 105.
  • the module 170 may be physically coupled to a heat sink portion having fins 190 of the casing 105.
  • thermoelectric module 170 and the casing 105 may be coupled together (e.g., via connecting elements such as bolts, screws, latches, clamps, clips, etc. via adhesives, or otherwise) and may include a thermally conductive grease or adhesive 180 interposed between the second portion 174 and the heat sink portion of the casing 105. In some instances, no heat sink portion may be included with the casing 105.
  • the thermally conductive grease or adhesive 180 may be a ceramic-based thermal grease (e.g., beryllium oxide), a metal-based thermal grease (e.g., silver or aluminium impregnated grease), a thermal adhesive (e.g., a mixture of epoxy and thermal conductive components, such as silver or aluminium), or any other thermally conductive grease or adhesive.
  • the thermally conductive grease or adhesive 180 may be used to fill any gaps between the second portion 174 of the thermoelectric module 170 and the casing 105, thereby increasing the thermal conductivity between the second portion 174 and the casing 105.
  • the first portion 172 of the thermoelectric module 170 faces an interior of the outdoor enclosure 100.
  • an electric current is applied to the module 170 in a first direction
  • the first portion 172 is cooled and the second portion 174 is heated.
  • the electric current is applied to the module 170 in a second direction, opposite the first direction, the first portion 172 is heated and the second portion 174 is cooled.
  • an internal fan may be horizontally positioned above the first portion 172 to draw air towards or away from the first portion 172 to increase the convective heating or cooling of the interior of the outdoor enclosure 100.
  • an internal fan may be vertically positioned adjacent to the first portion 172 (e.g., perpendicular to an interior surface of the first portion 172) in the interior of the outdoor enclosure 100 to draw air over the first portion 172 to increase the convective heating or cooling of the interior of the outdoor enclosure 100.
  • a second heat sink may be conductively coupled to the first portion 172 to increase the convective surface on the interior of the outdoor enclosure 100 as well.
  • the internal fan may be positioned adjacent to and/or above the second heat sink to increase the airflow through the heat sink fins.
  • the thermoelectric module 170 and/or the internal fan are electrically coupled to a power source (either directly or indirectly), such as power source 110 of Figure 1, to provide operating power to the thermoelectric module 170 and/or the internal fan.
  • the thermally conductive grease or adhesive 180 may be omitted and the thermoelectric module 170 may simply abut and otherwise be conductively coupled to the casing 105. In still other implementations, the thermoelectric module 170 may be coupled to other portions of the outdoor enclosure 100. Still further, a plurality or an array of thermoelectric modules 170 may be used.
  • thermoelectric module 170 may be embedded or integrated into the casing 105.
  • a recess 182 is formed in a portion of the casing 105 such that all or a portion of the second portion 174 of the thermoelectric module 170 may be inserted into the recess 182.
  • additional surface area of the second portion 174 may be conductively coupled to the casing 105, thereby increasing the heat transfer between the second portion 174 and the casing 105.
  • the thermoelectric module 170 and the casing 105 may be coupled together (e.g., via connecting elements such as bolts, screws, latches, clamps, clips, etc. via adhesives, or otherwise).
  • connecting elements such as bolts, screws, latches, clamps, clips, etc. via adhesives, or otherwise.
  • the thermally conductive grease or adhesive may be interposed between the second portion 174 and the surface of the recess of the casing 105 to increase the thermal conductivity.
  • an internal fan may be positioned above and/or adjacent to the embedded thermoelectric module 170 to increase air flow over the first portion 172 to increase the convective heating or cooling of the interior of the outdoor enclosure 100.
  • a second heat sink may be thermally coupled to the first portion 172 to increase the convective surface on the interior of the outdoor enclosure 100 as well.
  • the internal fan may be positioned adjacent to and/or above the second heat sink to increase the airflow through the heat sink fins.
  • the thermoelectric module 170 and/or the internal fan are electrically coupled to a power source (either directly or indirectly), such as power source 110 of Figure 1, to provide operating power to the thermoelectric module 170 and/or the internal fan.
  • thermoelectric module 170 may be embedded within the casing 105 such that an outer surface of the first portion 172 may be substantially flush with the interior surface of the casing 105. In still other implementations, the thermoelectric module 170 may be embedded or integrated into other portions of the outdoor enclosure 100. Still further, a plurality or an array of thermoelectric modules 170 may be used.
  • the casing 105 may include an opening 184 for the second portion 174 of the thermoelectric module 170 to be exposed to the external environment.
  • the atmospheric air may directly convectively transfer heat to or from the second portion 174.
  • an outer surface of the second portion 174 may be flush with a surface of the casing 105, such as that shown in Figure 4.
  • the second portion 174 may protrude outward from or be recessed relative to the casing 105.
  • the thermoelectric module 170 may be bonded to the casing 105 in a manner that prevents ingress of liquids into the outdoor enclosure 100.
  • thermoelectric module 170 may be bonded to the casing 105 using an adhesive such as a urethane adhesive.
  • the thermoelectric module 170 and the casing 105 may be physically coupled together (e.g., via connecting elements such as bolts, screws, latches, clamps, clips, etc.), either in addition to or in lieu of the adhesive bonding.
  • An internal fan may be positioned above and/or adjacent to the thermoelectric module 170 to increase air flow over the first portion 172 to increase the convective heating or cooling of the interior of the outdoor enclosure 100.
  • a second heat sink may be thermally coupled to the first portion 172 to increase the convective surface on the interior of the outdoor enclosure 100 as well.
  • the internal fan may be positioned adjacent to and/or above the second heat sink to increase the airflow through the heat sink fins.
  • thermoelectric module 170 and/or the internal fan are electrically coupled to a power source (either directly or indirectly), such as power source 110 of Figure 1, to provide operating power to the thermoelectric module 170 and/or the internal fan.
  • a power source either directly or indirectly
  • such as power source 110 of Figure 1 to provide operating power to the thermoelectric module 170 and/or the internal fan.
  • thermoelectric module 170 may be positioned within the casing 105 such that an outer surface of the first portion 172 is flush with the interior surface of the casing 105. In still other implementations, the thermoelectric module 170 positioned with the second portion 174 exposed in other portions of the outdoor enclosure 100. Still further, a plurality or an array of thermoelectric modules 170 may be used.
  • the outdoor enclosure 100 may also include additional internal fans not associated with thermoelectric modules 170 and that are located within the outdoor enclosure 100.
  • Each internal fan may circulate air within the outdoor enclosure 100, mitigating thermal gradients or hot spots on, for example, a surface of one or more of the enclosure devices 115 and regions within the outdoor enclosure 100.
  • the internal fans may be electrically coupled to a power source (either directly or indirectly) to provide operating power to the internal fan.
  • the thermal controller 120 may be configured with one or more temperature set points, such as T coo i and T eat- Using the one or more temperature set points, the thermal controller 120 may be configured to control the one or more fans 160 and/or the one or more thermoelectric modules 170.
  • the thermal controller 120 may receive a temperature, T, from a temperature sensor 130 (block 210).
  • the received temperature may be represented by a voltage outputted by the temperature sensor 130 to the thermal controller 120 that is indicative of the temperature detected by a temperature sensor 130.
  • the temperature T may be an average temperature, a maximum temperature, or a minimum temperature of the several readings from the temperature sensors 130.
  • the received temperature T may be compared against a first temperature set point, such as Tcooi, by the thermal controller 120 to determine whether the temperature detected T by the temperature sensor 130 is above a first temperature set point (block 220).
  • a first temperature set point such as Tcooi
  • the first temperature set point may be between 30°C, inclusive, and 45°C, inclusive.
  • the first temperature set point T coo i may be set at approximately 30°C.
  • the thermal controller 120 may be configured to activate one or more of the fans 160 and switch the H-bridge 150 to energize and drive current through the one or more thermoelectric modules 170 in the direction which will cause the first surface 172 of each of the one or more thermoelectric modules 170 to be cooled (block 230). Accordingly, the interior of the outdoor enclosure 100 may be cooled by the one or more thermoelectric modules 170 and the one or more fans 160 circulating air. The second portion 174 of the one or more thermoelectric modules 170 may be coupled to the casing 105 or a heat sink portion of the casing 105.
  • the thermal controller 120 is configured to operate the one or more fans 160 and the one or more thermoelectric modules 170 until the detected temperature T falls below the first temperature set point T coo i as shown in Figure 5.
  • the thermal controller 120 may be configured to operate the one or more fans 160 and the one or more thermoelectric modules 170 for a predetermined period of time, either in addition to or in lieu of the detected temperature T falling below the first temperature set point T cool .
  • the thermal controller 120 may simply keep the one or more fans 160 and the one or more thermoelectric modules 170 activated.
  • the thermal controller 120 determines whether the detected temperature T is below a second temperature set point T eat (block 240).
  • the second temperature set point may be set as a temperature below the operational range of one or more of the enclosure devices 115 or that would degrade the operation of one or more of the enclosure devices 115.
  • the second temperature set point may be between -20°C, inclusive, and 10°C, inclusive. In one example, the second temperature set point may be set at approximately 5 °C.
  • the thermal controller 120 may be configured to activate one or more of the fans 160 and switch the H-bridge 150 to energize and drive current through the one or more thermoelectric modules 170 in the direction which will cause the first surface 172 of each of the one or more thermoelectric modules 170 to be heated (block 250). Accordingly, the interior of the outdoor enclosure 100 may be heated by the one or more thermoelectric modules 170 and the one or more fans 160 circulating air. The second portion 174 of the one or more thermoelectric modules 170 may be coupled to the casing 105 or a heat sink portion of the casing 105.
  • the second portion 174 When the second portion 174 is cooled as the first portion 172 is heated, the second portion 174 thermally cools the casing 105 through conduction to dissipate the cool to the atmosphere. The process 200 may then return to block 210 to receive the temperature T from the temperature sensor 130.
  • the thermal controller 120 is configured to operate the one or more fans 160 and the one or more thermoelectric modules 170 until the detected temperature T increases above the second temperature set point T heat as shown in Figure 5.
  • the thermal controller 120 may be configured to operate the one or more fans 160 and the one or more thermoelectric modules 170 for a predetermined period of time, either in addition to or in lieu of the detected temperature T increasing above the second temperature set point T ea t- In some implementations, if the one or more fans 160 and the one or more thermoelectric modules 170 are already activated, then the thermal controller 120 may simply keep the one or more fans 160 and the one or more thermoelectric modules 170 activated.
  • thermoelectric modules 170 may be operated by the thermal controller 120 while one or more of the enclosure devices 115 is off or in a sleep mode to mitigate potential damage to one or more of the enclosure devices 115 (e.g., a display device, a data processor, etc.) that could be caused by ambient temperatures below a storage temperature of the device, such as, for example, below -20°C or above 45°C.
  • the process 200 may be performed periodically (i.e. polled), such as every minute, five minutes, ten minutes, thirty minutes, one hour, etc.
  • the thermal controller 120 may receive a temperature T from the temperature sensor 130 and a humidity H from the humidity sensor 140 (block 310).
  • the received temperature may be a voltage outputted by the temperature sensor 130 to the thermal controller 120 that is indicative of the temperature detected by the temperature sensor 130.
  • the temperature T may be an average temperature, a maximum temperature, or a minimum temperature of the several readings from the temperature sensors 130.
  • the received humidity may also be a voltage outputted by the humidity sensor 140 to the thermal controller 120 that is indicative of the humidity detected by the humidity sensor 140.
  • the humidity H may be an average humidity, a maximum humidity, or a minimum humidity of the several readings from the humidity sensors 140.
  • the received temperature T may be compared against a first temperature set point, such as Tcooi, to determine whether the temperature detected T by the temperature sensor 130 is above a first temperature set point (block 320).
  • a first temperature set point such as Tcooi
  • the first temperature set point may be between 30°C, inclusive, and 45°C, inclusive.
  • the first temperature set point T coo i may be set at approximately 30°C.
  • the thermal controller 120 determines whether the received humidity H is less than or equal to a maximum humidity H max (block 330).
  • the maximum humidity H max may be a value indicative of a relative humidity between 75% and 100%. In one example, the maximum humidity H max may be set as a value indicative of a relative humidity of approximately 85%.
  • the thermal controller 120 may be configured to activate one or more of the fans 160 and switch the H-bridge 150 to energize and drive current through the one or more thermoelectric modules 170 in the direction which will cause the first surface 172 of each of the one or more thermoelectric modules 170 to be cooled (block 340). Accordingly, the interior of the outdoor enclosure 100 may be cooled by the one or more thermoelectric modules 170 and the one or more fans 160 circulating air. The second portion 174 of the one or more thermoelectric modules 170 may be coupled to the casing 105 or a heat sink portion of the casing 105.
  • the second portion 174 When the second portion 174 is heated as the first portion 172 is cooled, the second portion 174 thermally conducts heat through the heat sink portion of the rear cover assembly 300 to dissipate the heat to the atmosphere. The process 300 may then return to block 310 to receive the temperature T from the temperature sensor 130 and the humidity H from the humidity sensor 140.
  • the thermal controller 120 is configured to operate the one or more fans 160 and the one or more thermoelectric modules 170 until the detected temperature T falls below the first temperature set point T coo i, as shown in Figure 6.
  • the thermal controller 120 may be configured to operate the one or more fans 160 and the one or more thermoelectric modules 170 for a predetermined period of time, either in addition to or in lieu of the detected temperature T falling below the first temperature set point Tcooi. In some implementations, if the one or more fans 160 and the one or more thermoelectric modules 170 are already activated, then the thermal controller 120 may simply keep the one or more fans 160 and the one or more thermoelectric modules 170 activated.
  • the thermal controller 120 may be configured to deactivate the one or more thermoelectric modules 170 (block 350).
  • the one or more fans 160 may remain active to circulate the air within outdoor enclosure 100 to assist in the transfer of thermal energy from the air within the outdoor enclosure 100 to the casing 105 or a heat sink portion of the casing 105, even if the one or more thermoelectric module 170 is no longer active.
  • both of the one or more fans 160 and the one or more thermoelectric modules 170 may be deactivated when the received humidity H is above a maximum humidity H max (block 330).
  • a dew point temperature may be determined by the thermal controller 120 based on the received temperature T and the received humidity H.
  • the received temperature T may be compared to the calculated dew point temperature in lieu of, or in addition to, the comparison of the received humidity H, is above a maximum humidity H max by the thermal controller 120 (block 330).
  • the process 300 may then return to block 310 to receive the temperature T from the temperature sensor 130 and the humidity H from the humidity sensor 140.
  • the thermal controller 120 determines whether the detected temperature T is below a second temperature set point T eat (block 360).
  • the second temperature set point may be set as a temperature below the operational range of one or more of the enclosure devices 115 or that would degrade the operation of one or more of the enclosure devices 115.
  • the second temperature set point may be between -20°C, inclusive, and 10°C, inclusive. In one example, the second temperature set point may be set at approximately 5 °C.
  • the thermal controller 120 may be configured to activate one or more of the fans 160 and switch the H-bridge 150 to energize and drive current through the one or more thermoelectric modules 170 in the direction which will cause the first surface 172 of each of the one or more thermoelectric modules 170 to be heated (block 370). Accordingly, the interior of the outdoor enclosure 100 may be heated by the one or more thermoelectric modules 170 and the one or more fans 160 circulating air. The second portion 174 of the one or more thermoelectric modules 170 may be coupled to the casing 105 or a heat sink portion of the casing 105.
  • the thermal controller 120 is configured to operate the one or more fans 160 and the one or more thermoelectric modules 170 until the detected temperature T increases above the second temperature set point T eat, as shown in Figure 6.
  • the thermal controller 120 may be configured to operate the one or more fans 160 and the one or more thermoelectric modules 170 for a predetermined period of time, either in addition to or in lieu of the detected temperature T increasing above the second temperature set point T ea t.
  • the thermal controller 120 may simply keep the one or more fans 160 and the one or more thermoelectric modules 170 activated.
  • thermoelectric modules 170 may be operated by the thermal controller 120 while one or more of the enclosure devices 115 is off or in a sleep mode to mitigate potential damage to one or more of the enclosure devices 115 (e.g., a display device, a data processor, etc.) that could be caused by ambient temperatures below a storage temperature of the device, such as, for example, below -20°C or above 45°C.
  • the process 300 may be performed periodically (i.e., polled), such as every minute, five minutes, ten minutes, thirty minutes, one hour, etc.
  • a pair of cooling temperature set points T coo i _ 1 and T coo i 2 may be used by the thermal controller 120 when activating the one or more thermoelectric modules 170.
  • the thermal controller 120 may activate the one or more fans 160 while the one or more thermoelectric modules 170 remain deactivated. If the received temperature T is above the second cooling temperature set point T coo i 2 , then the thermal controller 120 may also activate the one or more thermoelectric modules 170 such that the first portion 172 of each is cooled.
  • the thermal controller 120 is configured to operate the one or more fans 160 and the one or more thermoelectric modules 170 until the detected temperature T falls below the second cooling temperature set point
  • thermoelectric modules 170 may be deactivated by the thermal controller 120 while the one or more fans 160 remain activated.
  • the one or more fans 160 may be deactivated as well. In other implementations, both the one or more fans 160 and the one or more thermoelectric modules 170 may remain active until the detected temperature T falls below the first cooling temperature set point T coo i ⁇ In other implementations,
  • the thermal controller 120 may be configured to operate the one or more fans 160 and/or the one or more thermoelectric modules 170 for a predetermined period of time after the received temperature T is above the first and/or the second cooling temperature set points Tcooi i and T cool _ 2 .
  • the first and second cooling temperature set points T coo i _ 1 and T cool _ 2 may be between 30°C, inclusive, and 45°C, inclusive.
  • the first cooling temperature set point T coo ij may be set at approximately 30°C and the second cooling temperature set point T cool _ 2 may be set at approximately 35°C.
  • Such a pair of cooling temperature set points may be used as part of process 200 at blocks 220 and 230 of Figure 5 or process 300 at blocks 320 and 340 of Figure 6.
  • the pair of cooling temperature set points T coo i_i and Tcooi 2 may be used to incrementally increase the cooling provided by the first portion 172 of each of the one or more thermoelectric modules 170. For example, in one configuration, when the received temperature T is above the first cooling temperature set point T coo i i, then the thermal controller 120 may activate the one or more fans 160 and the one or more
  • thermoelectric modules 170 to cool the interior of the outdoor enclosure 100.
  • the thermal controller 120 may be configured to control the current flowing through the one or more thermoelectric modules 170 using pulse width modulation (PWM).
  • PWM pulse width modulation
  • the duty cycle for the pulse width modulation may be determined based on the received temperature T relative to the first and second cooling temperature set points T cool _ 1 and ⁇ ⁇ 1 _ 2 .
  • the first and second cooling temperature set points T coo i and T cool _ 2 may be between 30°C, inclusive, and 45°C, inclusive.
  • the first cooling temperature set point T coo i i may be set at approximately 30°C and the second cooling temperature set point T cool _ 2 may be set at approximately 35°C.
  • the duty cycle for the pulse width modulation may be determined by DutyCycle x 100% .
  • the thermal controller 120 may be configured to control the current flowing through the one or more thermoelectric modules 170 using pulse width modulation (PWM).
  • the duty cycle for the pulse width modulation may be
  • thermoelectric module 170 increases the duty cycle of the pulse width modulation provided to control the thermoelectric module 170, and therefore the cooling effect provided, based on the temperature T detected by the temperature sensor 130 relative to the cooling temperature set points.
  • the cooling temperature set points are merely examples and other cooling temperature set points may be used.
  • Such a pair of cooling temperature set points and control of the thermoelectric modules 170 via pulse width modulation duty cycle may be used as part of process 200 at blocks 220 and 230 of Figure 5 or process 300 at blocks 320 and 340 of Figure 6.
  • a pair of heating temperature set points T eat ⁇ and h eat 2 may be used by the thermal controller 120.
  • the thermal controller 120 may activate the one or more thermoelectric modules 170 such that the first portion 172 of each is heated while the one or more fans 160 remain deactivated. If the received temperature T falls below the second heating temperature set point T eat i then the thermal controller 120 may also activate the one or more fans 160 to further circulate the heated air from the first portions 172 of each of the one or more thermoelectric modules 170.
  • the thermal controller 120 is configured to operate the one or more fans 160 and the one or more thermoelectric modules 170 until the detected temperature T increases above the second heating temperature set point T eat i
  • the one or more thermoelectric modules 170 may be deactivated by the thermal controller 120 while the one or more fans 160 remain activated to circulate the air within the outdoor enclosure 100.
  • the one or more fans 160 may be deactivated as well.
  • both the one or more fans 160 and the one or more thermoelectric modules 170 may remain active until the detected temperature T increases above the first heating temperature set point T heat i-
  • the thermal controller 120 may be configured to operate the one or more fans 160 and/or the one or more thermoelectric modules 170 for a predetermined period of time after the received temperature T increases above the first and/or the second heating temperature set points Theat 1 and Theat 2.
  • the first and second heating temperature set points Th ea t 1 and T heat 2 may be between -20°C, inclusive, and 10°C, inclusive. In one example, the first heating temperature set point T heat 1 may be set at approximately 10°C and the second heating temperature set point T heat 2 may be set at approximately 5°C.
  • Such a pair of heating temperature set points may be used as part of process 200 at blocks 240 and 250 of Figure 5 or process 300 at blocks 360 and 370 of Figure 6.
  • the pair of heating temperature set points T eat 1 and Theat 2 may be used to incrementally increase the heating provided by the first portion 172 of each of the one or more thermoelectric modules 170. For example, in one configuration, when the received temperature T is below the first heating temperature set point T ea t ⁇ then the thermal controller 120 may activate the one or more fans 160 and the one or more
  • thermoelectric modules 170 to heat the interior of the outdoor enclosure 100.
  • the thermal controller 120 may be configured to control the current flowing through the one or more thermoelectric modules 170 using pulse width modulation (PWM).
  • PWM pulse width modulation
  • the duty cycle for the pulse width modulation may be determined based on the received temperature T relative to the first and second heating temperature set points T heat _ 1 and T heat _ 2 .
  • the first and second heating temperature set points T eat ⁇ and T ea t i may be between -20°C, inclusive, and 10°C, inclusive.
  • the first heating temperature set point T ea t ⁇ may be set at approximately 10°C and the second heating temperature set point T eat 2 may be set at approximately 5°C.
  • the duty cycle for the pulse width modulation may be determined by DutyCycle x 100% .
  • the thermal controller 120 may be configured to control the current flowing through the one or more thermoelectric modules 170 using pulse width modulation (PWM).
  • the duty cycle for the pulse width modulation may
  • thermoelectric module 170 increases the duty cycle of the pulse width modulation provided to control the thermoelectric module 170, and therefore the heating effect provided, based on the temperature T detected by the temperature sensor 130 relative to the heating temperature set points.
  • the heating temperature set points are merely examples and other heating temperature set points may be used.
  • Such a pair of heating temperature set points and control of the thermoelectric modules 170 via pulse width modulation duty cycle may be used as part of process 200 at blocks 240 and 250 of Figure 5 or process 300 at blocks 360 and 370 of Figure 6.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
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Abstract

A kiosk apparatus with a temperature control system. A kiosk body includes an interior, the interior of the kiosk body sized and configured to receive a display device therein. A thermoelectric module includes a first portion and a second portion. The first portion is positioned within the interior of the kiosk body, and the second portion coupled to a portion of the kiosk body exposed to an external environment. A thermal controller is electrically coupled to the thermoelectric module and is operable to control heating or cooling of the first portion of the thermoelectric module.

Description

KIOSK APPARATUS WITH TEMPERATURE CONTROL SYSTEM
FIELD OF THE INVENTION
[0001] The present invention relates generally to structures for enclosing electronic devices. More particularly, the present invention relates to outdoor enclosures, such as outdoor kiosks, for heating and/or cooling electronic devices and/or the interior of the outdoor enclosure.
BACKGROUND
[0002] This section is intended to provide a background or context to the invention that is recited herein. The description herein may include concepts that could be pursued, but are not necessarily ones that have been previously conceived or pursued. Therefore, unless otherwise indicated herein, what is described in this section is not prior art to the description of this application and is not admitted to be prior art by inclusion in this section.
[0003] In recent years, outdoor enclosures have become enormously popular in both commercial and residential sectors, such as outdoor kiosks, vending machines, gas station pumps, etc. Such outdoor enclosures have risen in popularity due to lessening costs of electronic components, increased durability of electronic components, and increased desire of consumers for accessibility to the products provided by the outdoor enclosures. Some electronic devices that have decreased in cost and/or increased in durability include flat panel displays, computing components, etc.
[0004] Such electronic components might be located outdoors in various residential and commercial settings for entertainment, marketing, informational, and/or sales purposes, potentially exposing the electronic components to damaging rain, snow, debris, temperature fluctuations, humidity fluctuations, and other outdoor conditions. As with outdoor
applications, liquids and other potential contaminants may be near or come into contact with the electronic components, potentially damaging or degrading the performance of the electronic components. It is desirable to protect the electronic components from exposure to
environmental and other potential contaminants or conditions. Accordingly, various environmental enclosures have been developed that are intended to protect electronic components from the elements and other containments to permit locating such enclosures outdoors and in other potentially inhospitable environments.
[0005] When the electronic components are within the environmental enclosure, the temperature within the enclosure may vary depending on the environment. For example, in an outdoor environment with cold temperatures, the interior temperature within the enclosure may be similarly cold, which may affect the operation of the electronic components (e.g., dimming the screen of a display device, freezing a liquid crystal display, freezing interior water vapor on electronic components or electrical connections thereof, etc.). Similarly, in an outdoor environment with hot temperatures, the interior temperature within the enclosure may be similarly hot, which may affect the operation of the electronic components (e.g., overheating electronics components within the enclosure, such as a display device, microprocessor, memory device, video card, storage device, etc.).
BRIEF DESCRIPTION OF THE DRAWINGS
[0006] Figure 1 is a schematic block diagram illustrating components of an outdoor enclosure;
[0007] Figure 2 is a partial cross sectional view of an implementation of an assembly showing a thermoelectric module coupled to an outer casing of the outdoor enclosure;
[0008] Figure 3 is a partial cross sectional view of another implementation of an assembly showing a thermoelectric module partially embedded in the outer casing of the outdoor enclosure;
[0009] Figure 4 is a partial cross sectional view of still another implementation of an assembly for a thermoelectric module having a portion extending through an opening of the outer casing of the outdoor enclosure;
[0010] Figure 5 is a flow diagram of an example process for controlling the thermoelectric module based on temperature; and
[0011] Figure 6 is a flow diagram of another example process for controlling the
thermoelectric module based on temperature and humidity. DETAILED DESCRIPTION
[0012] Figure 1 depicts a block diagram illustrating components of an outdoor enclosure 100 one or more enclosure devices 115. The outdoor enclosure 100 may include a variety of outdoor enclosures, such as outdoor kiosks, vending machines, gas station pumps, etc. The outdoor enclosure 100 is a protective enclosure configured to enclose one or more enclosure devices 115, such as a display device (e.g., a LCD, LED or plasma display device), data processors, memory devices, video components (e.g., video cards), audio components (e.g., speakers, audio cards, etc.), storage devices (e.g., hard disk drives, solid-state drives, etc.), and/or other electronic components, within an interior of the outdoor enclosure 100.
Additionally, structures such as outdoor kiosks may also include other items housed within the interior thereof, such as products for purchase or rental.
[0013] The outdoor enclosure 100 is constructed so that the enclosure devices 115 may be located in an outdoor environment or in other environments where the enclosure devices 115 require or may benefit from protection from ambient conditions. Accordingly, the outdoor enclosure 100 is constructed to resist and substantially prevent ingress of various liquids that may be encountered in the location, including precipitation when the outdoor enclosure 100 may be directly or indirectly exposed to precipitation. In various embodiments, the outdoor enclosure 100 is constructed to prevent ingress of rain, snow, and/or splashing liquid. In a particular embodiment, the outdoor enclosure 100 is constructed to prevent ingress of liquid at a submersed depth of up to five feet of water, which may correspond to a modified rating of the IP68 standard (the contents of which are incorporated herein by reference).
[0014] The outdoor enclosure 100 includes a casing 105 (e.g., the kiosk body ) that houses the enclosure devices 115 within the outdoor enclosure 100. In some implementations, the casing 105 may be a multi-piece assembly, such as a front portion and a rear portion that may be coupled together to enclose the enclosure devices 115 therebetween. In some
implementations, the rear portion and front portion may be joined together in a manner that prevents ingress of liquids into the outdoor enclosure 100. A plurality of connecting elements may join the multi-piece assembly for the casing 105. The use of removable connecting elements allows for installation of and access to the enclosure devices 115 within in the outdoor enclosure 100. In an embodiment, one or more gaskets may be disposed between one or more of the pieces of a multi-piece casing 105 to provide appropriate sealing of the outdoor enclosure 100. In some implementations, a portion or all of the casing 105 may also serve as a heat sink, dissipating heat generated from within the outdoor enclosure 100 to the environment outside the enclosure. As such, at least a portion of the casing 105 may comprise a material having a relatively high thermal conductivity. For example, in an embodiment, the casing 105 comprises die cast aluminum. In some implementations, the casing 105 may include a heat sink portion that comprises a plurality of fins, such as fins 190 of Figures 2-4, disposed on the outer surface to enhance convective transfer of heat generated from within the outdoor enclosure 100 to the environment. As will be discussed in greater detail below, a
thermoelectric module 170 may be coupled (e.g., via connecting elements such as bolts, screws, latches, clamps, clips, etc., via adhesives, or otherwise) or positioned relative to the casing 105 such that thermal conduction occurs between a second portion of the thermoelectric module 170 and the casing 105. Thus, the thermal energy, either heating or cooling, may be conducted through the casing 105 to the plurality of fins for convection to the surrounding environment, as will be discussed in greater detail below.
[0015] Various other thermal control devices may be disposed within or at least partially within the outdoor enclosure 100, to assist in maintaining the internal temperature of the outdoor enclosure 100. Thermal control may be accomplished by including devices intended to add and/or remove heat from the outdoor enclosure 100 depending on ambient conditions and/or the operating conduction or conditions of the enclosure devices 115. The various thermal control devices may work independently or in concert to assist in modulating the temperature inside the outdoor enclosure 100 within the operating temperature range(s) and/or storage temperature range(s) of the enclosure devices 115 under various ambient conditions. In a particular embodiment, the outdoor enclosure 100 is capable of maintaining the internal temperature inside the enclosure within the operating range of an ambient temperature range of between about -20 °C and about 60 °C. The thermal control devices within the outdoor enclosure 100 may comprise passive and/or active devices.
[0016] Still referring to Figure 1, the outdoor enclosure 100 may further include a power source 110 within the outdoor enclosure 100 to provide direct or indirect power to one or more components within the outdoor enclosure 100. The power source 110 may be mounted within the outdoor enclosure 100 and may be electrically coupled to an external power source, for example, directly or indirectly to a conventional power grid or other source. In some implementations, an EMI filter may be included between the external power source and the internal power source 110. In other implementations, the power source 110 may be a battery, a solar panel, etc.
[0017] The outdoor enclosure 100 further includes a thermal controller 120. As shown in Figure 1, the thermal controller 120 is electrically coupled to the power source 110 to receive power. The thermal controller 120 is also electrically coupled to a temperature sensor 130, a humidity sensor 140, an H-Bridge 150, and one or more fans 160. The thermal controller 120 may be configured to control the heating or cooling of the first portion of the thermoelectric module 170. In one implementation, the thermal controller 120 may receive an output from the temperature sensor 130, such as a value indicative of an internal temperature of the outdoor enclosure 100, and/or an output from the humidity sensor 140, such as a value indicative of an internal humidity of the outdoor enclosure 100, and control the operation of the one or more fans 160 and one or more thermoelectric modules 170.
[0018] Referring briefly to Figures 2-4, the heating and/or cooling system may include a thermoelectric module 170, and more particularly a Peltier thermoelectric module. One example of such a Peltier thermoelectric module is be a TEC 1-12705 Thermoelectric Peltier Cooler available from Hebei I.T. (Shanghai) Co., Ltd. of Shanghai, China. The Peltier thermoelectric module 170 of the present example is a silicon device having a first portion 172 and a second portion 174. The first portion 172 may be positioned within an interior of the casing 105 of the outdoor enclosure 100 and the second portion 174 may be coupled to a portion of the casing 105 of the outdoor enclosure 100 and directly or indirectly exposed to the external environment. When an electric current is applied to the thermoelectric module 170 in a first direction, the first portion 172 is cooled and the second portion 174 is heated. When the electric current is applied to the module 170 in a second direction, substantially opposite the first direction, the first portion 172 is heated and the second portion 174 is cooled.
Accordingly, it may be appreciated that the internal temperature of the outdoor enclosure 100 and/or one or more of the enclosure devices 115 may be actively regulated, by heating or cooling the first portion 172, using the thermoelectric module 170. In some implementations, a plurality of thermoelectric modules 170 may be provided to form a thermoelectric module array.
[0019] In some embodiments, the first portion 172 of the thermoelectric module or modules 170 may be aligned with one or more of the enclosure devices 115 and/or the power source 110 that is thermally sensitive or otherwise may benefit from thermal management. For example, the first portion 172 may be positioned within the outdoor enclosure 100 such that the first portion 172 is substantially aligned with a location of an enclosure device 115 and/or the power source 110 of the outdoor enclosure 100. In other embodiments, the thermoelectric module or modules 170 and the first portion 172 may be arbitrarily positioned within the outdoor enclosure 100.
[0020] In some embodiments, the second portion 174 of each thermoelectric module or modules 170 may be coupled to the casing 105 for heat transfer to a heat sink portion of the casing 105. For example, the thermoelectric module 170 and the casing 105 may be coupled together (e.g., via connecting elements such as bolts, screws, latches, clamps, clips, etc. via adhesives, or otherwise) and may include a thermally conductive grease or adhesive interposed between the second portion 174 and the heat sink portion, as will be discussed in further detail in reference to Figure 2. Thus, the second portion 174 is conductively coupled to the heat sink portion of the casing 105. In other embodiments, the thermoelectric module 170 may be integrated or embedded in the casing 105 (e.g., a recess may be formed in the casing 105 for the thermoelectric module 170 to be at least partially embedded, as will be discussed in further detail in reference to Figure 3). In yet a further configuration, the casing 105 may include an opening for the second portion 174 to be exposed to the external environment, as will be discussed in further detail in reference to Figure 4. In still further implementations, the second portion 174 of the thermoelectric module 170 may be associated with another portion of the outdoor enclosure 100. In some embodiments, a plurality or an array of thermoelectric modules 170 may be positioned within the outdoor enclosure 100. The Peltier thermoelectric module 170 and control thereof will be described in greater detail below.
[0021] The temperature sensor 130 is electrically coupled to the thermal controller 120 and the power source 110 (either directly or indirectly) and is configured to output a signal indicative of a temperature detected by the temperature sensor 130. The temperature sensor 130 may include a thermistor, a thermocouple, a resistance temperature detector, or any other temperature sensor. The signal output from the temperature sensor 130 may be a voltage value that corresponds to a detected temperature. The thermal controller 120 may receive and use the voltage value representative of the temperature as an input for controlling the one or more fans 160 and/or the thermoelectric module or modules 170, as will be described in greater detail below.
[0022] The temperature sensor 130 is positioned within the outdoor enclosure 100 to measure the internal temperature of the outdoor enclosure 100. In some implementations, the temperature sensor 130 may be positioned near the thermoelectric module 170. For example, the temperature sensor 130 may be positioned adjacent to a thermoelectric module 170. In other instances, the temperature sensor 130 may be positioned remote from the thermoelectric module 170, such as at an opposite corner of the outdoor enclosure 100 relative to the thermoelectric module 170. In still further implementations, the temperature sensor 130 may be arbitrarily positioned within the outdoor enclosure 100. In some implementations, a plurality of temperature sensors 130 may be provided within the outdoor enclosure 100. Each temperature sensor 130 may be associated with a corresponding enclosure device 115 and/or a set of enclosure devices 115.
[0023] The humidity sensor 140 is also electrically coupled to the thermal controller 120 and the power source 110 (either directly or indirectly) and is configured to output a signal indicative of a humidity detected by the humidity sensor 140. The humidity sensor 140 may include a hygrometer, a humistor, or any other humidity sensor. The signal output from the humidity sensor 140 may be a voltage value that corresponds to a detected humidity, such as a relative humidity. The thermal controller 120 may receive and use the voltage value representative of the humidity as an input for controlling the one or more fans 160 and/or the thermoelectric module or modules 170, as will be described in greater detail below.
[0024] The humidity sensor 140 is positioned within the outdoor enclosure 100 to measure the internal humidity of the outdoor enclosure 100. In some implementations, the humidity sensor 140 may be positioned near the temperature sensor 130 and/or the thermoelectric module 170. For example, the humidity sensor 140 may be positioned adjacent to the temperature sensor 130 such that the humidity and temperature measurements are taken at substantially the same spatial position. In other instances, the humidity sensor 140 may be positioned remote from the temperature sensor 130. In still further implementations, the humidity sensor 140 may be arbitrarily positioned within the outdoor enclosure 100. In some implementations, a plurality of temperature sensors 130 may be provided within the outdoor enclosure 100. Each temperature sensor 130 may be associated with a corresponding enclosure device 115 and/or a set of enclosure devices 115. In some implementations, the humidity sensor 140 may be omitted.
[0025] The thermal controller 120 is further electrically coupled to the H-Bridge 150. The H- Bridge 150 is also electrically coupled to one or more thermoelectric modules 170 and the power source 110. The thermal controller 120 is configured to control the direction of current supplied from the power source 110 to the one or more thermoelectric modules 170 via the H- Bridge 150. In one implementation, the thermal controller 120 may control the current flow to the one or more thermoelectric modules 170 by using one half of the H-Bridge 150. That is, the thermal controller 120 may, using the H-Bridge 150, control whether current flows in a first direction or a second direction through the thermoelectric modules 170. As noted above, when an electric current is applied to the one or more thermoelectric modules 170 in the first direction, the first portion 172 of each thermoelectric module 170 is cooled and the second portion 174 of each thermoelectric module 170 is heated. When the electric current is applied to the one or more thermoelectric modules 170 in the second direction, opposite the first direction, the first portion 172 of each thermoelectric module 170 is heated and the second portion 174 of each thermoelectric module 170 is cooled. The second portion 174 may be conductive ly coupled to or otherwise associated with the casing 105 for heat transfer to the external atmosphere of the outdoor enclosure 100. Accordingly, it may be appreciated that the internal temperature of the outdoor enclosure 100, portions thereof, and/or one or more of the enclosure devices 115 may be actively regulated by the thermal controller 120 using the H- Bridge 150 and one or more thermoelectric modules 170.
[0026] The thermal controller 120 may control the current flowing through the one or more thermoelectric modules 170 using pulse width modulation (PWM). The thermal controller 120 may control the duty cycle of the pulse width modulation to vary the heating or cooling provided by the one or more thermoelectric modules 170. When the duty cycle of the pulse width modulation reaches 100%, then the maximum current is applied and the maximum heating or cooling is provided by the one or more thermoelectric modules 170.
[0027] One or more fans 160 may be electrically coupled the thermal controller 120 and the power source 110 (either directly or indirectly). The thermal controller 120 may be configured to control the one or more fans 160. The one or more fans 160 may be positioned to circulate air within the outdoor enclosure 100. In some implementations, the one or more fans 160 may be positioned relative to the one or more thermoelectric modules 170 to increase the convective heat transfer from the first portion 172 (e.g., adjacent to, above, etc.) to the interior air of the outdoor enclosure 100 to assist the heating or cooling provided by the first portion 172 of the one or more thermoelectric modules 170.
[0028] In addition to the enclosure devices 115, the power source 110 may be a significant heat generator that may raise the internal temperature within the outdoor enclosure 100 when in operation. Accordingly, in some implementations a Peltier thermoelectric module 170 may be located between the power source 110 and the casing 105 such that the thermoelectric module 170 may actively cool the power source 110 and/or the interior of the outdoor enclosure 100. As noted above, the thermoelectric module 170 may be conductively coupled to the casing 105 such that thermal energy may be conducted to a heat sink portion of the casing 105. In some instances, such as when the outdoor enclosure 100 is within a cold environment, the thermoelectric module 170 may heat the power source 110 and/or the interior of the outdoor enclosure 100.
[0029] Referring to Figures 2-4, the outdoor enclosure 100 may include one or more thermoelectric modules 170 (more particularly, Peltier thermoelectric modules) associated with the casing 105. In the implementation depicted in Figure 2, the module 170 may be physically coupled to a heat sink portion having fins 190 of the casing 105. For example, the
thermoelectric module 170 and the casing 105 may be coupled together (e.g., via connecting elements such as bolts, screws, latches, clamps, clips, etc. via adhesives, or otherwise) and may include a thermally conductive grease or adhesive 180 interposed between the second portion 174 and the heat sink portion of the casing 105. In some instances, no heat sink portion may be included with the casing 105. The thermally conductive grease or adhesive 180 may be a ceramic-based thermal grease (e.g., beryllium oxide), a metal-based thermal grease (e.g., silver or aluminium impregnated grease), a thermal adhesive (e.g., a mixture of epoxy and thermal conductive components, such as silver or aluminium), or any other thermally conductive grease or adhesive. The thermally conductive grease or adhesive 180 may be used to fill any gaps between the second portion 174 of the thermoelectric module 170 and the casing 105, thereby increasing the thermal conductivity between the second portion 174 and the casing 105.
[0030] The first portion 172 of the thermoelectric module 170 faces an interior of the outdoor enclosure 100. When an electric current is applied to the module 170 in a first direction, the first portion 172 is cooled and the second portion 174 is heated. When the electric current is applied to the module 170 in a second direction, opposite the first direction, the first portion 172 is heated and the second portion 174 is cooled.
[0031] In some implementations, an internal fan may be horizontally positioned above the first portion 172 to draw air towards or away from the first portion 172 to increase the convective heating or cooling of the interior of the outdoor enclosure 100. In other
implementations, an internal fan may be vertically positioned adjacent to the first portion 172 (e.g., perpendicular to an interior surface of the first portion 172) in the interior of the outdoor enclosure 100 to draw air over the first portion 172 to increase the convective heating or cooling of the interior of the outdoor enclosure 100. In still other implementations, a second heat sink may be conductively coupled to the first portion 172 to increase the convective surface on the interior of the outdoor enclosure 100 as well. The internal fan may be positioned adjacent to and/or above the second heat sink to increase the airflow through the heat sink fins. The thermoelectric module 170 and/or the internal fan are electrically coupled to a power source (either directly or indirectly), such as power source 110 of Figure 1, to provide operating power to the thermoelectric module 170 and/or the internal fan.
[0032] In some implementations, the thermally conductive grease or adhesive 180 may be omitted and the thermoelectric module 170 may simply abut and otherwise be conductively coupled to the casing 105. In still other implementations, the thermoelectric module 170 may be coupled to other portions of the outdoor enclosure 100. Still further, a plurality or an array of thermoelectric modules 170 may be used.
[0033] In another implementation, shown in Figure 3, the thermoelectric module 170 may be embedded or integrated into the casing 105. In the example shown, a recess 182 is formed in a portion of the casing 105 such that all or a portion of the second portion 174 of the thermoelectric module 170 may be inserted into the recess 182. Thus, additional surface area of the second portion 174 may be conductively coupled to the casing 105, thereby increasing the heat transfer between the second portion 174 and the casing 105. The thermoelectric module 170 and the casing 105 may be coupled together (e.g., via connecting elements such as bolts, screws, latches, clamps, clips, etc. via adhesives, or otherwise). In some
implementations, the thermally conductive grease or adhesive may be interposed between the second portion 174 and the surface of the recess of the casing 105 to increase the thermal conductivity.
[0034] In some implementations, an internal fan may be positioned above and/or adjacent to the embedded thermoelectric module 170 to increase air flow over the first portion 172 to increase the convective heating or cooling of the interior of the outdoor enclosure 100. In some implementations, a second heat sink may be thermally coupled to the first portion 172 to increase the convective surface on the interior of the outdoor enclosure 100 as well. The internal fan may be positioned adjacent to and/or above the second heat sink to increase the airflow through the heat sink fins. The thermoelectric module 170 and/or the internal fan are electrically coupled to a power source (either directly or indirectly), such as power source 110 of Figure 1, to provide operating power to the thermoelectric module 170 and/or the internal fan.
[0035] In some implementations, the thermoelectric module 170 may be embedded within the casing 105 such that an outer surface of the first portion 172 may be substantially flush with the interior surface of the casing 105. In still other implementations, the thermoelectric module 170 may be embedded or integrated into other portions of the outdoor enclosure 100. Still further, a plurality or an array of thermoelectric modules 170 may be used.
[0036] In still another implementation, shown in Figure 4, the casing 105 may include an opening 184 for the second portion 174 of the thermoelectric module 170 to be exposed to the external environment. Thus, the atmospheric air may directly convectively transfer heat to or from the second portion 174. In some implementations, an outer surface of the second portion 174 may be flush with a surface of the casing 105, such as that shown in Figure 4. In other implementations, the second portion 174 may protrude outward from or be recessed relative to the casing 105. The thermoelectric module 170 may be bonded to the casing 105 in a manner that prevents ingress of liquids into the outdoor enclosure 100. For example, the thermoelectric module 170 may be bonded to the casing 105 using an adhesive such as a urethane adhesive. In some implementations, the thermoelectric module 170 and the casing 105 may be physically coupled together (e.g., via connecting elements such as bolts, screws, latches, clamps, clips, etc.), either in addition to or in lieu of the adhesive bonding.
[0037] An internal fan may be positioned above and/or adjacent to the thermoelectric module 170 to increase air flow over the first portion 172 to increase the convective heating or cooling of the interior of the outdoor enclosure 100. In some implementations, a second heat sink may be thermally coupled to the first portion 172 to increase the convective surface on the interior of the outdoor enclosure 100 as well. The internal fan may be positioned adjacent to and/or above the second heat sink to increase the airflow through the heat sink fins. The
thermoelectric module 170 and/or the internal fan are electrically coupled to a power source (either directly or indirectly), such as power source 110 of Figure 1, to provide operating power to the thermoelectric module 170 and/or the internal fan.
[0038] The thermoelectric module 170 may be positioned within the casing 105 such that an outer surface of the first portion 172 is flush with the interior surface of the casing 105. In still other implementations, the thermoelectric module 170 positioned with the second portion 174 exposed in other portions of the outdoor enclosure 100. Still further, a plurality or an array of thermoelectric modules 170 may be used.
[0039] In addition to, or in lieu of, the fans discussed above in reference to the thermoelectric modules 170, the outdoor enclosure 100 may also include additional internal fans not associated with thermoelectric modules 170 and that are located within the outdoor enclosure 100. Each internal fan may circulate air within the outdoor enclosure 100, mitigating thermal gradients or hot spots on, for example, a surface of one or more of the enclosure devices 115 and regions within the outdoor enclosure 100. The internal fans may be electrically coupled to a power source (either directly or indirectly) to provide operating power to the internal fan.
[0040] Referring to Figures 5 and 6, the thermal controller 120 may be configured with one or more temperature set points, such as Tcooi and T eat- Using the one or more temperature set points, the thermal controller 120 may be configured to control the one or more fans 160 and/or the one or more thermoelectric modules 170. In one example configuration, shown as process 200 in Figure 5, the thermal controller 120 may receive a temperature, T, from a temperature sensor 130 (block 210). The received temperature may be represented by a voltage outputted by the temperature sensor 130 to the thermal controller 120 that is indicative of the temperature detected by a temperature sensor 130. In some implementations, such as for several temperature sensors 130, the temperature T may be an average temperature, a maximum temperature, or a minimum temperature of the several readings from the temperature sensors 130.
[0041] The received temperature T may be compared against a first temperature set point, such as Tcooi, by the thermal controller 120 to determine whether the temperature detected T by the temperature sensor 130 is above a first temperature set point (block 220). In some implementations, the first temperature set point may be between 30°C, inclusive, and 45°C, inclusive. In one particular example, the first temperature set point Tcooi may be set at approximately 30°C.
[0042] If it is determined that the detected temperature T is above the first temperature set point, Tcooi (block 220) then the thermal controller 120 may be configured to activate one or more of the fans 160 and switch the H-bridge 150 to energize and drive current through the one or more thermoelectric modules 170 in the direction which will cause the first surface 172 of each of the one or more thermoelectric modules 170 to be cooled (block 230). Accordingly, the interior of the outdoor enclosure 100 may be cooled by the one or more thermoelectric modules 170 and the one or more fans 160 circulating air. The second portion 174 of the one or more thermoelectric modules 170 may be coupled to the casing 105 or a heat sink portion of the casing 105. When the second portion 174 is heated as the first portion 172 is cooled, the second portion 174 thermally conducts heat through the casing 105 to dissipate the heat to the atmosphere. The process 200 may then return to block 210 to receive the temperature T from the temperature sensor 130. In some implementations, the thermal controller 120 is configured to operate the one or more fans 160 and the one or more thermoelectric modules 170 until the detected temperature T falls below the first temperature set point Tcooi as shown in Figure 5. In other implementations, the thermal controller 120 may be configured to operate the one or more fans 160 and the one or more thermoelectric modules 170 for a predetermined period of time, either in addition to or in lieu of the detected temperature T falling below the first temperature set point Tcool. In some implementations, if the one or more fans 160 and the one or more thermoelectric modules 170 are already activated, then the thermal controller 120 may simply keep the one or more fans 160 and the one or more thermoelectric modules 170 activated.
[0043] If it is determined that the detected temperature T does not exceed the first temperature set point Tcooi (block 220), then a determination may be made by the thermal controller 120 whether the detected temperature T is below a second temperature set point T eat (block 240). The second temperature set point may be set as a temperature below the operational range of one or more of the enclosure devices 115 or that would degrade the operation of one or more of the enclosure devices 115. In some implementations, the second temperature set point may be between -20°C, inclusive, and 10°C, inclusive. In one example, the second temperature set point may be set at approximately 5 °C.
[0044] If it is determined that the detected temperature T is below the second temperature set point T eat (block 240) then the thermal controller 120 may be configured to activate one or more of the fans 160 and switch the H-bridge 150 to energize and drive current through the one or more thermoelectric modules 170 in the direction which will cause the first surface 172 of each of the one or more thermoelectric modules 170 to be heated (block 250). Accordingly, the interior of the outdoor enclosure 100 may be heated by the one or more thermoelectric modules 170 and the one or more fans 160 circulating air. The second portion 174 of the one or more thermoelectric modules 170 may be coupled to the casing 105 or a heat sink portion of the casing 105. When the second portion 174 is cooled as the first portion 172 is heated, the second portion 174 thermally cools the casing 105 through conduction to dissipate the cool to the atmosphere. The process 200 may then return to block 210 to receive the temperature T from the temperature sensor 130. In some implementations, the thermal controller 120 is configured to operate the one or more fans 160 and the one or more thermoelectric modules 170 until the detected temperature T increases above the second temperature set point Theat as shown in Figure 5. In other implementations, the thermal controller 120 may be configured to operate the one or more fans 160 and the one or more thermoelectric modules 170 for a predetermined period of time, either in addition to or in lieu of the detected temperature T increasing above the second temperature set point T eat- In some implementations, if the one or more fans 160 and the one or more thermoelectric modules 170 are already activated, then the thermal controller 120 may simply keep the one or more fans 160 and the one or more thermoelectric modules 170 activated.
[0045] If it is determined that the detected temperature T is not below the second temperature set point Theat, (block 240), then a determination may be made by the thermal controller 120 whether the one or more fans 160 and the one or more thermoelectric modules 170 are active (block 260). If the one or more fans 160 and the one or more thermoelectric modules 170 are not active, then the process 200 may return to block 210 to receive the temperature T from the temperature sensor 130. If the one or more fans 160 and the one or more thermoelectric modules 170 are active, then the process 200 may proceed to deactivate the one or more fans 160 and the one or more thermoelectric modules 170 (block 270). The process 200 may then return to block 210 to receive the temperature T from the temperature sensor 130.
[0046] In some implementations, the one or more fans 160 and the one or more
thermoelectric modules 170 may be operated by the thermal controller 120 while one or more of the enclosure devices 115 is off or in a sleep mode to mitigate potential damage to one or more of the enclosure devices 115 (e.g., a display device, a data processor, etc.) that could be caused by ambient temperatures below a storage temperature of the device, such as, for example, below -20°C or above 45°C. In some other implementations, the process 200 may be performed periodically (i.e. polled), such as every minute, five minutes, ten minutes, thirty minutes, one hour, etc.
[0047] In another example configuration, shown as process 300 in Figure 6, the thermal controller 120 may receive a temperature T from the temperature sensor 130 and a humidity H from the humidity sensor 140 (block 310). The received temperature may be a voltage outputted by the temperature sensor 130 to the thermal controller 120 that is indicative of the temperature detected by the temperature sensor 130. In some implementations, such as for several temperature sensors 130, the temperature T may be an average temperature, a maximum temperature, or a minimum temperature of the several readings from the temperature sensors 130. The received humidity may also be a voltage outputted by the humidity sensor 140 to the thermal controller 120 that is indicative of the humidity detected by the humidity sensor 140. In some implementations, such as for several humidity sensors 140, the humidity H may be an average humidity, a maximum humidity, or a minimum humidity of the several readings from the humidity sensors 140.
[0048] The received temperature T may be compared against a first temperature set point, such as Tcooi, to determine whether the temperature detected T by the temperature sensor 130 is above a first temperature set point (block 320). In some implementations, the first temperature set point may be between 30°C, inclusive, and 45°C, inclusive. In one example, the first temperature set point Tcooi may be set at approximately 30°C.
[0049] If it is determined that the detected temperature T is above the first temperature set point Tcooi, (block 320), then a determination may be made by the thermal controller 120 whether the received humidity H is less than or equal to a maximum humidity Hmax (block 330). For example, the maximum humidity Hmax may be a value indicative of a relative humidity between 75% and 100%. In one example, the maximum humidity Hmax may be set as a value indicative of a relative humidity of approximately 85%. If the value of the received humidity H within the outdoor enclosure 100 is below the maximum humidity Hmax, then the thermal controller 120 may be configured to activate one or more of the fans 160 and switch the H-bridge 150 to energize and drive current through the one or more thermoelectric modules 170 in the direction which will cause the first surface 172 of each of the one or more thermoelectric modules 170 to be cooled (block 340). Accordingly, the interior of the outdoor enclosure 100 may be cooled by the one or more thermoelectric modules 170 and the one or more fans 160 circulating air. The second portion 174 of the one or more thermoelectric modules 170 may be coupled to the casing 105 or a heat sink portion of the casing 105. When the second portion 174 is heated as the first portion 172 is cooled, the second portion 174 thermally conducts heat through the heat sink portion of the rear cover assembly 300 to dissipate the heat to the atmosphere. The process 300 may then return to block 310 to receive the temperature T from the temperature sensor 130 and the humidity H from the humidity sensor 140. In some implementations, the thermal controller 120 is configured to operate the one or more fans 160 and the one or more thermoelectric modules 170 until the detected temperature T falls below the first temperature set point Tcooi, as shown in Figure 6. In other implementations, the thermal controller 120 may be configured to operate the one or more fans 160 and the one or more thermoelectric modules 170 for a predetermined period of time, either in addition to or in lieu of the detected temperature T falling below the first temperature set point Tcooi. In some implementations, if the one or more fans 160 and the one or more thermoelectric modules 170 are already activated, then the thermal controller 120 may simply keep the one or more fans 160 and the one or more thermoelectric modules 170 activated.
[0050] If the value of the received humidity H within the outdoor enclosure 100 increases above the maximum humidity Hmax, then condensation may occur within the outdoor enclosure 100. Such condensation may potentially harm the one or more enclosure devices 115 of the outdoor enclosure 100. Accordingly, if the value of the received humidity H increases above the maximum humidity Hmax, (block 330), then the thermal controller 120 may be configured to deactivate the one or more thermoelectric modules 170 (block 350). In the present example, the one or more fans 160 may remain active to circulate the air within outdoor enclosure 100 to assist in the transfer of thermal energy from the air within the outdoor enclosure 100 to the casing 105 or a heat sink portion of the casing 105, even if the one or more thermoelectric module 170 is no longer active. In another implementation, both of the one or more fans 160 and the one or more thermoelectric modules 170 may be deactivated when the received humidity H is above a maximum humidity Hmax (block 330). In some implementations, a dew point temperature may be determined by the thermal controller 120 based on the received temperature T and the received humidity H. The received temperature T may be compared to the calculated dew point temperature in lieu of, or in addition to, the comparison of the received humidity H, is above a maximum humidity Hmax by the thermal controller 120 (block 330). The process 300 may then return to block 310 to receive the temperature T from the temperature sensor 130 and the humidity H from the humidity sensor 140.
[0051] If it is determined that the detected temperature T does not exceed the first temperature set point Tcool, (block 320), then a determination may be made by the thermal controller 120 whether the detected temperature T is below a second temperature set point T eat (block 360). The second temperature set point may be set as a temperature below the operational range of one or more of the enclosure devices 115 or that would degrade the operation of one or more of the enclosure devices 115. In some implementations, the second temperature set point may be between -20°C, inclusive, and 10°C, inclusive. In one example, the second temperature set point may be set at approximately 5 °C.
[0052] If it is determined that the detected temperature T is below the second temperature set point T eat, (block 360) then the thermal controller 120 may be configured to activate one or more of the fans 160 and switch the H-bridge 150 to energize and drive current through the one or more thermoelectric modules 170 in the direction which will cause the first surface 172 of each of the one or more thermoelectric modules 170 to be heated (block 370). Accordingly, the interior of the outdoor enclosure 100 may be heated by the one or more thermoelectric modules 170 and the one or more fans 160 circulating air. The second portion 174 of the one or more thermoelectric modules 170 may be coupled to the casing 105 or a heat sink portion of the casing 105. When the second portion 174 is cooled as the first portion 172 is heated, the second portion 174 thermally cools the casing 105 through conduction to dissipate the cool to the atmosphere. The process 300 may then return to block 310 to receive the temperature T from the temperature sensor 130 and the humidity H from the humidity sensor 140. In some implementations, the thermal controller 120 is configured to operate the one or more fans 160 and the one or more thermoelectric modules 170 until the detected temperature T increases above the second temperature set point T eat, as shown in Figure 6. In other implementations, the thermal controller 120 may be configured to operate the one or more fans 160 and the one or more thermoelectric modules 170 for a predetermined period of time, either in addition to or in lieu of the detected temperature T increasing above the second temperature set point T eat. In some implementations, if the one or more fans 160 and the one or more thermoelectric modules 170 are already activated, then the thermal controller 120 may simply keep the one or more fans 160 and the one or more thermoelectric modules 170 activated.
[0053] If it is determined that the detected temperature T is not below the second temperature set point Theat, (block 360), then a determination may be made by the thermal controller 120 whether the one or more fans 160 and the one or more thermoelectric modules 170 are active (block 380). If the one or more fans 160 and the one or more thermoelectric modules 170 are not active, then the process 300 may then return to block 310 to receive the temperature T from the temperature sensor 130 and the humidity H from the humidity sensor 140. If the one or more fans 160 and the one or more thermoelectric modules 170 are active, then the process 300 may proceed to deactivate the one or more fans 160 and the one or more thermoelectric modules 170 (block 390). The process 300 may then return to block 310 to receive the temperature T from the temperature sensor 130 and the humidity H from the humidity sensor 140.
[0054] In some implementations, the one or more fans 160 and the one or more
thermoelectric modules 170 may be operated by the thermal controller 120 while one or more of the enclosure devices 115 is off or in a sleep mode to mitigate potential damage to one or more of the enclosure devices 115 (e.g., a display device, a data processor, etc.) that could be caused by ambient temperatures below a storage temperature of the device, such as, for example, below -20°C or above 45°C. In some other implementations, the process 300 may be performed periodically (i.e., polled), such as every minute, five minutes, ten minutes, thirty minutes, one hour, etc.
[0055] In some implementations, a pair of cooling temperature set points Tcooi _1 and Tcooi 2 may be used by the thermal controller 120 when activating the one or more thermoelectric modules 170. For example, in one configuration, when the received temperature T is above the first cooling temperature set point TCOoi_i, then the thermal controller 120 may activate the one or more fans 160 while the one or more thermoelectric modules 170 remain deactivated. If the received temperature T is above the second cooling temperature set point Tcooi 2, then the thermal controller 120 may also activate the one or more thermoelectric modules 170 such that the first portion 172 of each is cooled. In some implementations, the thermal controller 120 is configured to operate the one or more fans 160 and the one or more thermoelectric modules 170 until the detected temperature T falls below the second cooling temperature set point
Tcooi 2- When the detected temperature T falls below the second cooling temperature set point Tcooi 2, then the one or more thermoelectric modules 170 may be deactivated by the thermal controller 120 while the one or more fans 160 remain activated. When the detected
temperature T falls below the first cooling temperature set point Tcooi ι, then the one or more fans 160 may be deactivated as well. In other implementations, both the one or more fans 160 and the one or more thermoelectric modules 170 may remain active until the detected temperature T falls below the first cooling temperature set point Tcooi ι· In other
implementations, the thermal controller 120 may be configured to operate the one or more fans 160 and/or the one or more thermoelectric modules 170 for a predetermined period of time after the received temperature T is above the first and/or the second cooling temperature set points Tcooi i and Tcool_2. The first and second cooling temperature set points Tcooi _1 and Tcool_2 may be between 30°C, inclusive, and 45°C, inclusive. In one example, the first cooling temperature set point Tcooij, may be set at approximately 30°C and the second cooling temperature set point Tcool_2 may be set at approximately 35°C. Such a pair of cooling temperature set points may be used as part of process 200 at blocks 220 and 230 of Figure 5 or process 300 at blocks 320 and 340 of Figure 6.
[0056] In yet another implementation, the pair of cooling temperature set points Tcooi_i and Tcooi 2 may be used to incrementally increase the cooling provided by the first portion 172 of each of the one or more thermoelectric modules 170. For example, in one configuration, when the received temperature T is above the first cooling temperature set point Tcooi i, then the thermal controller 120 may activate the one or more fans 160 and the one or more
thermoelectric modules 170 to cool the interior of the outdoor enclosure 100. The thermal controller 120 may be configured to control the current flowing through the one or more thermoelectric modules 170 using pulse width modulation (PWM). The duty cycle for the pulse width modulation may be determined based on the received temperature T relative to the first and second cooling temperature set points Tcool_1 and Τ∞ο1_2. For example, the first and second cooling temperature set points Tcooi and Tcool_2 may be between 30°C, inclusive, and 45°C, inclusive. In one example, the first cooling temperature set point Tcooi i may be set at approximately 30°C and the second cooling temperature set point Tcool_2 may be set at approximately 35°C. In one example, the duty cycle for the pulse width modulation may be determined by DutyCycle x 100% . Thus, the thermal controller 120 may
Figure imgf000021_0001
increase the duty cycle of the pulse width modulation provided to control the thermoelectric module 170, and therefore the cooling effect provided, based on the temperature T detected by the temperature sensor 130 relative to the cooling temperature set points. Of course it should be understood that the cooling temperature set points are merely examples and other cooling temperature set points may be used. Such a pair of cooling temperature set points and control of the thermoelectric modules 170 via pulse width modulation duty cycle may be used as part of process 200 at blocks 220 and 230 of Figure 5 or process 300 at blocks 320 and 340 of Figure 6.
[0057] Similarly, in some implementations, a pair of heating temperature set points T eat ι and heat 2 may be used by the thermal controller 120. For example, in one configuration, when the received temperature T falls below the first heating temperature set point T eat ι then the thermal controller 120 may activate the one or more thermoelectric modules 170 such that the first portion 172 of each is heated while the one or more fans 160 remain deactivated. If the received temperature T falls below the second heating temperature set point T eat i then the thermal controller 120 may also activate the one or more fans 160 to further circulate the heated air from the first portions 172 of each of the one or more thermoelectric modules 170. In some implementations, the thermal controller 120 is configured to operate the one or more fans 160 and the one or more thermoelectric modules 170 until the detected temperature T increases above the second heating temperature set point T eat i When the detected temperature T increases above the second heating temperature set point Theat 2 then the one or more thermoelectric modules 170 may be deactivated by the thermal controller 120 while the one or more fans 160 remain activated to circulate the air within the outdoor enclosure 100. When the detected temperature T increases above the first heating temperature set point T eat 1 then the one or more fans 160 may be deactivated as well. In other implementations, both the one or more fans 160 and the one or more thermoelectric modules 170 may remain active until the detected temperature T increases above the first heating temperature set point Theat i- In other implementations, the thermal controller 120 may be configured to operate the one or more fans 160 and/or the one or more thermoelectric modules 170 for a predetermined period of time after the received temperature T increases above the first and/or the second heating temperature set points Theat 1 and Theat 2. The first and second heating temperature set points Theat 1 and Theat 2 may be between -20°C, inclusive, and 10°C, inclusive. In one example, the first heating temperature set point Theat 1 may be set at approximately 10°C and the second heating temperature set point Theat 2 may be set at approximately 5°C. Such a pair of heating temperature set points may be used as part of process 200 at blocks 240 and 250 of Figure 5 or process 300 at blocks 360 and 370 of Figure 6. [0058] In yet another implementation, the pair of heating temperature set points T eat 1 and Theat 2, may be used to incrementally increase the heating provided by the first portion 172 of each of the one or more thermoelectric modules 170. For example, in one configuration, when the received temperature T is below the first heating temperature set point T eat ι then the thermal controller 120 may activate the one or more fans 160 and the one or more
thermoelectric modules 170 to heat the interior of the outdoor enclosure 100. The thermal controller 120 may be configured to control the current flowing through the one or more thermoelectric modules 170 using pulse width modulation (PWM). The duty cycle for the pulse width modulation may be determined based on the received temperature T relative to the first and second heating temperature set points Theat _1 and Theat _2. For example, the first and second heating temperature set points T eat ι and T eat i may be between -20°C, inclusive, and 10°C, inclusive. In one example, the first heating temperature set point T eat ι may be set at approximately 10°C and the second heating temperature set point T eat 2 may be set at approximately 5°C. In one example, the duty cycle for the pulse width modulation may be determined by DutyCycle x 100% . Thus, the thermal controller 120 may
Figure imgf000023_0001
increase the duty cycle of the pulse width modulation provided to control the thermoelectric module 170, and therefore the heating effect provided, based on the temperature T detected by the temperature sensor 130 relative to the heating temperature set points. Of course it should be understood that the heating temperature set points are merely examples and other heating temperature set points may be used. Such a pair of heating temperature set points and control of the thermoelectric modules 170 via pulse width modulation duty cycle may be used as part of process 200 at blocks 240 and 250 of Figure 5 or process 300 at blocks 360 and 370 of Figure 6.
[0059] The foregoing description of embodiments of the present invention have been presented for purposes of illustration and description. It is not intended to be exhaustive or to limit the present invention to the precise form disclosed, and modifications and variations are possible in light of the above teachings or may be acquired from practice of the present invention. The embodiments were chosen and described to explain the principles of the present invention and its practical application to enable one skilled in the art to utilize the present invention in various embodiments and with various modifications as are suited to the particular use contemplated.

Claims

WHAT IS CLAIMED IS:
1. A kiosk apparatus with a temperature control system, comprising:
a kiosk body having an interior, the interior of the kiosk body sized and configured to receive a display device therein;
a thermoelectric module having a first portion and a second portion, the first portion positioned within the interior of the kiosk body, and the second portion coupled to a portion of the kiosk body exposed to an external environment; and
a thermal controller electrically coupled to the thermoelectric module and operable to control heating or cooling of the first portion of the thermoelectric module.
2. The kiosk apparatus of claim 1, wherein the thermoelectric module comprises a Peltier thermoelectric module.
3. The kiosk apparatus of any one of the preceding claims, further comprising a temperature sensor provided within the kiosk body and configured to detect a temperature within the interior, wherein the temperature sensor is electrically coupled to the thermal controller, such that the thermal controller receives a temperature output from the temperature sensor that is indicative of the detected temperature and controls the heating or cooling based on the temperature output.
4. The kiosk apparatus of any one of the preceding claims, further comprising a humidity sensor provided within the kiosk body and configured to detect a humidity within the interior, wherein the humidity sensor is electrically coupled to the thermal controller, such that the thermal controller receives a humidity output from the humidity sensor that is indicative of the detected humidity and controls the heating or cooling based on the humidity output.
5. The kiosk apparatus of claim 3 or claim 4, wherein the temperature output or the humidity output is a voltage value that corresponds to the detected temperature or the detected humidity.
6. The kiosk apparatus of any one of the preceding claims, further comprising a heat sink including a plurality of fins configured to dissipate heat via convention across the plurality of fins, wherein the heat sink is coupled to one of the first and second portions of the thermoelectric module.
7. The kiosk apparatus of claim 6, wherein the heat sink is coupled to the second portion of the thermoelectric module via a thermally conductive adhesive interposed between the second portion and the heat sink.
8. The kiosk apparatus of any one of the preceding claims, further comprising a power source provided within the kiosk body and configured to supply electric power to the thermal controller.
9. The kiosk apparatus of claim 8, wherein the thermoelectric module is provided between the power source and the kiosk body, such that the thermoelectric module may actively cool the power source.
10. The kiosk apparatus of claim 8, further comprising an H-bridge electrically coupled to the thermoelectric module, thermal controller, and the power source, wherein the thermal controller may control current flow through the thermoelectric module using the H-bridge, such that when current flows in a first direction the first portion of the thermoelectric module is cooled and the second portion of the thermoelectric module is heated and when current flows in a second direction the first portion is heated and the second portion is cooled.
1 1. The kiosk apparatus of any one of the preceding claims, further comprising a pulse width modulator, wherein the thermal controller controls a duty cycle of the pulse width modulator to vary the level of heating or cooling provided by the thermoelectric module up to and including 100% duty cycle, wherein when the duty cycle reaches 100%, then the maximum current is applied.
12. The kiosk apparatus of any one of the preceding claims, further comprising a fan electrically coupled to both the power source and the thermal controller, wherein the fan is provided within the kiosk body at a location proximate to the thermoelectric module to increase convective heat transfer from one of the first and second portions of the thermoelectric module.
13. The kiosk apparatus of any one of the preceding claims, wherein the kiosk body includes a recess that receives at least a portion of the second portion of the thermoelectric module, such that the second portion is at least partially embedded in the kiosk body.
14. The kiosk apparatus of any one of the preceding claims, wherein the kiosk body is constructed to resist ingress of liquid into the interior.
15. The kiosk apparatus of any one of the preceding claims, wherein the kiosk apparatus is one of an outdoor kiosk, a vending machine, and a gas station pump.
PCT/US2015/015025 2014-02-11 2015-02-09 Kiosk apparatus with temperature control system WO2015123142A1 (en)

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US9823690B2 (en) 2015-09-11 2017-11-21 Civiq Smartscapes, Llc Techniques and apparatus for securing a structure to a support
US9622392B1 (en) 2015-09-17 2017-04-11 Civiq Smartscapes, Llc Techniques and apparatus for controlling the temperature of a personal communication structure (PCS)
US9703320B2 (en) 2015-09-17 2017-07-11 Civiq Smartscapes, Llc Techniques and apparatus for mounting a housing on a personal communication structure (PCS)
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CN115240321A (en) * 2022-06-22 2022-10-25 益逻触控系统公司 Self-service terminal with temperature adjusting assembly and operation method thereof

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