JP2010014957A - Image display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a technology for actively utilizing a support essential for installing an image display device as a cooling member and radiating heat efficiently in the image display device reduced in thickness. <P>SOLUTION: This image display device is arranged in contact with a heat generating part 10 composed of a PDP (Plasma Display Panel) 1 as a display panel, a chassis 2, and a circuit board 3, is extended to the outside of a case body 5, and has the support 7 connected with a pedestal part 8 and supporting the case body 5. When quantity of heat to be radiated through the support 7 is Q<SB>s</SB>at least at a certain time during operation, the following relationship, Q<SB>s</SB>≥29W, is satisfied. Alternatively, when electric power consumption of the image display device is P<SB>c</SB>, the following relationship, Q<SB>s</SB>≥P<SB>c</SB>×0.07, is satisfied. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an image display device, and more particularly to a technique for improving the heat dissipation efficiency of an image display device.

  The image display device includes a display panel that displays an image by emission light control for each pixel, a circuit board on which a control circuit and a power supply circuit that perform emission light control are mounted, and a column that supports the display panel and the circuit board. . Here, a plasma display device will be described as an example of an image display device. However, a liquid crystal display device, a field emission display, and an organic EL have the same problems as described below.

  Since the plasma display device displays an image using plasma discharge, a display panel (plasma display panel, hereinafter referred to as PDP) is likely to have a high temperature. Furthermore, since many electronic components generating large amounts of heat are used in the control circuit and the power supply circuit, the circuit board on which these components are mounted is likely to be hot. In addition, since many electronic components that generate large amounts of heat are used in the control circuit and the power supply circuit, the circuit board on which these components are mounted tends to be hot. Therefore, the image display device provided with the display panel and the circuit board becomes high temperature. Therefore, various heat dissipation measures are taken in the plasma display device.

Japanese Patent Laid-Open No. 2006-227513 (Patent Document 1) discloses that an electronic component on a circuit board is individually mounted on a support via a heat sink in a plasma display device, and the support extends from the inside of the housing to the outside. There is disclosed a technique for efficiently releasing heat generated from an electronic component to the outside of the housing.
JP 2006-227513 A

  The present inventors have studied a technique for thinning the plasma display device. The challenge in reducing the thickness is that the space in the housing is reduced, so the installation location of members (radiation fins, cooling fans, etc.) for improving the cooling efficiency is reduced or impossible to install. Is a decrease.

  FIG. 1 is a side perspective view of a plasma display device 50 examined by the present inventors, and is a diagram for explaining a problem in reducing the thickness. As shown in FIG. 1, the plasma display device 50 disposed on the floor 9 includes a PDP 1, a chassis 2, a circuit board 3, a housing 5, a pedestal portion 8, and a column 7.

  The PDP 1 is composed of a pair of flat substrates facing each other. The display surface (main surface for displaying an image) has a toned image, near infrared rays, other electromagnetic waves, and a display surface. A glass filter 4 is disposed for preventing reflection of outside light. The chassis 2 is disposed in contact with the PDP 1 along the back surface opposite to the display surface of the PDP 1. The circuit board 3 is disposed on the opposite side of the chassis 2 from the PDP 1 and is equipped with a control circuit and a power supply circuit that control the emitted light (emitted light control) from each of the plurality of pixels of the PDP 1. The PDP 1, the chassis 2, and the circuit board 3 constitute a heat generating portion 10 in the plasma display device 50.

  The housing 5 accommodates the PDP 1, the chassis 2 and the circuit board 3, and the pedestal portion 8 is installed on the floor 9 (fixed portion). The thickness of the housing 5 in the direction perpendicular to the PDP 1 is, for example, 8 to 10 cm. The support column 7 is disposed so as to be in contact with the heat generating portion 10, extends to the outside of the housing 5, is connected to the pedestal portion 8, and supports and connects the housing 5.

  In the plasma display device 50, in order to suppress the temperature rise, a heat radiating fin (not shown) and a ventilation hole (not shown) are provided in the housing 5, and a cooling fan 6 is installed in the vicinity of the ventilation hole, and a display panel is provided. In addition, the air heated by the heat generated in the circuit board is discharged from the ventilation hole to the outside of the housing 5 by the cooling fan 6.

  For this reason, when the plasma display device 50 is thinned in the direction perpendicular to the plane of the PDP 1 (the right and left directions in FIG. 1), the space in the housing 5 is reduced. The installation location of the fins, the cooling fan 6 and the like) is reduced or cannot be installed, so that the heat radiation efficiency is lowered.

  The objective of this invention is providing the technique which improves the thermal radiation efficiency of an image display apparatus.

  Another object of the present invention is to provide a technique capable of reducing the thickness of an image display device.

  The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

  Of the inventions disclosed in the present application, the outline of typical ones will be briefly described as follows.

  The present invention provides the following image display apparatus. A plurality of pixels are arranged, a display panel that displays an image from the main surface by controlling the emitted light for each pixel, a chassis that is arranged in contact with the display panel along the back surface of the display panel, And a circuit board on which a control circuit for controlling the emitted light and a power supply circuit are mounted, which are arranged in a direction opposite to the display panel of the chassis. Further, the housing that houses the display panel, the chassis, and the circuit board, the pedestal that can be installed on a fixed part such as a floor, a wall, and a ceiling, and the heat generating part that includes the display panel, the chassis, and the circuit board. And a column that extends to the outside of the casing, is connected to the pedestal portion, and supports the casing.

In the present invention, a support column, which is essential for installing the image display device, is actively used as a cooling member. That is, at least at a certain point in time during the operation of the image display device, the amount of heat dissipated through the support column is Q _s, and Q _s ≧ 29 [W]. In other words, the power consumption of the image display device is P _c, and Q _s ≧ P _c × 0.07.

  Among the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows.

  According to this embodiment, the heat dissipation efficiency of the image display device can be improved. In addition, the image display device can be thinned.

  In the following embodiments, when it is necessary for the sake of convenience, the description will be divided into a plurality of sections or embodiments. However, unless otherwise specified, they are not irrelevant to each other. There are some or all of the modifications, details, supplementary explanations, and the like.

  In all the drawings for explaining the present embodiment, components having the same function are denoted by the same reference numerals in principle, and repeated description thereof is omitted. Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings, taking a plasma display device as an example.

(Embodiment 1)
2 is an explanatory view showing the configuration of the plasma display device 100, FIG. 3 is a plan view schematically showing the PDP 1 provided in the plasma display device 100 of FIG. 2, and FIG. 4 is a schematic view of the PDP 1 of FIG. It is a disassembled perspective view shown.

  As shown in FIG. 3, an AC (alternating current) type PDP 1 that is a display panel is formed by combining structures of a front substrate 11 and a back substrate 12. A space between the front substrate 11 and the rear substrate 12 is sealed by a panel sealing portion 13 disposed in the peripheral portion of the panel. A display area 14 located inside the panel sealing portion 13 is an area in which an image corresponding to an address / display cell matrix constituted by various electrode groups is displayed. An area for electrical connection between the terminals of the electrode group and the external control circuit side is provided outside the panel sealing portion 13. The PDP 1 is further fixedly held with respect to the chassis arranged on the back side thereof, and a circuit board on which a control circuit and the like arranged on the back side of the chassis are mounted and terminals of the electrode group of the PDP 1 are connected. A plasma display device is formed.

  As shown in FIG. 4, the front substrate 11 and the rear substrate 12 are arranged to face each other with a space therebetween, and a space sandwiched between the two substrates becomes a discharge space. In the front substrate 11, a plurality of display electrode (sustain electrode) pairs X electrodes 16 A and 16 B and Y electrodes 17 A and 17 B are formed on the discharge space side relative to the front glass substrate 15, and these X electrodes 16 A and 16 B are formed. The Y electrodes 17A and 17B are further covered with a dielectric layer 18, a protective layer 19, and the like. On the back substrate 12 side, a plurality of address electrodes 21 used for an address operation are formed relatively on the discharge space side of the back glass substrate 20, and the plurality of address electrodes 21 are further covered with a dielectric layer 22 or the like. ing. Furthermore, on the surface of the rear substrate 12 on the discharge space side, structures such as partition walls 23 that divide the discharge space and phosphor layers 24 formed between the partition walls 23 are formed.

  The AC type PDP 1 is the most practically used system because of its simple structure and high reliability, and a display electrode pair (a pair of X electrodes 16A for generating a display discharge on the front substrate 11). , 16B and Y electrodes 17A, 17B) are arranged in parallel, and address electrodes 21 are arranged on the back substrate 12 so as to intersect with them, and a plurality of display cells (discharge cells), that is, a plurality of pixels are arranged in a matrix. It has the structure arranged in.

  As shown in FIG. 2, the plasma display apparatus 100 includes a PDP 1 having address electrodes 21, Y electrodes 17A and 17B as one display electrode, and X electrodes 16A and 16B as other display electrodes. The plasma display apparatus 100 further drives an address driving circuit 101 for driving the address electrodes 21, a sustain / scanning pulse output circuit 102 for driving the Y electrodes 17A and 17B, and the X electrodes 16A and 16B. A sustain pulse output circuit 103, a drive control circuit 104 for controlling these output circuits, a signal processing circuit 105 for processing input signals, and a power supply circuit 106 for supplying power to these circuits are provided.

  Such a plasma display device 100 supplies a video signal to the drive control circuit 104, and the PDP 1 receives signals from various circuits to control the emitted light for each pixel, and on the main surface (front substrate 11) side. An image is displayed from the display area 14.

  In the plasma display apparatus 100, a PDP 1 electrode and a flexible substrate are joined by an anisotropic conductive film, and a chassis such as aluminum is attached to improve the heat dissipation of the PDP 1, and the emitted light is controlled on the chassis. And a circuit board on which the circuit for performing the power supply and the power supply circuit are mounted are assembled.

  FIG. 5 is a side perspective view schematically showing the plasma display device 100 according to the present embodiment. As shown in FIG. 5, the plasma display device 100 disposed on the floor 9 as a fixed portion includes a PDP 1, a chassis 2, a circuit board 3, a housing 5, a support column 7, and a pedestal portion 8. I have.

  As described above, the PDP 1 that is a display panel has a plurality of pixels arranged in a matrix and displays an image from the main surface (first surface) that is the display surface by controlling the emitted light for each of the plurality of pixels. Is. The chassis 2 is disposed in contact with the PDP 1 along a back surface (second surface) opposite to the main surface of the PDP 1. The circuit board 3 is disposed on a surface (fourth surface) opposite to the surface (third surface) on the side in contact with the PDP 1, and as a control circuit for controlling the emitted light, for example, a drive control circuit 104 and its power supply circuit 106 (see FIG. 2) is mounted. These PDP 1, chassis 2, and circuit board 3 constitute a heat generating portion 10 in the plasma display device 100.

  Further, the housing 5 accommodates the PDP 1, the chassis 2, and the circuit board 3. The support column 7 is connected to the housing 5 and extends to the outside of the housing 5. The pedestal portion 8 is connected to the column 7.

  Thus, for example, the chassis 2 that is a plate-like member is bonded to the back surface of the PDP 1 with a heat conductive adhesive or the like. Examples of the chassis 2 include metals such as aluminum, and examples of the thermally conductive adhesive that bonds the PDP 1 and the chassis 2 include silicon paste. A circuit board 3 provided on the rear surface of the chassis 2 is mounted with a plurality of electronic components constituting a control circuit and a power supply circuit for performing emission light control for each pixel of the PDP 1. The PDP 1 (excluding the main surface (image display surface)), the chassis 2, and the circuit board 3 are covered with a housing 5. The housing 5 may be provided with a vent hole (not shown) so that heat generated from the heat generating part 10 including the internal PDP 1 and the circuit board 3 can be exhausted.

  As described above, the support column 7 is arranged so as to be in contact with the heat generating unit 10 including the display panel 1, the chassis 2, and the circuit board 3. The support column 7 and the heat generating part 10 are in contact with each other through a heat conductive adhesive or brazing (for example, containing silver).

  In the present embodiment, the support column 7 that is essential for installing the plasma display device 100 is actively used as a cooling member. As a result, in the plasma display device 100 that is an image display device, heat generated from the PDP 1 that is the display panel and the circuit board 3 can be efficiently radiated, and a cooling member such as a fan is not required. (The thickness of the casing 5 in the direction perpendicular to the main surface of the PDP 1 is 35 mm or less) and noise reduction. Further, the temperature can be lowered and display defects can be reduced. Further, the number of cooling members such as fans can be reduced, and the cost can be reduced.

  FIG. 6 is a perspective view schematically showing the support column 7 included in the plasma display device 100 of FIG. As shown in FIG. 6, the support column 7 is constituted by a main body portion having a U-shaped cross section and three leg portions of a prism. This support | pillar 7 is comprised from materials with high heat conductivity, such as aluminum, copper, magnesium, iron, or brass, for example. The prism that is the foot of the column 7 has, for example, a width in the y direction of 10 cm, a depth in the z direction of 1 cm, and a length in the x direction of 20 cm. In this embodiment, the support column 7 has a shape as shown in FIG. 6, but not limited to this, as long as the support column 7 is arranged so as to be in contact with the heating unit 10 including the PDP 1, the chassis 2, and the circuit board 3. good.

  As shown in FIG. 5, the main body of the column 7 is arranged so that the circuit board 3 is wrapped. In other words, the support column 7 covers the circuit board 3. In this way, the support column 7 enclosing the circuit board 3 is arranged so as to contact the surface opposite to the surface of the chassis 2 on the side in contact with the PDP 1. Thereby, in the plasma display apparatus 100 which is an image display apparatus, the heat generated from the PDP 1 and the circuit board 3 which are display panels can be efficiently radiated. Furthermore, fins 31 (or uneven portions) are arranged on the support post 7 shown in FIG. 6, and the heat generated from the heat generating portion 10 can be radiated more efficiently.

  Thus, in the plasma display device 100, the support column 7 is in good thermal contact with the chassis 2 and the circuit board 3. The support column 7 extends from the inside of the housing 5 to the outside, and is connected to the pedestal portion 8 below the housing 5. Further, the pedestal portion 8 is installed on the floor 9 which is a fixed portion. A part of the column 7 is connected to the chassis 2 by screwing or the like. As a result, the column 7 functions to support the PDP 1 via the chassis 2. Adhesion between the support surface of the support column 7 and the heat generating portion 10 and the support column 7 and the pedestal portion 8 is enhanced by a heat conductive elastic body. Are the same temperature.

  In the case of a liquid crystal display device as the image display device, the heat generating portion corresponding to the heat generating portion 10 in FIG. 5 is configured from a backlight and a circuit board, and the display panel corresponding to PDP 1 is configured from a unit including a liquid crystal panel and a backlight. Is done. Therefore, also in the liquid crystal display device, a good thermal contact is configured between the supporting column, the backlight, and the circuit board.

  In the case of a field emission display or an organic EL (LED) display, the circuit board mainly serves as a heat generating portion, and the display panel is composed of a field emission display, an organic EL, or an organic LED. Therefore, also in the field emission display and the organic EL, a good thermal contact is configured between the support and the circuit board constituting them.

(Embodiment 2)
FIG. 7 is a side perspective view schematically showing the plasma display device 200 in the present embodiment. As shown in FIG. 7, on the display surface (main surface on which an image is displayed) of the PDP 1 provided in the plasma display device 200, the toned color of the display image, near infrared rays, other electromagnetic waves are suppressed, and external light is reflected on the display surface. A glass filter 4 is disposed for prevention or the like. Except for the provision of the glass filter 4, the configuration is the same as that shown in the plasma display device 100 of the first embodiment.

First, in the image display device provided with a strut, at least some time during the operation of the apparatus, the heat quantity Q _s is radiated through the post, will be described with reference to a plasma display device 200. This amount of heat Q _s [W] is defined by equation (1).

Q _s = κ · (A _s / l) · (T ₁ −T ₀ ) (1)
κ: Thermal conductivity of support material [W / (m · K)]
A _s: cross-sectional area of the column ^[m 2]
l: Length of column [m]
T ₁ : Temperature of the support column end (heat generating part side) [° C.]
T ₀ : Temperature of the end of the column (the pedestal side) [° C.]
Here, the length of the support column 7 is not necessarily the length of the support column in the longitudinal direction, but indicates the length in the direction in which the amount of heat moves from the heating unit toward the pedestal unit, and the column end (heating unit side) And the distance between the column end (the pedestal side). Hereinafter, this direction is referred to as a connection direction. The column end portion (heat generating portion side) is a point closest to the pedestal portion 8 along the connection direction in the region where the column 7 and the heat generating portion are connected. Similarly, the column end portion (the pedestal portion side) is a point closest to the heat generating portion along the connection direction in the region where the column 7 and the pedestal portion 8 are connected. And the cross-sectional area of the support | pillar 7 is an area of a surface perpendicular | vertical to a connection direction.

Further, the temperatures T ₁ and T ₀ at the end of the column are measured using a voltmeter or a thermometer with a thermocouple fixed to the column end with an adhesive tape or the like. Q _s can be calculated using the above formula (1) from T ₁ , T ₀ measured by the above method, the shape (length, cross-sectional area) of the column 7 and the thermal conductivity of the column material.

Moreover, it is not always necessary to measure the temperature at both ends of the support for the measurement of the amount of heat. The coordinate of the connection direction of the support column is x, and the heat quantity Q _s [W] passing through the cross section at a certain position x is defined by the equation (2).

Q _s = κ · A _s (x) · (dT (x) / dx) (2)
κ: Thermal conductivity of support material [W / (m · K)]
A _s (x): the cross-sectional area of the column at the position x [m ² ]
T (x): the temperature of the column at position x [° C.]
dT (x) / dx: temperature gradient at position x [K / m]
The amount of heat Q _s can be calculated by measuring the temperature T (x) at the position x on the support column by the above method and calculating the temperature gradient from the equation (2).

Next, the range of the heat quantity Q _s radiated through the support column 7 will be described. An index that is important in determining the heat radiation amount Q _s is the surface temperature T _cf of the image display surface. From the viewpoint of safety, an upper limit value is set for the surface temperature. In the JIS standard, the upper limit value is defined by the temperature rise from the device operating temperature, and the temperature rise limit is 55 ° C. However, when used at an ambient temperature of 30 ° C., the upper limit is 85 ° C., and consideration of the usage environment may be desired. In a normal environment, 65 ° C. is appropriate as the upper limit of the surface temperature, and 60 ° C. is more preferable. Therefore, in the present embodiment, the Q _s range is such that T _cf is 65 ° C. or lower, more preferably 60 ° C. or lower.

In order to define the range of Q _s , a model as shown in FIG. 8 can be established, and the heat release amount and temperature from each part can be calculated. In the model of FIG. 8, only the heat conduction in the direction perpendicular to the display surface is considered, and each temperature is uniform in the surface. Further, the heat generating part 10 is composed of the PDP 1 and the circuit board 3.

A calculation formula for calculating Q _{s at} which T _cf in a steady state where the power consumption P _c and the heat radiation amount Q _p of the plasma display device 200 as an image display device are balanced is 65 ° C. and 60 ° C. is shown below.

First, the heat radiation amount Q _f from the front side of the plasma display apparatus 200 which is a main surface side of PDP1 can be determined from the following equation.

The amount of heat released by radiation from the image display surface (the surface of the glass filter 4) to the ambient air 26 is defined as _Qr2 .

Q _r2 = h _r2 · A _panel · (T _cf −T _∞ ) (3)
A _panel : Area of heat generating part 10 (area of glass filter 4 and air layer 25) [m ² ]
T _cf : surface temperature on the display surface side [K]
T _∞ : temperature of ambient air 26 [K]
h _r2 : Heat transfer coefficient [W / (m ² · K)] corresponding to radiation from the glass filter 4 to the ambient air 26
The amount of heat released by convection from the image display surface (the surface of the glass filter 4) to the ambient air 26 is defined as _Qcf .

Q _cf = h _cn — _f · A _panel · (T _cf −T _∞ ) (4)
h _{cn — f} : Heat transfer coefficient during natural convection (display surface side) [W / (m ² · K)]
Further, the amount of heat conducted through the glass filter 4 is defined as _{Qc_glass} .

Q _{c_glass} = κ _glass · (A _panel / d _glass ) · (T _f −T _cf ) (5)
d _glass : thickness of the glass filter 4 [m ² ]
T _f : temperature [K] of the glass filter 4 on the heat generating part 10 side
κ _glass : thermal conductivity of glass [W / (m · K)]
Further, the amount of heat that moves through the air layer 25 by heat conduction is _defined as Q _{c_air} .

_{Q c_air = κ air · (A} panel / d air) · (T p -T f) (6)
d _air : thickness of air layer 25 [m]
T _p : temperature of the heating unit 10 [K]
κ _air : thermal conductivity of air [W / (m · K)]
Further, the amount of heat transferred from the surface of the heat generating portion 10 to the glass filter 4 by radiation is defined as Q _r1 .

Q _r1 = h _r1 · A _panel · (T _p −T _f ) (7)
h _r1 : heat transfer coefficient [W / (m ² · K)] corresponding to radiation from the heat generating portion 10 to the glass filter 4
_{Q f = Q c_air + Q r1} = Q c_glass = Q cf + Q r2 (8)
Then, the heat radiation amount Q _b from the rear side opposite to the plasma display apparatus 200 and the main surface of PDP1 can be determined from the following equation.

The amount of heat that moves from the heat generating part 10 to the housing 5 by radiation is _{defined as Qr3} .

Q _r3 = h _r3 · A _panel · (T _p −T _cb ) (9)
T _cb : Rear side housing surface temperature [K]
h _r3 : heat transfer coefficient [W / (m ² · K)] corresponding to radiation from the heat generating portion 10 to the housing 5
Further, the amount of heat released into the housing 5 by convection from the heat generating part 10 is defined as Q _cb1 .

Q _cb1 = h _cn — _b1 · A _panel · (T _p −T _cb ) (10)
h _{cn — b1} : Heat transfer coefficient during natural convection (inside of rear case) [W / (m ² · K)]
Further, the amount of heat released to the ambient air 26 due to radiation from the housing 5 is defined as _Qr4 .

Q _r4 = h _r4 · A _panel · (T _cb −T _∞ ) (11)
h _r4 : heat transfer coefficient [W / (m ² · K)] corresponding to radiation of ambient air 26 from the housing 5
Further, the amount of heat released to the surrounding air 26 by convection from the housing 5 is defined as Qcb2.

Q _cb2 = h _cn — _b2 · A _panel · (T _cb −T _∞ ) (12)
h _{cn — b2} : Heat transfer coefficient during natural convection (outside of the back side housing) [W / (m ² · K)]
Q _b = Q _r3 + Q _cb1 = Q _cb2 + Q _r4 (13)
Accordingly, the heat radiation amount Q _p from the entire plasma display apparatus 200 is an image display device becomes the following equation.

_{Q p = Q f + Q b} + Q s (14)
In addition, when a cooling fan is used, the exhaust heat coefficient (k) by a cooling fan is considered.

Using equations (3) to (14), it is possible to calculate the heat radiation amount Q _{s at} which T _cf in a steady state where the power consumption P _c and the heat radiation amount Qp balance in the image display device is 65 ° C. and 60 ° C. . In calculating the heat radiation amount Q _s , A _panel can be 0.78 m ² , d _glass can be 0.003 m, and d _air can be 0.003 m, for example.

First, before calculating the heat release amount Q _s of the plasma display apparatus 200 of the present embodiment, as a reference to calculate the heat radiation amount Q _s of the plasma display device 300 shown in FIG. FIG. 9 is a side perspective view of the plasma display device 300 examined by the present inventors, and shows a state in which the cooling fan installed in the plasma display device 50 of FIG. Yes. That is, the casing 5 of the plasma display device 300 has the same thickness (for example, 10 cm) as that of FIG. Hereinafter, a configuration in which no cooling fan is installed like the plasma display device 300 is referred to as a fanless image display device.

According to the model of FIG. 8, the amount of heat radiation was calculated and the temperature of each part was calculated. As a result, when the power consumption P _c = 400 W, the surface temperature T _cf = 67 ° C. on the display surface side of the image display device is higher than the upper limit value. Become. _Therefore, the heat radiation amount _{Q s} for a _{T cf} below the upper limit value _Q s = 26W in _T cf = 65 ° C., the temperature difference ΔT of the strut ends at that time is 52 ° C.. Further, at T _cf = 60 ° C., Q _s = 91 W, and the temperature difference ΔT between both ends of the column at that time is 45 ° C. The power consumption P _c = 400 W is applied from the power consumption of a general 50-inch Full-HD plasma display device.

Next, the heat radiation amount Q _s in the plasma display apparatus 200 in the present embodiment is calculated. The plasma display device 200 is obtained by reducing the thickness of the housing 5 in addition to the fanless configuration, and the thickness of the housing 5 is, for example, 35 mm. For this reason, the volume in the housing 5 is reduced as the housing 5 is thinned. The surface area of the heat dissipating fin is reduced, and air convection in the housing 5 is less likely to occur. These effects are reflected in the heat transfer coefficient h _{cn — b1} and set to 0.8 times that of the plasma display device 300.

As a result of calculation using such parameters, when the power consumption P _c = 400 W, the surface temperature T _cf on the display surface side of the image display device is 67 ° C., which is higher than the upper limit value. _Therefore, the heat radiation amount _{Q s} for a _{T cf} below the upper limit value _Q s = 29W in _T cf = 65 ° C., the temperature difference ΔT of the strut ends at that time is 52 ° C.. Further, at T _cf = 60 ° C., Q _s = 94 W, and the temperature difference ΔT between both ends of the column at that time is 45 ° C.

The above results are shown in FIG. FIG. 10 is a table summarizing the results of calorific value calculation in the fanless type plasma display apparatus 300 and the fanless type and thin case plasma display apparatus 200. Heat Q _s is preferably at least 29W is radiated through the support column 7 when thinner than a result, more than 94W is more preferable.

Further, the amount of heat generated in the image display device substantially matches the power consumption of the image display device. Therefore, power consumption changes depending on the screen size and display state. Accordingly, since the amount of heat Q _s is radiated through the support column 7 should also changes in response to the power, if the power consumption of the image display apparatus was P _c, ratio of the power consumption P _c (Q _s / P _c ) is preferably 0.07 or more, and more preferably 0.24 or more. Note that the power consumption _Pc of the image display device can be measured using a power meter.

Further, the material of the column 7 can be selected from the amount of heat Q _{s radiated} through the column 7. When the cross-sectional area A _s = 0.003 m ² and the length l = 0.2 m of the support column 7 and the temperature difference between both ends of the support column 7 is 30 K, the thermal conductivity of the support material is calculated using Equation (1). Calculated as a parameter. FIG. 11 shows a plot of the amount of heat Q _s moving in the column with respect to the thermal conductivity κ. Thermal conductivity kappa required from 11 in the _{Q s} ≧ 29W is κ ≧ 65W / (m · K ), the _{Q s ≧ 94W κ ≧ 208W /} (m · K).

Therefore, in the case where the amount of heat Q _s ≧ 29 W radiated from the support column 7, for example, copper (κ = 395 W / (m · K)), aluminum (κ = 240 W / (m · K)), magnesium (κ) = 154 W / (m · K)), brass (κ = 128 W / (m · K)), iron (κ = 72 W / (m · K)), and the like. Further, in the case where the amount of heat radiated from the support 7 is Q _S ≧ 94 W, examples of the support material include copper and aluminum. Thus, as the raw material of the support | pillar 7, the material which has the metal / alloys mentioned in the example and the thermal conductivity of said range is preferable.

Further, the shape of the strut 7 is cross-sectional area A _s is wider than the formula (1), length l is preferably and more shorter heat dissipation. In consideration of the heat radiation from the column 7 and the thermal conductivity of the column material, it is preferable that A _s /l≧0.0025. Furthermore, it is preferable that A _s ≧ 0.00025 m ^{2 when} the length of the support is standard. However, the shape of the column 7 in contact with the heat generating portion 10 is arbitrary, for example, a shape that covers the chassis 2 broadly, a shape that is combined with heat dissipation fins of electronic components on the circuit board 3, etc. A shape that efficiently collects the amount of heat generated from the electronic components on the PDP and the circuit board may be used.

  Furthermore, as shown in FIG. 12, a cooling member 27 such as a heat pipe having a high heat transport capability or a self-excited vibration heat pipe may be incorporated in the support column 7. In addition, a heat flow capacity may be increased by introducing a flow path for circulating the cooling water inside the column 7 and the pedestal portion 8 and a power source for circulating the cooling water in one direction of the flow path.

Next, a case where a copper support is used as an example of the image display device will be described. The 50-inch Full-HD plasma display device 200, which is an image display device, is configured to be fanless as shown in FIG. 7 and the thickness of the housing 5 is reduced (for example, 35 mm). However, the glass filter 4 is employ | adopted regarding the filter. The shape of the strut 7 is installed width 10 cm, depth 1 cm, the prism of length 0.2 m 3 present (cross-sectional area _A s: 0.003 m ^2, the length l: 0.2 m).

  The support column 7 has a good thermal connection with the circuit board 3 on which the chassis 2 and the heat dissipating component of the electronic component are mounted. Moreover, the support | pillar 7 is connected also with the base part 8 via a heat conductive adhesive, an elastic body, etc., and the temperature of a connection part is the same.

The measurement of the surface temperature _Tcf of the display surface is performed under the following conditions. The ambient temperature at the time of measurement is 30 ° C., a thermocouple is fixed to the surface of the image display surface with an adhesive tape or the like, and the temperature is measured with a voltmeter or a thermometer. As shown in FIG. 13, with respect to the center of the image display surface as shown in FIG. 13, a total of 5 points are measured in the horizontal direction (left-right direction) and the vertical direction (up-down direction), and the average value of the five points is calculated as T _cf It is defined as Note that the vertical direction is the measurement point 10 cm inside from the edge of the display area 14, and the horizontal direction is the measurement point 15 cm inside.

When the power consumption P _c = 400 W in the configuration as described above, the display surface side surface temperature T _cf of the plasma display device 200 was 52 ° C. The temperature at both ends of the column at that time is 62 ° C. on the PDP side (T ₁ ) and 30 ° C. on the pedestal side (T ₀ ), the temperature difference ΔT between both ends of the column is 32 ° C., and the temperature gradient dT / dx is 160 K / m. It becomes. When calculated using the formula (1) or (2), the amount of heat Q _s transported through the support column is 191 W. Thus, by performing heat dissipation through the support column, the surface temperature of the display surface can be made to be the upper limit (60 ° C.) or less.

  In the present embodiment, the support column 7 that is indispensable for installing the plasma display device 200 is actively used as a cooling member. Thereby, in the plasma display device 200 as the image display device, heat generated from the PDP 1 as the display panel and the circuit board 3 can be efficiently dissipated, and the plasma display device 200 can be thinned (a casing in a direction perpendicular to the main surface of the PDP 1). 5 is 35 mm or less).

(Embodiment 3)
In the second embodiment, the case where the glass filter 4 is used for the display surface of the PDP 1 of the plasma display device 200 has been described. However, in the present embodiment, a directly attached filter (film filter) is used instead of the glass filter 4. Will be described. Since other configurations are the same as those of the second embodiment, description thereof is omitted.

  The direct attachment filter is composed of a base filter and a functional film. Furthermore, the base filter is composed of, for example, a hard coat layer and an antireflection layer. Moreover, the functional film is comprised from the adhesion layer containing an electromagnetic wave shielding layer, a near-infrared absorption layer, an antireflection layer, and a pigment | dye, for example.

First, before calculating the heat radiation amount Q _s in the plasma display device according to the present embodiment, as a reference, the heat radiation amount Q when a directly attached filter is used instead of the glass filter 4 of the plasma display device 300 shown in FIG. _s is calculated. The plasma display device (image display device) having this configuration is not necessarily thinned, but has been studied because it has a great advantage in terms of image quality such as a reduction in reflection and is likely to be adopted in the future.

When the directly attached filter is used, when the glass filter 4 is omitted, the glass filter 4 and the air layer 25 are not present in the model of FIG. 8, and the temperature T _p of the heat generating portion 10 is equal to the surface temperature T _cf on the display surface side. Become. Furthermore, since radiation from the surface of the heat generating part 10 is not the glass filter 4 but the ambient air 26, hr1 changes. Further, heat radiation by natural convection occurs on the surface of the heat generating portion 10.

As a result of calculation using the above parameters, when the power consumption P _c = 400 W, the surface temperature T _cf on the display surface side of the image display device was 73 ° C., which was higher than the upper limit value. Heat radiation amount to the T _cf below the upper limit value _{Q s} is _Q s = 87W in _T cf = 65 ℃, the temperature difference ΔT of the strut ends at that time is 35 ° C.. Further, at T _cf = 60 ° C., Q _s = 139 W, and the temperature difference ΔT between both ends of the column at that time is 30 ° C. Note that the power consumption P _c = 400 W is applied from the power consumption of a general 50-inch Full-HD plasma display device.

Next, the heat dissipation amount Q _s in the plasma display device in the present embodiment is calculated. This plasma display device uses a directly attached filter and is formed by thinning the housing 5 in addition to fanless, and the thickness of the housing 5 is, for example, 35 mm. For this reason, the volume in the housing 5 is reduced as the housing 5 is thinned. The surface area of the heat dissipating fin is reduced, and air convection in the housing 5 is less likely to occur. These effects are reflected in the heat transfer coefficient h _{cn — b1} and set to 0.8 times that of the plasma display device 300.

As the configuration that can be made the thinnest, the calculation was performed for an image display device that incorporates all the elements studied above shown in FIG. When the power consumption P _c = 400 W, the surface temperature T _cf on the display surface side of the image display device is 75 ° C., which is higher than the upper limit value. Heat radiation amount to the T _cf below the upper limit value _{Q s} is _Q s = 105W In _T cf = 65 ℃, the temperature difference ΔT of the strut ends at that time is 35 ° C.. Further, at T _cf = 60 ° C., Q _s = 155 W, and the temperature difference ΔT between both ends of the column at that time is 30 ° C.

The above results are shown in FIG. FIG. 14 is a table summarizing the results of calorific value calculations in the direct-attached filter type plasma display device and the direct-attached filter, fanless type, and thin case plasma display device. As a result, when the thickness is made thinner, the amount of heat Q _s dissipated through the support column 7 is preferably 105 W or more, and more preferably 155 W or more.

Further, the amount of heat generated in the image display device substantially matches the power consumption of the image display device. Therefore, power consumption changes depending on the screen size and display state. Accordingly, since the amount of heat Q _s is radiated through the support column 7 should also changes in response to the power, if the power consumption of the image display apparatus was P _c, ratio of the power consumption P _c (Q _s / P _c ) is preferably 0.26 or more, and more preferably 0.39 or more. Note that the power consumption _Pc of the image display device can be measured using a power meter.

Further, the material of the column 7 can be selected from the amount of heat Q _{s radiated} through the column 7. When the cross-sectional area A _s = 0.003 m ² and the length l = 0.2 m of the support column 7 and the temperature difference between both ends of the support column 7 is 30 K, the thermal conductivity of the support material is calculated using Equation (1). from 11 calculated as a parameter, the thermal conductivity kappa required in the _{Q s} ≧ 105W is κ ≧ 233W / (m · K ), the _{Q s ≧ 155W κ ≧ 395W /} (m · K).

Therefore, in the case where the heat quantity Q _s ≧ 105 W radiated from the support column 7, examples of the support material include copper (κ = 395 W / (m · K)) and aluminum (κ = 240 W / (m · K)). Further, in the case where the amount of heat radiated from the support column 7 is Q _s ≧ 233 W, the support column material is, for example, copper. Thus, as the raw material of the support | pillar 7, the material which has the metal / alloys mentioned in the example and the thermal conductivity of said range is preferable.

  In the present embodiment, the support column 7 that is indispensable for installing the plasma display device is actively used as a cooling member. Thereby, in the plasma display device which is an image display device, heat generated from the PDP 1 which is the display panel and the circuit board 3 can be efficiently radiated, and the plasma display device can be thinned (the casing 5 in the direction perpendicular to the main surface of the PDP 1). The thickness can be 35 mm or less).

(Embodiment 4)
In the first embodiment, as shown in FIG. 5, the plasma display device 100 disposed on the floor 9 as the fixed portion has been described. However, in the present embodiment, the plasma disposed on the wall as the fixed portion. The display device will be described. Other configurations are the same as those of the first embodiment, and thus redundant description may be omitted.

FIG. 15 is a side perspective view schematically showing a wall-mounted plasma display device 400 using aluminum columns 7 in the present embodiment. In addition to the configuration of plasma display device 100 of the first embodiment, plasma display device 400 uses a directly attached filter (not shown) mounted on the panel surface. The shape of the column 7 was a cross-sectional area of 0.008 m ² and a length l = 0.15 m. The support column 7 is in good thermal contact with the chassis 2 and the circuit board 3 on which the heat dissipating component of the electronic component is mounted. Moreover, the support | pillar 7 is connected also with the base part 8 via a heat conductive adhesive, an elastic body, etc., and the temperature of a connection part is the same.

When the power consumption P _c = 400 W in the configuration as described above, the surface temperature T _cf on the display surface side of the plasma display device 400 installed on the wall 29 as a fixed portion was 50 ° C. The temperature at both ends of the column at that time is 50 ° C. on the PDP side (T ₁ ) and 30 ° C. on the pedestal side (T ₀ ), the temperature difference ΔT between both ends is 20 ° C., and the temperature gradient dT / dx is 133 K / m. Become. When calculated using Equation (1) or (2), the amount of heat _{Q s} to be transported through the struts 7 becomes 250 W. Thus, by performing heat dissipation through the support | pillar 7, the surface temperature of a display surface can be made into an upper limit (60 degreeC) or less.

(Embodiment 5)
In the first embodiment, as shown in FIG. 5, the plasma display device 100 disposed on the floor 9 serving as a fixed portion has been described. However, in the present embodiment, the plasma disposed on the ceiling as the fixed portion. The display device will be described. Other configurations are the same as those of the first embodiment, and thus redundant description may be omitted.

  FIG. 16 is a side perspective view schematically showing a ceiling-suspended plasma display device 500 using aluminum columns 7 in the present embodiment. In addition to the configuration of plasma display device 100 of the first embodiment, plasma display device 500 uses a directly attached filter (not shown) mounted on the panel surface.

When the power consumption P _c = 400 W in the configuration as described above, the surface temperature T _cf on the display surface side of the plasma display device 500 installed on the ceiling 30 as a fixed portion was 50 ° C. The temperature at both ends of the column at that time is 50 ° C. on the PDP side (T ₁ ) and 30 ° C. on the pedestal side (T ₀ ), the temperature difference ΔT between both ends is 20 ° C., and the temperature gradient dT / dx is 133 K / m. Become. When calculated using Equation (1) or (2), the amount of heat _{Q s} to be transported through the struts 7 becomes 250 W. Thus, by performing heat dissipation through the support | pillar 7, the surface temperature of a display surface can be made into an upper limit (60 degreeC) or less.

  As mentioned above, the invention made by the present inventor has been specifically described based on the embodiment. However, the present invention is not limited to the embodiment, and various modifications can be made without departing from the scope of the invention. Needless to say.

  For example, in the above embodiment, the case where the present invention is applied to a plasma display device as an image display device has been described. However, the present invention can also be applied to a liquid crystal display device, a field emission display device, or the like.

  The present invention is used as a heat dissipation means of an image display device.

It is side surface perspective drawing of the plasma display apparatus which the present inventors examined. It is explanatory drawing which shows the structure of a plasma display apparatus. It is a top view which shows typically PDP with which the plasma display apparatus of FIG. 2 is provided. It is a disassembled perspective view which shows typically PDP of FIG. It is side surface perspective drawing which shows typically the plasma display apparatus in one embodiment of this invention. It is a perspective view which shows typically the support | pillar with which the plasma display apparatus of FIG. 5 is provided. It is a side perspective view which shows typically the plasma display apparatus in other embodiment of this invention. It is a model figure of the plasma display apparatus used for calculation of calorie | heat amount. It is side surface perspective drawing of the plasma display apparatus which the present inventors examined. It is the table | surface which put together the result of having performed the calorie | heat amount calculation in the fanless type plasma display apparatus and the fanless type and the case thin plasma display apparatus. It is a diagram showing the relationship of the quantity of heat Q _s to move the thermal conductivity κ and a strut of the strut material. It is side surface perspective drawing of the support | pillar vicinity of the plasma display apparatus incorporating the heat pipe in the support | pillar. It is the figure which showed the surface temperature measurement point of an image display surface. It is the table | surface which put together the result of having performed calorie | heat amount calculation in the direct sticking filter type plasma display apparatus and the direct sticking filter, fanless type, and case thin plasma display apparatus. It is a side perspective view which shows typically the plasma display apparatus in other embodiment of this invention. It is a side perspective view which shows typically the plasma display apparatus in other embodiment of this invention.

Explanation of symbols

1 PDP (display panel)
2 Chassis 3 Circuit board 4 Glass filter 5 Housing 6 Cooling fan 7 Support column 8 Base part 9 Floor (fixed part)
DESCRIPTION OF SYMBOLS 10 Heat generating part 11 Front substrate 12 Rear substrate 13 Panel sealing part 14 Display area 15 Front glass substrate 16A, 16B X electrode 17A, 17B Y electrode 18 Dielectric layer 19 Protective layer 20 Rear glass substrate 21 Address electrode 22 Dielectric layer 23 Partition wall 24 Phosphor layer 25 Air layer 26 Ambient air 27 Cooling member 28 Temperature measurement point 29 Wall (fixed part)
30 Ceiling (fixed part)
31 Fin 50 Plasma Display Device 100 Plasma Display Device 101 Address Drive Circuit 102 Sustain / Scanning Pulse Output Circuit 103 Sustain Pulse Output Circuit 104 Drive Control Circuit 105 Signal Processing Circuit 106 Power Supply Circuit 200, 300, 400, 500 Plasma Display Device

Claims (26)

A display panel in which a plurality of pixels are arranged, and an image is displayed from the first surface by controlling the emitted light for each of the plurality of pixels;
A chassis disposed in contact with the display panel along a second surface opposite to the first surface of the display panel;
A circuit board on which a control circuit for controlling the emitted light and a power circuit thereof are mounted, which is disposed on a fourth surface opposite to the third surface in contact with the display panel;
A housing that houses the display panel, the chassis, and the circuit board;
A pedestal installed on the fixed part;
The display panel, the chassis, and the circuit board are disposed so as to be in contact with the heat generating portion, extend to the outside of the housing, connect to the pedestal portion, and support columns that support the housing,
An image display device characterized in that at least at a certain point in time during operation, the amount of heat dissipated through the support column is Q _s, and Q _s ≧ 29 W. A display panel in which a plurality of pixels are arranged, and an image is displayed from the first surface by controlling the emitted light for each of the plurality of pixels;
A chassis disposed in contact with the display panel along a second surface opposite to the first surface of the display panel;
A circuit board on which a control circuit for controlling the emitted light and a power circuit thereof are mounted, which is disposed on a fourth surface opposite to the third surface in contact with the display panel;
A housing that houses the display panel, the chassis, and the circuit board;
A pedestal installed on the fixed part;
The display panel, the chassis, and the circuit board are disposed so as to be in contact with the heat generating portion, extend to the outside of the housing, connect to the pedestal portion, and support columns that support the housing,
An image display device characterized in that at least at a certain point in time during operation, the amount of heat dissipated through the support column is Q _s, and Q _s ≧ 94 W. A display panel in which a plurality of pixels are arranged, and an image is displayed from the first surface by controlling the emitted light for each of the plurality of pixels;
A chassis disposed in contact with the display panel along a second surface opposite to the first surface of the display panel;
A circuit board on which a control circuit for controlling the emitted light and a power circuit thereof are mounted, which is disposed on a fourth surface opposite to the third surface in contact with the display panel;
A housing that houses the display panel, the chassis, and the circuit board;
A pedestal installed on the fixed part;
The display panel, the chassis, and the circuit board are disposed so as to be in contact with the heat generating portion, extend to the outside of the housing, connect to the pedestal portion, and support columns that support the housing,
An image display device characterized in that at least at a certain point in time during operation, the amount of heat dissipated through the support column is Q _s , the power consumption is P _c, and Q _s ≧ P _c × 0.07. A display panel in which a plurality of pixels are arranged, and an image is displayed from the first surface by controlling the emitted light for each of the plurality of pixels;
A chassis disposed in contact with the display panel along a second surface opposite to the first surface of the display panel;
A circuit board on which a control circuit for controlling the emitted light and a power circuit thereof are mounted, which is disposed on a fourth surface opposite to the third surface in contact with the display panel;
A housing that houses the display panel, the chassis, and the circuit board;
A pedestal installed on the fixed part;
The display panel, the chassis, and the circuit board are disposed so as to be in contact with the heat generating portion, extend to the outside of the housing, connect to the pedestal portion, and support columns that support the housing,
An image display device characterized in that at least at a certain point in time during operation, the amount of heat dissipated through the support column is Q _s , the power consumption is P _c, and Q _s ≧ P _c × 0.24.   5. The image display device according to claim 1, wherein a thickness of the housing in a direction perpendicular to the first surface of the display panel is 35 mm or less. A display panel in which a plurality of pixels are arranged, and an image is displayed from the first surface by controlling the emitted light for each of the plurality of pixels;
A chassis disposed in contact with the display panel along a second surface opposite to the first surface of the display panel;
A circuit board on which a control circuit for controlling the emitted light and a power circuit thereof are mounted, which is disposed on a fourth surface opposite to the third surface in contact with the display panel;
A housing that houses the display panel, the chassis, and the circuit board;
A pedestal installed on the fixed part;
The display panel, the chassis, and the circuit board are disposed so as to be in contact with the heat generating portion, extend to the outside of the housing, connect to the pedestal portion, and support columns that support the housing,
An image display device characterized in that at least at a certain point in time during operation, the amount of heat dissipated through the support column is Q _s, and Q _s ≧ 105 W. A display panel in which a plurality of pixels are arranged, and an image is displayed from the first surface by controlling the emitted light for each of the plurality of pixels;
A chassis disposed in contact with the display panel along a second surface opposite to the first surface of the display panel;
A circuit board on which a control circuit for controlling the emitted light and a power circuit thereof are mounted, which is disposed on a fourth surface opposite to the third surface in contact with the display panel;
A housing that houses the display panel, the chassis, and the circuit board;
A pedestal installed on the fixed part;
The display panel, the chassis, and the circuit board are disposed so as to be in contact with the heat generating portion, extend to the outside of the housing, connect to the pedestal portion, and support columns that support the housing,
An image display device characterized in that at least at a certain point in time during operation, the amount of heat dissipated through the support column is Q _s, and Q _s ≧ 155 W. A display panel in which a plurality of pixels are arranged, and an image is displayed from the first surface by controlling the emitted light for each of the plurality of pixels;
A chassis disposed in contact with the display panel along a second surface opposite to the first surface of the display panel;
A circuit board on which a control circuit for controlling the emitted light and a power circuit thereof are mounted, which is disposed on a fourth surface opposite to the third surface in contact with the display panel;
A housing that houses the display panel, the chassis, and the circuit board;
A pedestal installed on the fixed part;
The display panel, the chassis, and the circuit board are disposed so as to be in contact with the heat generating portion, extend to the outside of the housing, connect to the pedestal portion, and support columns that support the housing,
An image display device characterized in that at least at a certain point in time during operation, the amount of heat dissipated through the support column is Q _s , the power consumption is P _c, and Q _s ≧ P _c × 0.26. A display panel in which a plurality of pixels are arranged, and an image is displayed from the first surface by controlling the emitted light for each of the plurality of pixels;
A chassis disposed in contact with the display panel along a second surface opposite to the first surface of the display panel;
A circuit board on which a control circuit for controlling the emitted light and a power circuit thereof are mounted, which is disposed on a fourth surface opposite to the third surface in contact with the display panel;
A housing that houses the display panel, the chassis, and the circuit board;
A pedestal installed on the fixed part;
The display panel, the chassis, and the circuit board are disposed so as to be in contact with the heat generating portion, extend to the outside of the housing, connect to the pedestal portion, and support columns that support the housing,
An image display device characterized in that at least at a certain point in time during operation, the amount of heat dissipated through the support column is Q _s , the power consumption is P _c, and Q _s ≧ P _c × 0.39. A thickness of the casing in a direction perpendicular to the first surface of the display panel is 35 mm or less;
10. The image display device according to claim 6, wherein a direct attachment filter is attached to the first surface of the display panel. 11.   The image display device according to claim 1, wherein a material constituting at least a portion of the support is aluminum, copper, magnesium, iron, or brass.   11. The image display device according to claim 1, wherein a material constituting at least a portion of the support has a thermal conductivity of 65 W / (m · K) or more.   The image display device according to any one of claims 1 to 12, wherein a heat pipe or a self-excited vibration heat pipe is incorporated in the support column.   The flow path for circulating the cooling water to the support column and the pedestal and the power source for circulating the cooling water in one direction of the flow path are incorporated. Image display device. In at least some section of the strut, the cross-sectional area and A _s, the length of the strut and l, any one of claims 1 to 14 characterized in that it is a A _s /l≧0.0025 The image display device described in 1. In at least some section of the strut, the cross-sectional area and A _s, the length of the strut and l, in any one of claims 1 to 15, characterized in that the A _s ≧ 0.00025m ² The image display device described.   The image display device according to claim 1, wherein the support column and / or the pedestal portion includes an uneven portion and a fin.   The image display according to any one of claims 1 to 17, wherein the support column is connected to the heat generating unit and the pedestal unit by heat conductive adhesive or brazing. apparatus.   The image display device according to claim 1, wherein the display panel is a plasma display panel.   The image display device according to claim 1, wherein the display panel is a unit including a liquid crystal panel and a backlight.   The image display device according to claim 1, wherein the display panel is a field emission display.   The image display device according to claim 1, wherein the display panel is an organic EL or an organic LED. A display panel in which a plurality of pixels are arranged, and an image is displayed from the first surface by controlling the emitted light for each of the plurality of pixels;
A chassis disposed in contact with the display panel along a second surface opposite to the first surface of the display panel;
A circuit board on which a control circuit for controlling the emitted light and a power circuit thereof are mounted, which is disposed on a fourth surface opposite to the third surface in contact with the display panel;
A housing that houses the display panel, the chassis, and the circuit board;
A column connected to the housing and extending to the outside of the housing;
A pedestal portion connected to the support column;
The image display device, wherein the support column is disposed so as to be in contact with a heat generating portion including the display panel, the chassis, and the circuit board.   24. The image display device according to claim 23, wherein the support post wraps the circuit board.   25. The image display device according to claim 24, wherein the support column surrounding the circuit board is disposed so as to contact the fourth surface of the chassis.   24. The image display device according to claim 23, wherein the support column covers the circuit board.

Images