JP2006227513A - Display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a display device capable of radiating heat emitted from electronic components transmitted to a support through a heat conductive member at high efficiency, that is utilized to be radiated from a part extended from a casing out of the supports to a casing outside, since the electronic components and the supports are connected by the heat conductive member. <P>SOLUTION: A PDP device 10, storing a plurality of the electronic components 61 and 62 in a case 20, comprises PDP 50 for arranging a plurality of pixels in a surface form and displaying images by emission light control at each pixel, a chassis 54 arranged along the rear face of PDP 50, and a control circuit for executing the emission light control. A support 40 for supporting PDP 50 via the chassis 54 is extended from the inside of a case 20 to the outside. The electronic components 61 and 62 and the support 40 are respectively connected by radiator plates 71 and 72 made of aluminum. The support 40 consists of a metal, such as aluminum, and the surface is black-treated. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a display device such as a plasma display device, and more particularly to a technique for improving heat dissipation efficiency.

The display device includes a display panel that displays an image by emission light control for each pixel, a control circuit that executes the emission light control, a support that supports the display panel, and the like.
For example, in a plasma display device, since an image is displayed using plasma discharge, the display panel is likely to be hot. In addition, since many electronic components that generate heat are also used in the control circuit, the apparatus tends to be hot.

Therefore, various heat dissipation measures are taken in the plasma display device. As an example, it is possible to form a vent hole in a housing that houses a display panel and a control circuit, and to dispose a cooling fan in the vicinity of the vent hole. As a result, the air heated by the heat generated from the electronic components that make up the display panel and control circuit can be forcibly released from the vents to the outside of the housing by the cooling fan, thus increasing the heat dissipation efficiency of the device. Can do.
JP 2000-156581 A

However, plasma display devices have been increasing in screen size and definition in recent years, and accordingly, the amount of heat generated by the devices tends to increase, and only the heat dissipation by the above-described method can be emitted from the device. There is a problem that heat cannot be dissipated sufficiently.
On the other hand, from the viewpoint of suppressing the generation of noise from the apparatus, there is a strong demand for reducing the number of cooling fans, and the creation of a new technology for improving the heat dissipation efficiency is eagerly desired.

  The present invention has been made in view of the above points, and an object of the present invention is to provide a display device capable of highly efficient heat dissipation.

  In order to achieve the above object, a display device according to the present invention includes a display panel in which a plurality of pixels are arranged in a plane and an image is displayed by emission light control for each pixel, and along the back surface of the display panel. A display device in which a chassis disposed and a plurality of electronic components constituting a control circuit that executes the emitted light control are housed in a housing, the support supporting the display panel via the chassis A body extends from the inside of the housing to the outside, and the support and at least one of the plurality of electronic components are connected by a heat conducting member.

  Note that “connected by a heat conducting member” means, for example, thermally connected via a heat conducting member having a high thermal conductivity without interposing a member that does not conduct heat such as a circuit board. State.

In the above configuration, since the electronic component and the support are connected by the heat conducting member, the heat generated from the electronic component is transferred to the support with high efficiency via the heat conducting member. Heat is radiated from the portion extending from the housing to the outside of the housing. Thereby, it is suppressed that the inside of a housing | casing becomes high temperature with the heat | fever emitted from the electronic component, and highly efficient heat dissipation is attained.
In the above configuration, the support is preferably made of metal. By using a metal as a material for the support, the support can have high thermal conductivity and mechanical strength for supporting the display panel.

  Moreover, it is desirable that the support has a black surface. By performing black treatment on the surface of the support, the absorption rate of infrared rays and the emissivity of heat are improved. As a result, heat radiated as infrared rays from the display panel and electronic components inside the housing is absorbed by the support with high efficiency, and then efficiently radiated from a portion of the support outside the housing. As a result, the temperature inside the housing can be prevented from becoming high, and heat can be efficiently dissipated.

Hereinafter, a plasma display device according to an embodiment of the present invention will be described with reference to the drawings.
<First Embodiment>
First, the configuration of the plasma display device will be described with reference to FIG. FIG. 1 is an exploded perspective view of the plasma display device 10.

The plasma display device 10 includes a case 20, a plasma display panel (hereinafter referred to as “PDP”) (display panel) 50 accommodated in the case 20, a chassis 54, and a plurality of control circuits incorporated therein. The circuit board 60 and the support body 40 which supports PDP50 are provided.
The PDP 50 has a plurality of pixels arranged in a plane and displays an image by controlling emission light for each pixel. The PDP 50 includes a front panel 51 and a rear panel 52 arranged to face each other in parallel. Yes. The front panel 51 includes a display electrode pair, a dielectric layer, and a protective layer arranged in this order on the facing surface of the front glass substrate. On the other hand, in the rear panel 52, address electrodes, a dielectric layer, and barrier ribs are sequentially arranged on the opposite surface of the rear glass substrate, and a phosphor layer is formed between the barrier ribs. The phosphor layers are repeatedly arranged in the order of red, green, and blue. The front panel 51 and the back panel 52 are bonded to each other with a sealing material, and a gap between the two panels is partitioned by a stripe-shaped partition wall to form a discharge space. A discharge gas is generated in the discharge space. It is enclosed. With such a configuration, the PDP 50 receives a signal from the control circuit of the circuit board 60 and displays an image on the image display surface 53.

The chassis 54 is a plate-like member made of, for example, aluminum. The back panel 52 and the chassis 54 of the PDP 50 are bonded together by a heat conductive adhesive such as silicone paste, for example.
By arranging the chassis 54 along the back surface of the PDP 50 in this way, the heat distribution of the PDP 50 is made uniform, so that the occurrence of display unevenness can be suppressed. Further, by disposing the chassis 54 on the back surface of the PDP 50, an effect of improving the heat dissipation efficiency of the PDP 50 can be obtained.

A plurality of electronic components (not shown) constituting a control circuit that performs emission light control for each pixel of the PDP 50 are mounted on the circuit board 60 provided on the rear surface of the chassis 54.
The case 20 includes a front case 22 and a rear case 24. The front case 22 and the rear case 24 are fitted into one housing. A plurality of ventilation holes 26 (not shown in the illustration of the ventilation holes on the lower surface) are formed on the upper surface and the lower surface of the front case 22, and the front surface thereof is made of glass that protects the image display surface 53 of the PDP 50. A panel 30 is provided. A plurality of vent holes 26 and 28 are also formed on the upper and lower surfaces of the rear case 24.

The support 40 is made of aluminum, for example. The support body 40 includes a leg portion 41 and a pair of support columns 42 extending vertically from both ends of the leg portion 41. Protruding portions 43, 44, and 45 that protrude in the same direction are formed on the column 42.
The arrangement state of the support will be described with reference to FIG. FIG. 2 is a cross-sectional view taken along the line AA of FIG.

  In the support 40, the support column 42 extends from the inside of the case 20 to the outside, and the leg portion 41 is installed on the floor 100 below the case 20. The support body 40 and the chassis 54 are joined by screwing the projecting portions 43, 44, 45 of the support body 40 and the chassis 54. As a result, the support body 40 functions to support the PDP 50 via the chassis 54. In addition, the adhesion between the projecting portions 43, 44, 45 of the support 40 and the chassis 54 is enhanced by an elastic member having thermal conductivity such as silicone paste.

  A heat radiating plate 71 made of aluminum is attached to the electronic component 61 mounted on the circuit board 60. Here, the heat radiating plate 71 is disposed so as to be in surface contact with the support 40. Similarly, a heat radiating plate 72 made of aluminum is also attached to the electronic component 62, and the heat radiating plate 72 is disposed so as to be in surface contact with the support 40. That is, the electronic component 61 and the support body 40 are connected by the heat conducting member.

Hereinafter, effects of the PDP device 10 having the above configuration will be described.
In the PDP device 10, members that mainly generate heat are the electronic components 61 and 62 mounted on the PDP 50 and the circuit board 60.
In the above configuration, the heat radiation plate 71 is attached to the electronic component 61 so as to be in contact with the support column 42 of the support body 40. Thereby, the heat generated from the electronic component 61 is transmitted to the support column 42 of the support body 40 through the heat radiating plate 71. The heat transmitted to the support column 42 is conducted to the leg portion 41 having a low temperature in the support body 40, and is radiated to the atmosphere, the floor 100, and the like.

Similarly, the heat radiating plate 72 is attached to the electronic component 62 so as to be in contact with the support column 42 of the support 40. Thereby, the heat generated from the electronic component 62 is transmitted to the support column 42 of the support body 40 through the heat radiating plate 72. The heat transmitted to the support column 42 is conducted to the leg portion 41 having a low temperature in the support body 40, and is radiated to the atmosphere, the floor 100, and the like.
As described above, in the present embodiment, since the heat generated from the electronic components 61 and 62 is radiated from the support 40 to the outside of the case 20, it is possible to suppress the inside of the case 20 from becoming a high temperature. And high efficiency heat dissipation is possible.

  Moreover, since the low temperature part of the support body 40 is the leg part 41 and the support | pillar 42 near the leg part 41, most of the heat transferred to the support body 40 moves the support body 40 downward in the figure. Conducted to the leg 41. In the conventional configuration, most of the heat radiated from the electronic components or the like into the air is transmitted upward in the figure by convection, so that the upper portion of the case 20 is likely to become high temperature. Since heat is transmitted downward in the figure through the support body 40, the effect that the upper portion of the case 20 can be prevented from becoming high temperature is also obtained.

  Further, in the above configuration, the heat generated from the PDP 50 is transmitted to the support body 40 from the projecting portions 43, 44, 45 via the chassis 54, and is radiated to the outside of the apparatus. From the viewpoint of supporting the PDP 50, it is sufficient for the support body 40 to be joined to the chassis 54 at the projecting portions 43 and 45, but the projecting portion 44 is also joined to the chassis 54. This is to increase the contact area between the chassis 54 and the support 40 in order to increase the heat transfer efficiency from the chassis 54 to the support 40.

Further, a heat conductive silicone paste is applied to the joint surface between the projecting portions 43, 44, 45 and the chassis 54, and the adhesion between the projecting portions 43, 44, 45 and the chassis 54 is enhanced. Therefore, heat is transferred from the chassis 54 to the projecting portions 43, 44, 45 with high efficiency.
Here, the surface of the support 40 is preferably black-treated. By treating the surface of the support 40 with black, the infrared absorption rate and heat emissivity of the support 40 are improved. Thereby, the heat radiated | emitted as infrared rays in the case 20 from PDP50, the electronic components 61 and 62 grade | etc., Is absorbed by the support body 40 with high efficiency. The absorbed heat is radiated with high efficiency from the support column 42 and the leg portion 41 located outside the case 20 in the support body 40. That is, since heat is transferred from the inside of the case 20 to the outside through the support body 40 with high efficiency, the inside of the case 20 can be suppressed from becoming high temperature, and high efficiency heat dissipation is possible. become.

In addition, as a black process, when the material of the support body 40 is aluminum, it is suitable to carry out the black alumite process on the surface of the support body 40, for example.
<Example>
Hereinafter, based on an Example, the effect of the PDP apparatus 10 which concerns on this Embodiment is demonstrated. Here, the PDP device 10 according to the present embodiment shown in FIG. 2 is used as an example, and as a comparative example, a PDP device having a conventional configuration in which the heat sink attached to the electronic component and the support are not in contact with each other. Was used.

The inventors of the present invention carried out measurements on the heat dissipation effect for the examples and comparative examples. Specifically, by measuring the temperature of the heat sink attached to the electronic components performing the same function in the control circuit and the temperature of the support, the difference in heat dissipation effect between the example and the comparative example is determined. investigated. FIG. 3 is a table showing the results.
In the comparative example, the temperature of the heat radiating plate (corresponding to the heat radiating plate 71 in FIG. 2) attached to the electronic component (corresponding to the electronic component 61 in FIG. 2) is 52.7 ° C. The temperature at the closest part was 37.4 ° C.

In the example, the temperature of the heat sink 71 attached to the electronic component 61 was 46.9 ° C., and the temperature in the vicinity of the joint portion of the support 40 with the heat sink 71 was 44.7 ° C.
In the comparative example, since the heat sink and the support are not connected by the heat conducting member, the temperature difference between the heat sink and the support is 15.3 ° C., and heat is efficiently transferred from the heat sink to the support. You can see that it has not been done. For this reason, the transition of heat from the heat sink is mainly radiated into the air, and the temperature of the heat sink is as high as 52.7 ° C.

  On the other hand, in the embodiment, as shown in FIG. 2, since the heat sink 71 and the support 40 are in surface contact, the temperature difference between the heat sink 71 and the support 40 is 2.2 ° C. It can be seen that heat is efficiently transferred from 71 to the support 40. As a result, heat is radiated from the heat radiating plate 71 to the outside of the case 20 through the support 40, so the temperature of the heat radiating plate 71 is 46.9 ° C., which is 5.8 ° C. lower than the comparative example. ing.

From the comparative test between the above-described example and comparative example, it can be said that the PDP device 10 according to the present embodiment has higher heat dissipation efficiency than the PDP device having the conventional configuration.
In the above-described embodiment, the heat radiation plate 71 and the support body 40 are brought into surface contact with each other, and the temperature is measured for the case where heat is transferred from the heat radiation plate 71 to the support body 40. For example, by applying a silicone paste to the joint surface with 40 to enhance the adhesion of the joint surface, the heat transfer efficiency from the heat radiating plate 71 to the support 40 is further increased, so that the temperature of the heat radiating plate 71 can be further reduced. It is considered possible.

<Second Embodiment>
A PDP apparatus according to the second embodiment will be described with reference to FIG. FIG. 4 is a cross-sectional view of the PDP device 11 according to the second embodiment. Note that the second embodiment is different from the first embodiment in the aspect of the support, and the others are the same, so the description of the portion excluding the support is omitted.

The PDP device 11 is a so-called wall-hanging type, and the support body 80 is fixed to the wall 101 and is joined to the chassis 54 at the projecting portions 83, 84, 85 to support the PDP 50.
A heat radiating plate 71 is attached to the electronic component 61 mounted on the circuit board 60. The heat radiating plate 71 and the support 80 are in surface contact with each other, and, for example, adhesion is enhanced by applying a silicone paste.

In such a form, the heat generated from the electronic component 61 is transmitted to the support body 80 via the heat radiating plate 71 and is radiated from the support body 80 to the wall 101. Thereby, it is suppressed that the inside of case 20 becomes high temperature with the heat | fever emitted from the electronic component 61, and highly efficient heat dissipation is attained.
The support 80 is preferably shaped so that the contact area with the wall 101 is as large as possible. This is because the amount of heat transferred from the support 80 to the wall 101 increases, so that the heat dissipation efficiency increases.

  Furthermore, in order to increase the heat radiation efficiency, it is preferable to embed a support 81 in the wall 101 as shown in FIG. A broken line in the figure indicates a portion of the support 81 that is embedded in the wall 101 (embedded portion 82). Thus, by burying the support body 81 in the wall 101, the amount of heat transferred from the support body 81 to the wall 101 is further increased, so that the heat dissipation efficiency is further increased.

The embedded portion 82 is preferably shaped so that the contact area with the wall 101 is as large as possible. This is because the amount of heat transferred from the embedded portion 82 to the wall 101 increases, so that the heat dissipation efficiency increases.
<Modification>
As described above, the present invention has been described based on the embodiments. However, the content of the present invention is not limited to the specific examples shown in the above embodiments. For example, the following modifications are possible. Can think.

  (1) In the above description, as shown in FIG. 2, the configuration in which the support 40 and the electronic components 61 and 62 are connected by the plate-like heat radiation plates 71 and 72 has been described. , 62 may be connected by, for example, silicone rubber, silicone paste or the like having high thermal conductivity. Moreover, you may connect the support body 40 and the electronic components 61 and 62 with a strip | belt-shaped metal foil.

  (2) For example, in FIG. 2, the electronic components 61 and 62 disposed in the facing space where the support body 40 and the circuit board 60 face each other are connected to the support body 40 by the radiator plates 71 and 72, respectively. Although the electronic component connected to the support body 40 is not limited to the illustrated one, any electronic component disposed in the case 20 and the support body 40 are You may connect by a heat conductive member.

  (3) In the above, the case where the PDP device is disposed on the floor is described in the first embodiment, and the case where the PDP device is attached to the wall is described in the second embodiment. As shown in FIG. 6, the PDP device may be attached to the ceiling. Also in this case, as shown in FIG. 5, since the support 90 and the electronic components 61 and 62 are connected by the heat sinks 71 and 72, the heat generated from the electronic components 61 and 62 is supported by the support 90. Radiated from the support 90 to the ceiling 102 and the atmosphere. Thereby, it is suppressed that the inside of case 20 becomes high temperature, and highly efficient heat dissipation is attained.

6 is also preferably embedded in the ceiling 102, like the support 81 in FIG. As a result, the amount of heat transferred from the support 90 to the ceiling 102 increases, so that the heat dissipation efficiency is further increased.
(4) In the above description, the case where aluminum is used as the support material has been described, but instead of aluminum, an aluminum-based alloy, other materials such as magnesium, nickel, titanium, etc., or alloys thereof, iron You may use metals, such as a system alloy and stainless steel.

  (5) In FIG. 1, the support 40 is illustrated as having a structure having two support columns 42, but the number of support columns 42 is not limited to two, and may be three or more, for example. The shape of the support is not limited to that shown in FIGS. 1, 2, 4 to 6, etc., and may be in any form, allowing more electronic components and the support to conduct heat. It is desirable that it is in a form that can be connected by a member.

(6) In the above description, the structure in which the chassis and the support are separately formed is described. However, the chassis and the support may be integrally formed. Thereby, the effect that the heat transfer efficiency from a chassis to a support body increases is acquired.
(7) In the above description, the PDP device has been described as an example of the display device. However, in addition to the PDP device, for example, a liquid crystal display device or an FED (Field Emission Display) device or other display device in which electronic components can become high temperature. The present invention can be similarly applied to the above. When applied to these devices, the electronic component can be prevented from becoming high temperature, and an effect of increasing the heat dissipation effect can be obtained.

  The present invention can be widely applied to a display device including an electronic component that becomes high temperature when driven, such as a PDP device. In addition, since the present invention can provide a display device capable of highly efficient heat dissipation, its industrial utility value is extremely high.

1 is an exploded perspective view of a plasma display device according to a first embodiment. It is AA arrow sectional drawing in FIG. 1 of a plasma display apparatus. It is a table | surface which shows the result of the experiment which measures heat dissipation efficiency. It is sectional drawing of the plasma display apparatus which concerns on 2nd Embodiment. It is sectional drawing of the plasma display apparatus which concerns on 2nd Embodiment. It is sectional drawing of the plasma display apparatus which concerns on a modification.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Plasma display apparatus 20 Case 40, 80, 90 Support body 50 PDP
54 Chassis 60 Circuit board 61, 62 Electronic component 71, 72 Heat sink 100 Floor 101 Wall 102 Ceiling

Claims (3)

A display panel in which a plurality of pixels are arranged in a plane, and an image is displayed by emission light control for each pixel, a chassis disposed along the back surface of the display panel, and a control circuit that performs the emission light control A plurality of electronic components constituting the display device housed in a housing,
A support that supports the display panel via the chassis extends from the inside of the housing to the outside,
The display device, wherein the support and at least one of the plurality of electronic components are connected by a heat conductive member.   The display device according to claim 1, wherein the support is made of metal.   The display device according to claim 1, wherein a surface of the support is black-treated.

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