KR20020059328A - 피가공물 반송장치 - Google Patents
피가공물 반송장치 Download PDFInfo
- Publication number
- KR20020059328A KR20020059328A KR1020027000076A KR20027000076A KR20020059328A KR 20020059328 A KR20020059328 A KR 20020059328A KR 1020027000076 A KR1020027000076 A KR 1020027000076A KR 20027000076 A KR20027000076 A KR 20027000076A KR 20020059328 A KR20020059328 A KR 20020059328A
- Authority
- KR
- South Korea
- Prior art keywords
- horizontal
- workpiece
- arm
- bent
- fixed arm
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/0009—Constructional details, e.g. manipulator supports, bases
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
- B25J9/042—Cylindrical coordinate type comprising an articulated arm
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Abstract
Description
Claims (8)
- 피가공물을 고정하는 핸드와, 이 핸드를 수평방향으로 이동시키는 이동기구를 구비하여 이루어지는 피가공물 반송장치에 있어서, 상기 핸드의 피가공물 고정부를 수평방향으로 뻗는 카본파이버재로 이루어지는 수평고정암에 의해 형성하고, 이 수평고정암은 상기 피가공물에 대향하는 수평암부와, 이 수평암부와 교차하는 방향으로 절곡된 최소한 하나의 절곡부를 갖고, 이 절곡부와 상기 수평암부와의 경계의 구석부의 면이 둥글도록 한 것을 특징으로 하는 피가공물 반송장치.
- 제 1항에 있어서,상기 수평고정암은 상기 수평암부의 양측에 상기 절곡부를 갖고 있는 것을 특징으로 하는 피가공물 반송장치.
- 제 1항 또는 제 2항에 있어서,상기 수평고정암은 상기 절곡부의 상기 수평암부와는 반대측에서 또한 절곡된 플랜지부를 갖고 있는 것을 특징으로 하는 피가공물 반송장치.
- 제 3항에 있어서,상기 플랜지부는 바깥쪽으로 절곡되는 것을 특징으로 하는 피가공물 반송장치.
- 제 1항에 있어서,상기 수평고정암은 횡단면이 중공타원모양인 것을 특징으로 하는 피가공물 반송장치.
- 제 1항 내지 제 5항 중 어느 한 항에 있어서,상기 수평암부의 앞쪽에 상기 피가공물을 흡착하기 위한 흡착부를 돌출시킴과 동시에 상기 수평암부의 뒤쪽에 상기 흡착부를 고정하기 위한 고정기구 및 흡착용의 배관을 수납하여 되는 것을 특징으로 하는 피가공물 반송장치.
- 제 6항에 있어서,상기 수평암부의 뒤쪽에 상기 절곡부 사이에서 형성된 오목부로 이루어지는 공간안에 상기 고정기구가 수납되는 것을 특징으로 하는 피가공물 반송장치.
- 제 6항에 있어서,상기 피가공물은 박판모양의 판재로서 상기 수평암부에는 여러개의 상기 흡착부를 구비하고, 상기 여러개의 흡착부에 의해 상기 박판모양의 판재를 흡착고정하여 되는 것을 특징으로 하는 피가공물 반송장치.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22135399 | 1999-08-04 | ||
JPJP-P-1999-00221353 | 1999-08-04 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20020059328A true KR20020059328A (ko) | 2002-07-12 |
KR100578601B1 KR100578601B1 (ko) | 2006-05-10 |
Family
ID=16765482
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020027000076A KR100578601B1 (ko) | 1999-08-04 | 2000-08-04 | 피가공물 반송장치 |
Country Status (5)
Country | Link |
---|---|
US (1) | US6739638B1 (ko) |
JP (1) | JP3933932B2 (ko) |
KR (1) | KR100578601B1 (ko) |
TW (1) | TW483809B (ko) |
WO (1) | WO2001010608A1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190002303A (ko) * | 2017-06-29 | 2019-01-08 | 니혼 덴산 산쿄 가부시키가이샤 | 산업용 로봇의 핸드 및 산업용 로봇 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101198179B1 (ko) | 2005-01-17 | 2012-11-16 | 삼성전자주식회사 | 핸들링 로봇의 정적 처짐 보정방법 및 장치 |
CN102101296B (zh) * | 2009-12-21 | 2015-05-13 | 柳州市中晶科技有限公司 | 非接触搬运装置 |
US20130287532A1 (en) * | 2012-04-27 | 2013-10-31 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Transporting Device for Substrate |
US9991152B2 (en) * | 2014-03-06 | 2018-06-05 | Cascade Microtech, Inc. | Wafer-handling end effectors with wafer-contacting surfaces and sealing structures |
CN205674219U (zh) | 2016-05-13 | 2016-11-09 | 鄂尔多斯市源盛光电有限责任公司 | 机械手手臂、机械手及承载装置 |
CN109524338B (zh) * | 2018-10-11 | 2022-11-15 | 中国电子科技集团公司第二研究所 | 摆动式生瓷片刮片上下料方法 |
US11600580B2 (en) * | 2019-02-27 | 2023-03-07 | Applied Materials, Inc. | Replaceable end effector contact pads, end effectors, and maintenance methods |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05228873A (ja) | 1992-02-21 | 1993-09-07 | Sony Corp | 真空チャック |
US5622400A (en) * | 1995-06-07 | 1997-04-22 | Karl Suss America, Inc. | Apparatus and method for handling semiconductor wafers |
JPH11163093A (ja) | 1997-11-28 | 1999-06-18 | Nissin Electric Co Ltd | 基板搬送ロボット |
JPH11188681A (ja) | 1997-12-24 | 1999-07-13 | Canon Inc | 基板搬送用ハンド及びその吸着機構 |
-
2000
- 2000-08-04 KR KR1020027000076A patent/KR100578601B1/ko active IP Right Grant
- 2000-08-04 WO PCT/JP2000/005263 patent/WO2001010608A1/ja active IP Right Grant
- 2000-08-04 US US10/031,881 patent/US6739638B1/en not_active Expired - Lifetime
- 2000-08-04 JP JP2001515106A patent/JP3933932B2/ja not_active Expired - Lifetime
- 2000-08-04 TW TW089115822A patent/TW483809B/zh not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190002303A (ko) * | 2017-06-29 | 2019-01-08 | 니혼 덴산 산쿄 가부시키가이샤 | 산업용 로봇의 핸드 및 산업용 로봇 |
Also Published As
Publication number | Publication date |
---|---|
TW483809B (en) | 2002-04-21 |
WO2001010608A1 (fr) | 2001-02-15 |
US6739638B1 (en) | 2004-05-25 |
JP3933932B2 (ja) | 2007-06-20 |
KR100578601B1 (ko) | 2006-05-10 |
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