KR20020046545A - Riveting machine for electronic parts assembly - Google Patents

Abstract

PURPOSE: A riveting machine for the assembly of electronic components is provided to improve the productivity of electronic products and to reduce a labor cost of the assembly work by performing a trimming work, a bending work, and a riveting work via only one process. CONSTITUTION: The riveting machine for the assembly of electronic components is comprised of a supply device(100) for supplying a lead frame into a bending device(200) consisting of an upper mold and a lower mold; the bending device used to perform a trimming work and a bending work; a coupling device(300) having a plate bearing a heat sink at the one side and used to dispose the lead frame and the heat sink over a moving mold; a riveting device(400) passing the moving mold to perform a riveting work by hitting the lead frame and the heat sink; and a stacking device for successively stacking completed products in a loading box.

Description

Riveting machine for electronic parts assembly {RIVETING MACHINE FOR ELECTRONIC PARTS ASSEMBLY}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a riveting machine, and more particularly, to a riveting machine for assembling electronic components that automatically couples small electronic components or devices with each other.

Particularly, in the present invention, a lead frame used as a substrate for various electronic components and a heat sink, that is, a heat sink, are coupled, and trimming and bending of the lead frame before riveting are performed. (bending) work together.

Typically, to bond the lead frame and the heat sink, an adhesive is applied and attached or a double-sided tape is used. However, the adhesive part is easily detached and the harmful gas and the tape are attached at high temperature (350-400 ° C.). As debris is generated, there is a problem of environmental pollution. Therefore, the coupling method by riveting with high binding force is adopted.

On the other hand, the lead frame formed by the press work is completed after the trimming and bending work by a separate press work, each has a separate process has to go through a separate process, not only the production capacity is reduced, but also a large number of workers It is uneconomical. And the lead frame thus completed is again expensive, and the work process and the labor cost that must be provided with a separate riveting machine to assemble with the heat sink is also a great consumption of manpower.

The present invention is to overcome the above-mentioned conventional problems, an object of the present invention is to provide a riveting machine for assembling electronic components to improve the workforce reduction and productivity while trimming, bending and riveting operations are performed in one process It is.

In order to achieve the above object, the present invention provides a supply device 100 for supplying a lead frame into the bending device, and the bending device 200 has an upper mold and a lower mold that can perform the trimming and bending operations It is provided, having a mounting table for loading the heat sink on one side and the coupling device 300 for placing the lead frame and the heat sink over the movable mold, the movable mold is passed through the upper mold is located above the It consists of a riveting device 400 for performing a riveting by applying a punch to the lead frame and the heat sink coupled by the coupling device by the upper mold, and a stacking device 500 for sequentially loading the finished product in the loading box It features.

1 is a schematic front view of a riveting machine according to an embodiment of the invention.

2 is a schematic plan view of a riveting machine according to an embodiment of the invention.

3A and 3B are exploded perspective views of a lead frame and a heat sink assembled according to an embodiment of the present invention.

4 and 5 are some perspective views of the present invention.

Figure 6 is a reference diagram showing the front of the supply apparatus in the present invention.

Figure 7 is a partial cutaway perspective view showing the configuration of each feeder of the supply and the coupling device in the present invention.

Figure 8 is a front view schematically showing the configuration of the bending device in the present invention.

9 is a plan view schematically showing the configuration of the bending device in the present invention.

Figure 10 is a front view schematically showing the configuration of the riveting device in the present invention.

11 is a partial cross-sectional view showing the configuration of the upper mold and the moving mold to extract the main portion in FIG.

12 is a cross-sectional view taken along the line A-A in FIG.

13, 14, 15, and 16 are reference diagrams illustrating a process in which a lead frame and a heat sink are coupled by a coupling device.

17 is an enlarged cross-sectional view of a portion “B” in FIG. 16.

18 is a reference diagram showing the operating state of the gripper moved along the rail of the coupling device.

<Code Description of Main Parts of Drawing>

1: body 2: lead frame

4: hole 5: pin

6: Heatsink 8: Rivet

11: Base plate 12: Guide bar

20: first horizontal frame 22: screw rod

23: support stand 24: moving frame

26: vertical transfer table 29: suction hole

30: gripper 35: rail

44: upper mold 46: lower mold

50: gripper 60: second horizontal frame

63: support 64: moving frame

66: first adsorption port 68: second adsorption port

70: moving mold 72: mold rail

84: upper mold 85: punch

90: third horizontal frame 92: moving frame

94: rotating shaft 95: robot arm

95a: finger 98: suction hole

99: loaded 100: supply unit

200: banding device 300: coupling device

400: riveting device 500: loading device

600: casing 610: control panel

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. First, in describing the present invention, detailed descriptions of related well-known functions or configurations will be omitted if they may obscure the gist of the present invention.

1 and 2 schematically illustrate the structure of the riveting machine for assembling electronic components according to the present invention. According to the drawings, the rivet main body 1 for assembling electronic parts of the present invention includes a mounting table 10 on which the lead frame 2 is mounted, and a supply device 100 for moving the lead frame to a predetermined position. The lead frame 2 and the heat sink 6 include a bending device 200 for trimming the lead frame 2 and performing a bending operation, and a mounting base 10a on which the heat sink 6 is mounted. Combining device 300 for coupling the, riveting device 400 for fixing by applying a punch to the combined product as described above, and a loading device 500 for loading the finished product into a large box.

3A and 3B are perspective views of the lead frame 2 and the heat sink 6 assembled by the riveting machine for assembling electronic components according to the present invention, and FIG. 3A is a state in which the lead frame ( 2) is shown in the state before trimming and banding operations are performed. 3B shows a state in which the lead frame 2 is coupled with the heat sink 6 after trimming and bending are performed in accordance with the present invention. According to the drawing, the lead frame 2 has a plurality of pins 5 formed at the rear side, and an edge portion 5b connecting each pin is formed at an outer end of the pin. At this time, the edge portion 5b is trimmed by the press work of the inventive banding device 200. In addition, an assembly pin 5a is provided at the center of the pins 5 to be bent to extend vertically by a press operation of the bending device 200. In addition, the rear side of the lead frame (2) has a coupling plate (3) at regular intervals, and has a hole (4) on both sides of the coupling plate (3). The heat sink 6 coupled to the lead frame 2 has a joining plate 7 disposed at the same interval as the joining plate 3 of the lead frame 2 in the forward direction. 7) is provided with a rivet (8) formed to protrude upward on both sides front. The rivet 8 is fastened by punching after being fitted into the hole 4 formed in the lead frame 2 above. In addition, a concave groove 9 is formed between each coupling plate 7, and an assembly pin 5a bent from the lead frame 2 is fitted therein.

In addition, referring to FIG. 4 and a loading apparatus, in which a bending device and a riveting device mounted to the inner top plate 13 of the casing 600 are shown, a plurality of lead frames 2 are fitted on the right side. There is a supply device 100 for moving one lead frame 2 from the mounting table 10 to the bending device 200 on the left side, in which the lead frame 200 is moved from the supply device 100. (2) trimming and banding are performed through the upper mold and the lower mold. Then, the lead frame 2 moves along the rail 55 on the left side again and moves along the mold rail 72 together with the heat sink 6 fitted on the mounting table 10a on one side ( It is seated at 70). Thereafter, the movable mold 70 is punched through the assembled rivet 8 while passing through the riveting device 400 on the left side to complete the riveting. Then, the moving mold is moved to the stacking apparatus 500 as shown in FIG. 5 and is loaded into the stacking box 99 by the finger 95 moving vertically and horizontally.

The above is described in more detail as follows.

As shown in FIG. 1, the main devices of the present invention are configured on the upper plate 13 provided on the upper portion of the leg 620, and the casing 600 having the control panel 610 on one side of the upper plate 13.

The right side of the upper plate 13 is provided with a feeder 100 consisting of a mounting table 10 and a rail 35 and the first horizontal frame 20 for mounting a plurality of lead frames (2). The mounting table 10 is provided with a supporting plate 11 on which a plurality of lead frames 2 can be placed, and a predetermined guide bar 12 according to the spacing 2 of the lead frame before and after the supporting plate 11. ) Is fixed to the top plate 13. And the rack gear 15 is attached to the bottom surface of the support plate 11 passes through the hole formed in the upper plate and the pinion gear 16 that rotates by the power of the motor 17 is coupled to the bottom of the rack gear 15 The support plate 11 is moved vertically. In this way, the lead frame 2 raised to the upper portion of the support plate 11 is sucked in a vacuum by a predetermined suction port 29 mounted on the fixed base 27 and sequentially moved to the rear rail 35 one by one. In this case, in order to keep the upper part of the lead frame 2 at the same height at all times, it is preferable to move the support plate 11 while attaching a predetermined sensor to one side. The holder 27 is attached to the vertical carrier 26 as shown in FIG. 6 and the vertical carrier 26 is mounted on the right side moving frame 24 to the hydraulic cylinder (not shown). To move vertically. In addition, the movable frame 24 is mounted on the first horizontal frame 10 on the right side, and the first horizontal frame 10 is installed by the struts 23 on both sides, and the inside of the movable frame 24 is driven by the motor 21. A screw rod 22 is provided to rotate along, and the moving frame 24 coupled with the screw rod moves horizontally in accordance with the rotation of the screw rod 22. Therefore, the fixed base 27 which absorbs the lead frame 2 on the mounting base 10 is placed on the rail 35 while moving vertically and horizontally. On the other hand, the suction port 29 is connected to the hose 28 is connected to the upper side and the normal vacuum device is attached to the lead frame (2) contacting while applying a vacuum pressure to the end of the suction port. In addition, a gripper 30 is disposed in the rail 35 to move horizontally along the rail, and the gripper 30 moves to the left by biting the lead frame 2 placed on the rail 35. At this time, the gripper 30 is connected to the rod 31 rearward and the rod 31 is connected to the sleeve 32 fastened to the screw rod 33 mounted below the upper plate while the screw rod 33 is The upper gripper 30 is moved left and right when rotated by the driving force of the motor 34. On the other hand, the gripper 30 is provided with the upper and lower fingers vertically moved by the operation of the hydraulic cylinder or the drive motor to pick up and move the lead frame.

The lead frame 2 moved along the rail 35 is moved to the bending device 200 on the left side so that the trimming operation and the bending operation are simultaneously performed. The banding device 200 has a conventional press structure for vertical movement according to the operation of the crank and the rod (not shown) in the crank box 40, the rotational force of the motor 41, the lower ram As shown in Figure 8, the upper mold 44 is mounted. Under the upper mold 44, there is a lower mold 46 in which the upper lead frame 2 is moved and placed therein, and a trimming and banding process is performed on the lead frame 2 when the upper mold is lowered. At this time, the upper mold is provided with a predetermined punch for processing the lead frame (2).

The lead frame 2 is cut by the banding device 200 at the rear edge portion 5b, and the trimming and bansing operation is completed while the end of the assembly pin 5a is bent vertically, and the lead frame 2 is completed. Is moved back to the rail 55 on the left. The rail 55 is provided with a gripper 50 inside the same as the rail 35 on the right side. The gripper 50 has a screw rod 53 which also rotates by driving the motor 54 as shown in FIG. 18, and is connected to a sleeve 52 that is fastened and moved according to the rotation of the screw rod.

Next, a coupling device 300 for coupling the lead frame 2 and the heat sink 6 to the left side of the rail 55 is provided.

The coupling device 300 has a mounting table 10a having the same structure as the mounting table 10 of the supply device 100 in front of the rail 55 on which the lead frame 2 is moved, and the rail 55 At the rear, a mold rail 72 is installed to settle the moving mold 70 and move it horizontally. A plurality of heat sinks 6 are sandwiched between the guide bars in the mounting table 10a, and the second horizontal frame 60 is positioned above the mounting table 10a, the rail 55, and the mold rail 72. It is attached by the props 63 of both sides. Meanwhile, as shown in FIG. 12, the second horizontal frame 60 has a screw rod 62 mounted therein, and horizontally moves the moving frame 64 attached to the front when rotated by the motor 61 on one side. Move it. In addition, the movable frame 64 is mounted on both sides of the vertical carriage (65, 67), which is moved up and down by the power of a hydraulic cylinder or a motor (not shown). A first suction port 66 and a second suction port 68 are attached to the lower portions of the vertical transfer tables 65 and 67 on both sides. At this time, the first and second suction ports 66 and 68 are connected to an external vacuum device while a hose is connected to the upper portion. In addition, a guide rail 74 is installed at the rear of the mold rail 72 in parallel with the mold rail 72, and a rod 75 is seated on the guide rail 74 to move along the guide rail. At this time, the rod 75 is connected to each other with the moving mold 70 moving along the mold rail 72, the other end is bent under the upper plate 13 is attached to the sleeve 76. In addition, the rod 75 and the moving mold 70 move when the screw rod 77 rotates while being engaged with the screw rod 77 rotating to drive the motor 78. Meanwhile, the lead frame 2 and the heat sink 6 are placed on the movable mold 70. The process of coupling the lead frame 2 and the heat sink 6 by the coupling device 300 is shown in FIG. 13. To FIG. 16.

According to the drawing, first, as shown in FIG. 13, the movable frame 64 is moved to the left along the second horizontal frame 60, and the second suction port 68 on the right holds the heat sink 6. (10a) Stop above. Then, the second suction port 68 moves downward to suck the upper heat sink 6 and then returns to the original position. Thereafter, the moving frame 64 moves to the right side, and stops when the first adsorption port 66 on the left reaches the position of the rail 55 as shown in FIG. 14, and then descends to the banding device 200. The moved lead frame 2 is sucked and moved back to its original position. Then, the moving frame 64 continues to move to the right and stops when the second suction hole 68 is positioned on the moving mold 70, as shown in FIG. 15, and the second suction hole 68 is lowered and sucked. The heat sink 6 that has been used is seated on the movable mold 70. Since the moving frame 64 is moved again, the lead frame 2 adsorbed to the first suction port 66 is seated on the heat sink 6, as shown in FIG. 16. At this time, the rivet 8 of the heat sink 6 is turned upward and the revet 8 is fitted into the hole 4 formed in the coupling plate 3 of the lead frame 2. At the same time, the assembly pin 5a of the lead frame 20 is fitted into the recess 9 of the heat sink.

As such, the movable mold 70 having the lead frame 2 and the heat sink 6 settled is moved to the riveting device 400 on the left side as the rod 75 moves.

The riveting device 400 has a conventional press structure in which the rotational force of the motor 81 is vertically moved by the operation of the crank and the rod in the crank box 80, as shown in FIG. 10 of the ram 82. The upper mold 84 is attached to the bottom. In addition, when the above-described moving mold 70 moves and stops below the upper mold 84, the upper mold 84 descends to perform a riveting operation. At this time, the upper mold (84) is provided with a punch (85) having a sharp portion at the bottom as shown in Figure 11 and hits the upper surface of the rivet (8) of the heat sink (6) as the punch (85) is lowered. . As a result, the striking portion of the rivet 8 is firmly fixed to the lead frame 2 while the diameter is diffused.

In this way, the lead frame and the heat sink (hereinafter referred to as the finished product 700) after the riveting operation is completed are transferred to the stacking device 500 on the left side while being placed in the movable mold 70.

The stacking device 500 is provided with a suction port 98 to move vertically on the moving mold 70 as shown in FIG. The suction port 98 is mounted to the vertical frame 96 as the hose 97 is connected to the external vacuum device, upward, downward as the screw rod rotates inside the vertical frame 96. The descent operation will take place. In addition, the front of the suction port 98 is provided with a robot arm 95 equipped with a finger (95a) operated hydraulically on one side. The robot arm 95 is rotated from the rear to the vertical down by the rotary shaft 94, the rotary shaft 94 is moved by the vertical carriage 93 and the moving frame 92 and the third horizontal frame 90, It moves linearly backwards or upwards or downwards. The operation of the third horizontal frame 90 and the moving frame 92 and the vertical carrier 93 can be operated by the operation of the hydraulic cylinder or the motor, and the detailed description thereof will be omitted.

On the other hand, under the robot arm 95 is provided a loading box 99 for loading the finished product 700. As a result, the finished product 700 on the moving mold 70 is loaded into the loading box 99 by the suction hole 98 and the robot arm 95. The operation thereof will be described below.

First, the suction hole 98 descending along the vertical frame 96 attaches the finished product 700 on the moving mold 70, and then moves upward and stops, thereby moving the robot arm 95 forward. The upper and lower fingers 95 are caught on the finished product 700. The robot arm 95 is then moved forward along the third horizontal frame 90 and rotates about the rotation axis 94 at the lower loading box 99 position so that the finger 95 is vertically below. . The robot arm 95 moves down along the moving frame 92 and then lowers the finished product 700 into the loading box while the finger 95 is opened. Therefore, the finished product 700, which is sequentially trimmed and bent, and the riveting is completed, is automatically loaded into the loading box to perform the continuous operation.

As described above, the riveting machine for assembling electronic components according to the present invention is an automated system for performing all processes without the need for an operator, which can reduce manufacturing cost without consuming manpower and enables mass production in a short time. In particular, the quality of the product is uniform and precise, there is an effect that the defective product does not occur.

Claims (8)

There is a mounting base 10 for loading a plurality of lead frames, and there is a rail 35 mounted with a gripper 30 for moving the lead frame, and the lead frame on the mounting table 10 is vacuumed. A feeder (100) having a suction port (29) to be sucked and placed on the rail (35); A bending device (200) having an upper mold (44) and a lower mold (46) capable of trimming and bending a lead frame moved by the rail (35); There is a mounting table (10a) for loading the heat sink on one side and the rail (55) having a gripper 50 therein for transporting the lead frame is completed in the bending device, and in a position close to the rail (55) There is a moving mold 70 which moves along the mold rail 72 with the mold rail 72 and the guide rail 74 therein, and the heat sink on the lead frame 2 and the mounting table 10a on the rail ( A coupling device (300) comprising first and second suction holes (66, 68) on both sides for placing 6) over the moving mold (70); The upper mold 84 is mounted on the ram 82 that is operated up and down, and the lead rail 72 is passed therethrough, and the lead frame coupled by the coupling device when the movable mold 70 is moved. 2) and a riveting device 400 for performing a riveting by applying a punch to the heat sink 6; Riveting machine for assembling electronic components, characterized in that consisting of a loading device 500 for sequentially loading the finished product 700, the finished product 700 is completed above. The mounting bases 10 and 10a on which the lead frame 2 and the heat sink 6 are mounted are provided with predetermined guide bars 12 before and after the support plate 11, and the support plate (10). A rack gear 15 is mounted on the bottom of the rack 11, and the pinion gear 16, which is rotated by the driving of the motor 17 under the rack gear 15, is bitten with the rack gear 15 as the support plate. A riveting machine for assembling an electronic component, characterized by moving 11 vertically. According to claim 1, wherein the suction port 98 is connected to the external vacuum device by a hose 28 and horizontal, by the first horizontal frame 20, the moving frame 24 and the vertical carriage 26, A riveting machine for assembling electronic components, characterized in that it is moved vertically. The gripper 30 mounted on the rail 35 is moved along the rail while being connected by the rod 31 and the sleeve 32 which is linearly moved by the rotational force of the motor 34. Riveting machine for assembling electronic parts. According to claim 1, The coupling device 300 is an external vacuum for placing the heat sink 6 on the mounting table (10a) and the lead frame (2) on the rail (55) on the movable mold (70) First and second suction holes 66 and 68 connected to the apparatus, respectively, and the first and second suction holes 66 and 68 are mounted on the vertical carriages 65 and 67, respectively. Riveting machine for assembling electronic components, characterized in that the horizontal and vertical movement by (64) and the second horizontal frame (60). According to claim 1, The movable mold 70 is seated on the mold rail 72 and the rod 76 connected to one side and the sleeve 76 coupled with the screw rod 77 is rotated by the motor 78 and Riveting machine for assembling electronic components, characterized in that the movement from the coupling device 300 to the riveting device 400 and the loading device 500 while being connected to the mold rail (72). According to claim 1, The stacking device 500 is provided with a suction port 98 that is vertically moved by a vertical frame 96 to lift the finished product 700 on the movable mold 70 by vacuum suction. The robot arm 95, which is rotated by the rotating shaft 94, is moved horizontally and vertically by the third horizontal frame 90 and the vertical transfer table 93, and has a loading box 99 provided thereunder. Riveting machine for assembling electronic parts. 8. The riveting machine for assembling electronic parts according to claim 7, wherein a finger (95) operated by hydraulic pressure is attached to an end portion of the robot arm (95).