KR20020030341A - Mold block for manufacturing semiconductor package - Google Patents

Mold block for manufacturing semiconductor package Download PDF

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Publication number
KR20020030341A
KR20020030341A KR1020000060931A KR20000060931A KR20020030341A KR 20020030341 A KR20020030341 A KR 20020030341A KR 1020000060931 A KR1020000060931 A KR 1020000060931A KR 20000060931 A KR20000060931 A KR 20000060931A KR 20020030341 A KR20020030341 A KR 20020030341A
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South Korea
Prior art keywords
block
center block
center
mold block
mold
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KR1020000060931A
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Korean (ko)
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KR100521977B1 (en
Inventor
홍종철
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마이클 디. 오브라이언
앰코 테크놀로지 코리아 주식회사
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Priority to KR10-2000-0060931A priority Critical patent/KR100521977B1/en
Publication of KR20020030341A publication Critical patent/KR20020030341A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE: A mold block for fabricating a semiconductor package is provided to reduce the quantity of cull filled in a space of a center block and to save molding resin, by reducing the space of the center block of the mold block. CONSTITUTION: The center block(20) is connected to a port for supplying resin. A runner(12) is connected to both sides of the center block. A plurality of cavities(14) are connected to the runner. The concave space of the center block connected to port for supplying resin is reduced. The central portion of the center block protrudes to the upper surface of the mold block(10).

Description

반도체 패키지 제조용 몰드블럭{Mold block for manufacturing semiconductor package}Mold block for manufacturing semiconductor package

본 발명은 반도체 패키지 제조용 몰드블럭에 관한 것으로서, 더욱 상세하게는 몰드블럭의 센터블럭의 구조를 개선하여, 몰딩수지의 소모량을 절감시킬 수 있도록 한 반도체 패키지 제조용 몰드블럭에 관한 것이다.The present invention relates to a mold block for manufacturing a semiconductor package, and more particularly, to a mold block for manufacturing a semiconductor package to improve the structure of the center block of the mold block, thereby reducing the consumption of molding resin.

통상적으로, 반도체 패키지는 리드프레임, 인쇄회로기판, 회로필름등의 부재를 이용하여 다양한 구조로 제조되는 바, 대개 부재의 칩탑재영역에 칩을 부착하는 공정과, 상기 칩의 본딩패드와 부재의 본딩영역간을 와이어로 본딩하는 공정과, 상기 칩과 와이어등을 외부로부터 보호하기 위하여 수지로 몰딩하는 공정등으로 제조된다.In general, semiconductor packages are manufactured in various structures using members such as lead frames, printed circuit boards, and circuit films. The semiconductor package generally includes a step of attaching a chip to a chip mounting region of the member, and a bonding pad and a member of the chip. Bonding between bonding areas with a wire, molding with a resin to protect the chip and wire from the outside, and the like.

상기 몰딩공정은 몰딩머신의 하형에 올려져 고정되는 몰드블럭을 사용하게 되는데, 상기 몰드블럭의 양쪽에는 와이어 본딩된 상태의 부재가 올려지는 다수의 캐비티가 정렬된 상태로 형성되어 있고, 상기 양쪽 캐비티의 안쪽 중앙에는 첨부한 도 3a,3b에 도시한 바와 같은 센터블럭(20)이 위치되어 있다.The molding process uses a mold block which is mounted on a lower mold of the molding machine and fixed to the mold. A plurality of cavities on which wire-bonded members are placed are arranged on both sides of the mold block, and both cavities are aligned. In the inner center of the center block 20 as shown in Figure 3a, 3b is located.

좀 더 상세하게는, 상기 센터블럭(20)과 각각의 캐비티(14)간에는 수지의 흐름 경로로서 런너(12)가 형성되어 있다.More specifically, a runner 12 is formed between the center block 20 and each cavity 14 as a flow path of the resin.

따라서, 상기 몰드블럭(10)의 캐비티(14)에 와이어 본딩된 상태의 부재를 올려놓고 몰딩머신의 상형과 하형을 클램핑시킨 후, 상기 센터블럭(20)으로 수지를 공급하게 된다.Therefore, after placing the member in the state of wire bonding in the cavity 14 of the mold block 10 and clamping the upper and lower molds of the molding machine, the resin is supplied to the center block 20.

더욱 상세하게는, 몰딩머신(10)의 상형쪽에 형성된 포트(18)가 상기 센터블럭(20)과 일치되며 밀착된 상태가 되어, 포트(18)로 공급된 수지를 플런져(22)로 가압함으로써, 센터블럭(20)으로 수지가 공급되어지고, 수지는 런너(12)를 따라 각각의 캐비티(14)로 흘러 부재의 몰딩영역을 몰딩하게 된다.More specifically, the port 18 formed on the upper side of the molding machine 10 is brought into close contact with the center block 20 to pressurize the resin supplied to the port 18 with the plunger 22. As a result, resin is supplied to the center block 20, and the resin flows along the runner 12 to each cavity 14 to mold the molding region of the member.

이때, 상기 센터블럭의 형상을 보면 중앙에 돌출부를 중심으로 소정 깊이의 원형공간이 형성되어 있고, 이 원형공간의 양쪽이 런너와 연통되어진 구조로서, 몰딩공정이 끝난 후에 경화된 수지가 상기 센터블럭의 공간과 런너에 그대로 채워진 상태가 된다.In this case, when the shape of the center block is formed, a circular space having a predetermined depth is formed at the center of the protrusion, and both sides of the circular space communicate with the runner, and the resin cured after the molding process is finished. It is filled with the space and runner.

상기 센터블럭과 런너에 경화된 상태로 채워진 수지는 소위 컬(Cull)이라 칭하는 쓸모없는 폐기물로서, 그대로 폐기처분하게 되는데, 상기 컬의 양은 몰드블럭의 전체 캐비티에 채워지는 수지량보다 적지 않은 량이기 때문에, 몰딩수지재의 낭비를 초래하는 단점이 있었다.The resin filled in the center block and the runner in a cured state is a waste called so-called curl, which is disposed of as it is, and the amount of curl is not less than the amount of resin filled in the entire cavity of the mold block. Therefore, there was a disadvantage in that waste of the molding resin material.

따라서, 본 발명은 상기와 같은 단점을 감안하여, 몰드블럭의 센터블럭 구조를 몰딩수지가 공급되는 포트와의 연통되는 체적을 감소시킨 구조로 개선한 반도체 패키지 제조용 몰드블럭을 제공하는데 그 목적이 있다.Accordingly, an object of the present invention is to provide a mold block for manufacturing a semiconductor package in which the center block structure of the mold block is improved to a structure in which a volume communicating with a port to which a molding resin is supplied is reduced in view of the above disadvantages. .

이에, 몰드블럭의 센터블럭에 채워지는 경화된 수지의 량을 줄일 수 있어, 몰딩 수지재의 비용을 절감할 수 있는 잇점을 제공하게 된다.Therefore, the amount of cured resin filled in the center block of the mold block can be reduced, thereby providing an advantage of reducing the cost of the molding resin material.

도 1은 본 발명에 따른 반도체 패키지 제조용 몰드블럭의 요부를 나타내는 사시도,1 is a perspective view showing a main portion of a mold block for manufacturing a semiconductor package according to the present invention;

도 2는 본 발명에 따른 반도체 패키지 제조용 몰드블럭에 수지가 공급되는 상태를 나타내는 단면도,2 is a cross-sectional view showing a state in which a resin is supplied to a mold block for manufacturing a semiconductor package according to the present invention;

도 3a,3b는 종래의 반도체 패키지 제조용 몰드블럭의 요부를 나타내는 사시도 및 단면도,3A and 3B are a perspective view and a cross-sectional view showing the main parts of a mold block for manufacturing a conventional semiconductor package;

<도면의 주요 부분에 대한 부호의 설명><Explanation of symbols for the main parts of the drawings>

10 : 몰드블럭12 : 런너10: Mold Block 12: Runner

14 : 캐비티16 : 하형14: Cavity 16: Bottom Model

18 : 포트20 : 센터블럭18: port 20: center block

22 : 플런져22: plunger

이하, 첨부도면을 참조로 본 발명을 상세하게 설명하면 다음과 같다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

상기한 목적을 달성하기 위한 본 발명은: 수지 공급용 포트와 연통되는 센터블럭과, 이 센터블럭의 양쪽과 연통되는 런너와, 이 런너와 연통되는 다수의 캐비티를 포함하는 반도체 패키지 제조용 몰드블럭에 있어서, 상기 수지 공급용 포트(18)와 연통되는 상기 센터블럭(20)의 오목한 체적공간을 감소시킨 것을 특징으로 한다.The present invention for achieving the above object is a mold block for manufacturing a semiconductor package comprising a center block in communication with the resin supply port, a runner in communication with both of the center block, and a plurality of cavities in communication with the runner. The concave volume space of the center block 20 in communication with the resin supply port 18 is reduced.

상기 센터블럭(20)의 양쪽만이 오목한 공간으로 남아서 수지 공급용 포트(18)와 연통되도록 센터블럭(20)의 중앙부분은 몰드블럭(10)의 상면까지 돌출되게 성형된 것을 특징으로 한다.The center portion of the center block 20 is formed to protrude to the upper surface of the mold block 10 so that only both sides of the center block 20 remain in a concave space and communicate with the resin supply port 18.

여기서, 본 발명을 실시예로서, 첨부한 도면을 참조로 더욱 상세하게 설명하면 다음과 같다.Herein, the present invention will be described in more detail with reference to the accompanying drawings.

첨부한 도 1은 본 발명에 따른 반도체 패키지 제조용 몰드블럭의 요부를 나타내는 사시도로서, 상기 몰드블럭(10)의 중앙에는 원형의 오목한 공간을 이루는 센터블럭(20)이 형성되어 있고, 이 센터블럭(20)의 양쪽으로는 와이어 본딩된 상태의 부재가 올려지는 다수의 캐비티(14)가 형성되어 있으며, 상기 센터블럭(20)과 다수의 캐비티(14) 사이에는 서로 연통되게 하는 런너(12)가 형성되어 있다.1 is a perspective view illustrating a main portion of a mold block for manufacturing a semiconductor package according to the present invention, wherein a center block 20 forming a circular concave space is formed at the center of the mold block 10, and the center block ( A plurality of cavities 14 are formed on both sides of the wire-bonded member on both sides, and a runner 12 which communicates with each other between the center block 20 and the plurality of cavities 14 is formed. Formed.

여기서, 상기 센터블럭(20)의 오목한 공간체적을 감소시키고자, 양쪽 부분을 제외한 중앙부위를 몰드블럭(10)의 상면까지 평행하게 돌출시킴으로써, 수지의 공급 역할을 하는 포트(18)와 일치되며 연통되는 부위는 센터블럭(20)의 양쪽부분이된다.Here, in order to reduce the concave space volume of the center block 20, by projecting the central portion except for both parts in parallel to the upper surface of the mold block 10, and coincides with the port 18, which serves to supply the resin The communicating part becomes both parts of the center block 20.

더욱 상세하게는, 상기 수지 공급용 포트(18)와 일치되며 연통되는 상기 센터블럭(20)의 양쪽 부분은 센터블럭(20)의 원호라인을 따라 만곡된 형상을 띠게 된다.More specifically, both portions of the center block 20 which are in communication with and in communication with the resin supply port 18 have a curved shape along an arc line of the center block 20.

따라서, 상기 몰드블럭(10)의 캐비티에 와이어 본딩된 상태의 부재를 올려 놓은 다음, 몰딩머신의 하형(16)에 올려진 몰드블럭(10)에 몰딩머신의 상형을 클램핑 한 후, 상기 수지 공급용 포트(18)를 통하여 수지를 플런져(22)의 소정의 압으로 가압하며 공급하게 된다.Therefore, after placing the member in the state of wire bonding in the cavity of the mold block 10, and then clamping the upper mold of the molding machine to the mold block 10 mounted on the lower mold 16 of the molding machine, the resin supply The resin is pressurized and supplied to the predetermined pressure of the plunger 22 through the pot 18.

이에따라, 상기 수지는 첨부한 도 2에 도시한 바와 같이 센터블럭(20)의 양쪽 즉, 감소된 체적공간을 따라 런너(12)로 흐르게 되고, 런너(12)를 흐르는 수지는 계속 흘러 캐비티(14)에 채워짐으로써, 와이어 본딩된 상태의 부재의 몰딩영역을 몰딩하여, 반도체 패키지의 몰딩 공정이 진행된다.Accordingly, the resin flows to the runner 12 along both sides of the center block 20, that is, the reduced volume space, as shown in FIG. 2, and the resin flowing through the runner 12 continuously flows into the cavity 14. ), The molding region of the member in the wire bonded state is molded, and the molding process of the semiconductor package is performed.

이때, 상기 체적공간이 감소된 센터블럭(20)에는 경화된 수지가 채워진 상태로서, 즉 컬의 양이 종래의 센터블럭에 채워진 컬의 양보다 격감된 상태가 되어, 결국 몰딩수지의 양을 절감시킬 수 있게 된다.At this time, the center block 20 in which the volume space is reduced is a state in which the cured resin is filled, that is, the amount of curl is reduced than the amount of curl filled in the conventional center block, thereby reducing the amount of molding resin. You can do it.

이상에서 본 바와 같이, 본 발명에 따른 반도체 패키지 제조용 몰드블럭에 의하면, 몰드블럭의 센터블럭 체적공간을 감소시킴으로써, 센터블럭의 공간에 채워지는 컬의 양을 줄일 수 있어, 결국 몰딩수지의 절감과 비용절감의 효과를 얻어낼 수 있다.As described above, according to the mold block for manufacturing a semiconductor package according to the present invention, by reducing the volume of the center block volume of the mold block, it is possible to reduce the amount of curl to be filled in the space of the center block, thereby reducing the molding resin and Cost savings can be achieved.

Claims (2)

수지 공급용 포트와 연통되는 센터블럭과, 이 센터블럭의 양쪽과 연통되는 런너와, 이 런너와 연통되는 다수의 캐비티를 포함하는 반도체 패키지 제조용 몰드블럭에 있어서,A mold block for manufacturing a semiconductor package comprising a center block in communication with a resin supply port, a runner in communication with both sides of the center block, and a plurality of cavities in communication with the runner, 상기 수지 공급용 포트와 연통되는 상기 센터블럭의 오목한 체적공간을 감소시킨 것을 특징으로 하는 반도체 패키지 제조용 몰드블럭.Mold block for manufacturing a semiconductor package, characterized in that to reduce the concave volume space of the center block communicated with the resin supply port. 제 1 항에 있어서, 상기 센터블럭의 양쪽만이 오목한 공간으로 남아서 수지 공급용 포트와 연통되도록 센터블럭의 중앙부분은 몰드블럭의 상면까지 돌출되게 성형된 것을 특징으로 하는 반도체 패키지 제조용 몰드블럭.The mold block of claim 1, wherein a center portion of the center block is formed to protrude up to an upper surface of the mold block so that only both sides of the center block remain in the concave space and communicate with the resin supply port.
KR10-2000-0060931A 2000-10-17 2000-10-17 Mold block for manufacturing semiconductor package KR100521977B1 (en)

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KR100521977B1 KR100521977B1 (en) 2005-10-17

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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CN107768289A (en) * 2017-11-21 2018-03-06 太仓佳锐精密模具有限公司 A kind of semiconductor packaging mold bin
US20210242038A1 (en) * 2019-08-06 2021-08-05 Texas Instruments Incorporated Universal semiconductor package molds

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100842926B1 (en) * 2007-05-16 2008-07-02 미크론정공 주식회사 Connection structure between pcb and cull in molding apparatus of semiconductor package
CN107768289A (en) * 2017-11-21 2018-03-06 太仓佳锐精密模具有限公司 A kind of semiconductor packaging mold bin
US20210242038A1 (en) * 2019-08-06 2021-08-05 Texas Instruments Incorporated Universal semiconductor package molds
US11791170B2 (en) * 2019-08-06 2023-10-17 Texas Instruments Incorporated Universal semiconductor package molds

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