KR200193714Y1 - Lead frame press for producing ic chip - Google Patents
Lead frame press for producing ic chip Download PDFInfo
- Publication number
- KR200193714Y1 KR200193714Y1 KR2019980017806U KR19980017806U KR200193714Y1 KR 200193714 Y1 KR200193714 Y1 KR 200193714Y1 KR 2019980017806 U KR2019980017806 U KR 2019980017806U KR 19980017806 U KR19980017806 U KR 19980017806U KR 200193714 Y1 KR200193714 Y1 KR 200193714Y1
- Authority
- KR
- South Korea
- Prior art keywords
- lead frame
- circular
- groove
- pressure plate
- chip
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
IC칩(chip)을 제조하기 위한 초기단계인 동박판으로 된 리드프레임에 형성된 각 단자와 단자를 결선하기 위하여 리드프레임이 움직이지 못하도록 압지, 클램핑하는 압지판의 일측에 관통된 사각통공 주연부를 따라 원형요홈을 형성하고 이 원형요홈에 삽입되는 원형돌기를 돌설한 4각 고무테를 사각통공 주연부에 부착하여 리드프레임을 정확하게 압지클램핑하도록 압지판을 구성한 고안에 대한 것이다.Along the periphery of the rectangular through-hole perforated on one side of the pressure plate, which is pressed and clamped to prevent movement of the lead frame to connect the terminals and terminals formed on the lead frame made of copper foil, an initial stage for manufacturing an IC chip. The present invention relates to a design in which a pressure plate is formed to attach and clamp the lead frame accurately by attaching a quadrangular rubber frame formed in a circular groove and protruding a circular protrusion inserted into the circular groove to the periphery of the square hole.
Description
본 고안은 IC칩(chip)을 제조하기 위한 기술분야로서 보다 더 자세하게는 IC칩을 제조하기 위하여서는 IC칩의 중심체가 되는 동박판을 필요한 회로형태로 전단하여서 되는 리드프레임을 제조하고 리드프레임에 형성된 다수개의 단자와 단자간을 순도 99.9%의 금실(金線)로 결선용착하게 되는데 이때 리드프레임이 움직이지 못하도록 대략 중도부가 4각 홈으로 절개개통된 압지판이 리드프레임을 압지한 상태에서 결선작업을 기계적으로 하게 되는 바 종래 이 리드프레임을 압지하는 압지판(1)은 첨부한 도면 도 1 과 도 2 에서 도시한 바와 같이 압지판(1) 일측에 리드프레임(2)의 외각면을 압지하고 압지한 상태에서 리드프레임(2)의 단자간 결선작업을 하기 위한 4각 통공(3)이 절개관통되고 이 사각통공(3) 저부 주연부를 따라 일정한 폭으로 요홈(4)을 형성하여 이 요홈에 사각통공(3) 저면 주연부의 외각선에 형성된 요홈(4)과 동일한 폭으로 된 고무링(5)을 개재시키되 요홈(4)과 고무링(5) 사이에 접착제를 개재하여 고무링(5)을 접착하여 압지판(1)이 리드프레임(2)을 압지고정하도록 하고 있다.The present invention is a technical field for manufacturing an IC chip, and more specifically, in order to manufacture an IC chip, a lead frame is prepared by shearing a copper sheet, which is the center of the IC chip, into a necessary circuit form, and Wiring and welding between formed terminals and terminals with 99.9% purity gold thread. At this time, the wiring work is carried out by pressing the lead frame by the pressure plate where the middle part is cut into the square groove to prevent the lead frame from moving. The pressure plate 1 for pressing the lead frame is mechanically pushed to the outer surface of the lead frame 2 on one side of the pressure plate 1 as shown in FIGS. 1 and 2. In the squeezed state, a quadrangular through hole 3 for cutting the lead between the terminals of the lead frame 2 is cut and formed along the periphery of the bottom of the square through hole 3 to form a groove 4 with a predetermined width. The groove is provided with a rubber ring 5 having the same width as the groove 4 formed in the outer periphery of the bottom periphery of the square through hole 3, but with an adhesive between the groove 4 and the rubber ring 5 via an adhesive. (5) is bonded to the pressure plate 1 so that the lead frame 2 is pressed and fixed.
종래 압지판 저면 일측에 일정한 폭으로 형성된 요홈(4)에 접착액을 매개로 접착된 고무링(5)은 요홈(4)에 강제로 끼워 넣어야 함에 따라 균일한 수평유지가 되지 않는 경우가 있고 압지판(1)은 리드프레임(2)의 결선작업시 발생되는 고열이 전도되어 시간이 경과하면 고열로 인하여 접착력이 떨어져서 고무링(5)이 요홈(4)으로 부터 탈리되는 등의 문제점이 있었다.Conventionally, the rubber ring 5 adhered to the groove 4 formed with a constant width on one side of the bottom of the pressure plate by media through an adhesive liquid is forced into the groove 4 so that it may not be maintained evenly. The plate 1 has a problem such that the rubber ring 5 is detached from the grooves 4 due to the high heat generated during the connection work of the lead frame 2 and the adhesive force is dropped due to the high heat.
도 1 은 종래 리드프레임 압지판의 일부절결사시도1 is a partially cutaway perspective view of a conventional lead frame pressure plate
도 2 는 도 1 에서의 A-A 선 단면도2 is a cross-sectional view taken along the line A-A in FIG.
도 3 은 본 고안상으로 실시되는 리드프레임 압지판의 도 1 에서의 위치에서 저면을 평면적으로 위치변경하여서 도시한 일부절결사시도3 is a partially cutaway perspective view showing the bottom surface planarly repositioned at the position in FIG. 1 of the lead frame pressure plate according to the present invention;
도 4 는 도 3 에서의 A-A 선 단면도4 is a cross-sectional view taken along the line A-A in FIG.
<도면의 주요부분에 대한 부호설명><Code Description of Main Parts of Drawing>
1 : 압지판 2 : 리드프레임 3 : 사각통공1: pressure plate 2: lead frame 3: square hole
4 : 요홈 5 : 고무링 10 : 원형요홈4: groove 5: rubber ring 10: round groove
11 : 원형돌기 12 : 4각 고무테11: round protrusion 12: 4 square rubber frame
본 고안은 상기와 같이 항상 고무링이 수평을 유지하도록 함과 아울러 열에 의한 요홈(4)으로 부터의 탈리현상이 발생되지 않도록 안출한 것으로서 이를 첨부한 도면 도 3 및 도 4 를 참고로 하여 설명하면, 압지판(1)의 일측에 관통된 사각통공(3) 외주연을 따라 일정한 간격과 소정의 깊이로 원형요홈(10)을 요입형성하고 원형요홈(10)의 깊이와 동일하고 원형요홈(10) 직경보다 다소 큰 직경의 원형돌기(11)가 원형요홈(10)과 동일한 위치와 개수로 돌설되고 원형돌기(11)의 직경보다 다소 큰 폭의 4각 고무테(12)를 원형요홈(10)에 원형돌기(11)를 강삽하여 부착하되 원형요홈(10)과 원형돌기(11)의 대접면에는 접착제를 개재하여 부착되도록 하여서 본원고안이 이루어진다.The present invention is to ensure that the rubber ring is always horizontal as described above and to prevent the detachment phenomenon from the groove (4) by the heat as described with reference to the accompanying drawings, Figures 3 and 4 Along the outer circumference of the rectangular through hole 3, one side of the pressure plate 1 is formed with a recess in the groove 10 at a predetermined interval and a predetermined depth and the same as the depth of the circular groove 10 and the circular groove 10 A circular protrusion 11 having a diameter slightly larger than the diameter is protruded in the same position and number as the circular recess 10, and the square rubber frame 12 having a width larger than the diameter of the circular protrusion 11 is round. The circular projection (11) is attached to the indentation but the circular concave groove 10 and the convex surface of the circular projection (11) to be attached via an adhesive to make the present application.
상기와 같이 구성된 본원고안은 원형요홈(10) 직경보다 4각 고무테(12)상에 돌설된 원형돌기(11)의 직경이 다소 크므로 원형요홈(10)에 강삽하므로서 압지판이 가열되더라도 원형돌기(11)가 쉽게 이탈되지 않으며 고무테(12)는 원형요홈(10) 외면에 위치되므로 수평이 항상 유지되어 리드프레임(2)을 균일하게 압지, 클램핑하므로 IC칩의 불량률이 현저히 감소된다.The present application configured as described above has a larger diameter of the circular protrusion 11 protruding on the square rubber frame 12 than the circular groove 10 diameter, so that the circular protrusion is heated even though the blotter plate is heated by the circular groove 10. Since the rubber frame 12 is not easily detached and the rubber frame 12 is located on the outer surface of the circular recess 10, the horizontal frame is always maintained, thereby uniformly pressing and clamping the lead frame 2, thereby significantly reducing the defective rate of the IC chip.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019980017806U KR200193714Y1 (en) | 1998-09-18 | 1998-09-18 | Lead frame press for producing ic chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019980017806U KR200193714Y1 (en) | 1998-09-18 | 1998-09-18 | Lead frame press for producing ic chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20000006617U KR20000006617U (en) | 2000-04-25 |
| KR200193714Y1 true KR200193714Y1 (en) | 2000-09-01 |
Family
ID=19537440
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019980017806U KR200193714Y1 (en) | 1998-09-18 | 1998-09-18 | Lead frame press for producing ic chip |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR200193714Y1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020069885A (en) * | 2001-02-28 | 2002-09-05 | 앰코 테크놀로지 코리아 주식회사 | Clamp for semiconductor package |
-
1998
- 1998-09-18 KR KR2019980017806U patent/KR200193714Y1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR20000006617U (en) | 2000-04-25 |
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