CN212874531U

CN212874531U - Special welding seat for surface mount components and light-emitting diode surface mount component assembly

Info

Publication number: CN212874531U
Application number: CN202021929242.6U
Authority: CN
Inventors: 张遂富
Original assignee: Dongguan Huafang Electronic Technology Co ltd
Current assignee: Dongguan Huafang Electronic Technology Co ltd
Priority date: 2020-09-07
Filing date: 2020-09-07
Publication date: 2021-04-02
Anticipated expiration: 2030-09-07

Abstract

The utility model discloses a special welding seat of paster component, including the welding seat body, the welding seat body includes upper surface and lower surface, the welding seat upper surface is provided with the component groove, component groove below is provided with two guide pin holes at least. The utility model provides a special welding seat of paster element and emitting diode paster element subassembly can help straight foot guide pin formula plug-in components welding to carry out the paster processing, forms the subassembly that can the paster assembly to assemble conveniently and weld on next step, thereby reduce cost increases production efficiency.

Description

Special welding seat for surface mount components and light-emitting diode surface mount component assembly

Technical Field

The utility model relates to a LED part field especially relates to a special welding seat of paster element and emitting diode paster element subassembly.

Background

With the increasing demand of automated electronic products, the trend of the products towards miniaturization, integration and automated production is quite obvious. At present, in the industry, an SMT chip mounter and a reflow soldering machine are directly mounted on a circuit board in the prior art, but a plurality of welding parts adopt a straight-pin guide pin mode, and basically straight-pin lamp beads are inserted into the circuit board, wave soldering and pin cutting after being taken down from a woven belt by taking a light emitting diode as an example. Because of the plug-in welding, the circuit board has large use space, high processing cost and difficult quality control, the prior plug-in light emitting diode is taken by the traditional technology, the guide pin is cut to a proper length, then the circuit board is inserted, and finally the circuit board is welded. In the prior art, an auxiliary welding seat, a light-emitting diode welding assembly and a method for converting pin components such as a traditional diode into a surface mount component are lacked, the components such as the traditional diode can be universally applied to an SMT (surface mount technology) surface mount device, and the components including the light-emitting diode are directly mounted and reflow-welded on a circuit board.

SUMMERY OF THE UTILITY MODEL

In view of above prior art defect, the utility model provides a special welded seat of paster element, including the welded seat body, the welded seat body includes upper surface and lower surface, the welded seat upper surface is provided with the component groove, component groove below is provided with two guide pin holes at least.

Preferably, the lower surface of the welding seat is provided with a welding surface clamping groove extending from the guide pin hole to the outer edge of the bottom surface of the welding seat.

Preferably, the upper surface of the welding seat is provided with at least two bosses, the bosses protrude outwards from the upper surface of the welding seat, and the inner side surfaces of the bosses are matched with the upper surface of the welding seat to form the element grooves.

Preferably, the boss is slightly inwardly contracted and can bear a certain deformation.

Preferably, the upper surface of the welding seat is provided with a first boss, a second boss, a third boss and a fourth boss, wherein the side end faces of the third boss and the fourth boss are flush with the side end face of the welding seat, the front end face of the third boss is flush with the front end face of the welding seat, and the rear end face of the fourth boss is flush with the rear end face of the welding seat.

Preferably, the angle theta between the axis of the guide pin hole of the welding seat and the bottom surface is set to be between 118 DEG and 180 deg.

The utility model also provides a light emitting diode paster component part, including light emitting diode, the light emitting diode below is provided with as before the special welding seat of paster component, light emitting diode's guide pin passes guide pin hole on the special welding seat is in special welding seat bottom surface forms the platykurtic metal face of weld, platykurtic metal face of weld one end is passed guide pin jogged joint the light emitting diode bottom, the other end by follow special welding seat bottom surface outward flange of paster component extends and compares in special welding seat bottom surface outward flange of paster component outward protrusion.

Taking a typical guide pin with a diameter of 0.5 as an example, the width of the metal soldering surface is set to be 0.26-0.28 mm.

The utility model has the advantages that: (1) the utility model provides a special welding seat of paster element can help straight foot guide pin formula plug-in components welding to carry out the paster processing, forms the subassembly that can the paster assembly to conveniently assemble and weld on next step, thereby reduce cost increases production efficiency.

Simultaneously, the welding seat that this technical scheme provided can effectively insulate against heat part and circuit board welding part, because of overheated influence part performance in the time of preventing the welding.

(2) The series products are suitable for any SMT chip mounter and reflow soldering machine, can be mounted on a circuit board and perform reflow soldering, and really achieve high quality, high efficiency and low consumption. Fills the blank in the industry. Taking the light emitting diode as an example, the traditional light emitting diode is in a direct insertion type before being mounted and welded on a circuit board, and after the positive and negative guide pins are inserted into mounting holes of the circuit board, the excess material of the guide pins must be cut off after welding, so that the assembly speed is slow, and the utilization rate of the circuit board is low. The utility model discloses an utilize special bedplate installation emitting diode, can change the emitting diode of formula of cuting straightly into SMD emitting diode ingeniously, can accomplish the assembly more effectively, fast.

(3) This kind of welded seat of this patent design can effectively solve the problem that welding efficiency is low, and the component location is realized in the cooperation of welding body and component groove, and the guide pin of component passes the crooked face of weld draw-in groove of guide pin hole, can effectively fix a position the face of weld of wanting the welding. And the component groove that the welding boss formed makes the welded seat more convenient access, compares the component groove of pure indent, and the inslot is difficult to the mistake and goes into the foreign matter to influence the component operation. The boss can bear certain deformation in a shrinkage shape, so that the element can be positioned more effectively. The protruding setting of first, two bosss can effectively reduce the space, and convenient preparation, third, four bosss are parallel with the relevant plane of body, and it is more succinct to make welded seat structure and lines, prevents that the gap card from going into irrelevant foreign matter.

(4) The utility model provides a defect of traditional technical scheme is effectively solved to the method, and traditional technical scheme's emitting diode is for cut straightly the formula before the circuit board at the installation welding, and just, burden guide pin must cut off guide pin clout, assembly speed again after the welding slow after inserting the circuit board mounting hole, and the circuit board utilization ratio is lower.

The utility model discloses an utilize special bedplate to install emitting diode, use accurate dress seat trigger to install emitting diode lamp pearl, install in the bedplate after, original positive and negative pole guide pin (0.5mm diameter) flatten two flat welding faces that are 0.26 ~ 0.28mm thickness, welding performance improves greatly, and is applicable to any SMT chip mounter, reflow welding machine moreover; is a real surface-mounted SMDLED series product.

Drawings

Fig. 1 is a schematic perspective view of a welding seat according to embodiment 1 of the present invention.

Fig. 2 is a front view of fig. 1.

Fig. 3 is a schematic bottom perspective view of fig. 1.

Fig. 4 is a top view of fig. 2.

Fig. 5 is a schematic perspective view of a light emitting diode chip component assembly in embodiment 2.

Fig. 6 is a top view of a light emitting diode chip component assembly of example 2.

Fig. 7 is a sectional view taken along line B of fig. 6.

Fig. 8 is an enlarged partial schematic view of a of fig. 7.

Fig. 9 is a schematic bottom perspective view of fig. 5.

Detailed Description

The invention will be further explained with reference to the following figures and examples:

example 1

As shown in fig. 1, the special soldering socket for the patch element comprises a soldering socket body 1, wherein the soldering socket body 1 comprises an upper surface 11 and a lower surface 12, the upper surface 11 of the soldering socket is provided with an element groove 2, and at least two guide pin holes 3 are arranged below the element groove 2.

The embodiment can be applied to any guide pin type component, and the original direct-insert type component is fixed in the welding seat in the embodiment by the method in the third embodiment, so that the guide pin type component is converted into a patch type component. The production efficiency is improved, and the reject ratio is reduced.

Furthermore, the lower surface 12 of the soldering socket is provided with a soldering surface slot 4 extending from the guide pin hole 3 to the outer edge of the bottom surface of the soldering socket.

The guide pin is pressed into the welding surface, so that the welding reliability can be improved by effectively increasing the welding area, and the welding surface clamping groove can further fix the welding surface, so that the welding can be effectively carried out. It should be noted that the thickness of the welding surface slot can be adjusted according to the situation of the user, and the welding surface slot is not limited to a flat welding surface, but can be applied to welding surfaces with other shapes.

Further, the upper surface 11 of the welding seat is provided with at least two bosses 5, the bosses 5 protrude outwards from the upper surface 11 of the welding seat, and the inner side surface 6 of each boss 5 is matched with the upper surface 11 of the welding seat to form the element groove 2.

The component groove that the boss formed can have more the reliability than simple component recess, and on the one hand, the user more can effectively observe component behavior, and on the other hand prevents that irrelevant foreign matter from falling into the component inslot.

Further, the boss 5 is slightly inwardly contracted and can endure a certain deformation. The inward-shrinkage of the lug boss can effectively realize the positioning of the element and prevent the relative displacement between the element and the welding seat.

Further, a first boss 51, a second boss 52, a third boss 53 and a fourth boss 54 are arranged on the upper surface of the welding seat, wherein the side end surfaces of the third boss 53 and the fourth boss 54 are flush with the side end surface of the welding seat, the front end surface of the third boss 53 is flush with the front end surface of the welding seat, and the rear end surface of the fourth boss 54 is flush with the rear end surface of the welding seat.

The process that the third boss and the fourth boss flush with the relevant plane of the welding seat body is that the welding seat is simpler, and on the other hand, the structure of the welding seat is simpler. Further, the angle theta between the axis of the guide pin hole of the welding seat and the bottom surface is set to be 118-180 degrees. This is because if the angle between the guide pin hole and the bottom surface is less than 118 °, the bending is excessive, which affects the related performance, and meanwhile, the horizontal force on the substrate cannot be applied when the guide pin is inserted, which is not favorable for further stabilizing the component. If the angle is between 118 and 180 degrees, the guide pin can not only receive the upward supporting force of the substrate when penetrating, but also receive the friction force in the horizontal direction of the substrate, and can help the soldering socket to more firmly position the component.

Example 2

In embodiment 2, a led chip component assembly is provided, which includes a led 9, a dedicated soldering socket as in embodiment 1 is disposed below the led 9, a guide pin 8 of the led 9 passes through a guide pin hole 3 of the dedicated soldering socket to form a flat metal soldering surface 7 on a bottom surface of the dedicated soldering socket, one end of the flat metal soldering surface 7 passes through the guide pin hole 3 to connect with a bottom of the led, and the other end of the flat metal soldering surface extends from the bottom surface of the dedicated soldering socket to an outer edge of the bottom surface of the chip component dedicated soldering socket and protrudes outward compared with the outer edge of the bottom surface of the chip component dedicated soldering socket. The welding surface penetrates out of the bottom surface of the welding seat and penetrates out of the bottom surface of the welding seat to form the assembly pin, so that the assembly pin can be conveniently and electrically connected with other related components.

Further, the width of the metal welding surface 7 is set to be 0.26-0.28 mm. Since the diameter of the typical pin is 0.5mm, and a thickness of 0.26-0.28mm is used, the typical led pin is soldered within this width, the soldering effect is best, and it can be very conveniently positioned. If the width is less than 0.26mm, welding may cause a problem of weakness, and if the width is more than 0.28mm, the width may be too large and the thickness may be too thin, and there may be a problem that welding is not strong or circuit transmission is affected.

Example 3

In this embodiment, a method for manufacturing a light emitting diode chip component is provided, which includes the following steps:

1) taking a light-emitting diode, and calibrating the pin pitch of a guide pin of the light-emitting diode;

2) pressing the guide pin to form a flat metal welding surface with proper thickness;

3) the metal soldering surface is inserted into the guide pin hole of the die pad of the chip component described in example 1 and bent to form a corresponding soldering angle.

Further, in the step 3), the method further includes the following steps:

31) cutting off the pressed guide pin at the same time of bending or after bending;

32) and detecting whether the assembled LED welding assembly is a good product or not, and automatically packaging and winding the good product into a disc in a carrier tape.

Further, in the step 3), the bending angle θ of the guide pin after pressing is set to be 118-180 degrees;

and enabling the tail end of the pressed and bent guide pin to penetrate out of the outer edge of the bottom surface of the welding seat to form an external pin of the light-emitting diode.

The during operation, with former straight foot type product through the process of integrating, utilize professional equipment to take off the product from the braid (or loose the package), the foot distance to two guide pins calibrates, carry out accurate formula with two guide pins again and flatten to suitable thickness, insert purpose-made bedplate in, the guide pin after flattening is bent, the shaping is to accurate welding angle (118 ~ 180 degrees), area of contact when flattening the purpose and for increasing the welding, reduce occupation space greatly after bending, play the fixed action to the product after the bedplate of dress. The flattened guide pin is cut into a specified length during bending, then whether the product is a good product or not is detected, and the good product is placed into a carrier tape to be automatically packaged and rolled into a disc.

After the light emitting diode is installed on the seat plate, original positive and negative electrode guide pins are adopted, the guide pins with the diameter of 0.5mm are adopted in the embodiment, two flat welding surfaces with the thickness of 0.26-0.28mm are flattened, the welding performance is greatly improved, and the LED mounting structure is suitable for any SMT chip mounter and reflow soldering machine; is a real surface-mounted SMDLED series product.

The foregoing has described in detail preferred embodiments of the present invention. It should be understood that numerous modifications and variations can be devised by those skilled in the art in light of the teachings of the present invention without undue experimentation. Therefore, the technical solutions that can be obtained by a person skilled in the art through logic analysis, reasoning or limited experiments based on the prior art according to the concepts of the present invention should be within the scope of protection defined by the claims.

Claims

1. The utility model provides a special welding seat of paster component, characterized by: including weld holder body (1), weld holder body (1) includes upper surface (11) and lower surface (12), weld holder upper surface (11) are provided with component groove (2), component groove (2) below is provided with two guide pin holes (3) at least.

2. A specialized soldering nest for a patch element as claimed in claim 1 wherein: the lower surface (12) of the welding seat is provided with a welding surface clamping groove (4) which extends from the guide pin hole (3) to the outer edge of the bottom surface of the welding seat.

3. A solder cup for chip components according to claim 1, characterized in that the upper surface (11) of the solder cup is provided with at least two projections (5), said projections (5) projecting outwardly from the upper surface (11) of the solder cup, the inner side surfaces (6) of said projections (5) cooperating with the upper surface (11) of the solder cup to form said component slot (2).

4. A special soldering nest for patch elements according to claim 3, characterised in that the elevation (5) is slightly inwardly convergent and able to withstand a certain deformation.

5. A specialized soldering nest for a patch element as claimed in claim 3 wherein: the welding seat comprises a welding seat and is characterized in that a first boss (51), a second boss (52), a third boss (53) and a fourth boss (54) are arranged on the upper surface of the welding seat, wherein the side end faces of the third boss (53) and the fourth boss (54) are flush with the side end face of the welding seat, the front end face of the third boss (53) is flush with the front end face of the welding seat, and the rear end face of the fourth boss (54) is flush with the rear end face of the welding seat.

6. The special soldering nest for a patch element as claimed in claim 1, wherein the angle θ between the axis of the guide pin hole of the soldering nest and the bottom surface is set to be between 118 and 180 °.

7. An led chip component assembly, comprising: the special soldering seat for the patch element comprises a light-emitting diode (9), wherein the special soldering seat for the patch element as claimed in any one of claims 1 to 5 is arranged below the light-emitting diode (9), a guide pin (8) of the light-emitting diode (9) penetrates through a guide pin hole (3) on the special soldering seat to form a flat metal soldering surface (7) on the bottom surface of the special soldering seat, one end of the flat metal soldering surface (7) penetrates through the guide pin hole (3) to be connected with the bottom of the light-emitting diode, and the other end of the flat metal soldering surface extends towards the outer edge of the bottom surface of the special soldering seat for the patch element and protrudes outwards compared with the outer edge of the bottom surface of the special soldering seat for the patch element.

8. The led chip component assembly of claim 7, wherein: the width of the metal welding surface (7) is set to be 0.26-0.28 mm.